A temperature control device for a split-flow semiconductor process

Abstract

The application provides a temperature control device for semiconductor process, which comprises a compressor temperature control unit, a Peltier temperature control unit and a medium circulation unit. The compressor temperature control unit comprises a compressor, a condenser and an evaporator. The Peltier temperature control unit comprises a Peltier sheet, a circulating medium heat exchanger connected with the cold side of the Peltier sheet and a refrigerant heat exchanger connected with the hot side of the Peltier sheet. The medium circulation unit circulates medium, and the medium flows through the circulating medium heat exchanger. The exhaust port of the compressor is connected with the inlet of the condenser, the outlet of the condenser is divided into a first refrigerant branch and a second refrigerant branch, the first refrigerant branch is connected with the refrigerant inlet of the evaporator, the second refrigerant branch is connected with the refrigerant inlet of the refrigerant heat exchanger, and the refrigerant outlet of the evaporator and the refrigerant outlet of the refrigerant heat exchanger are combined and connected with the suction port of the compressor. The device greatly improves the heat dissipation capacity of the hot side of the Peltier sheet, thereby reducing the working temperature of the Peltier sheet and improving the refrigeration efficiency.

Description

Technical Field

[0001] This application relates to the field of semiconductor process technology, and specifically to a temperature control device for a shunt semiconductor process. Background Technology

[0002] In the semiconductor manufacturing field, the accuracy and stability of temperature control are crucial to chip yield and equipment lifespan. To overcome the inefficiency of traditional compressor-based refrigeration at low loads, current semiconductor temperature control devices have been optimized with a series refrigerant path (compressor → evaporator → refrigerant heat exchanger → return to compressor) using a Peltier converter. This structure can achieve energy efficiency optimization and energy consumption reduction to some extent. However, because the refrigerant at the evaporator outlet heats up due to heat absorption, it loses some of its low-temperature advantage by the time it enters the refrigerant heat exchanger, which weakens the cooling capacity of the Peltier converter to some extent. Furthermore, the minimum cold-side temperature of the Peltier converter is limited by the outlet temperature of the preceding evaporator, making it unsuitable for some ultra-low temperature and ultra-precision process scenarios. Utility Model Content

[0003] In view of the above-mentioned defects or deficiencies in the prior art, this application aims to provide a temperature control device for a shunt semiconductor process, enabling the refrigerant to reach the Peltier unit at a low temperature; the device includes:

[0004] A compressor temperature control unit, comprising a compressor, a condenser, and an evaporator;

[0005] A Peltier temperature control unit, comprising a Peltier patch, a circulating medium heat exchanger connected to the cold side of the Peltier patch, and a refrigerant heat exchanger connected to the hot side of the Peltier patch;

[0006] A medium circulation unit, wherein a medium circulates within the medium circulation unit, and the medium flows through the circulating medium heat exchanger;

[0007] The compressor's exhaust port is connected to the condenser's inlet, and the condenser's outlet is split into a first refrigerant branch and a second refrigerant branch. The first refrigerant branch is connected to the evaporator's refrigerant inlet, and the second refrigerant branch is connected to the refrigerant inlet of the refrigerant heat exchanger. The evaporator's refrigerant outlet and the refrigerant heat exchanger's refrigerant outlet are combined and then connected to the compressor's suction port.

[0008] The refrigerant flowing through the refrigerant inlet of the evaporator and the refrigerant flowing through the refrigerant inlet of the refrigerant heat exchanger have the same thermodynamic state.

[0009] According to the technical solution provided in the embodiments of this application, the medium circulation unit includes a medium tank and a circulation pump. The circulation pump drives the medium to flow through the circulating medium heat exchanger and then into the evaporator.

[0010] According to the technical solution provided in the embodiments of this application, the compressor temperature control unit further includes an oil separator, a liquid storage tank, and a dryer filter; the exhaust port of the compressor is connected in sequence to the oil separator and the condenser, the outlet of the condenser is connected to the inlet of the liquid storage tank, and the outlet of the liquid storage tank is split into the first refrigerant branch and the second refrigerant branch after passing through the dryer filter.

[0011] According to the technical solution provided in the embodiments of this application, the outlet of the liquid storage tank passes through the drying filter, and then through the main throttling component, and is divided into the first refrigerant branch and the second refrigerant branch.

[0012] According to the technical solution provided in the embodiments of this application, the main throttling component is an electronic expansion valve, which is used to throttle the refrigerant into a low-temperature, low-pressure gas-liquid mixture; the low-temperature, low-pressure gas-liquid mixture of refrigerant flowing out from the main throttling component is diverted to the first refrigerant branch and the second refrigerant branch in equal thermodynamic states.

