Automatic screening machine for BGA tin balls

Abstract

The utility model discloses a kind of BGA tin ball automatic screening machines, relate to screening machine field.The screening machine, box;Screening mechanism, screening mechanism is set in the bottom of box;Screening mechanism includes oscillator, lower screen mechanism and upper screen mechanism, and lower screen mechanism and upper screen mechanism are used to classify screening of BGA tin ball;Discharging mechanism, discharging mechanism is installed in the top of box, and discharging mechanism is used to guide BGA tin ball to screening mechanism and carry out screening;Lower screen material collecting mechanism and upper screen material collecting mechanism;Box atmosphere control mechanism.The BGA tin ball automatic screening machine, using the cooperation between oscillator and precision electrocast screen, realize the stability and continuity of screening action, solve the problem of low efficiency and insufficient precision of manual operation;Discharging mechanism controls discharging amount in real time by weight sensor, to avoid precision electrocast screen overload;Box atmosphere control mechanism forms inert environment by filling nitrogen, inhibits tin ball oxidation and pollution.

Description

Technical Field

[0001] This utility model relates to the field of screening machine technology, specifically to an automatic screening machine for BGA solder balls. Background Technology

[0002] Currently, BGA solder ball sieving is generally done manually. The specific operation is as follows: The worker first takes the upper electroforming screen, pours a certain amount of BGA solder balls onto its surface, and shakes the screen back and forth. Solder balls with a diameter smaller than the upper electroforming screen's aperture fall off and are collected. Then, the electroforming screen is removed, and the sieving is repeated in the same manner. Solder balls with a diameter smaller than the lower electroforming screen's aperture fall off, and the solder balls remaining on the lower electroforming screen are collected as qualified products. This method relies on manual, layer-by-layer operation, with the solder ball particle size sieving achieved by manually controlling the force, frequency, and duration of the screen shaking.

[0003] Because manual operation requires layer-by-layer sieving, each sieving session is time-consuming and difficult to meet the needs of mass production. Furthermore, prolonged operation can lead to worker fatigue, causing significant fluctuations in sieving efficiency. Inconsistent sieving force during manual operation can result in missed sieving, compromising the accuracy of particle size selection. Differences in sieving force, frequency, and duration between operators also lead to inconsistent batch-to-batch sieving results. Environmental factors such as workshop vibration and humidity can also affect the effectiveness of manual sieving, further reducing product consistency. Additionally, during manual operation, worker sweat, workshop dust, or metal debris can easily contaminate the solder ball surface. Moreover, the uncontrollable force of manually shaking the screen can cause mechanical damage or oxidation of the solder balls, affecting product quality. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides an automatic BGA solder ball screening machine, which solves the problems of low efficiency and low consistency caused by manual screening.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an automatic BGA solder ball sorting machine, comprising:

[0006] Box;

[0007] A screening mechanism is located at the bottom of the housing; the screening mechanism includes an oscillator, a lower screening mechanism, and an upper screening mechanism, the lower screening mechanism and the upper screening mechanism being used for classifying and screening BGA solder balls;

[0008] A feeding mechanism is installed on the top of the housing and is used to guide BGA solder balls to a screening mechanism for screening.

[0009] The lower screen collecting mechanism and the upper screen collecting mechanism are respectively arranged on both sides of the box. The lower screen collecting mechanism is used to collect the material with the required ball diameter that is left on the screen surface after screening by the lower screen mechanism, and the upper screen collecting mechanism is used to collect the waste material that has not passed the screening by the upper screen mechanism and has an excessively large ball diameter.

[0010] An atmosphere control mechanism for the enclosure is connected to the enclosure and is used to regulate the oxygen content inside the enclosure.

[0011] Preferred options also include:

[0012] The main controller is installed on the housing and is used to set and adjust the motion parameters of the screening mechanism, the parameters of the feeding mechanism, and the parameters of the housing atmosphere control mechanism.

