washer, washing machine

Abstract

The application relates to the technical field of photovoltaic cells, and particularly provides a cleaning machine. The application aims to solve the problems of low efficiency of manual detection and removal of over-etched pieces, and pollution of the pieces and breakage of the pieces caused by manual taking and placing of the pieces during detection. To this end, the application provides a cleaning machine, which comprises a first cleaning mechanism and a second cleaning mechanism, the second cleaning mechanism comprises opposite conveying sides and collecting sides; a removal device is arranged between the first cleaning mechanism and the second cleaning mechanism and comprises a lifting assembly and a third cleaning mechanism; a transition component is connected between the second cleaning mechanism and the removal device and is provided with a normal piece flow inlet and an over-etched piece flow inlet; an over-etched piece collecting device is arranged on the collecting side; the lifting assembly is used for lifting the normal silicon pieces on the third cleaning mechanism into the normal piece flow inlet and making the over-etched pieces fall into the over-etched piece collecting device through the over-etched piece flow inlet. The application can automatically guide the over-etched pieces out of the machine, improve the removal efficiency of the over-etched pieces, and avoid the problems of pollution and breakage of the pieces.

Description

Technical Field

[0001] This application relates to the field of photovoltaic cell technology, specifically to a cleaning machine. Background Technology

[0002] In photovoltaic cell manufacturing, removing the borosilicate glass (BSG) or phosphosilicate glass (PSG) layers from the back and periphery of silicon wafers using a chain cleaning machine is a key process for improving cell performance. During the operation of the chain cleaning machine, the drive rollers continuously carry the chemical solution from the process tank to etch the back and periphery of the silicon wafers flowing above the drive rollers. When an abnormal blockage occurs in the main unit or automated loading and unloading device of the chain cleaning machine, the chain cleaning machine must be stopped for troubleshooting. At this time, the silicon wafers remaining in the process tank have undergone over-etching due to prolonged contact with the chemical solution. Before restarting the chain cleaning machine, the over-etched wafers need to be rejected.

[0003] The existing technology involves feeding over-etched and normal cells together into a basket, followed by manual inspection to remove over-etched cells. However, manually removing over-etched cells is inefficient, and the process requires manual handling of the cells, which may contaminate them or even cause them to break.

[0004] Accordingly, a new technical solution is needed in this field to solve the above problems. Utility Model Content

[0005] In order to solve at least one of the above-mentioned problems in the prior art, namely, to solve the problem that manual inspection and removal of over-cut cells is inefficient, and that manual handling of cells during inspection may contaminate the cells or even cause them to break.

[0006] In a first aspect, this application provides a cleaning machine, the cleaning machine comprising: a first cleaning mechanism and a second cleaning mechanism, the second cleaning mechanism including a conveying side and a collecting side disposed opposite to each other; a rejection device disposed between the first cleaning mechanism and the second cleaning mechanism; the rejection device including a lifting assembly and a third cleaning mechanism disposed on the lifting assembly; a transition member connecting the second cleaning mechanism and the rejection device, having a normal wafer flow inlet located on the conveying side and an over-etched wafer flow inlet located on the collecting side; and an over-etched wafer collection device disposed on the collecting side; wherein, the lifting assembly is used to lift and lower to allow normal silicon wafers on the third cleaning mechanism to enter the normal wafer flow inlet, and to allow over-etched wafers on the third cleaning mechanism to fall into the over-etched wafer collection device through the over-etched wafer flow inlet.

[0007] In some embodiments, the cleaning machine further includes a second process tank disposed on the collection side, wherein the normal wafer flow inlet and the over-cut wafer flow inlet are disposed on the tank wall of the second process tank near the rejection device.

[0008] In some embodiments, the cleaning machine further includes a die-cutting collection tank disposed in the second process tank, the die-cutting collection tank being located on the collection side of the die-cutting inlet and connected to the tank wall where the die-cutting inlet is located; wherein, the die-cutting collection device is the die-cutting collection tank or the second process tank.