[0013] According to the technical solution provided in the embodiments of this application, the refrigerant outlet of the evaporator and the refrigerant outlet of the refrigerant heat exchanger are combined and then connected to the suction port of the compressor through an electric heater.

[0014] According to the technical solution provided in the embodiments of this application, the medium circulation unit further includes a level indicator and a low level switch; the circulation pump is located on the outlet pipeline of the medium tank, and the level indicator and the low level switch are installed inside the medium tank.

[0015] According to the technical solution provided in the embodiments of this application, the medium circulation unit further includes a drain valve, a liquid inlet and a flow meter. The drain valve is located at the bottom of the medium tank, the liquid inlet is located at the top of the medium tank, and the flow meter is located on the outlet pipe of the circulation pump.

[0016] According to the technical solution provided in the embodiments of this application, the compressor temperature control unit further includes a bypass throttling component; the inlet of the bypass throttling component is connected to the pipeline between the condenser and the oil separator, and the outlet of the bypass throttling component is connected to the refrigerant inlet of the evaporator and the refrigerant inlet of the refrigerant heat exchanger, respectively.

[0017] According to the technical solution provided in the embodiments of this application, it further includes a pressure sensing component and a temperature sensing component. The pressure sensing component includes multiple pressure sensors, and the temperature sensing component encapsulates multiple temperature sensors.

[0018] In summary, this application proposes a temperature control device for a split-flow semiconductor process, including a compressor temperature control unit comprising a compressor, a condenser, and an evaporator; the Peltier temperature control unit includes a Peltier plate, a circulating medium heat exchanger connected to the cold side of the Peltier plate, and a refrigerant heat exchanger connected to the hot side of the Peltier plate; a medium circulates within the medium circulation unit, and the medium flows through the circulating medium heat exchanger; wherein, the compressor's exhaust port is connected to the condenser's inlet, and the condenser's outlet is split into a first refrigerant branch and a second refrigerant branch; the first refrigerant branch is connected to the evaporator's refrigerant inlet, and the second refrigerant branch is connected to the refrigerant inlet of the refrigerant heat exchanger; the evaporator's refrigerant outlet and the refrigerant heat exchanger's refrigerant outlet are combined and then connected to the compressor's suction port.

[0019] Compared with existing technologies, the advantages of this application are as follows: This device splits the refrigerant at the condenser outlet into two branches (the first refrigerant branch enters the evaporator, and the second refrigerant branch directly enters the refrigerant heat exchanger), making the thermodynamic state of the refrigerant entering the heat exchanger consistent with that entering the evaporator. This significantly improves the heat dissipation capacity of the Peltier hot side, thereby reducing the Peltier operating temperature and improving its cooling efficiency (COP). Because the flow is split into two branches, the refrigerant inlet temperature of the heat exchanger is not affected by the preceding evaporator, and the Peltier cold side can achieve a lower limiting temperature, making it suitable for ultra-low temperature semiconductor processes. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the temperature control device for a shunt semiconductor process provided in an embodiment of this application.

[0021] The text labels in the image represent:

[0022] 1. Compressor; 2. Third temperature sensor; 3. Oil separator; 4. Bypass throttling assembly; 5. Condenser; 6. Receiver tank; 7. Fourth pressure sensor; 8. Dryer filter; 9. Main throttling assembly; 10. Electric heater; 11. Medium tank pressure sensor; 12. First temperature sensor; 13. Second temperature sensor; 14. First pressure sensor; 15. Flow meter; 16. Circulating medium heat exchanger; 17. Peltier patch; 18. Refrigerant heat exchanger; 19. Evaporator; 20. Drain valve; 21. Circulating pump; 22. Filler port; 23. Medium tank; 24. Liquid level indicator; 25. Low liquid level switch; 26. Compressor return gas temperature sensor; 27. Fifth pressure sensor; 28. Fourth temperature sensor; 29. ​​Fifth temperature sensor; 30. Second pressure sensor; 31. Third pressure sensor. Detailed Implementation

[0023] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0024] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0025] Example 1

[0026] As mentioned in the background section, in view of the problems in the prior art, this application proposes a temperature control device for a shunt semiconductor process, such as... Figure 1 As shown, it includes:

[0027] A compressor temperature control unit, comprising a compressor 1, a condenser 5, and an evaporator 19;

[0028] The Peltier temperature control unit includes a Peltier patch 17, a circulating medium heat exchanger 16 connected to the cold side of the Peltier patch 17, and a refrigerant heat exchanger 18 connected to the hot side of the Peltier patch 17.