[0013] Preferably, both the lower sieve mechanism and the upper sieve mechanism include:

[0014] Slide rails, two of which are mounted on top of the oscillator;

[0015] The slider is slidably engaged with the slide rail. The slider is equipped with a flipping mechanism. The electroformed screen is horizontally mounted on the flipping mechanism. The flipping mechanism can drive the electroformed screen to flip from a horizontal position by -°.

[0016] Preferably, the feeding mechanism includes:

[0017] A storage bin is installed on the top of the box body, and a discharge pipe is provided at the bottom of the storage bin;

[0018] A solenoid valve is installed on the discharge pipe at the bottom of the storage silo.

[0019] Preferably, the feeding mechanism further includes:

[0020] A weight sensor is used to sense and control the amount of material fed in a single operation, and the weight sensor is also used to record the weight of the material to be processed in the storage bin.

[0021] Preferably, the lower screening and collecting mechanism includes:

[0022] The lower screening collection bin is used to collect the screened material;

[0023] The lower screen collection plate is installed at an angle on the lower screen collection bin.

[0024] Preferably, the upper screening and collecting mechanism includes:

[0025] Upper screening collection bin, which is used to collect the screened material;

[0026] The upper screen collection plate is installed at an angle on the upper screen collection bin.

[0027] Preferably, the chamber atmosphere control mechanism includes:

[0028] A nitrogen cylinder, which is connected to the housing via a pipe;

[0029] An oxygen content regulator is connected between the nitrogen tank and the chamber. The oxygen content regulator can sense the oxygen content in the chamber and control the opening and closing of the nitrogen tank and the flow rate of nitrogen filling.

[0030] This utility model discloses an automatic BGA solder ball sorting machine, which has the following beneficial effects:

[0031] This invention replaces manual operation with an automated structural design. By utilizing the coordination between the vibrator and the precision electroforming screen, it achieves stability and continuity in the screening process, solving the problems of low efficiency and insufficient precision in manual operation. The feeding mechanism controls the feeding amount in real time through a weight sensor to avoid overloading the precision electroforming screen. The chamber atmosphere control mechanism creates an inert environment by filling with nitrogen to inhibit the oxidation and contamination of the solder balls. The central controller uniformly adjusts the parameters of each mechanism to ensure the consistency of the screening process and solve the problem of unstable results between batches. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0034] In the diagram: 1. Screening mechanism; 1-1. Vibrator; 1-2. Lower screen mechanism; 1-3. Upper screen mechanism; 2. Feeding mechanism; 2-1. Storage bin; 2-2. Solenoid valve; 2-3. Weight sensor; 3. Lower screen collecting mechanism; 3-1. Lower screen collecting bin; 3-2. Lower screen collecting plate; 4. Upper screen collecting mechanism; 4-1. Upper screen collecting bin; 4-2. Upper screen collecting plate; 5. Atmosphere control mechanism for the enclosure; 5-1. Nitrogen tank; 5-2. Oxygen content regulator; 6. Main controller. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model are described clearly and completely. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0036] This application provides an automatic BGA solder ball sieving machine, which solves the problems of low efficiency and low consistency caused by manual sieving. It achieves the replacement of manual operation through automated structural design. By utilizing the cooperation between the oscillator 1-1 and the precision electroforming screen, the stability and continuity of the sieving action are achieved, solving the problems of low efficiency and insufficient accuracy of manual operation. The feeding mechanism 2 controls the feeding amount in real time through the weight sensor 2-3 to avoid overloading the precision electroforming screen. The chamber atmosphere control mechanism 5 creates an inert environment by filling with nitrogen to inhibit the oxidation and contamination of solder balls. The main controller 6 uniformly adjusts the parameters of each mechanism to ensure the consistency of the sieving action and solve the problem of unstable results between batches.

[0037] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0038] This utility model discloses an automatic BGA solder ball screening machine.

