Server load falsification device

Abstract

The utility model discloses a kind of server dummy load devices, it is related to liquid cooling test technical field, server dummy load device includes at least one dummy load unit, dummy load unit includes box, at least one heating component, temperature measuring component and circuit board component, box is uniformly provided with multiple through-flow holes to opposite two sides along up-down direction, temperature measuring component includes at least one temperature measuring unit arranged in the side of heating component, temperature measuring unit includes two first temperature sensors, which are spaced apart in horizontal direction and oppositely arranged, circuit board component is arranged in box, and circuit board component is electrically connected with temperature measuring component.Box is immersed in coolant, coolant flows into from the through-flow hole of the lower side of box, flows out from the through-flow hole of the upper side of box after heating component, heating component can replace server and heat, the temperature data of coolant is obtained by the two first temperature sensors of same height and different positions, so that whether coolant flows uniformly is judged by temperature difference.

Description

Technical Field

[0001] This utility model relates to the field of liquid cooling testing technology, and in particular to a server dummy load device. Background Technology

[0002] With the development of liquid cooling technology, testing the heat dissipation capacity of liquid cooling systems has become increasingly important. In current liquid cooling system structures, the coolant immersed in the cooling chamber circulates and exchanges heat with a heat exchanger to achieve cooling. However, when testing the performance of a cooling system using a server, it is difficult to test the maximum heat dissipation capacity of the liquid cooling system, as liquid cooling systems are generally designed to exceed the server's heat dissipation limit. Furthermore, using a server as a heat source to perform long-term stress tests on the liquid cooling system can easily damage the server. Utility Model Content

[0003] The main purpose of this invention is to propose a server dummy load device that can be installed in a liquid cooling system to replace the server's heat generation in order to test the liquid cooling system. At the same time, temperature detection can measure the uniformity of coolant flow.

[0004] To achieve the above objectives, this utility model proposes a server dummy load device for immersion in coolant. The server dummy load device includes at least one dummy load unit, which includes:

[0005] The housing has multiple flow holes on both sides that are opposite each other in the vertical direction;

[0006] At least one heating element is disposed inside the housing;

[0007] A temperature measuring assembly includes at least one temperature measuring unit disposed on the side of the heating assembly. The temperature measuring unit includes two first temperature sensors spaced apart horizontally and arranged opposite each other. The two first temperature sensors are aligned vertically. The two first temperature sensors are used to measure the temperature of the flowing coolant.

[0008] A circuit board assembly is disposed inside the housing and fixed to the inner wall of the housing. The circuit board assembly is electrically connected to the temperature measuring component.

[0009] In one embodiment, the heating component includes:

[0010] A fixed bracket, the side of which is fixed to the inner wall of the housing;

[0011] The heating element is mounted on the fixed bracket; and,

[0012] The controller is fixed to the mounting bracket and electrically connected to the heating element and the circuit board assembly.

[0013] In one embodiment, the heating element includes two heating resistance wires electrically connected to the controller, and at least one of the heating resistance wires is capable of being powered on.

[0014] In one embodiment, a plurality of heating elements are provided, and the plurality of heating elements are arranged at intervals along the horizontal direction;

[0015] Each of the first temperature sensors is located between two adjacent heating components.

[0016] In one embodiment, the upper side of the enclosure is provided with multiple power interfaces;

[0017] The heating element is connected to the power interface via a cable.

[0018] In one embodiment, the side of the enclosure is provided with multiple indicator lights corresponding one-to-one with multiple power interfaces, for indicating the node status of the power interfaces; and / or,

[0019] The power interface is connected to the circuit board assembly via a power conversion module.

[0020] In one embodiment, multiple temperature measuring units are provided, and the multiple temperature measuring units are arranged at intervals along the vertical direction.

[0021] In one embodiment, multiple heating elements are provided, and a mating gap is formed between two adjacent heating elements;

[0022] The circuit board assembly includes:

[0023] The main body is fixed to the inner wall of the box;

[0024] Multiple extension segments, one end of which is connected to the main body and the other end extends into the mating gap, and multiple first temperature sensors are provided at intervals on each of the extension segments;

[0025] In this configuration, multiple extension segments extend into the same mating gap and are spaced apart, or multiple extension segments extend into multiple mating gaps respectively.