[0029] A medium circulation unit, wherein a medium circulates within the medium circulation unit, and the medium flows through the circulating medium heat exchanger 16;

[0030] Furthermore, the medium circulation unit includes a medium tank 23 and a circulation pump 21. The circulation pump 21 drives the medium to flow through the circulating medium heat exchanger 16 and then into the evaporator 19. Specifically, the medium outlet of the circulating medium heat exchanger 16 is connected to the medium inlet of the evaporator 19, forming a series heat exchange path.

[0031] The compressor 1's exhaust port is connected to the condenser 5's inlet, and the condenser 5's outlet is split into a first refrigerant branch and a second refrigerant branch. The first refrigerant branch is connected to the evaporator 19's refrigerant inlet, and the second refrigerant branch is connected to the refrigerant inlet of the refrigerant heat exchanger 18. The evaporator 19's refrigerant outlet and the refrigerant heat exchanger 18's refrigerant outlet are combined and then connected to the compressor 1's suction port.

[0032] The refrigerant flowing through the refrigerant inlet of the evaporator 19 has the same thermodynamic state as the refrigerant flowing through the refrigerant inlet of the refrigerant heat exchanger 18.

[0033] In a preferred embodiment, the compressor temperature control unit further includes an oil separator 3, a liquid receiver 6, and a dryer filter 8; the exhaust port of the compressor 1 is connected in sequence to the oil separator 3 and the condenser 5, the outlet of the condenser 5 is connected to the inlet of the liquid receiver 6, and the outlet of the liquid receiver 6 is split into the first refrigerant branch and the second refrigerant branch after passing through the dryer filter 8.

[0034] Furthermore, the outlet of the liquid storage tank 6 passes through the drying filter 8, and then through the main throttling assembly 9 before being split into the first refrigerant branch and the second refrigerant branch.

[0035] Furthermore, the main throttling component 9 is an electronic expansion valve used to throttle the refrigerant into a low-temperature, low-pressure gas-liquid mixture; the low-temperature, low-pressure gas-liquid mixture of refrigerant flowing out of the main throttling component 9 is diverted to the first refrigerant branch and the second refrigerant branch in equal thermodynamic states.

[0036] Specifically, the medium tank 23 is used to contain the medium, which can be water, and the medium tank 23 is a water tank. The circulating pump 21 is a water pump, the Peltier plate 17 is a semiconductor refrigeration chip, and the refrigerant heat exchanger 18 is a water-cooled plate. The compressor 1 is a fixed-frequency or variable-frequency compressor, the condenser 5 adopts water-cooled or air-cooled heat dissipation, the medium tank 23 is a single-tank or double-tank structure, and the circulating pump 21 is a fixed-frequency or variable-frequency compressor. In the current series structure, the refrigerant absorbs heat after flowing through the evaporator 19, and its temperature rises before entering the refrigerant heat exchanger 18. At this point, the refrigerant has lost some of its low-temperature capacity and cannot efficiently cool the hot side of the Peltier plate 17. The cooling capacity (cold side temperature) of the Peltier plate 17 directly depends on the heat dissipation efficiency of the hot side: the lower the hot side temperature, the easier it is for the cold side to reach ultra-low temperatures (such as below -60°C). However, in the series design, the heat dissipation of the hot side is limited by the outlet temperature of the evaporator 19, which prevents the cold side temperature of the Peltier plate from being further reduced, making it difficult to meet the requirements of ultra-precision processes (such as semiconductor etching or low-temperature testing). Furthermore, due to the high inlet temperature of the refrigerant heat exchanger 18, the Peltier requires a larger current to maintain the temperature difference, increasing system energy consumption. Based on this, further optimization using a series configuration resulted in the structure of this invention, where the refrigerant path is optimized to a parallel split: the refrigerant from the condenser 5 outlet is throttled by the main throttling component (such as an electronic expansion valve) to a low-temperature, low-pressure gas-liquid mixture, and then split into two independent branches: the first refrigerant branch flows directly into the evaporator 19 for cooling the medium circulation unit. The second refrigerant branch flows directly into the refrigerant heat exchanger 18 of the Peltier unit for cooling the hot side of the Peltier plate 17. The refrigerant in both branches has the same thermodynamic state (low-temperature, low-pressure gas-liquid mixture) at the inlet, and the split occurs after throttling, ensuring that the refrigerant inlet temperature of the refrigerant heat exchanger 18 is consistent with the refrigerant inlet temperature of the evaporator 19, avoiding the "preheating" problem in the series design. Finally, the refrigerant outlets of the two branches merge back into the compressor 1 suction port, completing the cycle.