[0009] In some embodiments, the overcut collection tank includes a bottom wall, a support strip is provided on the side of the bottom wall near the rejection device, and a plurality of overflow holes are also provided on the bottom wall.

[0010] In some embodiments, at least one mounting port is provided on the wall of the second process tank, and the die collection tank is provided with a connector corresponding to each mounting port, the connector being adapted to be inserted into the corresponding mounting port.

[0011] In some embodiments, the second process tank is further provided with a first waste discharge pipe; and / or, the cleaning machine further includes a second support, which is disposed below the second process tank for supporting the second process tank; and / or, the first cleaning mechanism, the second cleaning mechanism and the third cleaning mechanism are all composed of multiple drive rollers.

[0012] In some embodiments, the rejection device further includes a support base and a rejection groove; the rejection groove is slidably disposed on the support base; the third cleaning mechanism is disposed in the rejection groove, and the two opposite groove walls of the rejection groove distributed along the silicon wafer transport direction are respectively provided with a silicon wafer inlet and a silicon wafer outlet.

[0013] In some embodiments, the rejection device further includes a spraying device disposed in the rejection trough, the spraying device including a spray pipe and a water inlet pipe communicating with the spray pipe, the spray pipe having a plurality of spray nozzles facing the third cleaning mechanism, the water inlet pipe extending out of the rejection trough; and / or, the rejection device is further provided with a second waste discharge pipe.

[0014] In some embodiments, the rejection device further includes a drive device, a slide rail, and a trough mounting base. The slide rail is disposed on the support base, the trough mounting base is slidably disposed on the slide rail, the rejection trough is disposed on the trough mounting base, and the drive device and the trough mounting base are connected in a driving manner.

[0015] In some embodiments, the cleaning machine further includes a first process tank disposed below the first cleaning mechanism, and the cleaning machine further includes a first support disposed below the first process tank for supporting the first process tank; and / or, the first cleaning mechanism is provided with a photoelectric sensor support and a plurality of photoelectric sensors disposed on the photoelectric sensor support on the side near the rejection device, the photoelectric sensors being used to obtain the number of silicon wafers.

[0016] Under the premise of adopting the above technical solution, the first cleaning mechanism, the second cleaning mechanism, and the third cleaning mechanism of this application can cooperate to transfer silicon wafers. When abnormal wafer blockage occurs in the cleaning machine, the lifting component of the rejection device can drive the third cleaning mechanism to rise and fall, making the third cleaning mechanism level with the over-etched wafer inlet, so that the silicon wafers on the third cleaning mechanism enter the over-etched wafer collection device through the etched wafer inlet, and the over-etched wafers are rejected. After the over-etched wafers are rejected, the lifting component of the rejection device can drive the third cleaning mechanism to rise and fall, making the third cleaning mechanism level with the normal wafer inlet, so that the silicon wafers on the third cleaning mechanism enter the normal wafer inlet, and the cleaning machine resumes normal operation. When abnormal wafer blockage occurs, the rejection device of this application can cooperate with the transition component to automatically export the over-etched wafers. Compared with the method of manually detecting and rejecting over-etched wafers, the cleaning machine provided by this application not only improves the rejection efficiency of over-etched wafers, but also avoids the problem of cell contamination and fragmentation that may be caused by manually handling and placing cells. Attached Figure Description

[0017] The preferred embodiments of this application are described below with reference to the accompanying drawings, in which:

[0018] Figure 1 This is a structural schematic diagram of the cleaning machine in this application;

[0019] Figure 2 yes Figure 1 A schematic diagram of the second process tank and the over-cutting collection tank for the cleaning agent;

[0020] Figure 3 yes Figure 2 A structural diagram from another perspective;

[0021] Figure 4 yes Figure 1 Schematic diagram of the structure of the first process tank in the middle;

[0022] Figure 5 yes Figure 1 Schematic diagram of the middle rejection groove;

[0023] Figure 6 yes Figure 5 A schematic diagram of the middle rejection groove from another perspective;

[0024] Figure 7This is a schematic diagram of the bottom wall of the blade collection tank in this application.

