VC fin integrated structure with improved heat dissipation performance
The integrated VC fin design solves the problem of uneven heat distribution under high heat flux density, achieving more efficient heat dissipation and longer chip lifespan, and is suitable for customized designs of different shapes and sizes.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN JIFU METALLIC PROD CO LTD
- Filing Date
- 2025-06-23
- Publication Date
- 2026-07-10
AI Technical Summary
Existing heat sinks are unable to distribute heat evenly under high heat flux density, leading to heat accumulation in localized areas and affecting chip lifespan.
It adopts an integrated VC fin structure, including a shovel-tooth upper cover and a VC lower cover, forming an airtight VC chamber filled with working fluid. Combined with capillary structure and reinforced column design, it improves heat transfer efficiency.
It effectively avoids localized heat buildup, improves heat dissipation performance, extends chip lifespan, and increases production flexibility.
Smart Images

Figure CN224482053U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of radiator technology, and in particular to an integrated VC fin structure for improving heat dissipation performance. Background Technology
[0002] A single-fin heatsink design essentially achieves heat conduction and convection through full contact between the fins and the air. Its heat dissipation efficiency directly depends on the effective contact area with the air, and is also closely related to the area in contact with the heat source. When a chip generates high heat flux, the single heat conduction and diffusion path makes it difficult to evenly distribute the concentrated heat in a short time, leading to heat accumulation in localized areas and failing to achieve uniform temperature distribution. Sustained localized high temperatures accelerate the aging of internal chip materials, severely impacting the chip's lifespan and shortening its normal operating cycle; therefore, improvement is necessary. Utility Model Content
[0003] To address the shortcomings of existing technologies, the purpose of this utility model is to provide an integrated VC fin structure that improves heat dissipation performance, solves the problem of heat conduction between the heat source and the finned heat sink, avoids local heat accumulation at the bottom of the finned heat sink, improves the heat conduction efficiency between the heat source and the finned heat sink, and enhances the heat dissipation performance of the product.
[0004] To achieve the above objectives, the technical solution adopted by this utility model is: an integrated VC fin structure for improving heat dissipation performance, comprising a shovel-tooth upper cover and a VC lower cover plate. The top of the shovel-tooth upper cover is integrally formed with multiple fins, which are spaced apart along a straight line. The bottom surface of the shovel-tooth upper cover is formed with a recessed VC cavity. The VC lower cover plate is fixed to the bottom surface of the shovel-tooth upper cover by welding and seals the VC cavity to form an airtight VC chamber, which is filled with working fluid.
[0005] In a further technical solution, the bottom surface of the VC cavity is integrally formed with multiple reinforcing pillars, which are evenly distributed on the bottom surface of the VC cavity; the VC lower cover plate has multiple through holes, each of which corresponds to a corresponding reinforcing pillar. During assembly, each reinforcing pillar is inserted into the corresponding through hole, and the two are airtightly connected by welding. The end face of the reinforcing pillar is flush with the bottom surface of the VC lower cover plate.
[0006] In a further technical solution, the diameter of the reinforcing column is 1.5mm-3mm; the interval between two adjacent reinforcing columns is no more than 15mm.
[0007] In a further technical solution, the inner wall of the VC chamber is provided with a capillary structure, which includes a groove structure, a wire mesh structure, or a copper powder sintered structure.
[0008] In a further technical solution, the width d1 of the fin is 0.3mm-0.7mm; the interval d2 between two adjacent fins is 0.3mm-0.7mm; the thickness d3 of the upper cover of the shovel tooth is 1.5mm-2.5mm; and the thickness of the lower cover plate of VC is 0.5mm-1.2mm.
[0009] In a further technical solution, a recess is formed on one side of the upper cover of the shovel tooth to form a liquid injection section, which is provided with a liquid injection channel that connects to the VC chamber.
[0010] In a further technical solution, the working fluid includes pure water.
[0011] In a further technical solution, the side of the upper cover of the shovel tooth is provided with multiple upper connecting holes; the side of the lower cover of the VC is provided with multiple lower connecting holes. When the lower cover of the VC is welded to the upper cover of the shovel tooth, each lower connecting hole is aligned with the corresponding upper connecting hole for product installation and fixation.
[0012] In a further technical solution, the upper cover of the shovel tooth and the lower cover of the VC are made of a metal material with thermal conductivity.
