Mainboard assembly, circuit board and electronic device

Abstract

The application discloses a mainboard assembly, a circuit board and an electronic device, and relates to the technical field of electronic devices.The mainboard assembly comprises a mainboard body, a conversion plate connected with the mainboard body, an M.2 connector and an MCIO connector arranged on the conversion plate respectively, and a connecting component.The conversion plate is connected with the mainboard body through the connecting component, so that an installation space with a preset height is formed between at least part of the mainboard body and the conversion plate, and electronic components can be installed in the installation space.The connecting component is made of a conductive material, thereby solving the problem that other electronic components cannot be placed below the M.2 of the mainboard in the prior art, and the space cannot be effectively utilized.The technical effect of enhancing the space utilization efficiency of the mainboard, improving the design flexibility and the system heat dissipation performance is achieved.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to a motherboard assembly, circuit board, and electronic equipment. Background Technology

[0002] Currently, with the rapid growth in demand for cloud computing and big data processing, the design of next-generation server motherboards faces unprecedented challenges: how to achieve higher performance, faster data transfer rates, and the ability to meet diverse customer customization needs within limited physical space. To improve data read / write speeds, reduce latency, and enhance system stability, M.2, due to its compact size and powerful functionality, has become a key component in modern motherboard design, widely used in the installation of high-speed storage and communication devices such as SSDs and wireless network adapters.

[0003] In existing technologies, M.2 modules are typically soldered directly onto the motherboard, ensuring a stable, high-speed connection to the storage device through their compact structure. This design approach significantly improves data transmission efficiency, enabling servers to process massive amounts of information in a short time.

[0004] However, this direct-onboard design has led to a major bottleneck in motherboard space utilization. The space below the M.2 slot is almost completely occupied, making it impossible to install other critical components such as processor coolers, network chips, and power management units, which often require a large installation area and a good heat dissipation environment. Utility Model Content

[0005] This application provides a motherboard assembly, circuit board, and electronic device to at least solve the problem in the related art that other electronic components cannot be placed below the M.2 slot of the motherboard.

[0006] This application provides a motherboard assembly, including: a motherboard body; an adapter board connected to the motherboard body, wherein an M.2 connector and an MCIO connector are respectively disposed on the adapter board; and a connecting component, wherein the adapter board is connected to the motherboard body through the connecting component to form a mounting space of a predetermined height between at least a portion of the motherboard body and the adapter board for mounting electronic components; wherein the connecting component is made of a conductive material.

[0007] Furthermore, the connecting component includes: at least two conductive copper pillars, one end of each of the at least two conductive copper pillars being connected to the main board body, and the other end of each of the at least two conductive copper pillars being detachably connected to the adapter board.

[0008] Furthermore, at least two conductive copper pillars include a first conductive copper pillar and a second conductive copper pillar. One end of the first conductive copper pillar is electrically connected to the positive power port on the motherboard, and the other end of the first conductive copper pillar is electrically connected to the adapter board. One end of the second conductive copper pillar is electrically connected to the ground port on the motherboard, and the other end of the second conductive copper pillar is electrically connected to the adapter board.

[0009] Furthermore, the adapter plate is provided with a first connecting hole and a second connecting hole respectively. One end of the first conductive copper pillar and the second conductive copper pillar are respectively provided with an external thread section and extend into the first connecting hole and the second connecting hole respectively, so that the first conductive copper pillar and the second conductive copper pillar can be detachably connected to the adapter plate by connecting nuts.

[0010] Furthermore, at least two conductive copper pillars are connected to the motherboard body along an extension direction perpendicular to the motherboard body or along an extension direction inclined to the motherboard body; wherein, when at least two conductive copper pillars are connected to the motherboard body along an extension direction inclined to the motherboard body, at least a portion of the adapter plate is located at the top of the installation space and there is a preset angle between the conductive copper pillars and the motherboard body; the preset angle a satisfies: 80°≤a≤90°.

[0011] Furthermore, the M.2 connector includes a first connector interface and a second connector interface. The MCIO connector is electrically connected to the motherboard via a first cable, and the MCIO connector is electrically connected to the first connector interface and the second connector interface via a second cable, respectively, for providing signals and P3V3_STBY standby power to the M.2 connector.