[0025] Figure label:

[0026] 1. First cleaning mechanism; 2. Second cleaning mechanism; 3. Rejection device; 301. Lifting assembly; 302. Third cleaning mechanism; 303. Support base; 304. Rejection tank; 305. Silicon wafer inlet; 306. Silicon wafer outlet; 307. Second waste discharge pipeline; 3071. Second liquid discharge port; 4. Normal wafer inlet; 5. Wafer overcutting inlet; 6. First process tank; 7. Second process tank; 701. Mounting port; 702 7021. First waste pipe; 8. First liquid outlet; 9. Spray device; 10. Spray pipe; 11. Inlet pipe; 12. Spray nozzle; 13. Drive device; 14. Through-die collection tank; 15. Connector; 16. Bottom wall; 17. Support bar; 18. Overflow hole; 19. Second bracket; 10. Slide rail; 11. Tank mounting base; 12. First bracket; 13. Photoelectric sensor bracket; 14. Photoelectric sensor; 15. Silicon wafer. Detailed Implementation

[0027] Preferred embodiments of this application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely for explaining the technical principles of this application and are not intended to limit the scope of protection of this application. Those skilled in the art can make adjustments as needed to adapt to specific application scenarios. Such changes in application scenarios do not deviate from the basic principles of this application and fall within the scope of protection of this application.

[0028] In the embodiments of this application, the terms "upper," "lower," "inner," "middle," "outer," "front," and "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are mainly for better describing the embodiments of this application and their implementations, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation. Furthermore, some of the above terms may be used to indicate other meanings besides orientation or positional relationship; for example, the term "upper" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application according to the specific circumstances.

[0029] It should be noted that, in the description of this preferred embodiment, unless otherwise explicitly specified and limited, the terms "connected" and "connected" should be interpreted broadly. For example, they can refer to mechanical connections or electrical connections, direct connections or indirect connections through an intermediate medium, or connections within two components. These should not be construed as limitations on this application. Furthermore, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only, and those skilled in the art can understand the specific meaning of these terms in this application according to the specific circumstances.

[0030] This application provides a cleaning machine, combined with Figure 1 , Figure 2 and Figure 5 As shown, the cleaning machine provided in this application includes a first cleaning mechanism 1, a second cleaning mechanism 2, a rejection device 3, a transition component, and a cut-out collection device.

[0031] The second cleaning mechanism 2 includes a conveying side and a collecting side arranged opposite to each other, with the conveying side used to carry the battery cells.

[0032] The rejection device 3 is disposed between the first cleaning mechanism 1 and the second cleaning mechanism 2; the rejection device 3 includes a lifting assembly 301 and a third cleaning mechanism 302 disposed on the lifting assembly 301.

[0033] The transition component connects the second cleaning mechanism 2 and the rejection device 3. The transition component is provided with a normal wafer flow inlet 4 located on the conveying side of the second cleaning mechanism 2 and a wafer flow inlet 5 located on the collection side of the second cleaning mechanism 2.

[0034] The blade collection device is located on the collection side.

[0035] The lifting assembly 301 lifts and lowers the normal silicon wafers on the third cleaning mechanism 302 into the normal wafer flow inlet 4, and causes the over-etched wafers on the third cleaning mechanism 302 to fall into the over-etched wafer collection device through the wafer flow inlet 5.