[0037] The technical principles are explained below: I. Refrigerant State Optimization: Ensuring the Low-Temperature Advantage is Not Lost; Function of the Main Throttling Component: The main throttling component is an electronic expansion valve. Before the splitting point, the electronic expansion valve throttles the high-pressure liquid refrigerant at the condenser outlet 5 into a low-temperature, low-pressure gas-liquid mixture. This state is the ideal starting point for refrigerant evaporation and heat absorption. After throttling, the refrigerant is immediately split into two branches in the same state, ensuring that the refrigerant temperature in the second branch (refrigerant heat exchanger inlet 18) is the same as that in the first branch (evaporator inlet 19), with no temperature difference and consistent thermodynamic states (temperature, pressure, enthalpy), avoiding preferential "preheating" of any branch. In addition, the electronic expansion valve precisely controls the state after throttling, ensuring that the refrigerant in the second branch is always in an ultra-low temperature gas-liquid mixture state. In ultra-low temperature processes, the splitting ratio can be adjusted (e.g., increasing the flow rate of the second branch) to enhance the Peltier cooling capacity. II. Mechanism for Enhancing Peltier Cooling Capacity: Peltier Effect: When current passes through Peltier plate 17, the cold side absorbs heat (cools), and the hot side releases heat. The hot-side temperature (T_h) must be dissipated quickly; otherwise, the cold-side temperature (T_c) cannot be reduced (the refrigeration temperature difference ΔT = T_h - T_c is limited by the hot-side heat dissipation efficiency). Hot-side heat dissipation relies on the refrigerant heat exchanger 18: the refrigerant evaporates in the heat exchanger, absorbing heat from the Peltier hot side. The lower the refrigerant inlet temperature, the stronger the evaporation heat absorption capacity, and the lower the hot-side temperature (T_h). In this structure, because the refrigerant inlet temperature of the second branch is low (directly from the throttling), the refrigerant heat exchanger 18 can absorb heat from the Peltier hot side more efficiently. After T_h decreases, the Peltier cold side can reach a lower temperature (ΔT increases), causing the cold-side temperature (T_c) to exceed the lower limit. The split-flow design decouples the Peltier temperature control unit from the compressor temperature control unit, so the refrigerant heat exchanger 18 is not affected by fluctuations in the evaporator 19 outlet temperature, resulting in more stable temperature control.

[0038] In a preferred embodiment, the refrigerant outlet of the evaporator 19 and the refrigerant outlet of the refrigerant heat exchanger 18 are combined and then connected to the suction port of the compressor 1 via an electric heater 10.

[0039] Specifically, the electric heater 10 is connected in series on the combined outlet pipe of the evaporator 19 and the refrigerant heat exchanger 18, located at the front end of the compressor 1's suction port. The compressor 1 return gas temperature sensor 26 detects the refrigerant temperature at the suction port. When the temperature is lower than a set value (e.g., 5°C), the electric heater 10 is activated to superheat the gaseous refrigerant to a safe temperature. This enables compressor 1 to prevent liquid slugging: preventing low-temperature, low-pressure refrigerant from liquefying inside the compressor 1 and causing liquid slugging damage, thus extending the compressor 1's lifespan. It also ensures stable return gas superheat: maintaining the suction superheat within the optimal range of 5~8°C, improving the compressor 1's volumetric efficiency.

[0040] In a preferred embodiment, the medium circulation unit further includes a level indicator 24 and a low level switch 25; the circulation pump 21 is located on the outlet pipe of the medium tank 23, and the level indicator 24 and the low level switch 25 are installed inside the medium tank 23.

[0041] Furthermore, the medium circulation unit also includes a drain valve 20, a liquid inlet 22, and a flow meter 15. The drain valve 20 is located at the bottom of the medium tank 23, the liquid inlet 22 is located at the top of the medium tank 23, and the flow meter 15 is located on the outlet pipe of the circulation pump 21.

