Heat dissipation device and domain controller

Abstract

Disclosed are a heat dissipation device and a domain controller. The heat dissipation device comprises a shell, the shell being provided with a cooling cavity, a water inlet and a water outlet respectively communicating with the cooling cavity, the cooling cavity being used for flowing of cooling liquid, and the cooling liquid flowing out of the water outlet after flowing through the cooling cavity from the water inlet; along the flow direction of the cooling liquid, the cooling cavity comprises a first zone and a second zone, the flow area of the first zone is smaller than the flow area of the second zone, and the flow area is perpendicular to the flow direction of the cooling liquid; the outer wall of the first zone is used for thermal contact with a chip, so that the heat dissipation efficiency can be improved.

Description

Technical Field

[0001] This disclosure relates to the field of heat dissipation technology, and in particular to a heat dissipation device and a domain controller. Background Technology

[0002] Vehicle domain controllers, as electronic control units for functions such as driver assistance and smart cockpits, typically integrate high-performance computing chips. However, these high-performance chips generate a lot of heat during operation. Insufficient heat dissipation can lead to chip overheating, frequency reduction, decreased computing power, poor user experience, and even cause the domain controller to malfunction. Utility Model Content

[0003] To address the aforementioned technical problems, this disclosure provides a heat dissipation device and a domain controller that can improve heat dissipation efficiency.

[0004] The first aspect of this disclosure provides a heat dissipation device, comprising:

[0005] The shell is provided with a cooling chamber, an inlet and an outlet respectively connected to the cooling chamber. The cooling chamber is used to supply coolant flow, and the coolant flows from the inlet through the cooling chamber and then flows out from the outlet. Along the flow direction of the coolant, the cooling chamber includes a first zone and a second zone. The flow cross-sectional area of ​​the first zone is smaller than that of the second zone, and the flow cross-sectional area is perpendicular to the flow direction of the coolant.

[0006] The outer wall of the first zone is used for thermal contact with the chip.

[0007] A second aspect of this disclosure provides a domain controller, comprising:

[0008] The heat dissipation device provided in the first aspect of this disclosure;

[0009] The circuit board is installed inside the housing of the heat dissipation device;

[0010] The chip is located between the circuit board and the cooling cavity of the housing, and the chip is in contact with the outer wall of the first area of ​​the housing.

[0011] The heat dissipation device provided in this disclosure provides a first zone and a second zone in the cooling cavity, with the flow cross-sectional area of ​​the first zone being smaller than that of the second zone. This causes the coolant to flow through the cooling cavity to the first zone, where the flow cross-sectional area is reduced, resulting in an increased flow rate of the coolant and the removal of more heat, thereby improving the heat exchange efficiency. Furthermore, when the chip comes into contact with the outer wall of the first zone, the heat exchange efficiency between the coolant and the chip is improved, thus enhancing the heat dissipation efficiency. Attached Figure Description

[0012] Figure 1 This is an exploded structural diagram of the heat dissipation device provided in some examples of this disclosure in an application scenario;

[0013] Figure 2 This is a schematic diagram of the cross-sectional structure of a heat dissipation device provided in some examples of this disclosure. Figure 1 ;

[0014] Figure 3 This is a schematic diagram of the cross-sectional structure of a heat dissipation device provided in some examples of this disclosure. Figure 2 ;

[0015] Figure 4 yes Figure 3 An enlarged structural diagram of point A in the cross-section of the heat dissipation device shown;

[0016] Figure 5 This is a schematic diagram of the cross-sectional structure of a heat dissipation device provided in some examples of this disclosure. Figure 3 ;

[0017] Figure 6 This is a schematic diagram of the outline structure of the heat dissipation device provided in some examples of this disclosure when it is in an application scenario;

[0018] Figure 7 This is a schematic diagram of the connection structure between the heat dissipation plate and the housing in some examples of the heat dissipation device provided in this disclosure;

[0019] Figure 8 This is a partial cross-sectional structural diagram of a domain controller provided in some examples of this disclosure;

[0020] Figure 9 This is a cross-sectional view of a domain controller provided in some examples of this disclosure from another angle.

[0021] Explanation of reference numerals in the attached figures:

[0022] 1000 - Domain controller; 100 - Chip; 300 - Circuit board; 400 - Bracket; 410 - Fastener; 20 - Heat spreader; 14 - Protrusion;

[0023] 200 - Heat dissipation device; 10 - Housing; 11 - Cooling chamber; 111 - First zone; 112 - Second zone; 12 - Inlet; 13 - Outlet; 101 - Cover plate; 102 - Main housing; 15 - Baffle column; 11a - Area aligned with the water nozzle; 11b - Area located on both sides of the water nozzle; d1, d2 - Flow channel height; h - Height direction. Detailed Implementation

[0024] To explain this disclosure, exemplary embodiments of the disclosure will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the disclosure, and not all of them. It should be understood that the disclosure is not limited to exemplary embodiments.

[0025] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.