[0036] Under the premise of adopting the above technical solution, the first cleaning mechanism 1, the second cleaning mechanism 2, and the third cleaning mechanism 302 of this application can cooperate to transfer silicon wafers 17. When abnormal wafer blockage occurs in the cleaning machine, the lifting component 301 of the rejection device 3 can drive the third cleaning mechanism 302 to rise and fall, so that the third cleaning mechanism 302 is flush with the over-etching inlet 5, thereby allowing the silicon wafers 17 on the third cleaning mechanism 302 to enter the over-etching collection device through the etching inlet 5 and be rejected. After the over-etching is rejected, the lifting component 301 of the rejection device 3 can drive the third cleaning mechanism 302 to rise and fall, so that the third cleaning mechanism 302 is flush with the normal wafer inlet 4, thereby allowing the silicon wafers 17 on the third cleaning mechanism to enter the normal wafer inlet 4, and the cleaning machine resumes normal operation. When abnormal wafer blockage occurs, the rejection device 3 of this application can cooperate with the transition component to automatically export the over-etched wafers. Compared with the method of manually detecting and rejecting over-etched wafers, the cleaning machine provided by this application not only improves the rejection efficiency of over-etched wafers, but also avoids the problem of cell contamination and fragmentation that may be caused by manually handling cells.

[0037] Optionally, the third cleaning mechanism 302 consists of multiple drive rollers. The silicon wafer 17 is driven to rotate above the third cleaning mechanism 302 by the rotation of the drive rollers.

[0038] In some embodiments, combined with Figure 4 As shown, the cleaning machine also includes a first process tank 6 disposed below the first cleaning mechanism 1, and a first support 14 disposed below the first process tank 6 for supporting the first process tank 6. The area above the first cleaning mechanism 1 is used for conveying silicon wafers 17. By distributing the first process tank 6 below the first cleaning mechanism 1, it is possible to collect chemical solutions dripping from the first cleaning mechanism 1. The first support 14 serves to support the first process tank 6.

[0039] Optionally, combined Figure 4 As shown, the first process tank 6 includes a feed side and a discharge side, with the discharge side close to the rejection device 3. The feed side has a silicon wafer inlet, and the discharge side has a silicon wafer outlet. Silicon wafers 17 enter the first cleaning mechanism 1 within the first process tank 6 through the silicon wafer inlet, are moved to the silicon wafer outlet by the first cleaning mechanism 1, and flow out of the first process tank 6 through the silicon wafer outlet.

[0040] Optionally, the first cleaning mechanism 1 consists of multiple drive rollers. The silicon wafer 17 is driven to rotate above the first cleaning mechanism 1 by rotating the drive rollers.

[0041] In some embodiments, combined with Figure 1 and Figure 2As shown, the cleaning machine also includes a second process tank 7 disposed on the collection side of the second cleaning mechanism 2. A normal wafer flow inlet 4 and a wafer overcutting flow inlet 5 are disposed on the tank wall of the second process tank 7 near the rejection device 3. The conveying side of the second cleaning mechanism 2 is used to convey silicon wafers 17. By distributing the second process tank 7 on the collection side of the second cleaning mechanism 2, it is possible to collect the chemical solution dripping from the second cleaning mechanism 2. Under normal operating conditions, the first cleaning mechanism 1, the second cleaning mechanism 2, and the third cleaning mechanism 302 are arranged horizontally, with the conveying side of the second cleaning mechanism 2 at the top and the collection side at the bottom.

[0042] In some embodiments, combined with Figure 2 As shown, the cleaning machine also includes a second support 11, which is disposed below the second process tank 7 and is used to support the second process tank 7. The second support 11 serves to support the second process tank 7.

[0043] Optionally, the second cleaning mechanism 2 consists of multiple drive rollers. The silicon wafer 17 is driven to rotate above the second cleaning mechanism 2 by rotating the drive rollers.

[0044] In some embodiments, combined with Figure 3 As shown, at least one mounting port 701 is provided on the wall of the second process tank 7, combined with Figure 7 As shown, the die-cutting collection groove 10 is provided with a connector 101 corresponding to the mounting port 701, and the connector 101 is adapted to be inserted into the corresponding mounting port 701. This arrangement facilitates fixing the die-cutting collection groove 10 onto the second process groove 7 using the mounting port 701.

