LED lamp bead and LED light source

Abstract

This application provides an LED lamp bead and an LED light source. The LED lamp bead includes a substrate; at least one LED chip located on the substrate; a first dam located on each of the LED chips; a light-shielding layer located on the substrate and on the area of ​​the LED chip outside the first dam, the light-shielding layer and the first dam jointly defining the shape of the light emitted by the corresponding LED chip; and a light conversion layer located at least on the LED chip within the first dam. This application utilizes the first dam and the light-shielding layer to define the shape of the light emitted by the LED chip, allowing the light emitted by the LED chip to change from a square shape to other desired shapes, resulting in lower cost, simpler manufacturing process, and higher mass production efficiency.

Description

Technical Field

[0001] This application relates to the field of LED lighting technology, specifically to an LED lamp bead and an LED light source. Background Technology

[0002] LED (Light Emitting Diode) is a solid-state semiconductor device with advantages such as high brightness, low operating voltage, low power consumption, easy matching with integrated circuits, simple driving, and long life. It has been widely used as a light source in the lighting field.

[0003] Some LED products require light spots of special shapes (such as circles, ovals, etc.), but since LED chips are usually square, it is difficult to achieve special-shaped light spots with low cost and simple processes. For example, in some LED products such as flashlights, LED beads need to emit circular light spots. Currently, there are two main types of LED beads that produce circular light spots. One type directly makes the LED chip inside the LED bead circular, which is relatively expensive. The other type involves attaching a circular glass sheet to the surface of a square LED chip, with the area outside the circular glass sheet being light-shielded. This solution requires high light transmittance of the glass sheet and also needs to consider the glass bonding problem. Utility Model Content

[0004] In view of this, the embodiments of this application aim to provide an LED lamp bead and an LED light source to solve the problems of high cost and complex process of existing LED lamp beads that produce special shaped light spots.

[0005] This application provides an LED light bead, including:

[0006] substrate;

[0007] At least one LED chip is located on the substrate;

[0008] The first dike is located on each of the LED chips;

[0009] A light-shielding layer is located on the substrate and the area where the LED chip is located outside the first dam, the light-shielding layer and the first dam together defining the shape of the light emitted by the corresponding LED chip; and...

[0010] A light conversion layer is located, at least, on the LED chip within the first dike.

[0011] In some embodiments, the first cofferdam is at least one of a circle, an ellipse, or a polygon; and / or, the edge of the first cofferdam does not extend beyond the edge of the corresponding LED chip.

[0012] In some embodiments, the height of the light-shielding layer gradually decreases from the edge of the substrate to the center.

[0013] In some embodiments, the materials of the first cofferdam and the light-shielding layer are both light-shielding adhesives, and the viscosity of the light-shielding adhesive used in the first cofferdam is greater than the viscosity of the light-shielding adhesive used in the light-shielding layer.

[0014] In some embodiments, the light conversion layer is located at least on the LED chip, and the first dike is located on the light conversion layer.

[0015] In some embodiments, it also includes:

[0016] A second dam is located on the substrate and surrounds each of the LED chips, and the light-shielding layer fills the gap between the first dam and the second dam.

[0017] In some embodiments, the top surface of the second cofferdam is higher than the top surface of the first cofferdam, and the top surface of the shading layer gradually transitions from being flush with the top surface of the second cofferdam to being flush with the top surface of the first cofferdam.

[0018] In some embodiments, both the first and second cofferdams are made of light-shielding adhesive, and the viscosity of the light-shielding adhesive used in the first cofferdam is the same as that used in the second cofferdam.

[0019] This application also provides an LED light source, including the aforementioned LED beads.

[0020] In some embodiments, the LED light source is a flashlight, the LED bead includes one LED chip, and the first dam is circular in shape.

