An HTCC ceramic package layout structure

Abstract

This utility model discloses an HTCC ceramic tube shell layout structure and a method for manufacturing the ceramic tube shell, belonging to the technical field of HTCC ceramic tube shells. The specific structure includes a ceramic substrate, on which multiple product ceramic bodies are arranged. A straight electroplating line and an outer electroplating line connected to the straight electroplating line are arranged around the perimeter of the ceramic substrate. A sidewall hole and a serpentine electroplating line connected to the sidewall hole are arranged between two adjacent product ceramic bodies. The serpentine electroplating line connects to the straight electroplating line. By using serpentine electroplating line wiring, this utility model allows for seamless array arrangement of products, effectively utilizing the previously reserved area between products, reducing the number of cutting blades, improving manufacturing efficiency, increasing the utilization rate of the green ceramic tape, and avoiding scratches to the products caused by residual edges during chipping.

Description

Technical Field

[0001] This utility model relates to the field of HTCC ceramic tube shell technology, and specifically to an HTCC ceramic tube shell layout structure. Background Technology

[0002] HTCC ceramic tube shell plating mainly employs two methods: chemical plating and electroplating. Chemical plating works by depositing metal through a chemical reaction, requiring no power source and relying on chemical energy; non-conductive materials such as plastics, ceramics, and glass can also be directly plated. Electroplating, on the other hand, involves applying an external current to reduce the metal, requiring the workpiece to be conductive. Compared to chemical plating, electroplating is less expensive and suitable for mass production. Electroplating is often used for HTCCs with fewer internal traces and pads, such as the CLCC, CQFN, and CSOP series, to improve production efficiency and reduce plating costs. Currently, the overall electroplating wiring design for HTCC ceramic tube shells typically places the wiring between two products at appropriate locations. However, this inter-product electroplating wiring increases process residue edges, resulting in significant raw material waste, reduced green ceramic tape utilization, and a risk of scratching the product during the chip-breaking process. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide an HTCC ceramic tube shell layout structure that improves the utilization rate of green ceramic strip and reduces the risk of scratching the product by residual edges during the cracking process.

[0004] The technical solution adopted by this utility model is as follows: An HTCC ceramic tube shell layout structure includes a ceramic substrate, on which multiple product ceramics are arranged. A straight electroplating line and an outer electroplating line connected to the straight electroplating line are arranged around the ceramic substrate. A side wall hole and a serpentine electroplating line connected to the side wall hole are arranged between two adjacent product ceramics. The serpentine electroplating line is connected to the straight electroplating line.

[0005] Furthermore, the distance between the ceramic bodies of two adjacent products is 2.1 mm.

[0006] The beneficial effects of this utility model are as follows: Compared with the prior art, this utility model adopts a serpentine electroplating line wiring, which allows for seamless array layout of products. The area originally reserved between products can be effectively utilized, the number of cutting blades is reduced, the production efficiency is improved, the utilization rate of the green ceramic belt is increased, and the situation of residual edges scratching the products during the cracking process is avoided. Attached Figure Description

[0007] Figure 1 This is a schematic diagram of the HTCC ceramic tube shell layout structure in Example 1;

[0008] Figure 2 This is a schematic diagram of the HTCC ceramic tube shell layout structure in Example 2;

[0009] Figure 3 This is a schematic diagram of the HTCC ceramic tube shell manufacturing process;

[0010] Figure 4 This is a schematic diagram of the HTCC ceramic tube shell layout structure in Comparative Example 1;

[0011] Figure 5 This is a schematic diagram of the HTCC ceramic tube shell layout structure in Comparative Example 2. Detailed Implementation

[0012] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0013] Example 1: As Figure 1 As shown, an HTCC ceramic tube shell layout structure includes a ceramic substrate 1, on which multiple product ceramic bodies 2 are arranged. A straight electroplating line 3 and an outer electroplating line 4 connected to the straight electroplating line 3 are arranged around the ceramic substrate 1. A side wall hole 5 and a serpentine electroplating line 6 connected to the side wall hole 5 are arranged between two adjacent product ceramic bodies 2. The serpentine electroplating line 6 is connected to the straight electroplating line 3. The distance between two adjacent product ceramic bodies is 2.1 mm.

[0014] like Figure 1 In the HTCC ceramic tube shell layout, the products (individual ceramic bodies) are rotated by 90°, 180° and 270° respectively, so that the ceramic bodies of the products with the same chamfer size share a common chamfer cavity; the ceramic tube shell material is 92% black alumina, the printing paste and hanging hole paste are tungsten paste, and the surface is electroplated with nickel gold; an electroplating line is set on the fifth surface (out of eight layers) inside the product, connecting all metallized areas inside the product to the electroplating line for electroplating.