[0045] In some embodiments, combined with Figure 3 As shown, the second process tank 7 is also equipped with a first waste pipe 702. The first waste pipe 702 is located on the lower side of the second process tank 7. The fixed end of the first waste pipe 702 is connected to the second process tank 7, and the first drain port 7021 of the first waste pipe 702 is connected to an external pipe. Waste liquid in the second process tank 7 can be discharged through the first waste pipe 702.

[0046] In some embodiments, combined with Figure 5 and Figure 6 As shown, the rejection device 3 also includes a support base 303 and a rejection groove 304. The rejection groove 304 is slidably mounted on the support base 303. The third cleaning mechanism 302 is disposed in the rejection groove 304, and the groove wall of the rejection groove 304, which is distributed along the silicon wafer transport direction, is provided with a silicon wafer inlet 305 and a silicon wafer outlet 306.

[0047] The support base 303 provides support, and the rejection tank 304 is located below the third cleaning mechanism 302 to collect the chemical solution dripping from it. When the cleaning machine experiences abnormal blockage, the lifting component 301 of the rejection device 3 can lower the third cleaning mechanism 302 to a first height, making the silicon wafer outlet 306 flush with the over-etching inlet 5, thus allowing the silicon wafers on the third cleaning mechanism 302 to enter the over-etching inlet 5 and be rejected. When the cleaning machine is in normal operation, the lifting component 301 can raise the third cleaning mechanism 302 to a second height, making the silicon wafer outlet 306 flush with the normal wafer inlet 4, thus allowing the silicon wafers on the third cleaning mechanism 302 to enter the normal wafer inlet 4, and the cleaning machine resumes normal operation. The first height is less than the second height.

[0048] In some embodiments, combined with Figure 5 and Figure 6 As shown, the lifting assembly 301 includes a drive device 9, a slide rail 12, and a tank mounting base 13. The slide rail 12 is mounted on a support base 303, and the tank mounting base 13 is slidably mounted on the slide rail 12. A rejection trough 304 is mounted on the tank mounting base 13. The drive device 9 and the tank mounting base 13 are connected by a transmission. The drive device 9 provides power to the tank mounting base 13. The rejection trough 304 is slidably connected to the slide rail 12 via the tank mounting base 13. A third cleaning mechanism 302 is disposed within the rejection trough 304. The height of the third cleaning mechanism 302 can be changed by lifting the lifting assembly 301.

[0049] Optionally, the drive unit 9 is a cylinder.

[0050] In some embodiments, combined with Figure 5 and Figure 6 As shown, the rejection device 3 also includes a spray device 8 disposed in the rejection trough 304. The spray device 8 includes a spray pipe 801 and a water inlet pipe 802 connected to the spray pipe 801. The spray pipe 801 has multiple spray nozzles 803 facing the third cleaning mechanism 302. The water inlet pipe 802 extends out of the rejection trough 304.

[0051] The water inlet pipe 802 can be connected to an external pure water source. Multiple spray pipes 801 are provided on the spray device 8 to spray water toward the back of the silicon wafer 17 to clean the residual liquid on the back of the silicon wafer 17.

[0052] Optionally, combined Figure 6 As shown, the rejection device 3 is also equipped with a second waste pipe 307. The second waste pipe 307 is located on the lower side of the rejection tank 304. The fixed end of the second waste pipe 307 is connected to the rejection tank 304, and the second drain port 3071 of the second waste pipe 307 is connected to an external pipe. Waste liquid in the rejection tank 304 can be discharged through the second waste pipe 307.