[0039] According to the appendix Figure 1 As shown, it includes: a housing; a screening mechanism 1, which is located at the bottom of the housing; the screening mechanism 1 includes an oscillator 1-1, a lower screen mechanism 1-2, and an upper screen mechanism 1-3, which are used for classifying and screening BGA solder balls; the oscillator 1-1 is used to drive the slide rail and the electroforming screen to perform reciprocating oscillation, so that the solder balls are vibrated and screened on the surface of the electroforming screen; a feeding mechanism 2, which is installed at the top of the housing, and is used to guide the BGA solder balls to the screening mechanism 1 for screening; a lower screen collecting mechanism 3 and an upper screen collecting mechanism 4, which are used to collect and screen the BGA solder balls. Screening and collecting mechanisms 4 are respectively set on both sides of the box. The lower screen collecting mechanism 3 is used to collect the material with the required ball diameter left on the screen surface after screening by the lower screen mechanism 1-2, and the upper screen collecting mechanism 4 is used to collect the waste material that has not passed the screening by the upper screen mechanism 1-3 and has an excessively large ball diameter. The box atmosphere control mechanism 5 is connected to the box and is used to adjust the oxygen content in the box. The main controller 6 is installed on the box and is used to set and adjust the motion parameters of the screening mechanism 1, the parameters of the feeding mechanism 2, and the parameters of the box atmosphere control mechanism 5.

[0040] Specifically, both the lower screen mechanism 1-2 and the upper screen mechanism 1-3 include: a slide rail, two slide rails installed on the top of the vibrator 1-1, the slide rails being connected to the output end of the vibrator 1-1; a slider, the slider slidingly engaging with the slide rails, the slider slidingly engaging with the slide rails through a screw structure, thereby allowing the position of the slider to be adjusted through the screw structure, so as to adjust the height of the flipping mechanism through the slider, the slider being equipped with a flipping mechanism, the electroforming screen being horizontally installed on the flipping mechanism, the flipping mechanism being able to drive the electroforming screen to rotate 90-180° from the horizontal position, so as to tilt the balls on the electroforming screen, and a waste box (not shown in the figure) is provided below the lower electroforming screen, the waste box being used to collect waste, the screen on the upper screen mechanism 1-3 being tilted towards the lower screen mechanism 1-2 so that the balls can fall onto the lower screen mechanism 1-2.

[0041] The feeding mechanism 2 includes: a storage bin 2-1, which is installed on the top of the box and has a feeding pipe at the bottom; a solenoid valve 2-2, which is installed on the feeding pipe at the bottom of the storage bin 2-1; and a weight sensor 2-3, which is used to sense and control the amount of material fed at one time and also to record the weight of the material to be processed in the storage bin 2-1. The storage bin 2-1 facilitates the guidance of the feeding, and the solenoid valve 2-2 is used to open the feeding pipe.

[0042] The lower screen collection mechanism 3 includes: a lower screen collection bin 3-1, which is used to collect the screened material; and a lower screen collection plate 3-2, which is installed at an incline on the lower screen collection bin 3-1 and is used to guide the material poured down by the lower screen mechanism 1-2 into the interior of the lower screen collection bin 3-1.

[0043] The upper screen collection mechanism 4 includes: an upper screen collection bin 4-1, which is used to collect the screened material; and an upper screen collection plate 4-2, which is installed at an incline on the upper screen collection bin 4-1 and is used to guide the material poured down by the upper screen mechanism 1-3 into the interior of the upper screen collection bin 4-1.

[0044] The chamber atmosphere control mechanism 5 includes: a nitrogen tank 5-1, which is connected to the chamber via a pipe to facilitate the introduction of nitrogen into the chamber's interior; and an oxygen content regulator 5-2, which is connected between the nitrogen tank 5-1 and the chamber, and can sense the oxygen content inside the chamber and control the opening and closing of the nitrogen tank 5-1 and the flow rate of nitrogen filling.