[0026] In this disclosure, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral unit; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. However, specifying a direct connection indicates that the two entities connected are not linked by an intermediate structure, but are simply connected to form a whole. For those skilled in the art, the specific meaning of the above terms in this disclosure can be understood according to the specific circumstances.

[0027] As the brain of intelligent driving, the vehicle domain controller typically integrates high-performance computing chips, leading to increasingly higher power consumption. Therefore, effectively managing the heat dissipation of the domain controller is a pressing issue that needs to be addressed.

[0028] In related technologies, pure die-cast aluminum water-cooled plates are typically used to dissipate heat from domain controllers. However, due to the low heat exchange efficiency of water-cooled plates, they cannot meet the heat dissipation requirements of high-power chips. Alternatively, high-density brazed fins can be added to the flow channels of the water-cooled plate to improve heat exchange efficiency, but this method is more expensive.

[0029] This invention provides a heat dissipation device and a domain controller to improve the heat dissipation efficiency of the heat dissipation device without increasing costs.

[0030] Figure 1 This is an exploded structural diagram of the heat dissipation device provided in some examples of this disclosure in an application scenario. See also Figure 1 The heat dissipation device 200 provided by this utility model includes a housing 10, a cooling cavity 11, an inlet 12 and an outlet 13 respectively communicating with the cooling cavity 11; the outer wall of the cooling cavity 11 is in contact with the chip 100, the cooling cavity 11 is used for the flow of coolant, and the coolant flows from the inlet 12 through the cooling cavity 11 and then flows out from the outlet 13; along the flow direction of the coolant, the cooling cavity 11 includes a first region 111 and a second region 112, the flow cross-sectional area of ​​the first region 111 is smaller than the flow cross-sectional area of ​​the second region 112, the flow cross-section is perpendicular to the flow direction of the coolant, and the outer wall of the first region 111 is used for thermal contact with the chip 100.

[0031] In this disclosure, the flow cross-sectional area can be understood as the effective cross-sectional area through which the coolant flows in the cooling chamber 11. See also Figure 1 As shown, the flow cross-sectional area of ​​the coolant in the first zone 111 is the cross-sectional area of ​​the flowable region of the first zone 111 perpendicular to the coolant flow direction. For example, if a baffle column 15 is provided in the first zone 111, then the flowable region is the area of ​​the first zone 111 that does not correspond to the baffle column 15. The flow cross-sectional area of ​​the coolant in the first zone 111 is the difference between the inner contour cross-sectional area of ​​the first zone 111 perpendicular to the coolant flow direction and the outer contour cross-sectional area of ​​the baffle column 15 perpendicular to the coolant flow direction.

[0032] In this invention, thermal contact refers to the existence of a heat conduction path between the heat dissipation device 200 and the chip 100, enabling the transfer of heat energy from the high-temperature region (chip 100) to the low-temperature region (heat dissipation device 200), thereby achieving heat dissipation through heat exchange. Specifically, because the chip 100 is in contact with the first region 111 of the cooling chamber, when the coolant flows into the cooling chamber 11 through the inlet 12 and out through the outlet 13, the heat from the chip 100 is transferred through the outer wall of the first region 111 of the cooling chamber 11 to the coolant inside the cooling chamber 11, thereby reducing the heat generated by the chip 100 through heat exchange and achieving heat dissipation.

[0033] In some embodiments, the coolant can be a water-based coolant, such as pure water, deionized water, ethylene glycol aqueous solution, or propylene glycol aqueous solution. The coolant can also be a fluorinated fluid; for example, the cooling medium can be an electronic fluorinated fluid or a decafluoropolymer coolant. This disclosure does not limit the type of coolant used in its embodiments.

[0034] It should be noted that this disclosure does not limit the number of the first region 111 and the second region 112, nor does it limit the arrangement order of the first region 111 and the second region 112 within the cooling cavity 11. In one embodiment, the number of first regions 111 can be the same as the number of chips 100 that need to be cooled.

[0035] Based on the heat dissipation device 200 provided by this utility model, by setting a first region 111 and a second region 112 in the cooling cavity, and the flow cross-sectional area of ​​the first region 111 being smaller than that of the second region 112, when the coolant flows to the first region 111, the flow rate of the coolant increases due to the reduced flow cross-sectional area, carrying away more heat and thus improving heat exchange efficiency. Furthermore, when the chip 100 contacts the outer wall of the first region 111, the heat exchange efficiency between the coolant and the chip 100 is improved, further enhancing heat dissipation efficiency.

[0036] In other words, the outer wall of the cooling cavity 11 is in thermal contact with the chip 100. When heat from the chip 100 is transferred to the cooling cavity 11, the chip 100 can be considered a heat source for the cooling cavity 11. Therefore, the heat flux density near the chip 100 in the cooling cavity 11 is greater than that further away from the chip 100. The greater the heat flux density, the faster the heat transfer rate. By setting a first region 111 and a second region 112 in the cooling cavity 11, and using the first region 111 with a smaller flow cross-sectional area for thermal contact with the chip 100, the first region 111 is closer to the heat source. Thus, by placing the cooling cavity 11 with a smaller flow cross-sectional area in a region of higher heat flux density, the heat transfer efficiency between the chip 100 and the coolant in the first region 111 is accelerated. This adapts the structure of the cooling cavity 11 to changes in heat flux density, optimizes the structure of the cooling cavity 11, and improves heat dissipation efficiency.