[0053] In some embodiments, combined with Figure 2 As shown, the cleaning machine also includes a die-cutting collection tank 10 disposed in the second process tank 7. The die-cutting collection tank 10 is located below the die-cutting inlet 5 and is connected to the tank wall where the die-cutting inlet 5 is located. In this way, the die-cutting collection tank 10 is located on the falling path of the die-cuttings, and the die-cuttings can be collected by the die-cutting collection tank 10.

[0054] In some embodiments, combined with Figure 7 As shown, the over-etching collection tank 10 includes a bottom wall 102. A support strip 103 is placed on the side of the bottom wall 102 near the rejection device 3. Multiple overflow holes 104 are also provided on the bottom wall 102. The support strip 103 reduces the contact area between the silicon wafer 17 and the bottom wall 102, preventing the silicon wafer 17 from failing to slide to the correct position due to residual water stains on its surface. After the over-etching wafer is collected in the over-etching collection tank 10, the residual water stains on the silicon wafer 17 after cleaning can flow into the second process tank 7 through the overflow holes 104, and then be discharged through the second waste pipe 307.

[0055] In some embodiments, combined with Figure 1 As shown, the first cleaning mechanism 1 has a photoelectric sensor bracket 15 and multiple photoelectric sensors 16 mounted on the photoelectric sensor bracket 15 on the side near the rejection device 3. The photoelectric sensors 16 are used to obtain the number of silicon wafers 17. The photoelectric sensors 16 provide feedback on the actual number of wafers flowing into the wafer collection tank 10.

[0056] When the equipment is in normal process mode, the lifting assembly 301 of the rejection device 3 maintains the rejection tank 304 in the normal position. At this time, the drive rollers of the first cleaning mechanism 1, the third cleaning mechanism 302, and the second cleaning mechanism 2 are on the same horizontal plane. The silicon wafers flow out from the silicon wafer outlet of the first process tank 6 and enter the rejection device 3 through the silicon wafer inlet 305 of the rejection tank 304. The third cleaning mechanism 302 in the rejection device 3 transports the silicon wafers to the silicon wafer outlet 306. Finally, the silicon wafers enter the second process tank 7 through the normal wafer inlet 4 of the second process tank 7 for subsequent processes.

[0057] When a blockage occurs, the silicon wafers retained in the first process tank 6 become over-etched due to prolonged contact with the etching solution, requiring removal. Before the main equipment restarts after the anomaly is resolved, the drive unit 9 pushes the removal tank 304 down to the over-etched wafer removal position, aligning the silicon wafer outlet 306 with the over-etched wafer inlet 5 of the second process tank 7. The first cleaning mechanism 1 and the third cleaning mechanism 302 transport the over-etched wafers to the silicon wafer outlet 306; the over-etched wafers enter the over-etched wafer collection tank 10 through the over-etched wafer inlet 5. The system calculates the total number of over-etched wafers based on the etching tank length and belt speed of the first process tank 6; the photoelectric sensor 16 provides real-time feedback on the actual number entering the over-etched wafer collection tank 10. After all over-etched wafers are removed, the drive unit 9 raises the removal tank 304 to the normal position, restoring the normal wafer flow direction; the over-etched wafers are manually removed from the over-etched wafer collection tank 10 to clean them, and then reinstalled.

[0058] The technical solutions of this application have been described in conjunction with the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of this application is obviously not limited to these specific embodiments. Without departing from the principles of this application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions resulting from these changes or substitutions will all fall within the scope of protection of this application.

Claims

1. A cleaning machine, characterized in that, The cleaning machine includes: A first cleaning mechanism (1) and a second cleaning mechanism (2), wherein the second cleaning mechanism (2) includes a conveying side and a collecting side arranged opposite to each other; The rejection device (3) is disposed between the first cleaning mechanism (1) and the second cleaning mechanism (2). The rejection device (3) includes a transition member, a lifting assembly (301) and a third cleaning mechanism (302) disposed on the lifting assembly (301). The transition member connects the second cleaning mechanism (2) and the rejection device (3). It is provided with a normal chip flow inlet (4) on the conveying side and an over-cut chip flow inlet (5) on the collecting side. A blade collection device is disposed on the collection side; The lifting assembly (301) is used to lift and lower the normal silicon wafers on the third cleaning mechanism (302) into the normal wafer inlet (4), and to allow the over-etched wafers on the third cleaning mechanism (302) to fall into the over-etched wafer collection device through the over-etched wafer inlet (5).

