Electroplated dual-sided cavity filter
By electroplating copper and silver layers on the surface of the filter body, combined with a symmetrical internal cavity design and a resonant rod structure, the problems of low conductivity and large size of traditional filters are solved, realizing a high-stability and low-cost electroplated double-sided cavity filter.
CN224537314UActive Publication Date: 2026-07-21DONGGUAN NUOPUSHENG ELECTROPLATING TECHNOLOGY CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN NUOPUSHENG ELECTROPLATING TECHNOLOGY CO LTD
- Filing Date
- 2025-10-21
- Publication Date
- 2026-07-21
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Figure CN224537314U_ABST
Abstract
The utility model relates to electroplating hardware technology field, concretely relates to a kind of electroplating double-face cavity filter, filter body includes the first inner cavity and the second inner cavity that are mutually separated by partition, first band-pass channel and second band-pass channel are arranged in the first inner cavity, fourth band-pass channel of third band-pass channel is arranged in the second inner cavity, first band-pass channel and third band-pass channel, second band-pass channel and fourth band-pass channel are symmetrical about partition, filter body surface is electroplated with copper plating layer, the surface of copper plating layer is electroplated with silver plating layer.The utility model's electroplating double-face cavity filter can improve the conductivity of filter cavity by the surface of filter body electroplated copper plating layer and silver plating layer, the improvement of conductivity can reduce energy loss and heat accumulation under high-power working state of filter, avoid the performance deterioration caused by temperature rise, improve the stability of filter.
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