[0037] In one specific embodiment, a first zone 111 and a second zone 112 are respectively provided in the cooling chamber 11, and the first zone 111 and the second zone 112 are continuously arranged between the water inlet 12 and the water outlet 13.

[0038] Reference Figure 1 One end of the first zone 111 is connected to the inlet 12, and the second zone 112 is connected between the other end of the first zone 111 and the outlet 13. The flow path of the coolant is as follows: it flows into the cooling chamber 11 from the inlet 12, passes through the first zone 111 and the second zone 112, and then flows out from the outlet 13. It can be seen that the coolant enters the first zone 111 at a relatively high flow rate, which enables rapid heat exchange between the coolant and the chip 100, accelerating the heat dissipation efficiency; then, when the coolant flows out through the second zone 112, the flow rate is lower due to the larger flow cross-sectional area, thereby reducing the pressure loss on the outlet 13 and avoiding damage to the heat dissipation device 200.

[0039] Or, Figure 1 In the example where the inlet 12 and outlet 13 are interchanged, one end of the second zone 112 is connected to the inlet 12, and the first zone 111 is connected between the other end of the second zone 112 and the outlet 13. In this case, the coolant flow path is as follows: it flows into the cooling chamber 11 from the inlet 12, passes through the second zone 112 and the first zone 111, and then flows out from the outlet 13. The coolant entering the second zone 112 eliminates inlet turbulence, improves the uniformity of coolant flow, and reduces pressure loss caused by rapid changes in the flow cross-sectional area. When it flows into the first zone 111, the flow cross-sectional area decreases, thereby increasing the flow velocity, enhancing heat exchange, and improving the heat dissipation efficiency for the chip 100.

[0040] In another specific embodiment, if the number of at least one of the first zone 111 or the second zone 112 in the cooling chamber 11 is at least two, then the first zone 111 and the second zone 112 can be arranged alternately between the inlet 12 and the outlet 13. In this case, coolant may flow from the first zone 111 to the second zone 112, or from the second zone 112 to the first zone 111. The effects of coolant flowing from the first zone 111 to the second zone 112, and from the second zone 112 to the first zone 111, can be referred to the aforementioned embodiment where the first zone 111 and the second zone 112 are continuously arranged between the inlet 12 and the outlet 13, and will not be repeated here.

[0041] In one specific embodiment, a technical solution in which the number of at least one of the first zone 111 or the second zone 112 in the cooling cavity 11 is at least two is illustrated by way of example.

[0042] In some embodiments, the cooling chamber 11 includes one first zone 111 and two second zones 112. One end of each of the two second zones 112 is connected to the inlet 12 and the outlet 13, respectively, and the first zone 111 is connected between the other ends of the two second zones 112. In this case, the flow path of the coolant is as follows: it flows into the cooling chamber 11 from the inlet 12, passes through the second zone 112, the first zone 111, and the second zone 112, and then flows out from the outlet 13. This enhances heat transfer when the coolant flows through the first zone 111, improving the heat dissipation efficiency of the chip 100. Furthermore, by setting the second zone 112 at the inlet 12 and the outlet 13, the flow velocity can be reduced, the flow resistance optimized, and turbulence noise prevented from occurring at the outlet 13.

[0043] In some embodiments, the cooling chamber 11 includes two first zones 111 and one second zone 112. One end of each of the two first zones 111 is connected to the inlet 12 and the outlet 13, respectively, and the second zone 112 is connected between the other ends of the two first zones 111. In this case, the flow path of the coolant is as follows: it flows into the cooling chamber 11 from the inlet 12, passes through the first zone 111, the second zone 112, and then flows out from the outlet 13. This allows the coolant to flow through the first zone 111 at a relatively high speed to dissipate heat from the chip 100 with a strong heat exchange efficiency, while the second zone 112 can be used to reduce the flow rate and optimize the flow resistance, thereby reducing the energy loss of the coolant.

[0044] In some embodiments, there are two or more first zones 111 and second zones 112. The first zones 111 and second zones 112 are alternately arranged between the inlet 12 and the outlet 13. In this case, the flow path of the coolant includes the alternation of the first zones 111 and the second zones 112, which can form a periodic flow between the first zones 111 and the second zones 112. The second zone 112 reduces the flow resistance, and the first zone 111 improves the heat dissipation efficiency.

[0045] In some examples, when the heat dissipation device 200 needs to dissipate heat for at least two chips 100 spaced apart, the cooling cavity 11 includes at least two first zones 111 and at least two second zones 112 arranged alternately, and the outer wall of each first zone 111 is used to make thermal contact with at least one chip 100.

