A multilayer high-density double-sided PCB circuit board with heat conduction structure

Abstract

The utility model discloses a kind of multilayer high-density double-sided PCB circuit board with heat conduction structure, it is related to PCB manufacturing technical field, including substrate, the substrate is set and is set with insulating layer, two the one side fixedly arranged with copper layer of insulating layer away from substrate, cross air duct is set between the substrate, cross air duct inside is provided with heat conduction mechanism, two the one side fixedly arranged with heat conduction plate of copper layer away from substrate.The utility model is set to reciprocating screw rod, reciprocating plate, two shafts, hinged rod, push plate, push rod and return spring, realizes through push plate acceleration internal air circulation, increases heat dissipation effect, and cooperate with the gap between push plate and cross air duct, so that push plate when reciprocating push-pull, cross air duct inside will form circulating air duct too, further increase heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of PCB manufacturing technology, specifically to a multilayer high-density double-sided PCB circuit board with a thermally conductive structure. Background Technology

[0002] A PCB, or Printed Circuit Board, is a crucial electronic component. It serves as the support for electronic components and the carrier for their electrical connections. Because it is manufactured using electronic printing techniques, it is called a "printed" circuit board. PCBs have evolved from single-layer to double-sided, multi-layer, and flexible designs, and continue to develop in their respective directions. Continuous advancements towards higher precision, higher density, and higher reliability, along with reductions in size, cost, and performance, ensure that PCBs maintain strong vitality in the development of future electronic devices.

[0003] However, due to the high density of the multi-layered double-sided PCB circuit board, the existing heat dissipation structure accumulates a lot of heat during use. The existing heat dissipation and heat conduction mechanism cannot effectively utilize air cooling. Most of them use thermally conductive materials or thermally conductive coatings for heat conduction, which have a short lifespan and require regular replacement of new materials, which is very troublesome and has high material consumption. Utility Model Content

[0004] This utility model addresses the problem of overly simplistic solutions in existing technologies by providing a significantly different solution. Specifically, the purpose of this utility model is to provide a multilayer high-density double-sided PCB circuit board with a thermally conductive structure to solve the problems mentioned in the background.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a multilayer high-density double-sided PCB circuit board with a thermally conductive structure, comprising a substrate, an insulating layer disposed on both the top and bottom of the substrate, a copper layer fixedly disposed on the side of the two insulating layers facing away from the substrate, a cross-shaped air channel disposed between the substrates, a thermally conductive mechanism disposed inside the cross-shaped air channel, a thermally conductive plate fixedly disposed on the side of the two copper layers facing away from the substrate, and four sets of thermally conductive sheets inserted into the two thermally conductive plates.

[0006] Preferably, a filter screen is provided at the end of the cross-shaped air duct.

[0007] Preferably, one of the heat-conducting plates has a circular hole at its center, a filter plate is disposed inside the circular hole, a miniature fan is rotatably mounted at the center of the filter plate, and a drive shaft is fixedly mounted on the top of the miniature fan.

[0008] Preferably, the heat conduction mechanism includes a reciprocating lead screw, a reciprocating plate, and four heat conduction components. The reciprocating lead screw is fixedly mounted on the top of the drive shaft, the reciprocating plate is sleeved on the reciprocating lead screw, and the four heat conduction components are respectively hinged to the side wall of the reciprocating plate.

[0009] Preferably, each of the four heat-conducting components includes two rotating shafts, a hinge rod, a push plate, a push rod, and a return spring. One rotating shaft is rotatably mounted on the side wall of the reciprocating plate. One end of the hinge rod is fixedly mounted on one of the rotating shafts, and the other rotating shaft is fixedly mounted on the other end of the hinge rod. One end of the push rod is hinged to the other rotating shaft. The push plate is fixedly mounted on the end of the push rod, and the return spring is fixedly mounted on the side wall of the push plate opposite to the reciprocating plate.