[0042] Specifically, the medium tank 23 serves as a storage container for the circulating medium. Low-temperature media such as aqueous solutions are injected through the inlet 22, and a drain valve 20 is installed at the bottom for maintenance and venting. A circulating pump 21 is installed on the outlet pipe of the medium tank 23 to drive the medium flow. A level indicator 24 and a low-level switch 25 are integrated inside the medium tank 23 to monitor the liquid level in real time; the low-level switch 25 triggers a shutdown protection mechanism to prevent pump damage from dry running. The level indicator 24, a transparent window or a digital sensor, is vertically mounted on the side wall of the medium tank 23 to display the liquid level in real time. The low-level switch 25, a float-type or capacitive sensor, is located at the bottom of the tank and sends a shutdown signal when the liquid level drops to the safe lower limit.

[0043] In a preferred embodiment, the compressor temperature control unit further includes a bypass throttling component 4; the inlet of the bypass throttling component 4 is connected to the pipeline between the condenser 5 and the oil separator 3, and the outlet of the bypass throttling component 4 is connected to the refrigerant inlet of the evaporator 19 and the refrigerant inlet of the refrigerant heat exchanger 18, respectively.

[0044] Specifically, the bypass throttling component 4 is a thermal bypass expansion valve. The outlet of the bypass throttling component 4 is split into a first bypass branch and a second bypass branch, which are respectively connected to the refrigerant inlet of the evaporator 19 and the refrigerant inlet of the refrigerant heat exchanger 18, forming a parallel bypass circuit from the high-pressure side to the dual temperature control unit. The dual bypass structure is as follows: Main throttling: condenser 5 → liquid storage tank 6 → first throttling component 9 → split into a first refrigerant branch (to evaporator 19) and a second refrigerant branch (to refrigerant heat exchanger 18); Bypass throttling: oil separator 3 → bypass throttling component 4 → split into a first bypass branch (to evaporator 19) and a second bypass branch (to refrigerant heat exchanger 18).

[0045] This implementation can achieve: Dynamic flow distribution: By adjusting the opening of the bypass throttling component 4, the bypass flow of high-pressure side refrigerant to both the evaporator 19 and the refrigerant heat exchanger 18 is controlled; Low-temperature priority mode: The bypass branch flow of the evaporator 19 is reduced, while the bypass branch flow of the refrigerant heat exchanger 18 is increased, thereby enhancing the cooling capacity of the Peltier plate 17; High-load mode: The bypass branch flow of the evaporator 19 is increased to quickly replenish the refrigerant demand of the evaporator 19, preventing the compressor 1's suction pressure from being too low. Liquid slugging protection: During low-temperature startup or sudden load changes, the opening of the bypass throttling component 4 is increased to inject more high-pressure gaseous refrigerant into the refrigerant heat exchanger 18, raising the Peltier heat-side temperature and preventing liquid return from the compressor 1.

[0046] In a preferred embodiment, the system further includes a pressure sensing component and a temperature sensing component, wherein the pressure sensing component includes a plurality of pressure sensors and the temperature sensing component encapsulates a plurality of temperature sensors.

[0047] Specifically, the pressure sensors include a first pressure sensor 14, a second pressure sensor 30, a third pressure sensor 31, a fourth pressure sensor 7, and a fifth pressure sensor 27. The first pressure sensor 14 is installed at the medium inlet of the circulating medium heat exchanger 16, the second pressure sensor 30 is installed at the inlet pipe of the plant water used to dissipate heat from the condenser 5, the third pressure sensor 31 is installed at the outlet pipe of the plant water used to dissipate heat from the condenser 5, the fourth pressure sensor 7 is installed on the pipeline between the liquid storage tank 6 and the dryer filter 8, and the fifth pressure sensor 27 is installed on the straight pipe section before the suction port of the compressor 1.

[0048] Specifically, the temperature sensors include a first temperature sensor 12 located on the pipeline of the circulating pump 21 away from the medium tank 23, and a second temperature sensor 13 located at the medium inlet of the circulating medium heat exchanger 16. It also includes a compressor 1 return gas temperature sensor 26, installed on the straight pipe section before the compressor 1's suction port, to control the electric heater 10; it activates heating when the temperature is low to prevent liquid slugging, and reduces the expansion valve opening to increase superheat when the temperature is too high. It also includes a third temperature sensor 2 installed on the pipeline between the compressor 1's discharge port and the oil separator 3 to monitor the compressor 1's discharge temperature and prevent system overheating damage. Finally, it includes a fourth temperature sensor 28 installed on the inlet pipe of the plant water system for cooling the condenser 5, and a fifth temperature sensor 29 installed on the outlet pipe of the plant water system for cooling the condenser 5.