[0046] In one specific embodiment, the number of first zones 111 in the cooling cavity 11 may differ from the number of chips 100 requiring heat dissipation. If the dimensions of the chip 100 along the flow direction of the coolant are large, in order to maintain heat exchange efficiency, the chip 100 can make thermal contact with the outer walls of multiple spaced-apart first zones 111. It is understood that if a second zone 112 is located between adjacent first zones 111, the heat dissipation efficiency can be improved through the periodic flow of coolant between the first zones 111 and the second zones 112.

[0047] In some embodiments, the cooling chamber 11 is connected to an external liquid cooling circulation loop through an inlet 12 and an outlet 13, so that the coolant discharged from the outlet 13 can be cooled by the external liquid cooling circulation loop and then repeatedly supplied to the cooling chamber 11, thereby realizing the recycling of coolant and reducing the cost of coolant use.

[0048] To prevent the formation of large eddies as the coolant flows from the first zone 111 to the second zone 112, which could affect heat exchange efficiency, in some embodiments, a transition zone is provided on the side of the second zone 112 that connects to the first zone 111 along the coolant flow direction. In the direction from the first zone 111 to the second zone 112, the flow cross-sectional area of ​​the transition zone gradually increases, thereby preventing the large eddies from reducing the heat exchange area and affecting heat exchange efficiency as the coolant flows from the first zone 111 to the second zone 112.

[0049] To make the flow cross-sectional area of ​​the first zone 111 smaller than that of the second zone 112, this can be achieved in various ways, including but not limited to the following methods.

[0050] Method 1, refer to Figure 2 The cross-sectional structure diagram of the heat dissipation device provided in some examples of this disclosure is shown. Figure 1 The flow channel height d1 of the first zone 111 is smaller than the flow channel height d2 of the second zone 112. Here, by setting the flow channel height d1 of the first zone 111 to be smaller than the flow channel height d2 of the second zone 112, the flow cross-sectional area of ​​the first zone 111 is set to be smaller than the flow cross-sectional area of ​​the second zone 112, thereby increasing the heat exchange efficiency of the first zone 111.

[0051] Specifically, the flow channel height d1 of the first zone 111 can be set as follows: (Refer to...) Figure 2As shown, a protrusion 14 is formed on the inner bottom wall of the cooling cavity 11 facing inward, and a first region 111 is formed between the protrusion 14 and the top wall of the cooling cavity 11. By providing the protrusion 14, the flow channel height d1 of the first region 111 is reduced. In addition, the protrusion 14 can help to enhance the overall rigidity of the cooling cavity 11 and improve the deformation resistance of the shell 10.

[0052] In some embodiments, the projection of the protrusion 14 on the inner bottom wall of the cooling cavity 11 coincides with the projection of the first region 111 on the inner bottom wall of the cooling cavity 11.

[0053] In other embodiments, there are multiple protrusions 14, which are spaced apart in the first region 111, thereby increasing the contact area between the coolant and the cooling chamber 11 and improving heat dissipation efficiency.

[0054] In some examples, the protrusion direction of the protrusion 14 (which is consistent with the height direction h of the cooling cavity 11) is perpendicular to the flow direction of the coolant. The protrusion 14 has little influence on the flow direction of the coolant, thereby reducing the flow resistance of the coolant and increasing the flow exchange efficiency of the coolant in the cooling cavity.

[0055] Method 2: Refer to Figure 3 As shown, the heat dissipation device 200 also includes a turbulence column 15 located in the cooling cavity 11. The turbulence column 15 extends along the height direction h of the cooling cavity 11 to increase the heat exchange efficiency between the coolant and the cooling cavity wall. The turbulence column 15 is located in the first region 111.

[0056] The turbulence column 15 can disrupt the linear movement of the coolant along the extension direction of the first zone 111, generating turbulence, so that the coolant can fully contact the inner wall of the first zone 111, thereby improving the heat exchange efficiency between the coolant and the wall of the first zone 111.

[0057] In this design, the dimension of the turbulence column 15 along the height direction h is smaller than the height of the cooling cavity 11, causing the coolant to form a vortex between the top of the turbulence column 15 and the inner top wall of the cooling cavity 11, thereby improving heat exchange efficiency. Alternatively, the dimension of the turbulence column 15 along the height direction h is equal to the height of the cooling cavity 11, and the turbulence column 15 can serve as a supporting structure for the first region 111, increasing the structural strength of the cooling cavity 11.

[0058] In some embodiments, the cross-section of the turbulence column 15 along the flow direction parallel to the coolant is elliptical. In this case, along the flow cross-section of the coolant, the sidewall of the elliptical turbulence column 15 can have a larger surface area for the same width, thereby increasing the disturbance to the flow direction of the coolant and increasing the heat exchange efficiency between the coolant and the wall of the cooling chamber 11.

[0059] Specifically, the turbulence column 15 can be set in the following way: the major axis of the elliptical turbulence column 15 is aligned with the flow direction of the coolant, which can reduce the flow resistance of the coolant and at the same time achieve disturbance of the coolant flow direction.

