A finger structure compatible with a wafer carrier ring and a wafer
By designing a finger structure compatible with both the wafer carrier ring and the wafer, and employing an independent air duct and suction cup system, the problem of the inability to handle thick and thin wafers in existing technologies has been solved, enabling safe handling of the wafer carrier ring and reducing wafer damage.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- LEZI XINCHUANG SEMICON EQUIP (SHANGHAI) CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-07-14
AI Technical Summary
Existing technologies are not compatible with handling thicker wafers and thinned wafer carrier rings, and existing handling fingers easily attract the blue film of the wafer frame, leading to wafer damage.
A finger structure compatible with transporting wafer carrier rings and wafers was designed, including an internal first air channel and a second air channel, which operate independently through a vacuum pipeline structure. It is equipped with first and second suction cups to adsorb wafers and wafer carrier rings separately or simultaneously, reducing damage to the wafers.
It achieves simultaneous compatibility between handling wafers and wafer carrier rings, avoiding adsorption of the blue film on the wafer carrier ring and reducing wafer damage.
Smart Images
Figure CN224503928U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of manufacturing equipment in semiconductor industry, concretely relates to a finger structure compatible with wafer carrier ring and wafer. BACKGROUND
[0002] The main function of wafer handling finger is to handle wafer, generally used in combination with mechanical hand.
[0003] Before wafer thinning, the thickness is thick, and the wafer handling finger can directly carry wafer. After wafer thinning, the thickness is very thin, and the wafer is usually pasted on the blue film of wafer carrier ring (Frame), and the wafer is handled by handling wafer frame.
[0004] At present, there is no mature and good handling finger compatible with wafer and wafer frame in the market. The finger needs to be replaced to realize the handling of wafer and wafer frame.
[0005] The wafer handling finger has only one air passage, if the existing handling finger is used to handle wafer and wafer frame, it will inevitably be adsorbed to the blue film of wafer frame, which has a certain influence on wafer.
[0006] Therefore, it is urgent to develop a handling finger compatible with wafer and wafer carrier ring. UTILITY MODEL CONTENT
[0007] The utility model aims at providing a finger structure compatible with wafer carrier ring and wafer, which can handle wafer and wafer carrier ring and reduce damage to wafer.
[0008] In order to realize the above-mentioned purpose, the utility model provides a finger structure compatible with wafer carrier ring and wafer of watchcase, which comprises:
[0009] The finger body has a first air passage and a second air passage in the inside;
[0010] The vacuum pipe structure is connected with the beginning end of the first air passage and the beginning end of the second air passage, and can independently perform vacuumizing operation on the first air passage and the second air passage;
[0011] At least two first suction cups are communicated with the end of the first air passage and located at the front end of the upper surface of the finger body;
[0012] At least two second suction cups are communicated with the end of the second air passage and located at the rear end of the upper surface of the finger body;
[0013] When carrying wafer, the first suction cup can adsorb the wafer;
[0014] The first suction disc and the second suction disc can simultaneously adsorb the frame of the wafer carrier ring when the wafer carrier ring is carried.
[0015] In an optional solution, the finger body is a fork-shaped body with two prongs; and the number of the first suction discs is two, which are respectively located at the ends of the two prongs.
[0016] In an optional solution, the first air passage is Y-shaped, and the front ends of the Y-shaped passage are bifurcated and correspond to the two prongs.
[0017] In an optional solution, the number of the second suction discs is two, which are oppositely arranged with the two first suction discs.
[0018] In an optional solution, the second air passage is composed of two sub-passage which are parallel to each other.
[0019] In an optional solution, the vacuum pipeline structure comprises a first pipeline and a second pipeline.
[0020] The first pipeline is sequentially provided with a first electromagnetic valve, a first air pressure sensor, a first filter, a first air pipe joint and a second air pipe joint; and the first air pipe joint is connected with one of the sub-passage of the second air passage, and the second air pipe joint is connected with the other sub-passage of the second air passage.
[0021] The second pipeline is sequentially provided with a second electromagnetic valve, a second air pressure sensor, a second filter and a third air pipe joint, and the third air pipe joint is connected with the beginning end of the first air passage.