[0026] In one embodiment, the two opposite sides of the housing along the vertical direction are designated as a first side and a second side, wherein,

[0027] The flow area of ​​each of the flow holes on the first side is smaller than the size of each of the flow holes on the second side; and / or,

[0028] The number of the plurality of flow holes on the first side is greater than the number of the plurality of flow holes on the second side.

[0029] In one embodiment, multiple dummy load units are provided, and the multiple dummy load units are arranged at intervals along the horizontal direction; and / or,

[0030] The enclosure is open on one side in the horizontal direction.

[0031] In this invention, the enclosure is submerged in coolant. The coolant flows in through a vent on the lower side of the enclosure, passes through a heating element, and then flows out through a vent on the upper side. The heating element can replace the server for heat generation. Through communication and coordination between the temperature measuring unit and the circuit board assembly, and by using temperature data from two first temperature sensors at different positions at the same height, the uniformity of coolant flow can be determined by the temperature difference. Furthermore, the testing requirements of the cooling system can be met by rationally designing the number of heating elements and dummy load units. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0033] Figure 1 A schematic diagram of a structural embodiment of the server dummy load device provided by this utility model;

[0034] Figure 2 for Figure 1 Schematic diagram of coolant flow direction inside the dummy load device of the server;

[0035] Figure 3 for Figure 1 Schematic diagram of the indicator light control circuit;

[0036] Figure 4 for Figure 1 Schematic diagram of the circuit connection of the temperature measurement unit;

[0037] Figure 5 for Figure 4 Schematic diagram of the control circuit for the heating element.

[0038] Explanation of icon numbers:

[0039] 100. Server dummy load device; 1. Cabinet; 11. Vent hole; 12. Power interface; 13. Indicator light; 14. Serial port; 2. Heating component; 21. Mounting bracket; 22. Heating element; 23. Controller; 24. Cable; 3. Temperature measurement unit; 31. First temperature sensor; 4. Circuit board assembly; 41. Main body; 42. Extension section; 5. Power conversion module;

[0040] a. Second coil; b. First coil; c. Isolation transformer protection resistor; d. Isolation transformer; e. KM1 pull-in coil.

[0041] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0042] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0043] It should be noted that if the embodiments of this utility model involve directional indication, the directional indication is only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0044] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0045] With the development of liquid cooling technology, testing the heat dissipation capacity of liquid cooling systems has become increasingly important. Current liquid cooling systems consist of a CDU (Coolant Distribution Unit) control system and a liquid-cooled tank (a enclosure with a liquid cooling system). The liquid-cooled tank is connected to the CDU via piping. The CDU uses its internal heat exchanger to cool the coolant from an outdoor cold source, and then the circulating coolant dissipates heat from the server inside the liquid-cooled tank. The coolant circulates between the liquid-cooled tank and the CDU.

[0046] However, when testing the heat dissipation limit of a liquid cooling system, using a server as a heat source cannot determine the limit of the liquid cooling system's heat dissipation capacity. This is because liquid cooling systems are designed with a margin of safety, meaning that the heat dissipation capacity of the liquid cooling system will be greater than the heat generated by the server. Furthermore, using a server as a heat source to perform long-term stress testing on the liquid cooling system can easily damage the server and cause unnecessary losses.

[0047] In view of this, the present invention proposes a server dummy load device that can be installed in a liquid cooling system to replace the server's heat generation in order to facilitate testing of the liquid cooling system. At the same time, temperature detection can measure the uniformity of coolant flow.

[0048] Please refer to Figures 1 to 2 The server dummy load device 100 includes at least one dummy load unit, which includes a housing 1, at least one heating element 2, a temperature measuring element, and a circuit board assembly 4. The housing 1 has multiple flow holes 11 on both sides facing each other in the vertical direction. The heating element 2 is located inside the housing 1. The temperature measuring element includes at least one temperature measuring unit 3 located to the side of the heating element 2. The temperature measuring unit 3 includes two first temperature sensors 31 spaced apart horizontally and arranged opposite each other. The two first temperature sensors 31 are flush in the vertical direction and are used to measure the temperature of the flowing coolant. The circuit board assembly 4 is located inside the housing 1 and fixed to the inner wall of the housing 1. The circuit board assembly 4 is electrically connected to the temperature measuring element.