[0015] Depend on Figure 1 It is evident that the products are arranged without gaps between each other (adjacent ceramic products) because the sidewall holes and internal pads are connected one-to-one. All electroplating lines are led to appropriate layers and connected to the sidewall holes, which are then connected via serpentine wiring for electroplating. This connection is broken after the ceramic chip cracks. The use of serpentine wiring for the electroplating lines reduces residue between products, allowing for more products to be placed, improving the utilization rate of the green ceramic, and reducing the risk of cracking.

[0016] Example 2: As Figure 2As shown, an HTCC ceramic tube shell layout structure includes a ceramic substrate 1, on which multiple product ceramic bodies 2 are arranged. A straight electroplating line 3 and an outer electroplating line 4 connected to the straight electroplating line 3 are arranged around the ceramic substrate 1. A sidewall hole 5 and a serpentine electroplating line 6 connected to the sidewall hole 5 are arranged between two adjacent product ceramic bodies 2. The serpentine electroplating line 6 is connected to the straight electroplating line 3. The distance between two adjacent product ceramic bodies is 2.1 mm. In the HTCC ceramic tube shell layout structure, the ceramic material is 92% black alumina, the printing paste and the hole-hanging paste are tungsten paste, and the surface is electroplated with nickel-gold. Electroplating lines are arranged in appropriate positions inside, connecting all metallized areas within the product to the electroplating lines for electroplating.

[0017] Depend on Figure 2 It is known that the product has sidewall holes. A serpentine electroplating line is arranged in a layer with a low wiring density. The sidewall holes are shared between the two products. All metallized pads are connected by serpentine wiring for electroplating and then disconnected after the final wafer is cracked.

[0018] Example 3: As Figure 3 As shown, a method for manufacturing an HTCC ceramic tube shell is described. In this method, firstly, during the design phase, layer decomposition is performed, and the circuit layout of each layer inside the ceramic tube shell is designed. Metal pads are connected to layers suitable for placing electroplating lines via wiring. The green size and product size are combined, and the green is divided into multiple appropriately sized sections (cut into multiple sections during cutting to avoid excessive expansion deformation during sintering). Each section has electroplating holes on both sides. During electroplating, a fixture is used to connect and conduct electricity. The product is arranged in a seamless rectangular array, and the pads between products are connected by serpentine wiring for electroplating. If there are sidewall holes, electroplating lines can also be introduced into different layers for the pads. After a series of processes including hole opening, hole filling, hole hanging, printing, lamination, cutting, sintering, pre-plating with nickel, brazing, electroplating with nickel-gold, and sheet splitting, a complete tube shell product is obtained. The specific manufacturing process includes the following steps:

[0019] Step 1: Laser drilling and cavity creation

[0020] Laser drilling machines are used to create square cavities or circular through-holes in each layer of green preform according to design documents. High precision is generally required for the laser-drilled cavities and through-holes; the size of the cavities and the diameter of the through-holes must strictly adhere to design tolerances. The walls of the cavities and the holes need to be smooth to ensure strong adhesion and good electrical properties of the slurry during subsequent filling and hanging. Besides producing high-precision cavities and through-holes, laser drilling is also easily automated, highly efficient, and suitable for large-scale production.

[0021] Step 2, Hanging Hole

[0022] For products with sidewall holes, after opening the cavity, hole hanging is required (hole hanging is the process of applying electronic paste to the walls of the sidewall holes). First, the sidewall holes are filled with paste, and then the excess paste is removed using a stencil and hole hanging machine, leaving a uniform conductive paste on the sidewalls. The hole hanging paste has low viscosity and high flowability, and it is easy for the paste to contaminate the back of the green body during the hole hanging process. In order to prevent the paste from contaminating the back of the green body, a PET film is first applied to the back of the green body before hole hanging (when the paste is filled into the hole from the front of the green body, the PET film is applied to prevent the paste from contaminating the back of the green body).

[0023] Step 3: Fill the holes

[0024] The purpose of filling holes is to enable electrical connections and signal transmission between different layers of green billets. According to the design, a hole-filling machine, in conjunction with a steel mesh, is used to fill the holes in the green billets after the holes have been hung. Strict control is maintained over the quality of the hole filling, including the filling height and light transmission. If the filling height exceeds the standard, a leveling machine can be used to level and improve it.

[0025] Step 4: Printing

[0026] According to the design, a printing press is used in conjunction with a screen to print and dry the green blank after the holes have been filled, resulting in the metallized pads and serpentine plating lines of the expected HTCC product. The serpentine plating lines between products connect the metallized pads inside the product with the plating lines on the outside of each plate. After the layers are stacked, all the metallized pads in each plate are interconnected, and electroplating is achieved through the plating holes. In this printing stage, the main goal is to achieve the expected wiring pattern. The printing pattern needs to be strictly controlled, including printing height, line width, line spacing, and whether there are burrs, to ensure consistent printing quality.