[0022] In an optional solution, the upper surface of the finger body is provided with a plurality of supporting units for supporting the wafer.
[0023] The beneficial effects of the present application are as follows:
[0024] The first suction disc is used to adsorb the wafer, and the first suction disc and the second suction disc are used to jointly adsorb the wafer carrier ring; and the vacuum pipeline structure can independently perform vacuumizing operation on the first air passage and the second air passage. BRIEF DESCRIPTION OF DRAWINGS
[0025] The above and other objects, features and advantages of the present application will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which like reference characters refer to the like elements throughout the drawings, and in which:
[0026] Figure 1 FIG. 1 is a structural schematic view of a finger structure compatible with carrying a wafer carrier ring and a wafer in an embodiment of the present application.
[0027] BRIEF DESCRIPTION OF DRAWINGS
[0028] 11 - first suction cup a; 12 - first suction cup b; 21 - second suction cup a; 22 - second suction cup b; 3 - wafer; 4 - wafer carrier ring; 5 - first O-ring; 6 - second O-ring; 7 - first air passage; 8 - second air passage; 9 - second filter; 10 - first filter; 13 - second electromagnetic valve; 14 - first electromagnetic valve; 15 - vacuum pump; 16 - first air hose joint; 17 - second air hose joint; 18 - third air hose joint; 19 - second air pressure sensor; 20 - first air pressure sensor. DETAILED DESCRIPTION
[0029] The utility model will be explained in further detail below in combination with the drawings and specific embodiments. The advantages and features of the utility model will be more apparent according to the following description and drawings, however, it is stated that the conception of the technical scheme of the utility model can be implemented in a plurality of different forms and is not limited to the specific embodiments set forth herein. The drawings all adopt very simplified form and all use non-precise proportion, only to facilitate, clear and assist the purpose of explaining the embodiment of the utility model.
[0030] It should be understood that when an element or layer is referred to as being "on", "adjacent", "connected to", or "coupled to" another element or layer, it can be directly on, adjacent, connected or coupled to the other element or layer, or intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on", "directly adjacent", "directly connected to", or "directly coupled to" another element or layer, then there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application.
[0031] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and / or operation in addition to the orientations depicted in the figures. For example, if a device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatial descriptions used herein interpreted accordingly.
[0032] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.
[0033] Embodiments
[0034] Referring to Figure 1 The present embodiment provides a compatible wafer carrier ring and wafer finger structure, comprising:
[0035] A finger body, the finger body having a first air channel 7 and a second air channel 8 inside;
[0036] A vacuum pipe structure connected to the beginning of the first air channel 7 and the beginning of the second air channel 8, capable of independently performing vacuumizing operation on the first air channel 7 and the second air channel 8;
[0037] At least two first suction cups in communication with the end of the first air channel 7, located at the front end of the upper surface of the finger body;
[0038] At least two second suction cups in communication with the end of the second air channel 8, located at the rear end of the upper surface of the finger body;
[0039] When carrying a wafer 3, the first suction cup can adsorb the wafer 3;
[0040] The first suction disc and the second suction disc 8 can simultaneously adsorb the frame of the wafer carrier ring 4 when the wafer carrier ring 4 is carried.
[0041] Specifically, with reference to Figure 1 In the embodiment, the finger body is a fork-shaped body with two prongs; the number of the first suction disc is two (first suction disc a11 and first suction disc b12), which are respectively located at the top of the two prongs. The first air duct 7 is Y-shaped, and the front end of the Y-shaped body is bifurcated and corresponds to the two prongs, that is, the first air duct 7 is divided into two air hole branches from one air hole at the beginning along the direction of the prongs.
[0042] In the embodiment, the number of the second suction disc is two (second suction disc a21 and second suction disc b22), which are oppositely arranged with the two first suction discs. The second air duct 8 is composed of two parallel sub-air ducts. The two sub-air ducts are independent of each other.