[0021] This application provides an LED lamp bead and an LED light source. The LED lamp bead includes a substrate; at least one LED chip located on the substrate; a first dam located on each of the LED chips; a light-shielding layer located on the substrate and on the area of ​​the LED chip outside the first dam, the light-shielding layer and the first dam jointly defining the shape of the light emitted by the corresponding LED chip; and a light conversion layer located at least on the LED chip within the first dam. This application utilizes the first dam and the light-shielding layer to define the shape of the light emitted by the LED chip, allowing the light emitted by the LED chip to change from a square shape to other desired shapes, resulting in lower cost, simpler manufacturing process, and higher mass production efficiency. Attached Figure Description

[0022] Figure 1 This is a flowchart illustrating a method for preparing LED beads according to an embodiment of this application.

[0023] Figure 2 This is a schematic diagram of the structure of a die-bonded LED chip on a substrate provided in an embodiment of this application.

[0024] Figure 3 and Figure 4 This is a schematic diagram of a structure for forming a second dam on a substrate, provided as an embodiment of this application.

[0025] Figure 5 and Figure 6 This is a schematic diagram of a structure for forming a first dam on an LED chip, provided as an embodiment of this application.

[0026] Figure 7 This is a schematic diagram of a structure for forming a light conversion layer on an LED chip, provided in an embodiment of this application.

[0027] Figure 8 This is a cross-sectional schematic diagram of an LED lamp bead provided in an embodiment of this application.

[0028] Figure 9 This is a plan view of an LED lamp bead provided in an embodiment of this application.

[0029] Figure 10 This is a schematic diagram of a structure for forming a light conversion layer on an LED chip, provided in an embodiment of this application.

[0030] Figure 11 This is a schematic diagram of a structure for forming a first dam on a light conversion layer, provided as an embodiment of this application.

[0031] Figure 12 This is a cross-sectional schematic diagram of another LED lamp bead provided in an embodiment of this application.

[0032] Figure 13 This is a schematic diagram of a structure for bonding multiple LED chips onto a substrate, according to an embodiment of this application.

[0033] Figure 14 This is a schematic diagram of a second dam structure formed on a substrate in the form of a grid, according to an embodiment of this application.

[0034] The attached figures are labeled as follows:

[0035] 100 - Substrate; 200 - LED chip; 301 - Second cofferdam; 302 - First cofferdam; 400 - Light conversion layer; 500 - Light shielding layer. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] Figure 8 This is a cross-sectional schematic diagram of an LED lamp bead provided in one embodiment of this application. Figure 9 This is a top view of an LED lamp bead provided in one embodiment of this application. Figure 8 and Figure 9 As shown, the LED lamp bead includes a substrate 100, at least one LED chip 200, a first dam 302, a light-shielding layer 500, and a light conversion layer 400. The LED chips 200 are located on the substrate 100, and the first dam 302 is located on each LED chip 200. The light-shielding layer 500 is located on the substrate 100 and the area of ​​the LED chip 200 outside the first dam 302, and the light-shielding layer 500 and the first dam 302 together define the shape of the light emitted by the corresponding LED chip 200. The light conversion layer 400 is located at least on the LED chip 200 within the first dam 302. This application utilizes the first dam 302 and the light-shielding layer 500 to define the shape of the light emitted by the LED chip 200, allowing the light emitted by the LED chip 200 to change from a square shape to other desired shapes, resulting in lower cost, simpler manufacturing process, and higher mass production efficiency.

[0038] Specifically, the substrate of the substrate 100 can be made of ceramic materials (including one or more of AlN, Al2O3, SiO, SiO2, Si3N4, and SiON) or metal materials (including aluminum or copper). Electrical connectors such as plugs and pads can be provided within the substrate 100 to bring out the LED chip 200.

[0039] The substrate 100 may have one LED chip 200 or two or more LED chips 200. When the substrate 100 has two or more LED chips 200, the LED chips 200 can be arranged in an array on the substrate 100. The LED chips 200 can be attached to the substrate 100 using die-attach adhesive and then interconnected with electrical connectors within the substrate 100 using leads. In some embodiments, the LED chips 200 can also be flip-chip soldered onto the substrate 100, thus eliminating the constraints of leads and die-attach adhesive, resulting in LED chips 200 with high thermal conductivity, low thermal resistance, high current tolerance, stronger reliability, higher luminous flux maintenance, and longer lifespan.