[0027] Step 5, Stacking

[0028] After the green body with hole filling and printing is completed, it is stacked and formed in the design sequence. During the forming process, different products generally require different pressures. For products with sidewall holes, the pressure is generally lower, usually 500 psi, because higher pressure can easily cause the sidewall holes to collapse. For products without sidewall holes, the pressure can be appropriately increased, up to 2000 psi or more. The misalignment between layers is generally controlled within 30~50um. Excessive misalignment can easily lead to open circuits. This step requires attention to whether there is misalignment or collapse.

[0029] Step 6, Cutting

[0030] The pre-stacked green blanks are cut in two steps. The first step is to cut a double-sided half-cut along the outline of a single product, cutting down to the layer containing the electroplating line, while preserving the complete cut line for nickel-gold electroplating. The second step is to cut the green blank along the cut line of the plate product, generally to a size of 152.4×152.4mm. The product size is generally 10×10mm. A green blank is usually divided into four equal parts in the design, with each part generally around 55×55mm. If it is too large, it will expand and deform more during sintering. After cutting it into parts, it can be electroplated as a whole instead of individually (the appropriate part size is determined according to the actual situation).

[0031] Step 7: Remove glue

[0032] The cut green blanks are placed in an atmosphere debinding furnace for debinding, and the debinding temperature is 250-600℃.

[0033] Step 8: Sintering

[0034] The debonded green sheet is sintered at a temperature of 1750-1900℃ and then cooled to room temperature to obtain a whole alumina ceramic substrate.

[0035] Step 9, Pre-plating nickel

[0036] The sintered alumina ceramic substrate is pre-plated with nickel, and the pre-plating thickness is 2~5um.

[0037] Step 10, Brazing

[0038] A Kovar ring is brazed onto the pre-nickel-plated alumina ceramic substrate to obtain a semi-finished product.

[0039] Step 11: Electroplating nickel with gold

[0040] Electroplating holes are provided on both sides of each whole product (each whole product is one of four pieces after the green blank is divided into four parts, and there are multiple pieces of products on each piece). All the pads in the product are connected through clever design and electroplating holes. The electroplating holes are connected by a clamp (similar to a spring clamp, made of copper, which requires insulation treatment of non-contact areas, to fix the substrate, ensure metallization and cathode conduction, and electroplating in the plating solution). The electroplating holes are connected to the whole product and all pad areas are energized to achieve nickel-gold electroplating.

[0041] Step 12, Slicing

[0042] The entire alumina ceramic substrate, after being electroplated with nickel and gold, is split into pieces to obtain a single HTCC ceramic tube shell.

[0043] Comparative Example 1: Figure 4The layout structure shown is an HTCC layout design that uses electroplating lines to surround the product, with inconsistent chamfer sizes and separate cavities for each chamfer, and the product is arranged in a rectangular array. The blank is made of 92% black alumina, and the printing paste and hanging hole paste are tungsten paste. The outer ring electroplating line width is 0.5mm, and the pad connection line width is 0.2mm.

[0044] Depend on Figure 4 As can be seen, the electroplating lines are arranged around the product, and the solder pads are connected to the outer electroplating lines through straight electroplating lines, resulting in a simple layout. However, the 2.1mm gap between products is reserved for electroplating wiring, resulting in a large residual area of ​​green ceramic, low utilization rate, and the risk of scratching the product due to the residual edge between two products during the final sintering stage.

[0045] Comparative Example 2: Figure 5 The layout shown is an HTCC layout design that uses electroplating lines to surround the product, with rounded corners, and the products arranged in a rectangular array; the green body is 92% black alumina, and the printing paste and hole-hanging paste are tungsten pastes. The layout is as follows. Figure 5 As shown.

[0046] Depend on Figure 5 As can be seen, the electroplating line surrounds the entire product, and the metallized areas such as bonding fingers and sidewall holes are all connected through the wiring design. Due to the dense internal wiring, some pads are connected to the sidewall holes on other layers through the wiring design, thus connecting all pads for electroplating. This layout is simple and easy to operate. However, a suitable area needs to be reserved between products to place the electroplating line, which results in significant material waste, and cutting this area can easily scratch the product during the dicing process.

[0047] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A layout structure for an HTCC ceramic tube shell, characterized in that, It includes a ceramic substrate, on which multiple product ceramic bodies are arranged. A straight electroplating line and an outer electroplating line connected to the straight electroplating line are arranged around the ceramic substrate. A side wall hole and a serpentine electroplating line connected to the side wall hole are arranged between two adjacent product ceramic bodies. The serpentine electroplating line is connected to the straight electroplating line.

2. The HTCC ceramic tube shell layout structure according to claim 1, characterized in that, The distance between two adjacent ceramic bodies is 2.1mm.

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