[0049] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. The above descriptions are only preferred embodiments of this application. It should be noted that due to the limitations of written expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of this invention, and can also combine the above technical features in an appropriate manner. These improvements, modifications, changes, or combinations, or the direct application of the inventive concept and technical solution to other situations without modification, should all be considered within the scope of protection of this application.

Claims

1. A temperature control device for a shunt semiconductor process, characterized in that, include: The compressor temperature control unit includes a compressor (1), a condenser (5) and an evaporator (19). The Peltier temperature control unit includes a Peltier patch (17), a circulating medium heat exchanger (16) connected to the cold side of the Peltier patch (17), and a refrigerant heat exchanger (18) connected to the hot side of the Peltier patch (17). A medium circulation unit, wherein a medium circulates within the medium circulation unit, and the medium flows through the circulating medium heat exchanger (16). The compressor (1) has its exhaust port connected to the inlet of the condenser (5), and the outlet of the condenser (5) is split into a first refrigerant branch and a second refrigerant branch. The first refrigerant branch is connected to the refrigerant inlet of the evaporator (19), and the second refrigerant branch is connected to the refrigerant inlet of the refrigerant heat exchanger (18). The refrigerant outlet of the evaporator (19) and the refrigerant outlet of the refrigerant heat exchanger (18) are combined and then connected to the suction port of the compressor (1). The refrigerant at the refrigerant inlet of the evaporator (19) and the refrigerant at the refrigerant inlet of the refrigerant heat exchanger (18) have the same thermodynamic state.

2. The temperature control device for shunt semiconductor process according to claim 1, characterized in that: The medium circulation unit includes a medium tank (23) and a circulation pump (21). The circulation pump (21) drives the medium to flow through the circulating medium heat exchanger (16) and then into the evaporator (19).

3. The temperature control device for a shunt semiconductor process according to claim 1, characterized in that: The compressor temperature control unit also includes an oil separator (3), a liquid storage tank (6), and a dryer filter (8); the exhaust port of the compressor (1) is connected in sequence to the oil separator (3) and the condenser (5), the outlet of the condenser (5) is connected to the inlet of the liquid storage tank (6), and the outlet of the liquid storage tank (6) is split into the first refrigerant branch and the second refrigerant branch after passing through the dryer filter (8).

4. The temperature control device for a shunt semiconductor process according to claim 3, characterized in that: The outlet of the liquid storage tank (6) passes through the dryer filter (8), and then through the main road throttling assembly (9) before being split into the first refrigerant branch and the second refrigerant branch.

5. The temperature control device for a shunt semiconductor process according to claim 4, characterized in that: The main throttling component is an electronic expansion valve used to throttle the refrigerant into a low-temperature, low-pressure gas-liquid mixture. The low-temperature, low-pressure gas-liquid mixture of refrigerant flowing out of the main throttling component is diverted to the first refrigerant branch and the second refrigerant branch in equal thermodynamic states.

6. The temperature control device for a shunt semiconductor process according to claim 1, characterized in that: The refrigerant outlet of the evaporator (19) is combined with the refrigerant outlet of the refrigerant heat exchanger (18), and then connected to the suction port of the compressor (1) via an electric heater (10).

7. The temperature control device for a shunt semiconductor process according to claim 2, characterized in that: The medium circulation unit also includes a level indicator (24) and a low level switch (25); the circulation pump (21) is located on the outlet pipe of the medium tank (23), and the level indicator (24) and the low level switch (25) are installed inside the medium tank (23).

8. The temperature control device for a shunt semiconductor process according to claim 2, characterized in that: The medium circulation unit also includes a drain valve (20), a liquid inlet (22) and a flow meter (15). The drain valve (20) is located at the bottom of the medium tank (23), the liquid inlet (22) is located at the top of the medium tank (23), and the flow meter (15) is located on the outlet pipe of the circulation pump (21).

9. The temperature control device for a shunt semiconductor process according to claim 3, characterized in that: The compressor temperature control unit also includes a bypass throttling assembly (4); the inlet of the bypass throttling assembly (4) is connected to the pipeline between the condenser (5) and the oil separator (3), and the outlet of the bypass throttling assembly (4) is connected to the refrigerant inlet of the evaporator (19) and the refrigerant inlet of the refrigerant heat exchanger (18), respectively.

10. The temperature control device for a shunt semiconductor process according to claim 1, characterized in that: It also includes a pressure sensing component and a temperature sensing component, wherein the pressure sensing component includes multiple pressure sensors and the temperature sensing component includes multiple temperature sensors.

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