[0043] In the embodiment, the vacuum pipeline structure includes a first pipeline and a second pipeline; the first pipeline is sequentially provided with a first electromagnetic valve 14, a first air pressure sensor 20, a first filter 10, a first air pipe joint 16, and a second air pipe joint 17; one of the sub-air ducts of the second air duct 8 is connected to the first air pipe joint 16, and the other sub-air duct of the second air duct 8 is connected to the second air pipe joint 17; the second pipeline is sequentially provided with a second electromagnetic valve 13, a second air pressure sensor 19, a second filter 9, and a third air pipe joint 18, and the third air pipe joint 18 is connected to the beginning of the first air duct 7. The first electromagnetic valve 14 and the second electromagnetic valve 13 are connected to a vacuum pump 15 through a pipeline.
[0044] The first pipeline and the second pipeline of the vacuum pipeline structure work independently, when the wafer 3 needs to be adsorbed, the second pipeline works alone, and the first suction disc generates suction force. When the wafer carrier ring 4 needs to be adsorbed, the first pipeline and the second pipeline work simultaneously, and the first suction disc and the second suction disc generate suction force simultaneously.
[0045] In the embodiment, the upper surface of the finger body is provided with a plurality of supporting units for supporting the wafer. For example, the supporting unit is an O-shaped ring, which is a first O-shaped ring and a second O-shaped ring 6.
[0046] The utility model uses the first suction disc to adsorb the wafer, uses the first suction disc and the second suction disc to adsorb the frame of the wafer carrier ring, and the vacuum pipeline structure can independently perform vacuumizing operation on the first air duct and the second air duct. The utility model can adsorb the wafer and the wafer carrier ring, and when the wafer carrier ring is adsorbed, the blue film of the wafer carrier ring will not be adsorbed, reducing the damage to the wafer.
[0047] The above description is only the description of the preferred embodiment of the utility model, and does not limit the utility model in any way, and any change and modification of the utility model according to the above disclosure by the ordinary skilled in the art of the utility model belongs to the protection scope of the claims.
Claims
1. A finger structure compatible with a wafer carrier ring and a wafer, characterized in that, include: A finger body, wherein the finger body has a first airway and a second airway inside; The vacuum pipeline structure is connected to the beginning of the first gas channel and the beginning of the second gas channel, and can independently perform vacuuming operations on the first gas channel and the second gas channel. At least two first suction cups are connected to the end of the first airway and are located at the front end of the upper surface of the finger body; At least two second suction cups are connected to the end of the second airway and are located at the rear end of the upper surface of the finger body; When carrying a wafer, the first suction cup can adsorb the wafer; When carrying the wafer carrier ring, the first suction cup and the second suction cup can simultaneously adsorb the edge of the wafer carrier ring.
2. The compatible wafer carrier ring and wafer finger structure as described in claim 1, characterized in that, The finger body is a fork shape with two interdigitated fingers; there are two first suction cups, located at the tips of the two interdigitated fingers respectively.
3. The compatible wafer carrier ring and wafer finger structure as described in claim 2, characterized in that, The first airway is Y-shaped, and the forked front end of the Y-shape corresponds to the two interdigitated fingers.
4. The compatible wafer carrier ring and wafer finger structure as described in claim 2, characterized in that, The number of second suction cups is two, which are arranged opposite to the two first suction cups.
5. The compatible wafer carrier ring and wafer finger structure as described in claim 4, characterized in that, The second airway consists of two parallel sub-airways.
6. The compatible wafer carrier ring and wafer finger structure as described in claim 5, characterized in that, The vacuum pipeline structure includes a first pipeline and a second pipeline; The first pipeline is sequentially provided with a first solenoid valve, a first air pressure sensor, a first filter, a first air pipe connector, and a second air pipe connector; and the first air pipe connector is connected to one of the sub-air channels of the second airway, and the second air pipe connector is connected to the other sub-air channel of the second airway. The second pipeline is provided with a second solenoid valve, a second air pressure sensor, a second filter and a third air pipe connector in sequence, and the third air pipe connector is connected to the beginning of the first airway.
7. The compatible wafer carrier ring and wafer finger structure as described in claim 1, characterized in that, The upper surface of the finger body is provided with multiple support units for supporting the wafer.