[0012] Furthermore, the adapter board and the main board are arranged parallel to each other.

[0013] Furthermore, the preset height h satisfies: h≤12mm.

[0014] This application also provides a circuit board including the aforementioned motherboard assembly.

[0015] This application also provides an electronic device, including the circuit board mentioned above.

[0016] This application, by setting a connecting component on the motherboard to separate the M.2 adapter board from the motherboard and create a pre-defined mounting space on the motherboard, allows the motherboard area originally occupied by the M.2 to be used for installing other electronic components, such as heat sinks, capacitors, resistors, and network chips. Therefore, it solves the technical problem in traditional motherboard designs where the space below the M.2 cannot accommodate other electronic components, resulting in inefficient space utilization. This improves the overall layout efficiency of the motherboard and the integration of electronic components, facilitating the construction of more compact and functionally comprehensive hardware systems. It achieves the technical effects of enhancing motherboard space utilization efficiency, improving design flexibility, and enhancing system heat dissipation performance. Furthermore, the connecting component not only provides physical support but is also made of conductive material, serving as a bridge for electrical connections. This makes signal and power transmission from the motherboard to the adapter board more direct, reducing the need for additional wiring and connectors. Simultaneously, the existence of the mounting space allows the electronic components below the adapter board to receive better heat dissipation, especially under high-load operating conditions. This effectively reduces the temperature of core components, extends hardware lifespan, reduces system overheating-related failures and downtime, and thus improves the stability and reliability of servers and other equipment. Attached Figure Description

[0017] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a motherboard assembly provided in an embodiment of this application;

[0019] Figure 2 for Figure 1 The conductive copper pillars of the motherboard assembly shown are in a side view with an angled orientation.

[0020] Figure 3 for Figure 1 The diagram shows the structural connection of the adapter board of the motherboard assembly.

[0021] The above figures include the following reference numerals:

[0022] 10. Main board body; 20. Adapter board; 21. First connection hole; 22. Second connection hole; 30. M.2 connector; 31. First connector interface; 32. Second connector interface; 40. MCIO connector; 50. Connecting component; 51. Conductive copper pillar; 510. First conductive copper pillar; 511. Second conductive copper pillar. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0024] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0026] Currently, M.2 slots are typically soldered directly onto the motherboard, ensuring a stable and high-speed connection to storage devices through their compact structure. However, this direct-onboard design results in a major bottleneck in motherboard space utilization; the space beneath the M.2 slot is almost entirely occupied, preventing the placement of other electronic components within that space.

[0027] like Figures 1 to 3 As shown, this application provides a motherboard assembly, including: a motherboard body 10; an adapter board 20 connected to the motherboard body 10, wherein the adapter board 20 is respectively provided with an M.2 connector 30 and an MCIO connector 40; and a connecting component 50, wherein the adapter board 20 is connected to the motherboard body 10 through the connecting component 50, so that a mounting space of a predetermined height is formed between at least a portion of the motherboard body 10 and the adapter board 20 for mounting electronic components; wherein the connecting component 50 is made of a conductive material.

[0028] The motherboard assembly of this application separates the M.2 adapter board 20 from the motherboard body 10 by setting a connecting component 50 on the motherboard body 10, creating a mounting space of a preset height on the motherboard body 10. This allows the motherboard area originally occupied by the M.2 to be used to install other electronic components, such as heat sinks, capacitors, resistors, and network chips. Therefore, it solves the technical problem in traditional motherboard designs where the space below the M.2 cannot be used to place other electronic components, resulting in inefficient space utilization. This improves the overall layout efficiency of the motherboard and the integration of electronic components, facilitating the construction of more compact and functionally comprehensive hardware systems. It achieves the technical effects of enhancing motherboard space utilization efficiency, improving design flexibility, and enhancing system heat dissipation performance. Furthermore, the connecting component 50 not only provides physical support but is also made of conductive material, serving as a bridge for electrical connections. This makes signal and power transmission from the motherboard body 10 to the adapter board 20 more direct, reducing the need for additional wiring and connectors. Meanwhile, the presence of installation space allows the electronic components under the adapter board 20 to obtain a better heat dissipation environment. Especially under high load operating conditions, it can effectively reduce the temperature of core components, extend hardware life, reduce system overheating-induced failures and downtime, thereby improving the stability and reliability of servers and other equipment.