[0040] Furthermore, the excitation light generated by the LED chip 200 can be blue light, violet light, or ultraviolet light, etc. Based on this, the LED chip 200 can be a blue LED chip, such as a GaN-based LED chip that emits blue light, or a violet or ultraviolet LED chip.

[0041] The first cofferdam 302 is located on each LED chip 200. Specifically, the first cofferdam 302 can be directly formed on the top surface (light-emitting surface) of the LED chip 200. The light emitted by the LED chip 200 will only exit from within the first cofferdam 302. Therefore, the shape of the first cofferdam 302 determines the shape of the light emitted by the LED chip 200, and adjusting the shape of the first cofferdam 302 can adjust the shape of the light emitted by the LED chip 200. Furthermore, the material of the first cofferdam 302 can be a light-shielding adhesive, such as black or white adhesive. The material of the first cofferdam 302 can be a light-shielding adhesive with high viscosity, thereby simplifying the fabrication of the first cofferdam 302.

[0042] In some embodiments, the shape of the first cofferdam 302 can be at least one of a circle, an ellipse, and a polygon (e.g., a triangle, a rectangle, a trapezoid, a pentagon, a hexagon, etc.). In this case, the light emitted by the LED chip 200 can also be adjusted to a circle, an ellipse, or a polygon. The color of the first cofferdam 302 can be black or white, and this application does not impose any restrictions.

[0043] It should be noted that the edge of the first cofferdam 302 should preferably not extend beyond the edge of the LED chip 200. For example, the edge of the first cofferdam 302 can be located within the edge of the LED chip 200, or the edge of the first cofferdam 302 can partially coincide with the edge of the LED chip 200.

[0044] In some embodiments, the substrate 100 further includes a second dam 301 surrounding each LED chip 200, with a certain gap between the second dam 301 and the edge of the LED chip 200. For example, when the substrate 100 has two or more LED chips 200 arranged in an array, the second dam 301 can be in the form of a grid, with each LED chip 200 exposed from a corresponding grid of the second dam 301. Furthermore, the material of the second dam 301 can also be a light-shielding adhesive, such as black or white adhesive. The material of the second dam 301 can be a light-shielding adhesive with a high viscosity, thereby simplifying the fabrication of the second dam 301. For example, the viscosity of the light-shielding adhesive used in the first dam 302 can be the same as the viscosity of the light-shielding adhesive used in the second dam 301.

[0045] Furthermore, the top surface of the first cofferdam 302 may be lower than the top surface of the second cofferdam 301, which will give the light-shielding layer 500 a bowl-shaped morphology. The light-shielding layer 500 can reflect light, which is beneficial to the light emission of LED beads. In some embodiments, the top surface of the first cofferdam 302 may also be flush with the top surface of the second cofferdam 301.

[0046] Furthermore, the light conversion layer 400 is located at least on the LED chip 200 within the first cofferdam 302. The conversion layer can receive the excitation light emitted by the LED chip 200 and generate corresponding output light. Specifically, the light conversion layer 400 contains a light conversion material, which can absorb the excitation light generated by the LED chip 200 and generate light of a corresponding color, ultimately mixing to form the output light. The light conversion layer 400 in this application can be formed by mixing a colloid and a light conversion material. The light conversion material can be quantum dots or phosphors, and the colloid can be materials such as silicone. That is, the light conversion layer 400 can be a quantum dot layer or a phosphor layer.

[0047] In some embodiments, the light conversion layer 400 may also be located on the area of ​​the LED chip 200 outside the first dike 302 and on the substrate 100, but this does not affect the implementation of this application.

[0048] In some embodiments, the top surface of the light conversion layer 400 within the first cofferdam 302 may be flush with the top surface of the first cofferdam 302, making the surface of the LED beads relatively flat. However, this should not be a limitation, as the top surface of the light conversion layer 400 within the first cofferdam 302 may also be higher or lower than the top surface of the first cofferdam 302.