2. The cleaning machine according to claim 1, characterized in that, The cleaning machine also includes a second process tank (7) disposed on the collection side, wherein the normal wafer flow inlet (4) and the over-cut wafer flow inlet (5) are disposed on the tank wall of the second process tank (7) near the rejection device (3).

3. The cleaning machine according to claim 2, characterized in that, The cleaning machine also includes a die-cutting collection tank (10) disposed in the second process tank (7). The die-cutting collection tank (10) is located on the collection side of the die-cutting inlet (5) and is connected to the tank wall where the die-cutting inlet (5) is located. The die-cutting collection device is the die-cutting collection tank (10) or the second process tank (7).

4. The cleaning machine according to claim 3, characterized in that, The overcut collection tank (10) includes a bottom wall (102), and a support strip (103) is provided on the side of the bottom wall (102) near the rejection device (3). The bottom wall (102) is also provided with a plurality of overflow holes (104).

5. The cleaning machine according to claim 3, characterized in that, The second process tank (7) has at least one mounting port (701) on its tank wall, and the die collection tank (10) is provided with a plug (101) corresponding to the mounting port (701) one by one. The plug (101) is adapted to be inserted into the corresponding mounting port (701).

6. The cleaning machine according to claim 2, characterized in that, The second process tank (7) is also provided with a first row of waste pipes (702); and / or, The cleaning machine further includes a second support (11), which is disposed below the second process tank (7) to support the second process tank (7); and / or, The first cleaning mechanism (1), the second cleaning mechanism (2) and the third cleaning mechanism (302) are all composed of multiple transmission rollers.

7. The cleaning machine according to any one of claims 1 to 6, characterized in that, The rejection device (3) further includes a support base (303) and a rejection groove (304); wherein the rejection groove (304) is slidably mounted on the support base (303) via the lifting assembly (301); the third cleaning mechanism (302) is disposed in the rejection groove (304), and the two opposite groove walls of the rejection groove (304) distributed along the silicon wafer transport direction are respectively provided with a silicon wafer inlet (305) and a silicon wafer outlet (306).

8. The cleaning machine according to claim 7, characterized in that, The rejection device (3) further includes a spray device (8) disposed within the rejection trough (304). The spray device (8) includes a spray pipe (801) and a water inlet pipe (802) communicating with the spray pipe (801). The spray pipe (801) has a plurality of spray nozzles (803) facing the third cleaning mechanism (302). The water inlet pipe (802) extends out of the rejection trough (304); and / or, The rejection device (3) is also equipped with a second waste discharge pipeline (307).

9. The cleaning machine according to claim 7, characterized in that, The lifting assembly (301) includes a drive device (9), a slide rail (12), and a groove mounting base (13). The slide rail (12) is mounted on the support base (303), the groove mounting base (13) is slidably mounted on the slide rail (12), the rejection groove (304) is mounted on the groove mounting base (13), and the drive device (9) and the groove mounting base (13) are connected in a transmission manner.

10. The cleaning machine according to any one of claims 1 to 6, characterized in that, The cleaning machine further includes a first process tank (6) disposed below the first cleaning mechanism (1), and the cleaning machine further includes a first support (14) disposed below the first process tank (6) for supporting the first process tank (6); and / or, The first cleaning mechanism (1) is provided with an eye support (15) and a plurality of eyepieces (16) on the side near the rejection device (3), the eyepieces (16) being used to obtain the number of silicon wafers.

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