[0029] In this embodiment, the M.2 connector 30 is used to connect an M.2.

[0030] Specifically, the connecting component 50 includes at least two conductive copper pillars 51, one end of each of the at least two conductive copper pillars 51 is connected to the main board 10, and the other end of each of the at least two conductive copper pillars 51 is detachably connected to the adapter board 20.

[0031] This application connects to the adapter board 20 via at least two conductive copper pillars 51, providing not only physical support for the adapter board 20 but also serving as an electrical connection. Directly connecting the power supply on the mainboard 10 and the adapter board 20 via the conductive copper pillars 51 eliminates the need for additional cables and connectors, reducing hardware costs and simplifying the assembly and maintenance of the mainboard components, while ensuring stable power transmission. Furthermore, copper, as an excellent conductor, ensures low-impedance, high-efficiency current transmission, reducing energy loss and enhancing the reliability of the electrical connection.

[0032] Furthermore, after raising the adapter board 20, the mounting space below can serve as an additional heat dissipation channel, improving the heat dissipation conditions for the electronic components below. Utilizing the thermal conductivity of the copper pillars helps to conduct the heat generated on the adapter board 20 to the mainboard body 10, where it is evenly distributed through the heat dissipation system on the mainboard body 10, thereby improving the heat dissipation efficiency of the entire mainboard assembly and extending the lifespan of the electronic components.

[0033] Optionally, the conductive copper pillar 51 in this application can be replaced with other materials with good conductivity.

[0034] Specifically, at least two conductive copper pillars 51 include a first conductive copper pillar 510 and a second conductive copper pillar 511. One end of the first conductive copper pillar 510 is electrically connected to the positive power port on the motherboard 10, and the other end is electrically connected to the adapter board 20. One end of the second conductive copper pillar 511 is electrically connected to the ground port on the motherboard 10, and the other end is electrically connected to the adapter board 20. P3V3 is supplied to the M.2 connector 30 via the first conductive copper pillar 510, while the second conductive copper pillar 511 is connected to the GND of the motherboard 10.

[0035] This application simplifies motherboard component design and reduces manufacturing costs by replacing complex cables and additional connectors with first conductive copper pillars 510 and second conductive copper pillars 511. Simultaneously, this design reduces problems caused by cable failures, improving long-term system reliability and maintenance efficiency. Furthermore, the conductive copper pillars 51 not only transmit electrical signals, but their excellent thermal conductivity also aids in heat dissipation, transferring heat generated by the adapter board 20 to the motherboard, where it is then processed by the motherboard's cooling system, thus contributing to temperature control management of high-power electronic components.

[0036] The first conductive copper pillar 510 is specifically responsible for transmitting positive power, while the second conductive copper pillar 511 is used for grounding. This clearly defined connection method ensures the purity and independence of the power supply and ground wires, avoids mutual interference between electrical signals, and improves the electrical stability and data transmission quality of the system. The connection between the second conductive copper pillar 511 and the grounding port of the motherboard 10 effectively establishes electrical grounding between the adapter board 20 and the motherboard 10. This is crucial for preventing static electricity accumulation, electromagnetic interference, and potential electrical short circuits, ensuring the safe operation of the entire motherboard assembly and reducing the probability of electrical failures.

[0037] like Figure 1As shown, the adapter plate 20 is provided with a first connecting hole 21 and a second connecting hole 22 respectively. One end of the first conductive copper pillar 510 and the second conductive copper pillar 511 is provided with an external thread section and extends into the first connecting hole 21 and the second connecting hole 22 respectively, so that the first conductive copper pillar 510 and the second conductive copper pillar 511 can be detachably connected to the adapter plate 20 by connecting nuts.