[0010] Preferably, each of the heat-conducting sheets is provided with a cross-shaped air duct.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] (1) This utility model achieves accelerated internal air circulation and increased heat dissipation effect by setting up a reciprocating screw, reciprocating plate, two rotating shafts, hinge rod, push plate, push rod and reset spring. In addition, the gap between the push plate and the cross air channel makes the cross air channel also form a circulating air channel when the push plate is pushed and pulled back and forth, further increasing the heat dissipation effect.

[0013] (2) This utility model forms an S-shaped air channel between the staggered heat-conducting plates and the cross-shaped air channel, which increases the contact area and contact time between hot air and heat-conducting plates, thereby increasing the heat absorption effect of heat-conducting plates, significantly improving heat dissipation efficiency, and giving full play to the heat dissipation performance of heat-conducting plates. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the internal cross-sectional structure of this utility model;

[0016] Figure 3 This is a cross-sectional view of the heat conduction mechanism of this utility model;

[0017] Figure 4 This is a partial cross-sectional structural diagram of the present invention.

[0018] In the diagram: 1. Substrate; 2. Heat-conducting plate; 3. Cross-shaped air duct; 4. Heat-conducting sheet; 5. Miniature fan; 51. Drive shaft; 6. Heat-conducting mechanism; 61. Reciprocating screw; 62. Reciprocating plate; 63. Rotating shaft; 64. Hinge rod; 65. Push plate; 66. Push rod; 67. Return spring; 7. Filter plate; 8. Copper layer; 9. Insulation layer. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figures 1-4 This utility model provides an embodiment of a multilayer high-density double-sided PCB circuit board with a thermally conductive structure, comprising a substrate 1. Insulating layers 9 are disposed on both the top and bottom of the substrate 1. Copper layers 8 are fixedly disposed on the side of the two insulating layers 9 facing away from the substrate 1. A cross-shaped airflow channel 3 is disposed between the substrate 1. A thermally conductive mechanism 6 is disposed inside the cross-shaped airflow channel 3. A thermally conductive plate 2 is fixedly disposed on the side of the two copper layers 8 facing away from the substrate 1. Four sets of thermally conductive sheets 4 are inserted into the two thermally conductive plates 2. When the circuit board overheats severely, the thermally conductive mechanism 6 circulates the air inside the circuit board, simultaneously allowing the hot air inside to pass through the S-shaped airflow channel formed by the cross-shaped airflow channel 3 and the thermally conductive sheets 4. This ensures that the heat is fully absorbed by the thermally conductive sheets 4, and the heat is dissipated into the air through the part of the thermally conductive sheets 4 in contact with the outside, achieving a heat dissipation effect.

[0021] Specifically, a filter screen is provided at the end of the cross-shaped air duct 3.

[0022] Specifically, one of the heat-conducting plates 2 has a circular hole at its center, and a filter plate 7 is disposed inside the circular hole. A miniature fan 5 is rotatably mounted at the center of the filter plate 7, and a drive shaft 51 is fixedly mounted on the top of the miniature fan 5. The rotation of the miniature fan 5 drives the drive shaft 51 to rotate.

[0023] Specifically, the heat conduction mechanism 6 includes a reciprocating lead screw 61, a reciprocating plate 62, and four heat conduction components. The reciprocating lead screw 61 is fixedly mounted on the top of the transmission shaft 51, the reciprocating plate 62 is sleeved on the reciprocating lead screw 61, and the four heat conduction components are respectively hinged to the side wall of the reciprocating plate 62.