[0060] In some embodiments, the baffle column 15 is integrally formed on the inner wall of the cooling cavity 11. In this case, the baffle column 15 and the wall of the cooling cavity 11 are made of the same material. Since the contact thermal resistance is the thermal conduction resistance caused by microscopic unevenness, gaps or material property differences at the material interface, the integral forming of the baffle column 15 on the inner wall of the cooling cavity 11 greatly enhances the structural continuity between the baffle column 15 and the wall of the cooling cavity 11, greatly reduces or even eliminates the contact thermal resistance, and improves the efficiency of heat conduction to the coolant.

[0061] Method 3: Refer to Figure 3 As shown, the heat dissipation device 200 also includes baffle columns 15 located within the cooling cavity 11. The baffle columns 15 extend along the height direction h of the cooling cavity 11 and are distributed in the first region 111 and the second region 112, with the density of baffle columns 15 in the first region 111 being greater than the density of baffle columns 15 in the second region 112. The density of the baffle columns 15 can be understood as the number of baffle columns 15 arranged within the same area of ​​the inner bottom wall of the cooling cavity 11.

[0062] In this disclosure, the first zone 111 is provided with high-density turbulence columns 15, which can increase the heat exchange area between the coolant and the first zone 111, prolong the contact time of the coolant in the first zone 111, and change the flow direction and speed of the coolant, thereby increasing the efficiency of the coolant carrying away heat from the inner wall of the first zone 111; the second zone 112 is provided with low-density turbulence columns 15, which can smooth the sudden change in flow velocity of the coolant from the second zone 112 to the first zone 111 and reduce pressure loss.

[0063] In this disclosure, the technical solution of the spoiler column 15 being located in the second zone 112 can refer to the implementation of the spoiler column 15 being located in the first zone 111 (i.e., method two), and will not be repeated here.

[0064] In some specific embodiments, the turbulence column 15 in the second zone 112 can be set in the following manner: (Refer to...) Figure 3 As shown, the baffle columns 15 are located in the second zone 112 along the flow direction of the coolant and close to the first zone 111. Their arrangement density is less than that of the baffle columns 15 in the first zone 111, which reduces the pressure loss of the coolant flowing from the second zone 112 to the first zone 111 and also reduces the cost of setting the baffle columns 15 in the second zone 112.

[0065] Figure 4 yes Figure 3 An enlarged structural diagram of point A in the cross-section of the heat dissipation device shown.

[0066] In some specific embodiments, the turbulence column 15 of the first zone 111 or the second zone 112 is located near the water nozzle (inlet 12 or outlet 13). For example, Figure 4 An example of a baffle column 15 in the second zone 112 near the inlet 12 is shown. The baffle column 15 near the nozzle can be configured as follows: the density of the baffle column 15 in region 11a of the cooling chamber 11 aligned with the nozzle (inlet 12 or outlet 13) along the coolant flow direction is a first density; the density of the baffle column 15 in region 11b of the cooling chamber 11 located on both sides of the nozzle along the coolant flow direction is a second density. Since the first density is less than the second density, the coolant in region 11a with the first density is less disturbed by the baffle column 15, allowing the coolant to pass quickly through the inlet 12 or outlet 13. Region 11b with the second density, under the action of the baffle column 15, comes into thermal contact with the inner wall of the cooling chamber 11, preventing insufficient local heat dissipation within the cooling chamber 11.

[0067] See Figure 4 In the example shown, the cooling chamber 11 is provided with regions 11a and 11b near the water inlet 12, and the second density of the turbulence column 15 in region 11b is greater than the first density of the turbulence column 15 in region 11a.

[0068] In some embodiments, the flow cross-sectional area of ​​the first zone 111 can be achieved by adjusting the height of the cooling cavity 11 and setting the baffle column 15, etc. The corresponding embodiments can be referred to the aforementioned embodiments of setting the height of the cooling cavity 11 and setting the baffle column 15 in the cooling cavity 11, which will not be repeated here.

[0069] In some embodiments, the flow cross-sectional area of ​​the cooling cavity 11 near the inlet 12 is different from that of the cooling cavity 11 near the outlet 13 along the flow direction of the coolant.

[0070] In some specific embodiments, the flow cross-sectional area of ​​the cooling cavity near the inlet 12 is larger than that of the cooling cavity near the outlet 13. In this case, the coolant flows from the inlet 12 into the area with the larger flow cross-sectional area and from the area with the smaller flow cross-sectional area to the outlet 13. This reduces turbulence losses in the coolant flow and improves the heat exchange efficiency in the area near the outlet 13, which is particularly suitable for the heat dissipation device 200 in the first zone 111 near the outlet 13. Alternatively, the flow cross-sectional area of ​​the cooling cavity near the inlet 12 is smaller than that of the cooling cavity near the outlet 13. In this case, the coolant flows from the inlet 12 into the area with the smaller flow cross-sectional area and from the area with the larger flow cross-sectional area to the outlet 13. This increases the flow velocity of the coolant after it flows into the cooling cavity 11, enhancing the heat exchange efficiency with the cooling cavity 11 and reducing the pressure loss when the coolant flows out of the outlet 13. This is particularly suitable for the heat dissipation device 200 in the first zone 111 near the inlet 12.