[0038] The conductive copper pillar 51 and the adapter plate 20 are connected by a thread, providing a convenient installation and disassembly method. This allows the adapter plate 20 to be easily installed or removed as needed, facilitating equipment maintenance and upgrades. For example, when replacing an M.2 or performing repairs, the adapter plate 20 can be quickly separated from the main board 10 by removing the connecting nut, without damaging or replacing other components, greatly saving maintenance time and costs. Furthermore, the threaded connection allows for fine-tuning of the insertion depth of the conductive copper pillar 51, thereby adjusting the installation space height between the adapter plate 20 and the main board 10. This enables precise control of the installation space size according to the specific dimensions of electronic components and heat dissipation requirements, optimizing the efficiency of the heat dissipation channel, while ensuring the safe installation of all components and avoiding installation difficulties or damage caused by dimensional incompatibility.

[0039] Furthermore, the detachable nature of the threaded connection means that the motherboard components can easily adapt to different electronic components, enhancing system compatibility and scalability. If a new M.2 slot needs to be replaced or added, only the threaded conductive copper pillars 51 and the adapter board 20 need to be replaced for quick adaptation, without requiring major modifications to the motherboard.

[0040] like Figure 1 and Figure 2 As shown, at least two conductive copper pillars 51 are connected to the mainboard body 10 along an extension direction perpendicular to the mainboard body 10 or along an extension direction inclined to the mainboard body 10, respectively; wherein, when at least two conductive copper pillars 51 are connected to the mainboard body 10 along an extension direction inclined to the mainboard body 10, at least a portion of the adapter plate 20 is located at the top of the installation space and there is a preset angle between the conductive copper pillars 51 and the mainboard body 10; the preset angle a satisfies: 80°≤a≤90°.

[0041] This application allows for the selective vertical or tilting of the conductive copper pillar 51. When the conductive copper pillar 51 is connected to the motherboard body 10 vertically, it maximizes the installation space below the adapter board 20, making it suitable for scenarios requiring high space utilization. When connected to the motherboard body 10 at an angle, the tilt angle of the adapter board 20 can be adjusted for specific motherboard layouts, such as densely populated component areas, resulting in more efficient use of the space below. The preset angle range ensures that the tilt is not excessive, preventing insufficient installation space and the inability to install electronic components, thus maintaining connection stability and space availability. Furthermore, the tilted connection provides greater design flexibility, allowing the adapter board 20 to adapt to different motherboard layouts and component combinations, enhancing the compatibility and scalability of motherboard components. The adjustment within the preset angle range ensures good compatibility, enabling this design to be widely used in various electronic devices.

[0042] like Figure 3 As shown, the M.2 connector 30 includes a first connector interface 31 and a second connector interface 32. An MCIO connector 40 is electrically connected to the motherboard body 10 via a first cable. The MCIO connector 40 is also electrically connected to the first connector interface 31 and the second connector interface 32 via a second cable, for providing signals and P3V3_STBY standby power to the M.2 connector 30. The cables are routed through the PCH on the motherboard body 10, with SATA and PCIe connections via the MCIO connector 40 on the adapter board 20 to the M.2 connector 30, providing signals and P3V3_STBY standby power to the M.2 connector respectively.

[0043] This application utilizes a split connection method between the first and second cables to make the connection between the M.2 connector 30 and the motherboard body 10 more flexible, adaptable to different motherboard layouts and installation space conditions. By adjusting the cable length and routing, it ensures that the M.2 receives a stable signal and power supply even on motherboards with complex layouts, without affecting the layout of other components. This design also facilitates the expansion of M.2 devices to locations on the motherboard that were previously difficult to connect directly, improving the scalability of the motherboard components.

[0044] Compared to integrating multiple connectors on the motherboard body 10, the split-connection method reduces the space required for the motherboard and lowers hardware costs. Simultaneously, because the M.2 connector 30 is raised, usable installation space is created below it, which can be used to install other electronic components, improving space utilization efficiency and making the motherboard design more compact. Furthermore, the cable connection method simplifies the installation and removal process of M.2, eliminating the need for complex soldering or fixed physical connections, making maintenance and upgrades more convenient. When it is necessary to replace or add an M.2, simply disconnect the cable connection for quick replacement without redesigning or replacing the entire motherboard assembly.