[0049] In this invention, the housing 1 is immersed in coolant. The coolant flows in through the flow hole 11 on the lower side of the housing 1, passes through the heating element 2, and then flows out through the flow hole 11 on the upper side of the housing 1. The heating element 2 can replace the server for heating. Through communication and cooperation between the temperature measuring unit 3 and the circuit board assembly 4, and by using the temperature data of the coolant obtained by two first temperature sensors 31 at different positions at the same height, the uniformity of coolant flow can be determined by the temperature difference. This invention not only replaces the server for testing the cooling system but also allows for the determination of the uniformity of coolant flow through the dummy load unit using two first temperature sensors 31 at different positions at the same height.

[0050] It should be noted that the testing requirements of the cooling system can be met by reasonably designing the number of heat-generating components 2 and / or dummy load units. That is, the required dummy load function can be replaced according to the actual test power requirements. In some embodiments, the usable space of the liquid-cooled TANK is 42U, where U refers to the effective usable space inside the rack. The panels of standard equipment using the rack are generally manufactured according to nU specifications. The CDU is designed to have a heat dissipation power of 42kW. In one embodiment, a single dummy load unit in the server dummy load device 100 occupies 3U of space, and each dummy load unit contains 3 heat-generating components 2. The power of a single heat-generating component 2 is selected to be at least 1kW, thereby meeting the heat dissipation power test requirements of the liquid cooling system.

[0051] The circuit board assembly 4 is set as a PCB (Printed Circuit Board). The first temperature sensor 31 can be directly mounted on the PCB, so that it can be connected to the circuit on the PCB. It can also be connected through communication connection or wire connection. This utility model does not limit this.

[0052] The heating component 2 is capable of generating heat when powered on, thereby simulating the heat generation state during server operation. The specific structural form of the heating component 2 is not limited. In some embodiments, the heating component 2 includes a fixed bracket 21, a heating element 22, and a controller 23. The side of the fixed bracket 21 is fixed to the inner wall of the housing 1; the heating element 22 is mounted on the fixed bracket 21; the controller 23 is fixed to the fixed bracket 21 and electrically connected to the heating element 22 and the circuit board assembly 4. The controller 23 is used to control the heating temperature and on / off state of the heating element 22, thereby enabling the heating component 2 to simulate different heat generation states of the server according to actual testing needs.

[0053] The shape of the fixed bracket 21 is not limited. Its main function is to connect the housing 1 and support the heating element 22. In some embodiments, the fixed bracket 21 is a columnar structure that covers the outside of the heating element 22, thereby providing stable support for the heating element 22. At the same time, the fixed bracket 21 is a frame structure, and the coolant can contact the surface of the heating element 22 through the fixed bracket 21, thereby carrying away some of the heat from the surface of the heating element 22 to achieve the heat dissipation effect.

[0054] It should be noted that heat diffuses during the operation of the heating element 22. Therefore, regarding the positional relationship between the first temperature sensor 31 and the heating element 22, the first temperature sensor 31 can be set at a position corresponding to the heating element 22, or the first temperature sensor 31 and the heating element 22 can be set to be offset vertically. It should be understood that the temperature range detected by the first temperature sensor 31 at different positions is different.

[0055] The specific structure of the heating element 22 is not limited; it can be an electric heating tube, an electric heating plate, etc. Considering the operating conditions, the heating element needs to be compatible with 220VAC and 240VDC operating voltages, and the dummy load power needs to remain consistent under different voltage values. In this embodiment, the heating element 22 includes two heating resistance wires electrically connected to the controller 23. Please refer to the circuit connection diagram of the heating element 2. Figure 5 E11 and E12 are heating resistance wires connected in series. KM1 (AC contactor) is a normally open switch connected in parallel with E12. By default, KM1 is in an open circuit state and controlled by the KM1 pull-in coil. The KM1 pull-in coil is controlled by the isolation transformer d. When contacts 1 and 2 are connected to 220VAC (220V AC), the isolation transformer d only works with AC appliances, thus converting 220VAC to 24VAC (the voltage of the first coil a is 220VAC, and the voltage of the second coil b is 24VAC). At this time, the KM1 pull-in coil e, connected to 24VAC, closes the normally open switch KM1. Only the heating resistance wire E11 is energized and works, with a power of:

[0056] P=220V*220V / R1=220*220 / 48.4=1000W

[0057] Where R1 is the resistance value of E11.