[0013] The advantages of this invention compared to the prior art after adopting the above structure are:
[0014] 1. The shovel tooth structure and the VC heat dissipation structure use the same shovel tooth upper cover, which can reduce the heat transfer resistance of the two heat dissipation structures, avoid the heat transfer resistance caused by splicing welding points, and further improve the heat dissipation performance of the product.
[0015] 2. Compared to traditional toothed heat sinks, the integrated design of the VC heat dissipation structure and the toothed structure allows for more efficient heat transfer within the VC heat dissipation structure. Furthermore, the heat can be quickly distributed and transferred within the VC heat dissipation structure, effectively reducing the risk of localized overheating of the chip as a heat source and extending the chip's lifespan.
[0016] 3. The integrated design of the VC heat dissipation structure and the shovel tooth structure can improve the design flexibility of the product, making it easy to customize the integrated structure of different shapes and sizes according to different production needs. It also has low assembly difficulty and higher production efficiency. Attached Figure Description
[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0018] Figure 1 This is a schematic diagram of the structure of this utility model.
[0019] Figure 2 This is an exploded view of the present invention.
[0020] Figure 3 This is a cross-sectional schematic diagram of the present invention.
[0021] Figure 4 yes Figure 3 Enlarged view of point A in the image. Detailed Implementation
[0022] The following are merely preferred embodiments of the present invention and do not limit the scope of protection of the present invention.
[0023] like Figures 1 to 4 As shown, a VC fin integrated structure for improving heat dissipation performance is characterized by: including a shovel-tooth upper cover 1 and a VC lower cover 2. The top of the shovel-tooth upper cover 1 is integrally formed with multiple fins 11, which are spaced apart along a straight line. The bottom surface of the shovel-tooth upper cover 1 is formed with a recessed VC cavity 10. The VC lower cover 2 is fixed to the bottom surface of the shovel-tooth upper cover 1 by welding and seals the VC cavity 10 to form an airtight VC chamber, which is filled with working fluid. The bottom surface of the VC cavity 10 is integrally formed with multiple reinforcing pillars 12, which are evenly distributed on the bottom surface of the VC cavity 10. The VC lower cover plate 2 has multiple through holes 20, each of which corresponds to a corresponding reinforcing pillar 12. During assembly, each reinforcing pillar 12 is inserted into the corresponding through hole 20, and the two are airtightly connected by welding. The end face of the reinforcing pillar 12 is flush with the bottom surface of the VC lower cover plate 2. The welding process between the reinforcing pillar 12 and the through hole 20 is laser welding, which has the advantages of high precision, low heat loss and strong sealing.
[0024] Among them, the fin 11 is formed by the shovel machining process. With the high precision machining characteristics of the shovel machining process, the shape, size and spacing of the fin 11 can be precisely controlled, which greatly increases the contact area with the air.
[0025] The shovel tooth structure and the VC heat dissipation structure both use the same shovel tooth upper cover 1, which can reduce the thermal resistance of the two heat dissipation structures, avoid the thermal resistance caused by splicing welding points, and further improve the heat dissipation performance of the product.
[0026] Compared to traditional toothed heat sinks, the integrated design of the VC heat dissipation structure and the toothed structure allows for more efficient heat transfer within the VC heat dissipation structure. Furthermore, the heat can be quickly distributed and transferred within the VC heat dissipation structure, effectively reducing the risk of localized overheating of the chip as a heat source and extending the chip's lifespan.
[0027] The integrated design of the VC heat dissipation structure and the shovel tooth structure can improve the design flexibility of the product, making it easy to customize the integrated structure of different shapes and sizes according to different production needs. It also has low assembly difficulty and higher production efficiency.
[0028] Specifically, the diameter of the reinforcing column 12 is 1.8 mm; the interval between two adjacent reinforcing columns 12 is no more than 15 mm.
[0029] Specifically, the inner wall of the VC chamber is provided with a capillary structure, which includes a wire mesh structure.
[0030] Specifically, the width d1 of the fin 11 is 0.5 mm; the interval d2 between two adjacent fins 11 is 0.5 mm; the thickness d3 of the upper cover 1 of the shovel teeth is 1.8 mm; and the thickness of the lower cover 2 of the VC is 0.8 mm.