[0045] This application provides P3V3_STBY standby power via a second cable, ensuring that the M.2 can maintain basic functions, such as data caching or firmware updates, even in system standby or low-power modes. This power management mode optimizes device energy consumption and extends device lifespan. Furthermore, the M.2 connector 30 in this application connects signal and power via a splitter configuration, which not only optimizes signal transmission quality and improves the electromagnetic compatibility and electrical connection flexibility and scalability of the entire system, but also reduces costs, improves space utilization efficiency, and simplifies maintenance and upgrade processes. This has a significant positive impact on enhancing the overall performance and market competitiveness of motherboard components.

[0046] Specifically, the adapter board 20 and the main board 10 are arranged parallel to each other.

[0047] This application ensures a stable and predictable mounting space between the adapter board 20 and the motherboard body 10 through the parallel arrangement of the motherboard body 10. This facilitates the precise placement of other electronic components, such as heat sinks, capacitors, and resistors, beneath the adapter board 20 without concerns about alignment or spacing. This layout provides hardware designers with greater freedom, enabling more efficient component arrangement within limited space, which is beneficial for building higher-density and more compact motherboard systems. Furthermore, the parallel arrangement of the adapter board 20 helps maintain the straightness of signal cables, reducing bends and turns in the signal path, thereby reducing the risk of signal attenuation and reflection, and ensuring the quality and integrity of signal transmission. Simultaneously, the parallel space formed beneath the adapter board 20 can serve as a heat dissipation channel, allowing air to flow along it and providing a better heat dissipation environment for the electronic components below. Especially under high loads, this effectively removes heat, maintaining stable system operation, and also helps utilize the surface area of ​​the adapter board 20 as a heat dissipation area, further improving heat dissipation efficiency.

[0048] It is evident that the parallel arrangement of the adapter board 20 and the motherboard body 10 not only optimizes the spatial layout and signal transmission of the motherboard, improves heat dissipation efficiency and structural reliability, but also simplifies the maintenance, upgrade and production assembly process, and helps to build a high-performance, high-reliability motherboard system.

[0049] In this embodiment, the preset height h satisfies: h≤12mm.

[0050] This application effectively utilizes the installation space by reserving a defined height range below the adapter board 20 to accommodate other electronic components. In high-density motherboard designs, every millimeter of space is precious, and this design maximizes space utilization on the motherboard body 10, achieving a more compact layout that can accommodate more components. Furthermore, this application ensures compatibility with existing motherboard architectures and standard accessories, allowing the design to be widely applied to motherboards of different brands and models, enhancing the solution's versatility and market adaptability.

[0051] Meanwhile, the reserved installation space of up to 12mm in height can serve as an additional heat dissipation channel, improving the heat dissipation conditions of the electronic components below. In high-performance computing systems, optimizing the heat dissipation path helps improve the overall heat dissipation efficiency of the motherboard components, especially for the heat-generating components below, such as the processor and memory chips, providing better thermal management strategies.

[0052] As can be seen, by setting a preset height h that meets the condition h≤12mm, this application can efficiently utilize motherboard space, improve heat dissipation performance, enhance design flexibility and versatility, control costs, simplify installation and maintenance processes, and ultimately improve the overall performance of the system.

[0053] This application also provides a circuit board including the aforementioned motherboard assembly.

[0054] The circuit board provided in this application elevates the M.2 connector 30 by using the adapter board 20 and conductive copper pillars 51 on the motherboard assembly, thereby creating additional mounting space below the adapter board 20. This allows the circuit board to arrange electronic components, such as processors, memory, chipsets, and other critical components more densely within a limited physical area, improving overall space utilization efficiency. This not only optimizes space utilization and heat dissipation, improves signal transmission stability and electrical isolation, but also simplifies maintenance and upgrade processes, enhances compatibility and scalability, and ultimately significantly improves the overall system performance.

[0055] This application also provides an electronic device, including the circuit board mentioned above.