[0049] Figure 12 This is a cross-sectional schematic diagram of another LED lamp bead provided in one embodiment of this application. (See attached diagram.) Figure 12 As shown, the light conversion layer 400 can also be directly formed on the LED chip 200, with the first cofferdam 302 located on the light conversion layer 400. In this case, the first cofferdam 302 also needs to be located above the LED chip 200, and the edge of the first cofferdam 302 should preferably not extend beyond the edge of the LED chip 200. Furthermore, the first cofferdam 302 can still define the shape of the light emitted by the LED chip 200; adjusting the shape of the first cofferdam 302 can adjust the light emission shape of the LED chip 200.

[0050] Please continue reading Figure 8 or Figure 12 The light-shielding layer 500 is located on the area outside the first dike 302 of the substrate 100 and the LED chip 200. Figure 9As can be seen, the light-shielding layer 500 is annular and fills the gap between the first cofferdam 302 and the second cofferdam 301. At this time, the area of ​​the LED chip 200 outside the first cofferdam 302 is also covered by the light-shielding layer 500. Therefore, only light within the first cofferdam 302 can be emitted, while light outside the first cofferdam 302 is absorbed by the light-shielding layer 500, thus forming a light spot with the same shape as the first cofferdam 302, such as a circular, elliptical, or polygonal light spot. The first cofferdam 302 is preferably circular, which allows for the formation of LED beads capable of producing circular light spots, suitable for applications such as flashlights.

[0051] Of course, if the second cofferdam 301 is omitted, the light-shielding layer 500 can extend from the first cofferdam 302 to the edge of the substrate 100. The material of the light-shielding layer 500 can also be a light-shielding adhesive, but the viscosity of the light-shielding adhesive used in the light-shielding layer 500 can be lower than the viscosity of the light-shielding adhesive used in the first cofferdam 302 and the second cofferdam 301, thereby simplifying the preparation process of the light-shielding layer 500 and allowing the light-shielding layer 500 to have a cup-shaped morphology.

[0052] Please continue reading Figure 8 or Figure 12 The height of the light-shielding layer 500 gradually decreases from the edge to the center of the substrate 100. For example, the top surface of the light-shielding layer 500 can gradually transition from being flush with the top surface of the second cofferdam 301 to being flush with the top surface of the first cofferdam 302. In this way, the light-shielding layer 500 can have a bowl-like shape, which can act as a bowl to reflect light and improve light utilization.

[0053] Of course, in some embodiments, the top surface of the second cofferdam 301 can be flush with the top surface of the first cofferdam 302. In this case, the top surface of the light-shielding layer 500 can also be flush with the top surfaces of the second cofferdam 301 and the first cofferdam 302.

[0054] Undoubtedly, the aforementioned LED beads can be applied to various light-emitting fields. For example, they can be made into backlight modules for display backlighting (such as backlight modules for televisions, monitors, mobile phones, etc.). In this case, they can be used in backlight modules. Besides display backlighting, they can also be used in button backlighting, photography, home lighting, medical lighting, decoration, automotive, and transportation. When applied to button backlighting, they can serve as the backlight source for buttons on devices with buttons such as mobile phones, calculators, and keyboards; when applied to photography, they can be used as flashlights for cameras; when applied to home lighting, they can be used to make floor lamps, table lamps, lighting lamps, ceiling lights, downlights, and spotlights; when applied to medical lighting, they can be used to make surgical lights and low-electromagnetic lighting lamps; when applied to decoration, they can be used to make various decorative lights, such as colored lights, landscape lighting, and advertising lights; when applied to the automotive industry, they can be used to make car lights and indicator lights; and when applied to the transportation industry, they can be used to make various traffic lights and streetlights. The above applications are merely a few examples of applications exemplified in this embodiment. It should be understood that the applications of LED beads in this embodiment are not limited to the few fields exemplified above.