[0058] When contacts 1 and 2 are connected to 240VDC (direct current), and the isolation transformer d only operates for AC appliances, then, since the KM1 coil e is not connected to 24VAC, the normally open switch KM1 is in the open state. At this time, heating resistance wires E11 and E12 are energized, and the power is:

[0059] P=240V*240V / (R1+R2)=240*240 / (48.4+9.2)=1000W

[0060] Where R1 is the resistance value of E11 and R2 is the resistance value of E12.

[0061] This allows for consistent heating power when the heating component 2 is adapted to operating voltages of 220VAC and 240VDC.

[0062] For further details, please refer to Figure 2 Multiple heating elements 2 are provided, arranged at intervals along a horizontal direction; each first temperature sensor 31 is located between two adjacent heating elements 2. The multiple heating elements 2 are placed side-by-side to ensure that each heating element 2 can have sufficient contact with the coolant. Depending on the power requirements, the number of heating elements 2 can be 2, 3, 4, etc., and this invention does not impose any limitation on this.

[0063] Each temperature measuring unit 3 includes at least two first temperature sensors 31. When multiple heating elements 2 are provided, the two first temperature sensors 31 can correspond to the same side of the same heating element 2, or they can correspond to opposite sides of the same heating element 2. It should be understood that the coolant flow rate in the central region is greater, which is more advantageous for evaluating uniformity. Therefore, the two first temperature sensors 31 are preferably placed in the central position. When two heating elements 2 are provided, the two first temperature sensors 31 are both placed between the two heating elements 2. When three heating elements 2 are provided, one first temperature sensor 31 is placed between every two heating elements 2.

[0064] Furthermore, the upper side of the housing 1 is provided with multiple power interfaces 12, and the heating element 2 is connected to the power interfaces 12 via cables 24. Specifically, the heating element 2 is connected via oil-resistant cables, and the connection part of the oil-resistant cables serves a sealing function, and explosion-proof glands can be used.

[0065] Furthermore, a serial port 14 is provided on the upper side of the enclosure 1. The serial port 14 is separated from multiple power interfaces 12 and is used to connect external data cables so that the detected temperature value can be output.

[0066] Please refer to this again. Figure 1 In this embodiment, the heating element 22 is a spring-shaped heating tube made of stainless steel. Its interior mainly consists of a heating wire with a certain resistance. When current flows through the resistor, it heats up. The gap between the heating wire and the stainless steel tube is filled with magnesium powder. An oil-resistant cable connects the heating element 2 to the power interface 12.

[0067] The side of the housing 1 is provided with multiple indicator lights 13 corresponding to multiple power interfaces 12, which are used to indicate the node status of the power interface 12. For example, if there are 3 heating components 2, there are 3 power interfaces 12 and 3 indicator lights 13 respectively. When the corresponding power interface 12 is powered on, the corresponding indicator light 13 will light up; otherwise, the indicator light 13 will be off.

[0068] The exterior of the enclosure 1 has three power interfaces 12 for connecting to 220VAC or 240VDC power supplies, and indicator lights 13 corresponding to the power interfaces 12. Indicator lights 13 emit a green light when they are working. See the circuit connection diagram for each heating component 2. Figure 3 Specifically, EE represents heating element 2, which contains a temperature control switch S1 and a heating element E1. Heating element 2 has pins 1, 2, 3, and PE. Pin 1 is connected to the live wire L of the power socket, pin 2 is connected to the neutral wire N, and pin 3 is connected to the power indicator light HG and then to the neutral wire N. The housing of heating element 2 is connected to the power connector Pin PE via pin PE.

[0069] When the power socket is connected to 220VAC or 240VDC, the live wire L, the neutral wire N, the temperature control switch S1 (the temperature is set to 75℃, that is, when the temperature control switch detects that the temperature reaches 75℃, it will disconnect; the default state is closed), and the heating element E1 form a circuit. At this time, the heating element 22 begins to heat up slowly (in order to prevent the heating element 22 from instantly reaching 75℃ and causing the temperature control switch to disconnect, the power density of the heating element 2 is set to 1W / cm2).