[0024] Specifically, each of the four heat-conducting components includes two rotating shafts 63, a hinge rod 64, a push plate 65, a push rod 66, and a return spring 67. One rotating shaft 63 is rotatably mounted on the side wall of the reciprocating plate 62. One end of the hinge rod 64 is fixedly mounted on one of the rotating shafts 63, and the other rotating shaft 63 is fixedly mounted on the other end of the hinge rod 64. One end of the push rod 66 is hinged to the other rotating shaft 63. The push plate 65 is fixedly mounted on the end of the push rod 66, and the return spring 67 is fixedly mounted on the side wall of the push plate 65 away from the reciprocating plate 62. The rotation of the drive shaft 51 drives the reciprocating screw 61 to rotate, which in turn drives the reciprocating plate 62 to move up and down. The movement of the reciprocating plate 62 drives the hinge rod 64 to move synchronously. One end of the hinge rod 64 rotates around the rotating shaft 63 connected to the reciprocating plate 62, while the other end drives another rotating shaft 63 to push the push rod 66 to move. The movement of the push rod 66 drives the push plate 65 to move. It is worth noting that the push plate 65 slides between itself and the base plate 1, thereby pushing the internal hot air out of the cross-shaped air channel 3. Furthermore, there is a gap between the push plate 65 and the cross-shaped air channel 3, which is not a piston setting. This achieves accelerated internal air circulation through the push plate 65, increasing the heat dissipation effect. In addition, the gap between the push plate 65 and the cross-shaped air channel 3 also creates a circulating air channel inside the cross-shaped air channel 3 when the push plate 65 is pushed and pulled back and forth, further increasing the heat dissipation effect.

[0025] Specifically, each of the heat-conducting plates 4 is provided with a cross-shaped air duct 3 through an interlaced arrangement; the S-shaped air duct is formed between the interlaced heat-conducting plates 4 and the cross-shaped air duct 3, which increases the contact area and contact time between hot air and the heat-conducting plates 4, thereby increasing the heat absorption effect of the heat-conducting plates 4, significantly improving the heat dissipation effect, and giving full play to the heat dissipation performance of the heat-conducting plates 4.

[0026] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A multilayer high-density double-sided PCB circuit board with a thermally conductive structure, characterized in that: The substrate (1) includes an insulating layer (9) on both the top and bottom. A copper layer (8) is fixedly disposed on the side of the two insulating layers (9) away from the substrate (1). A cross-shaped air channel (3) is disposed between the substrates (1). A heat conduction mechanism (6) is disposed inside the cross-shaped air channel (3). A heat conduction plate (2) is fixedly disposed on the side of the two copper layers (8) away from the substrate (1). Four sets of heat conduction sheets (4) are inserted into the two heat conduction plates (2).

2. The multilayer high-density double-sided PCB circuit board with a thermally conductive structure according to claim 1, characterized in that: A filter screen is provided at the end of the cross-shaped air duct (3).

3. The multilayer high-density double-sided PCB circuit board with a thermally conductive structure according to claim 1, characterized in that: One of the heat-conducting plates (2) has a circular hole at its center, and a filter plate (7) is provided inside the circular hole. A miniature fan (5) is provided at the center of the filter plate (7) for limited rotation. A drive shaft (51) is fixedly provided on the top of the miniature fan (5).

4. A multilayer high-density double-sided PCB circuit board with a thermally conductive structure according to claim 3, characterized in that: The heat conduction mechanism (6) includes a reciprocating screw (61), a reciprocating plate (62) and four heat conduction components. The reciprocating screw (61) is fixedly mounted on the top of the transmission shaft (51), the reciprocating plate (62) is sleeved on the reciprocating screw (61), and the four heat conduction components are respectively hinged to the side wall of the reciprocating plate (62).

5. A multilayer high-density double-sided PCB circuit board with a thermally conductive structure according to claim 4, characterized in that: Each of the four heat-conducting components includes two rotating shafts (63), a hinge rod (64), a push plate (65), a push rod (66), and a return spring (67). One of the rotating shafts (63) is rotatably mounted on the side wall of the reciprocating plate (62). One end of the hinge rod (64) is fixedly mounted on one of the rotating shafts (63), and the other rotating shaft (63) is fixedly mounted on the other end of the hinge rod (64). One end of the push rod (66) is hinged to the other rotating shaft (63). The push plate (65) is fixedly mounted on the end of the push rod (66), and the return spring (67) is fixedly mounted on the side wall of the push plate (65) away from the reciprocating plate (62).

6. A multilayer high-density double-sided PCB circuit board with a thermally conductive structure according to claim 1, characterized in that: Each of the heat-conducting plates (4) is provided with a cross-shaped air duct (3) through it.

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