[0055] Based on this, some embodiments of this application also provide an LED light source, which includes at least one of the aforementioned LED beads. The LED beads in the LED light source can be in one or more rows, and can be used in light sources such as direct-lit LED light sources and edge-lit LED light sources.

[0056] Based on this, an embodiment of this application also provides a method for preparing the above-mentioned LED lamp beads. Figure 1 A flowchart of the LED chip fabrication method, such as... Figure 1 As shown, the method for manufacturing LED beads includes:

[0057] Step S100: Provide substrate 100;

[0058] Step S200: At least one LED chip 200 is die-bonded onto the substrate 100;

[0059] Step S300: Form a first dam 302 on each LED chip 200;

[0060] Step S400: A light conversion layer 400 is formed on the LED chip 200 at least within the first cofferdam 302; and,

[0061] Step S500: A light-shielding layer 500 is formed on the substrate 100 and in the area of ​​the LED chip 200 outside the first dam 302. The light-shielding layer 500 and the first dam 302 together define the shape of the light emitted by the corresponding LED chip 200.

[0062] Figures 2 to 14 This is a schematic diagram of the corresponding steps in the method for preparing an LED bead according to an embodiment of this application. Next, we will combine... Figures 2 to 14 The preparation method of LED lamp beads is described in detail.

[0063] like Figure 2 As shown, in step S100, a substrate 100 is provided. The substrate 100 can be made of ceramic materials (including one or more of AlN, Al2O3, SiO, SiO2, Si3N4, and SiON) or metal materials (including aluminum or copper). Electrical connectors such as plugs and pads can be provided in the substrate 100 to bring out the LED chip 200.

[0064] Please continue reading Figure 2 As shown, in step S200, the LED chip 200 is die-bonded onto the substrate 100. The LED chip 200 can be attached to the substrate 100 using die-bonding adhesive, and then interconnected with electrical connectors within the substrate 100 using leads. In some embodiments, the LED chip 200 can also be flip-chip soldered onto the substrate 100, thus eliminating the constraints of leads and die-bonding adhesive, resulting in a higher thermal conductivity, lower thermal resistance, and the ability to withstand high currents, leading to greater reliability, higher luminous flux maintenance, and a longer lifespan for the LED chip 200.

[0065] like Figure 3 and Figure 4 As shown, a second dam 301 is formed on the substrate 100, surrounding the LED chip 200, with a certain gap between the second dam 301 and the edge of the LED chip 200. The material of the second dam 301 can be a light-shielding adhesive with high viscosity. When the light-shielding adhesive with high viscosity is applied to the substrate 100, it can maintain a fixed shape on the substrate 100 without flowing, and the second dam 301 is formed after curing.

[0066] like Figure 5 and Figure 6As shown, in step S300, a first dam 302 is formed on each LED chip 200. The first dam 302 can be directly formed on the top surface (light-emitting surface) of the LED chip 200. After the LED chip is fabricated, the light emitted by the LED chip 200 will only exit from the first dam 302. Therefore, the first dam 302 can determine the shape of the light emitted by the LED chip 200. Adjusting the shape of the first dam 302 can adjust the light-emitting shape of the LED chip 200. The material of the first dam 302 can be the same as the material of the second dam 301. For example, the material of the first dam 302 can also be a light-shielding adhesive with high viscosity. When the light-shielding adhesive with high viscosity is applied to the LED chip 200, it can maintain a fixed shape on the LED chip 200 without flowing. After curing, the first dam 302 is formed.

[0067] In some embodiments, the shape of the first cofferdam 302 may be at least one of a circle, an ellipse, and a polygon (e.g., a triangle, a rectangle, a trapezoid, a pentagon, a hexagon, etc.), and the color of the first cofferdam 302 may be black or white, without limitation in this application.

[0068] It should be noted that the edge of the first cofferdam 302 should preferably not extend beyond the edge of the LED chip 200. For example, the edge of the first cofferdam 302 can be located within the edge of the LED chip 200, or the edge of the first cofferdam 302 can partially coincide with the edge of the LED chip 200.