[0070] At the same time, the live wire L, the neutral wire N, the temperature control switch S1, and the indicator light HG form a circuit. At this time, the indicator light will light up. When there is no 220VAC or 240VDC input at the power interface 12, or when the temperature of the heating element 2 exceeds 75℃ and the temperature control switch is disconnected, the indicator light will turn off.

[0071] Please refer to Figure 2 Considering the power conversion between circuit board assembly 4 and heat-generating component 2, power interface 12 is connected to circuit board assembly 4 via power conversion module 5. The power conversion module converts the 220VAC or 240VDC power supplied to power interface 12 to 12V, and the 12V power is then connected to the PCB board via cable 24.

[0072] To increase data for reference, in some embodiments, multiple temperature measuring units 3 are provided, and the multiple temperature measuring units 3 are arranged at intervals in the vertical direction. In another embodiment, the number of first temperature sensors 31 at the same height in the temperature measuring unit 3 can be set to more than two. For example, first temperature sensors 31 are provided between two adjacent heating components 2 and between the heating component 2 located at the edge and the side wall of the housing 1.

[0073] When multiple temperature measuring units 3 are arranged at intervals along the vertical direction, multiple heating components 2 are also provided, with a mating gap formed between adjacent heating components 2. The circuit board assembly 4 includes a main body 41 and multiple extension segments 42. The main body 41 is fixed to the inner wall of the housing 1. One end of each extension segment 42 is connected to the main body 41, and the other end extends into the mating gap. Multiple first temperature sensors 31 are spaced apart on each extension segment 42. By designing the shape of the PCB board, the first temperature sensors 31 can be directly mounted on the PCB board, taking into account both circuit connection and height requirements. It should be noted that the multiple extension segments 42 can extend into the same mating gap and be spaced apart, or the multiple extension segments 42 can extend into multiple mating gaps corresponding to each other. The arrangement is reasonable according to the size of the mating gap and the number of extension segments 42. It should be noted that in this embodiment, two mating gaps are provided, and two extension segments 42 are also provided, with the two extension segments 42 extending into two mating gaps respectively.

[0074] Refer to the circuit connection diagram of multiple temperature measuring units. Figure 4The power conversion module 5 converts the 220VAC or 240VDC power supplied by the power interface 12 into 12V. The 12V power is then connected to the PCB board via a cable. The voltage conversion module (VR) on the PCB board converts the voltage into 3.3V required for the normal operation of the MCU chip (Micro Controller Unit) and the temperature sensor, so that the MCU chip and the temperature sensor can work normally.

[0075] Multiple first temperature sensors 31 located in one of the extensions 42 are T11-T15, all connected to the MCU's I2C bus1 (I2C Inter-Integrated Circuit, a high-efficiency two-wire serial bus). Multiple first temperature sensors 31 located in the other extension 42 are T21-T25, all connected to the MCU's I2C bus2. The MCU chip can obtain the temperature of each temperature test point through the I2C bus and then output the read temperature value through the serial port 14 interface.

[0076] By replacing all servers with dummy load units and testing the liquid cooling system, the uniformity of coolant flow in the liquid cooling tank can be inferred by comparing the values ​​of the first temperature sensor 31 at the same location of each dummy load. That is, if the temperature difference exceeds the expected value, it indicates uneven heat dissipation and also indicates uneven coolant flow.

[0077] It should be understood that the distance between two adjacent temperature measuring units 3 can be the same or different, and this utility model does not limit this.

[0078] Please refer to this again. Figure 2 The server dummy load device 100 is placed inside the liquid-cooled tank. The coolant flows from bottom to top. Considering factors such as coolant flow rate and distribution effect, the tank 1 has two opposing sides along the vertical direction, designated as a first side and a second side. In some embodiments, the flow area of ​​each flow hole 11 on the first side is smaller than the size of each flow hole 11 on the second side, meaning the lower flow hole 11 is larger, thus providing a greater flow rate and facilitating rapid filling of the tank 1's internal space with coolant. The size difference can be adjusted by aspects such as length, width, or even shape. In other embodiments, the number of multiple flow holes 11 on the first side is greater than the number of multiple flow holes 11 on the second side. Since the power interface 12, serial port 14, indicator light 13, etc., all need to be located on the first side, the positions of the flow holes 11 need to correspond, requiring reasonable avoidance while ensuring the required flow rate. Therefore, increasing the number of flow holes meets the requirements.