[0056] This application utilizes the M.2 adapter board 20 on the circuit board to make more efficient use of the internal space of electronic devices. By adding extra mounting space below the M.2, more components or more efficient heat dissipation solutions can be accommodated, thus enabling a more compact design of the electronic devices. At the same time, the design of the adapter board 20 and conductive copper pillars 51 on the circuit board simplifies the replacement and maintenance of electronic devices, helping to reduce maintenance costs and improve service efficiency.

[0057] As can be seen, the electronic device of this application, through its integrated and innovative circuit board design, not only provides high-performance and high-efficiency data processing capabilities, but also achieves multiple advantages such as space optimization, enhanced heat dissipation, and ease of maintenance and upgrades. This enhances the device's compatibility, scalability, and market competitiveness, providing users with a more satisfactory product experience.

[0058] It should be noted that the motherboard components, circuit boards and electronic devices of this application can be used for stable operation in data centers, cloud computing infrastructure and high-performance computing systems, and have significant application prospects.

[0059] The foregoing has provided a detailed description of a motherboard assembly, circuit board, and electronic device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A motherboard assembly, characterized in that, include: Mainboard body (10); An adapter board (20) is connected to the main board body (10), and an M.2 connector (30) and an MCIO connector (40) are respectively provided on the adapter board (20); A connecting component (50) is provided, wherein the adapter plate (20) is connected to the main board body (10) via the connecting component (50) to form an installation space of a predetermined height between at least a portion of the main board body (10) and the adapter plate (20) for installing electronic components; The connecting component (50) is made of a conductive material.

2. The motherboard assembly according to claim 1, characterized in that, The connecting component (50) includes: At least two conductive copper pillars (51) are provided, one end of which is connected to the main board body (10), and the other end of which is detachably connected to the adapter plate (20).

3. The motherboard assembly according to claim 2, characterized in that, At least two of the conductive copper pillars (51) include a first conductive copper pillar (510) and a second conductive copper pillar (511). One end of the first conductive copper pillar (510) is electrically connected to the positive power port on the main board (10), and the other end of the first conductive copper pillar (510) is electrically connected to the adapter board (20). One end of the second conductive copper pillar (511) is electrically connected to the ground port on the main board (10), and the other end of the second conductive copper pillar (511) is electrically connected to the adapter board (20).

4. The motherboard assembly according to claim 3, characterized in that, The adapter plate (20) is provided with a first connecting hole (21) and a second connecting hole (22). One end of the first conductive copper pillar (510) and the second conductive copper pillar (511) is provided with an external thread section and extends into the first connecting hole (21) and the second connecting hole (22) respectively, so that the first conductive copper pillar (510) and the second conductive copper pillar (511) can be detachably connected to the adapter plate (20) by means of a connecting nut.

5. The motherboard assembly according to claim 3, characterized in that, At least two of the conductive copper pillars (51) are connected to the main board body (10) in a direction perpendicular to the extension of the main board body (10) or in a direction inclined to the extension of the main board body (10). Wherein, when at least two of the conductive copper pillars (51) are respectively connected to the mainboard body (10) along an extension direction inclined to the mainboard body (10), at least a portion of the adapter plate (20) is located at the top of the mounting space and there is a preset angle between the conductive copper pillars (51) and the mainboard body (10); the preset angle α satisfies: 80° ≤a≤90°。 6. The motherboard assembly according to claim 1, characterized in that, The M.2 connector (30) includes a first connector interface (31) and a second connector interface (32). The MCIO connector (40) is electrically connected to the motherboard body (10) via a first cable. The MCIO connector (40) is electrically connected to the first connector interface (31) and the second connector interface (32) via a second cable, respectively, to provide signals and P3V3_STBY standby power to the M.2 connector (30).

7. The motherboard assembly according to claim 1, characterized in that, The adapter plate (20) is arranged parallel to the main body (10).

8. The motherboard assembly according to claim 1, characterized in that, The preset height h satisfies the following condition: h≤12mm.

9. A circuit board, characterized in that, Includes the motherboard assembly as described in any one of claims 1 to 8.

10. An electronic device, characterized in that, Includes the circuit board as described in claim 9.

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