[0069] Furthermore, after the first cofferdam 302 is formed, the top surface of the first cofferdam 302 can be lower than the top surface of the second cofferdam 301. This will allow the subsequently formed light-shielding layer 500 to have a cup-like shape, and the light-shielding layer 500 can reflect light, which is beneficial to the light emission of LED beads. In some embodiments, the top surface of the first cofferdam 302 can also be flush with the top surface of the second cofferdam 301.

[0070] like Figure 7As shown, in step S400, a light conversion layer 400 is formed on the LED chip 200 within the first cofferdam 302. Specifically, an adhesive prepared from a light conversion material can be applied to the LED chip 200 within the first cofferdam 302, and after curing, the light conversion layer 400 is formed on the LED chip 200 within the first cofferdam 302. The light conversion layer 400 can receive the excitation light emitted by the LED chip 200 and generate corresponding output light. Specifically, the light conversion layer 400 contains a light conversion material, which can absorb the excitation light generated by the LED chip 200 and generate light of the corresponding color, which is ultimately mixed to form the output light. The light conversion layer 400 in this application can be formed by mixing a colloid and a light conversion material. The light conversion material can be quantum dots or phosphors, and the colloid can be materials such as silicone. That is, the light conversion layer 400 can be a quantum dot layer or a phosphor layer.

[0071] In some embodiments, the adhesive made of light conversion material can also be sprayed onto the LED chip 200 by spraying. In this case, some adhesive made of light conversion material may also be sprayed onto the surface of the substrate 100, so that the light conversion layer 400 formed after curing is still located on the area of ​​the LED chip 200 outside the first dike 302 and on the substrate 100, but this does not affect the implementation of this application.

[0072] In some embodiments, the top surface of the light conversion layer 400 within the first cofferdam 302 may be flush with the top surface of the first cofferdam 302, making the surface of the LED beads relatively flat. However, this should not be a limitation, as the top surface of the light conversion layer 400 within the first cofferdam 302 may also be higher or lower than the top surface of the first cofferdam 302.

[0073] like Figure 8 and Figure 9 As shown, in step S500, a light-shielding layer 500 is formed on the substrate 100 and in the area of ​​the LED chip 200 outside the first dam 302. The material of the light-shielding layer 500 can also be a light-shielding adhesive, but the viscosity of the light-shielding adhesive used in the light-shielding layer 500 will be lower than the viscosity of the light-shielding adhesive used in the first dam 302 and the second dam 301. When forming the light-shielding layer 500, the light-shielding adhesive with lower viscosity can be applied in the gap between the first dam 302 and the second dam 301. The light-shielding adhesive with lower viscosity has stronger fluidity and can spontaneously flow in the gap between the first dam 302 and the second dam 301, thereby filling the gap between the first dam 302 and the second dam 301. After curing, the light-shielding layer 500 is formed, which can fill the gap between the first dam 302 and the second dam 301.

[0074] Furthermore, when the top surface of the second cofferdam 301 is higher than the top surface of the first cofferdam 302, the light-shielding adhesive with lower viscosity flows in the gap between the first cofferdam 302 and the second cofferdam 301, forming a sloping shape on the top surface. After curing, the top surface of the light-shielding layer 500 gradually transitions from being flush with the top surface of the second cofferdam 301 to being flush with the top surface of the first cofferdam 302, resembling the shape of a bowl, so that the light-shielding layer 500 can act as a bowl to reflect light.

[0075] Of course, if the top surface of the second cofferdam 301 is flush with the top surface of the first cofferdam 302, the top surface of the shading layer 500 can also be flush with the top surfaces of the second cofferdam 301 and the first cofferdam 302, which does not affect the implementation of this application.

[0076] In some embodiments, after forming the second cofferdam 301, the light conversion layer 400 can be formed first, followed by the formation of the first cofferdam 302. Specifically, as... Figure 10 As shown, after the second cofferdam 301 is formed, a light conversion layer 400 is formed on at least the LED chip 200. Specifically, an adhesive made of light conversion material can be applied to the LED chip 200, and after curing, the light conversion layer 400 can be formed on the LED chip 200. Alternatively, a thin film made of light conversion material can be attached to the LED chip 200 to form the light conversion layer 400.