[0031] Specifically, a recessed part 14 is formed on one side of the upper cover 1 of the shovel teeth. The liquid injection part 14 is provided with a liquid injection channel, which is connected to the VC chamber.
[0032] Specifically, the working fluid includes pure water. The target heat source chip transfers heat to the VC heat dissipation structure. The working fluid in the VC chamber rapidly absorbs heat through phase change and evenly transfers the heat to the spade teeth. Forced convection carries away the heat transferred by the VC, thereby achieving the heat dissipation effect.
[0033] Specifically, the upper cover 1 of the shovel tooth is provided with multiple upper connecting holes 13 on its side; the lower cover 2 of the VC is provided with multiple lower connecting holes 21 on its side. When the lower cover 2 of the VC is welded to the upper cover 1 of the shovel tooth, each lower connecting hole 21 is aligned with the corresponding upper connecting hole 13 for product installation and fixing.
[0034] Specifically, the upper cover 1 of the shovel tooth and the lower cover 2 of the VC are made of copper alloy material. The materials used in this application can be metal materials with thermal conductivity, and are not limited to copper alloy material.
[0035] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of this utility model. The content of this specification should not be construed as a limitation of this utility model.
Claims
1. A VC fin integrated structure for improving heat dissipation performance, characterized in that: Includes the upper cover of the shovel teeth (1) and the lower cover of the VC (2), The top of the shovel tooth cover (1) is integrally formed with multiple fins (11), which are spaced apart along a straight line. The bottom surface of the shovel tooth cover (1) is formed with a recessed VC cavity (10). The VC lower cover plate (2) is fixed to the bottom surface of the shovel tooth upper cover (1) by welding process and seals the VC cavity (10) to form an airtight VC chamber, which is filled with working fluid.
2. The integrated VC fin structure for improving heat dissipation performance according to claim 1, characterized in that: The bottom surface of the VC cavity (10) is integrally formed with multiple reinforcing columns (12), and each reinforcing column (12) is evenly distributed on the bottom surface of the VC cavity (10). The VC lower cover plate (2) has multiple through holes (20), each through hole (20) corresponding to a corresponding reinforcing column (12). During assembly, each reinforcing column (12) is inserted into the corresponding through hole (20), and the two are airtightly connected by welding. The end face of the reinforcing column (12) is flush with the bottom surface of the VC lower cover plate (2).
3. The integrated VC fin structure for improving heat dissipation performance according to claim 2, characterized in that: The diameter of the reinforcing column (12) is 1.5mm-3mm; the interval between two adjacent reinforcing columns (12) is no more than 15mm.
4. The integrated VC fin structure for improving heat dissipation performance according to claim 3, characterized in that: The inner wall of the VC chamber is provided with a capillary structure, which includes a groove structure, a wire mesh structure, or a copper powder sintered structure.
5. The integrated VC fin structure for improving heat dissipation performance according to claim 4, characterized in that: The width d1 of the fin (11) is 0.3mm-0.7mm; the interval d2 between two adjacent fins (11) is 0.3mm-0.7mm; the thickness d3 of the upper cover (1) of the shovel teeth is 1.5mm-2.5mm; and the thickness of the lower cover (2) of the VC is 0.5mm-1.2mm.
6. The integrated VC fin structure for improving heat dissipation performance according to claim 5, characterized in that: The upper cover (1) of the shovel tooth has a recessed part on one side to form an injection part (14), and the injection part (14) is provided with an injection channel, which is connected to the VC chamber.
7. The integrated VC fin structure for improving heat dissipation performance according to claim 6, characterized in that: The working fluid includes pure water.
8. The integrated VC fin structure for improving heat dissipation performance according to claim 1, characterized in that: The upper cover of the shovel tooth (1) has multiple upper connecting holes (13) on its side; the lower cover of the VC plate (2) has multiple lower connecting holes (21) on its side. When the lower cover of the VC plate (2) is welded to the upper cover of the shovel tooth (1), each lower connecting hole (21) is aligned with the corresponding upper connecting hole (13) for product installation and fixing.
9. The integrated VC fin structure for improving heat dissipation performance according to claim 1, characterized in that: The upper cover (1) of the shovel teeth and the lower cover (2) of the VC are respectively made of a metal material with thermal conductivity.