[0071] In some specific embodiments, the cooling cavity 11 can be obtained in the following ways: Figure 1 As shown, the housing 10 also includes a cover plate 101 and a main housing 102. The main housing 102 is provided with a groove, and the cover plate 101 covers the opening of the groove, forming a cooling cavity 11 between the cover plate 101 and the groove. The side wall of the cover plate 101 facing the main housing 102 can be the top wall of the cooling cavity 11.

[0072] The main housing 102 and the cover plate 101 can be welded together to form a cooling cavity 11.

[0073] Specifically, the groove in the main housing 102 can be set in the following manner: (Refer to...) Figure 3 As shown, the groove may include a first groove and a second groove that are parallel to each other and interconnected. One of the first groove and the second groove is connected to the water inlet 12, and the other is connected to the water outlet 13. The groove connected to the water inlet 12 forms a water inlet channel with the cover plate 101; the groove connected to the water outlet 13 forms a water outlet channel with the cover plate 101.

[0074] Figure 5 This is a schematic diagram of the cross-sectional structure of a heat dissipation device provided in some examples of this disclosure. Figure 3 .

[0075] Reference Figure 1 or Figure 5 As shown, in some embodiments, the heat dissipation device 200 further includes a vapor chamber (VC) 20, which is at least partially disposed on the outer wall of the first region 111. The vapor chamber 20 is used to make thermal contact with the chip 100 and transfer the heat on the chip 100 to the coolant in the cooling chamber 11.

[0076] Because the heat flux density on the surface of chip 100 is not uniformly distributed, i.e. the temperature on the surface of chip 100 is inconsistent, by at least partially disposed on the outer wall of the first region 111, the heat of chip 100 is evenly distributed on the heat spreader 20 after being transferred to the heat spreader 20, so that an isothermal heat exchange interface is formed between the heat spreader 20 and the wall of the first region 111, effectively improving the efficiency of heat transfer from the heat spreader 20 to the coolant through the wall of the first region 111, thereby improving the efficiency of heat transfer from chip 100 to the coolant.

[0077] The outer wall of the heat spreader 20 is made of a thermally conductive material. The heat spreader 20 utilizes the thermal conductivity of this material to form a heat transfer path between the outer walls of the chip 100 and the first region 111, enabling the heat from the chip 100 to be transferred to the first region 111 through the heat spreader 20. In some examples, the outer wall of the heat spreader 20 may be made of copper or other thermally conductive materials; this disclosure does not limit the material of the heat spreader 20.

[0078] In some embodiments, the heat spreader 20 is disposed on the outer wall of the first region 111 and extends to the outer wall of the second region 112. In this way, the heat of the heat spreader 20 can also be transferred to the coolant through the wall of the second region 112, thereby increasing the thermal contact area between the heat spreader 20 and the coolant and improving the efficiency of heat dissipation for the chip 100.

[0079] Figure 6 This is a schematic diagram showing the outline structure of the heat dissipation device and the chip provided in some examples of the heat dissipation device disclosed herein.

[0080] Reference Figure 6 As shown, in the stacking direction of the heat spreader 20 and the chip 100 (see...) Figure 6 In the direction perpendicular to the paper, the size of the heat spreader 20 is greater than or equal to the size of the chip 100. Setting the size of the heat spreader to be greater than or equal to the size of the chip ensures that the entire area of ​​the chip 100 facing the heat spreader 20 can form thermal contact with the heat spreader 20. This allows the heat from the chip 100 to be transferred to the heat spreader 20 through the contact surface, avoiding the problem of insufficient local heat dissipation caused by heat retention of the chip 100 and improving the quality of heat dissipation for the chip 100.

[0081] In some examples, the direction of the long side of the heat spreader 20 is consistent with the flow direction T1 of the coolant. Alternatively, the direction of the short side of the heat spreader 20 is consistent with the flow direction T1 of the coolant. By configuring the heat spreader 20 to have a larger size along the flow direction T1 of the coolant, the heat dissipation area between the chip 100 and the coolant along the flow direction T1 is increased, thereby improving heat dissipation efficiency and reducing the manufacturing cost of the heat dissipation device 200 to meet high heat dissipation requirements.

[0082] It should be noted that the orientation of the heat spreader 20 on the outer wall of the first zone 111 is not limited, as long as thermal contact can be achieved between the entire area of ​​the chip 100 facing the heat spreader 20 and the heat spreader 20.

[0083] In some implementations, reference is made to Figure 2 As shown, the orthographic projection of the heat spreader 20 onto the bottom wall of the cooling cavity 11 covers the projection of the first region 111 onto the bottom wall of the cooling cavity 11. The orthographic projection of the heat spreader 20 onto the bottom wall of the cooling cavity 11 refers to the area of ​​the heat spreader 20 used for thermal contact with the chip 100 or the first region 111.

[0084] With the above scheme, the heat exchange plate 20 is configured to cover the outer wall of the first zone 111 for thermal contact with the chip 100, so that when the coolant flows through the first zone 111, the entire first zone 111 exchanges heat with the heat exchange plate 20, thereby maximizing the heat exchange effect of the first zone 111 and thus maximizing the efficiency of the heat dissipation device 200 in dissipating heat for the chip 100.