[0077] In some embodiments, the adhesive made of light conversion material can also be sprayed onto the LED chip 200 by spraying. In this case, some adhesive made of light conversion material may also be sprayed onto the surface of the substrate 100, so that the light conversion layer 400 formed after curing is still located on the substrate 100, but this does not affect the implementation of this application.

[0078] like Figure 11 As shown, a first dam 302 is formed on the light conversion layer 400. Specifically, the first dam 302 also needs to be located above the LED chip 200, and the edge of the first dam 302 preferably does not extend beyond the edge of the LED chip 200. At this time, the first dam 302 can still limit the shape of the light emitted by the LED chip 200, and the shape of the first dam 302 can be adjusted to adjust the shape of the light emitted by the LED chip 200.

[0079] like Figure 12 As shown, a light-shielding layer 500 is formed on the substrate 100 and in the area of ​​the LED chip 200 outside the first dike 302. The specific steps for forming the light-shielding layer 500 have been described above and will not be repeated here.

[0080] In some embodiments, the substrate 100 may have two or more LED chips 200. In this case, a first cofferdam 302 is located on each LED chip 200, and a second cofferdam 301 surrounds each LED chip 200. Specifically, as shown... Figure 13 As shown, the substrate 100 can have two or more light-emitting regions, which can be arranged in an array, and each light-emitting region can have an LED chip 200 deposited within it. Figure 14 As shown, a second dam 301 is formed on the substrate 100. The second dam 301 can be in the form of a grid, thereby surrounding each LED chip 200. There is still a certain gap between the second dam 301 and the edge of the LED chip 200.

[0081] Subsequently, a first dam 302 and a light conversion layer 400 can be formed on each LED chip 200 according to the steps described above, and a light-shielding adhesive can be applied and cured in the gap between the first dam 302 and the second dam 301 to form a light-shielding layer 500.

[0082] It should be noted that in some embodiments, regardless of the number of LED chips 200 on the substrate 100, the step of forming the second dam 301 can be omitted. Instead, when forming the light-shielding layer 500, a mold can be used to cover the substrate 100, and then a light-shielding adhesive with low viscosity can be applied to the substrate 100. The adhesive's strong flow properties allow it to spread to the entire area of ​​the substrate 100 outside the first dam 302. After curing the adhesive, the light-shielding layer 500 is formed, and then the mold can be removed. Furthermore, even if the second dam 301 is omitted, the light-shielding layer 500 can still separate adjacent LED chips 200, thus preventing optical crosstalk between them.

[0083] Furthermore, when the substrate 100 has multiple LED chips 200, after forming the light-shielding layer 500, a cutting process can be performed to separate individual LED beads. Each LED bead can include a specific number of LED chips 200. In this way, a specific number of LED beads can be applied to specific applications. For example, when used in a flashlight, individual LED chips 200 can be cut and separated to form an LED bead containing individual LED chips 200. Since flashlights require a circular light spot with high central light intensity and a small luminous surface, otherwise the flashlight will have problems such as flooding and difficulty in illuminating distant areas. LED beads packaged with such individual LED chips 200 can achieve flashlight illumination at a lower cost and with better lighting effects.

[0084] In summary, one embodiment of this application provides an LED lamp bead and an LED light source. The LED lamp bead includes a substrate 100; at least one LED chip 200 located on the substrate 100; a first dam 302 located on each LED chip 200; a light-shielding layer 500 located on the substrate 100 and the area of ​​the LED chip 200 outside the first dam 302, the light-shielding layer 500 and the first dam 302 jointly defining the shape of the light emitted by the corresponding LED chip 200; and a light conversion layer 400 located at least on the LED chip 200 within the first dam 302. This application utilizes the first dam 302 to define the shape of the light emitted by the LED chip 200, and utilizes the light-shielding layer 500 to block the light in the area outside the first dam 302, so that the light emitted by the LED chip 200 can be changed from a square shape to other desired shapes. This approach has lower costs, simpler manufacturing processes, and higher mass production efficiency.