[0079] In this embodiment, a plurality of strip-shaped flow holes 11 are provided on the first side, and two square flow holes 11 are provided on the second side. The coolant flow rate on the second side is greater than or equal to the coolant flow rate on the first side.

[0080] Furthermore, multiple dummy load units are configured to meet different operating conditions, arranged at intervals along a horizontal direction. Specifically, the arrangement of these dummy load units mimics the layout of multiple servers, thus simulating a multi-server heat dissipation scenario. It should be noted that these dummy load units are independent of each other and can be added or removed according to actual power consumption requirements; however, size limitations must be considered in practical applications.

[0081] To increase the contact area between the heating element 2 and the coolant, the housing 1 is open on one side in the horizontal direction. That is, the coolant can enter the housing 1 not only through the flow hole 11, but also through the open side of the housing 1.

[0082] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A server dummy load device for immersion in coolant, characterized in that, The server dummy load device includes at least one dummy load unit, the dummy load unit comprising: The housing has multiple flow holes on both sides that are opposite each other in the vertical direction; At least one heating element is disposed inside the housing; A temperature measuring assembly includes at least one temperature measuring unit disposed on the side of the heating assembly. The temperature measuring unit includes two first temperature sensors spaced apart horizontally and arranged opposite each other. The two first temperature sensors are aligned vertically. The two first temperature sensors are used to measure the temperature of the flowing coolant. A circuit board assembly is disposed inside the housing and fixed to the inner wall of the housing. The circuit board assembly is electrically connected to the temperature measuring component.

2. The server dummy load device as described in claim 1, characterized in that, The heating component includes: A fixed bracket, the side of which is fixed to the inner wall of the housing; The heating element is mounted on the fixed bracket; and, The controller is fixed to the mounting bracket and electrically connected to the heating element and the circuit board assembly.

3. The server dummy load device as described in claim 2, characterized in that, The heating element includes two heating resistance wires electrically connected to the controller, and at least one of the heating resistance wires is capable of being powered on.

4. The server dummy load device as described in any one of claims 1 to 3, characterized in that, The heating element is provided in multiple ways, and the multiple heating elements are arranged at intervals along the horizontal direction; Each of the first temperature sensors is located between two adjacent heating components.

5. The server dummy load device as described in claim 4, characterized in that, The upper side of the enclosure is equipped with multiple power interfaces; The heating element is connected to the power interface via a cable.

6. The server dummy load device as described in claim 5, characterized in that, The side of the enclosure is equipped with multiple indicator lights, each corresponding to a power interface, to indicate the node status of the power interface; and / or, The power interface is connected to the circuit board assembly via a power conversion module.

7. The server dummy load device as described in claim 1, characterized in that, The temperature measuring unit is provided in multiple ways, and the multiple temperature measuring units are arranged at intervals along the vertical direction.

8. The server dummy load device as described in claim 7, characterized in that, Multiple heating elements are provided, and a fitting gap is formed between two adjacent heating elements; The circuit board assembly includes: The main body is fixed to the inner wall of the box; Multiple extension segments, one end of which is connected to the main body and the other end extends into the mating gap, and multiple first temperature sensors are provided at intervals on each of the extension segments; In this configuration, multiple extension segments extend into the same mating gap and are spaced apart, or multiple extension segments extend into multiple mating gaps respectively.

9. The server dummy load device as described in claim 1, characterized in that, The box body is configured with two opposite sides along the vertical direction as a first side and a second side, wherein, The flow area of ​​each of the flow holes on the first side is smaller than the size of each of the flow holes on the second side; and / or, The number of the plurality of flow holes on the first side is greater than the number of the plurality of flow holes on the second side.

10. The server dummy load device as described in claim 1, characterized in that, Multiple dummy load units are provided, and the multiple dummy load units are arranged at intervals along the horizontal direction; and / or, The enclosure is open on one side in the horizontal direction.

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