[0085] Reference Figure 2 As shown, in some embodiments, the cooling cavity 11 has a recess (not shown) formed on the outer bottom wall of the first region 111. The heat spreader 20 is disposed in the recess, which provides positioning for the heat spreader 20, allowing it to connect to the outer wall of the first region 111. The heat spreader 20 being disposed in the recess can be: the entire heat spreader 20 is located within the recess, which can reduce the thickness of the heat spreader 20, thereby shortening the path for the heat from the chip 100 to be transferred to the coolant through the heat spreader 20 and improving heat transfer efficiency; or, in the stacking direction of the heat spreader 20 and the chip 100, part of the heat spreader 20 is located within the recess, and part is located outside the recess.

[0086] In some embodiments, the location of the recess can refer to the location where the heat spreader 20 is connected to the outer wall of the cooling chamber 11, which will not be described again here.

[0087] Figure 7 This is a schematic diagram of the connection structure between the heat dissipation plate and the housing in some examples of the heat dissipation device provided in this disclosure. (Refer to...) Figure 7 As shown, the temperature distribution plate 20 is welded and fixed to the outer wall of the first zone 111.

[0088] In some examples, the surface of the heat spreader 20 used to connect with the recess is coated with solder, such as tin or brazing solder, which connects the outer wall of the heat spreader 20 to the inner wall of the recess. Alternatively, the heat spreader 20 is pressed into the recess.

[0089] It should be noted that the above welding or pressing is only an example of the connection method between the heat spreader 20 and the outer wall of the first zone 111. The embodiments of this application do not limit the connection method between the heat spreader 20 and the outer wall of the first zone 111.

[0090] Figure 8 This is a partial cross-sectional structural diagram of a domain controller provided in some examples of this disclosure. (Refer to...) Figure 1 and Figure 8Based on the same concept, this disclosure also provides a domain controller 1000, which includes a chip 100, a heat sink 200, and a circuit board 300. The circuit board 300 is mounted in the receiving cavity of the housing 10 in the heat sink 200. The chip 100 is located between the circuit board 300 and the cooling cavity 11 of the housing 10, and the chip 100 is in contact with the outer wall of the first area 111 of the housing 10. In this domain controller 1000, the chip 100 makes thermal contact with the first area 111 of the heat sink 200, thereby transferring heat from the chip 100 to the coolant in the cooling cavity 11 through the first area 111 of the heat sink 200. The coolant then carries away the heat from the chip 100, improving the heat dissipation efficiency of the chip 100 and enhancing the performance of the domain controller 1000.

[0091] Chip 100 can serve as the core computing hardware of domain controller 1000, and can be an intelligent driving chip, intelligent cockpit chip, or other high-computing-power chip. This application embodiment does not limit the type of chip. Of course, there can be multiple chips 100, which is not limited here.

[0092] It should be noted that the domain controller 1000 is conceived in relation to the aforementioned heat dissipation device 200, and accordingly has the same technical effects as the aforementioned heat dissipation device 200. In addition, the heat dissipation device 200 can improve the heat dissipation efficiency of the chip 100, so that the chip 100 can operate in a suitable temperature environment, thereby improving the performance of the domain controller 1000.

[0093] The technical features and implementation methods of the domain controller 1000 can be referred to the aforementioned technical solution of the heat dissipation device 200, and will not be repeated here.

[0094] The receiving cavity of the housing 10 is located on the side of the bottom wall of the cooling cavity 11 facing away from the cooling cavity 11.

[0095] In some implementations, chip 100 is mounted on circuit board 300 and connected to an external power source via circuit board 300. The external power source supplies power to chip 100 so that chip 100 can perform its functions.

[0096] Figure 9 This is a cross-sectional view of a domain controller provided in some examples of this disclosure from another angle.

[0097] Reference Figure 1 , Figure 8 and Figure 9 As shown, in some embodiments, the domain controller 100 further includes a bracket 400 disposed on the side of the circuit board 300 facing away from the chip 100; the bracket 400 and the circuit board 300 are connected to the housing 10 by fasteners 410 so that the chip 100 is clamped between the circuit board 300 and the first area 111 of the housing 10.

[0098] Through the above solution, when connecting the circuit board 300 and the housing 10 using fasteners 410, in order to increase the thermal contact area between the chip 100 and the outer wall of the first region 111, it is necessary to tighten the fasteners 410. The fasteners 410 provide clamping force to reduce the gap between the chip 100 and the outer wall of the first region 111, thereby increasing the reliability of the thermal contact between the chip 100 and the outer wall of the first region 111, and thus increasing the heat conduction efficiency. By setting a bracket 400 on the side of the circuit board 300 facing away from the chip 100, the clamping force can be applied to the bracket 400 during the tightening of the fasteners 410, avoiding direct application to the circuit board 300 and preventing damage or even breakage of the circuit board 300, thus ensuring the safety of the circuit board 300. In addition, the bracket 400 is located on the side of the circuit board 300 facing away from the chip 100. When the circuit board 300 is heated or vibrated, it can provide support for the circuit board 300, prevent the circuit board 300 from deforming, maintain the shape of the chip 100, ensure that the heat sink gap between the chip 100 and the outer wall of the cooling cavity 11 is small, ensure thermal contact between the chip 100 and the outer wall of the cooling cavity 11, and thus ensure the efficiency of heat dissipation for the chip 100.