[0085] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the systems disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple, and relevant parts can be referred to the method section.

[0086] It should also be noted that although preferred embodiments have been disclosed above, these embodiments are not intended to limit this application. Any person skilled in the art can make many possible variations and modifications to the technical solutions of this application, or modify them into equivalent embodiments, without departing from the scope of the technical solutions of this application. Therefore, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this application, without departing from the content of the technical solutions of this application, shall still fall within the scope of protection of the technical solutions of this application.

[0087] It should also be understood that, unless otherwise specified or indicated, the terms “first,” “second,” “third,” etc., in the specification are used only to distinguish the various components, elements, and steps in the specification, and not to indicate the logical or sequential relationships between the various components, elements, and steps.

[0088] Furthermore, it should be recognized that the terminology described herein is used only to describe particular embodiments and is not intended to limit the scope of this application. It must be noted that the singular forms “a” and “an” as used herein include plural bases unless the context clearly indicates the opposite. For example, a reference to “a step” or “an apparatus” means a reference to one or more steps or apparatuses, and may include secondary steps and secondary apparatuses. All conjunctions used should be understood in the broadest sense. Also, the word “or” should be understood as having the definition of logical “or”, not logical “exclusive OR”, unless the context clearly indicates the opposite. Furthermore, implementations of the methods and / or devices in the embodiments of this application may include performing selected tasks manually, automatically, or in combination.

Claims

1. An LED lamp bead, characterized in that, include: substrate(100); At least one LED chip (200) is located on the substrate (100); The first cofferdam (302) is located on each of the LED chips (200); A light-shielding layer (500) is located on the area of ​​the substrate (100) and the LED chip (200) outside the first dike (302), the light-shielding layer (500) and the first dike (302) together define the light-emitting shape of the corresponding LED chip (200); and, A light conversion layer (400) is located on the LED chip (200) at least within the first dike (302).

2. The LED lamp bead according to claim 1, characterized in that, The first cofferdam (302) is in the shape of at least one of a circle, an ellipse, or a polygon; and / or, the edge of the first cofferdam (302) does not extend beyond the edge of the corresponding LED chip (200).

3. The LED lamp bead according to claim 1, characterized in that, The height of the light-shielding layer (500) gradually decreases from the edge of the substrate (100) towards the center.

4. The LED lamp bead according to claim 1, characterized in that, The materials of the first cofferdam (302) and the light-shielding layer (500) are both light-shielding adhesives, and the viscosity of the light-shielding adhesive used in the first cofferdam (302) is greater than the viscosity of the light-shielding adhesive used in the light-shielding layer (500).

5. The LED lamp bead according to claim 1, characterized in that, The light conversion layer (400) is located at least on the LED chip (200), and the first dike (302) is located on the light conversion layer (400).

6. The LED lamp bead according to any one of claims 1 to 5, characterized in that, Also includes: A second dam (301) is located on the substrate (100) and surrounds each of the LED chips (200), and the light-shielding layer (500) fills the gap between the first dam (302) and the second dam (301).

7. The LED lamp bead according to claim 6, characterized in that, The top surface of the second cofferdam (301) is higher than the top surface of the first cofferdam (302), and the top surface of the shading layer (500) gradually transitions from being flush with the top surface of the second cofferdam (301) to being flush with the top surface of the first cofferdam (302).

8. The LED lamp bead according to claim 6, characterized in that, The materials of the first cofferdam (302) and the second cofferdam (301) are both light-shielding adhesives, and the viscosity of the light-shielding adhesive used in the first cofferdam (302) is the same as that used in the second cofferdam (301).

9. An LED light source, characterized in that, It includes at least one LED lamp bead as described in any one of claims 1 to 8.

10. The LED light source as described in claim 9, characterized in that, The LED light source is a flashlight, the LED bead includes an LED chip (200), and the first dam (302) is circular in shape.

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