[0099] In other words, by introducing the bracket 400, a basis is provided for the fastener 410 to be tightened and clamped, ensuring the reliable contact between the heat spreader 20 and the outer wall of the chip 100 and the first region 111. In embodiments without the heat spreader 20, the bracket 400 provides a basis for the fastener 410 to be tightened and clamped, ensuring the reliable contact between the chip 100 and the outer wall of the first region 111, and ensuring reliable heat conduction. That is, by introducing the bracket 400, the physical gap between the chip 100 and the outer wall of the cooling cavity 11 is controlled within a very small range, ensuring efficient heat conduction without affecting the mechanical reliability of the chip 100. This ensures a very small heat sink gap.

[0100] In some specific embodiments, the bracket 400 may include a first part and a second part, the first part being used to pass through a fastener 410, and the second part being used to connect the first part so that the first part and the second part form a single unit.

[0101] In some embodiments, the fastener 410 can be a screw, bolt, nut, or other fastener. This application embodiment does not limit the type of fastener 410.

[0102] In some implementations, the heat dissipation device 200 is also referred to as the water-cooled plate system of the domain controller 1000, used to achieve water-cooled heat dissipation for the domain controller 1000. The water-cooled plate system includes a main housing 102, a cover plate 101, a bracket 400, and a heat spreader 20.

[0103] Various modifications and variations can be made to this disclosure without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include such modifications and variations.

Claims

1. A heat dissipation device, characterized in that, include: The housing includes a cooling chamber, an inlet and an outlet communicating with the cooling chamber. The cooling chamber is used to supply coolant flow, and the coolant flows from the inlet through the cooling chamber and then out from the outlet. Along the flow direction of the coolant, the cooling chamber includes a first region and a second region. The flow cross-sectional area of ​​the first region is smaller than that of the second region, and the flow cross-sectional area is perpendicular to the flow direction of the coolant. The outer wall of the first region is used for thermal contact with the chip.

2. The heat dissipation device according to claim 1, characterized in that, The flow channel height in the first zone is smaller than that in the second zone.

3. The heat dissipation device according to claim 2, characterized in that, The inner bottom wall of the cooling cavity has a protrusion facing the interior of the cooling cavity, and the first region is formed between the protrusion and the top wall of the cooling cavity.

4. The heat dissipation device according to claim 1, characterized in that, The heat dissipation device also includes a baffle column located in the cooling cavity, the baffle column extending along the height direction of the cooling cavity; The turbulence-disrupting column is located in the first region; or... The turbulence-disrupting columns are distributed in the first region and the second region, and the density of the turbulence-disrupting columns in the first region is greater than the density of the turbulence-disrupting columns in the second region.

5. The heat dissipation device according to claim 4, characterized in that, Along the flow direction parallel to the coolant, the cross-sectional structure of the turbulence column is elliptical.

6. The heat dissipation device according to any one of claims 1 to 5, characterized in that, Along the flow direction of the coolant, the flow cross-sectional area of ​​the cooling chamber near the inlet is different from that of the cooling chamber near the outlet.

7. The heat dissipation device according to any one of claims 1 to 5, characterized in that, The heat dissipation device also includes: A heat spreader is at least partially disposed on the outer wall of the first region. The heat spreader is also used to make thermal contact with the chip and transfer the heat on the chip to the coolant in the cooling cavity.

8. The heat dissipation device according to claim 7, characterized in that, In the stacking direction of the heat spreader and the chip, the outer contour dimension of the heat spreader is greater than or equal to the outer contour dimension of the chip.

9. The heat dissipation device according to claim 7, characterized in that, The orthographic projection of the heat spreader onto the bottom wall of the cooling chamber covers the projection of the first area onto the bottom wall of the cooling chamber.

10. The heat dissipation device according to claim 9, characterized in that, The cooling cavity has a recess formed on the outer bottom wall corresponding to the first area, and the heat spreader is disposed in the recess.

11. The heat dissipation device according to any one of claims 1 to 5, characterized in that, The housing includes a cover plate and a main housing. The main housing has a groove, and the cover plate covers the opening of the groove, forming the cooling cavity between the cover plate and the groove.

12. A domain controller, characterized in that, include: The heat dissipation device as described in any one of claims 1 to 11; The circuit board is installed inside the housing cavity of the heat dissipation device; The chip is located between the circuit board and the cooling cavity of the housing, and the chip is in contact with the outer wall of the first area of ​​the housing.

13. The domain controller according to claim 12, characterized in that, The domain controller also includes a bracket disposed on the side of the circuit board facing away from the chip; The bracket and the circuit board are connected to the housing by fasteners so that the chip is clamped between the circuit board and a first area of ​​the housing.

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