[0045] Working principle:

[0046] In operation, first add the BGA solder balls to be screened into the feeding mechanism 2. Then, fix the corresponding upper and lower electroforming screens to the upper screening mechanism 1-3 and lower screening mechanism 1-2, respectively. Turn on the valve of the nitrogen tank 5-1 and the power supply of the main controller 6. The nitrogen tank 5-1 will start working and fill the chamber with nitrogen. After the oxygen content in the chamber drops to the set value, the screening mechanism 1 will start operating: at this time, the upper electroforming screen of the upper screening mechanism 1-3 is directly below the feeding pipe, and the lower electroforming screen of the lower screening mechanism 1-2 is directly below the upper electroforming screen. Open the solenoid valve 2-2, and the BGA solder balls will begin to fall onto the surface of the upper electroforming screen through the feeding pipe. The weight sensor 2-3 senses the weight of the material being fed. Once the weight reaches the set value, the solenoid valve 2-2 will close to stop the feeding. At this point, oscillator 1-1 is activated, causing the lower screen mechanism 1-2 and the upper screen mechanism 1-3 to reciprocate. BGA solder balls with a diameter smaller than the mesh size of the upper electroforming screen fall through the mesh into the lower electroforming screen. As the lower electroforming screen reciprocates, BGA solder balls with a diameter smaller than the mesh size fall through the mesh into the waste box below the lower electroforming screen. After the number of cycles of oscillator 1-1 reaches the set value, the lower screen mechanism 1-2 and the upper screen mechanism 1-3 stop oscillating. The lower electroforming screen is then rotated 120° by the flipping mechanism, pouring the BGA solder balls remaining on the screen surface into the lower screen collection plate 3-2 and flowing into the lower screen collection bin 3-1. After the dumping is complete, the screen is returned to a horizontal position. 1. The upper electroforming screen is rotated 120° by a tilting mechanism, pouring the BGA solder balls remaining on the screen surface into the upper screen collection plate 4-2 and flowing into the upper screen collection bin 4-1. After tilting, the screen returns to a horizontal position. Once the BGA solder balls on both the upper and lower electroforming screens have been tilted and the screens have returned to a horizontal position, the next screening operation can begin, and this cycle continues until the screening of the inner BGA solder balls is complete.

[0047] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An automatic BGA solder ball screening machine, characterized in that, include: Box; A screening mechanism (1) is located at the bottom of the housing; the screening mechanism (1) includes an oscillator (1-1), a lower screening mechanism (1-2) and an upper screening mechanism (1-3), the lower screening mechanism (1-2) and the upper screening mechanism (1-3) are used for grading and screening BGA solder balls; The feeding mechanism (2) is installed on the top of the box and is used to guide the BGA solder balls to the screening mechanism (1) for screening. The lower screen collecting mechanism (3) and the upper screen collecting mechanism (4) are respectively set on both sides of the box. The lower screen collecting mechanism (3) is used to collect the material with the required ball diameter left on the screen surface after screening by the lower screen mechanism (1-2), and the upper screen collecting mechanism (4) is used to collect the waste material with the ball diameter that has not passed the screening by the upper screen mechanism (1-3) and is too large. The atmosphere control mechanism (5) is connected to the box and is used to regulate the oxygen content inside the box.

2. The automatic BGA solder ball screening machine according to claim 1, characterized in that, Also includes: The main controller (6) is installed on the housing and is used to set and adjust the motion parameters of the screening mechanism (1), the parameters of the feeding mechanism (2), and the parameters of the housing atmosphere control mechanism (5).

3. The automatic BGA solder ball screening machine according to claim 1, characterized in that, Both the lower sieve mechanism (1-2) and the upper sieve mechanism (1-3) include: Slide rails, two of which are mounted on top of the oscillator (1-1); The slider is slidably engaged with the slide rail. The slider is equipped with a flipping mechanism, on which an electroforming screen is horizontally mounted. The flipping mechanism can rotate the electroforming screen from a horizontal position by 90-180°.

4. The automatic BGA solder ball screening machine according to claim 1, characterized in that, The feeding mechanism (2) includes: Storage bin (2-1), the storage bin (2-1) is installed on the top of the box, and the bottom of the storage bin (2-1) is provided with a discharge pipe; Solenoid valve (2-2) is installed on the discharge pipe at the bottom of the storage silo (2-1).

5. The automatic BGA solder ball screening machine according to claim 1, characterized in that, The feeding mechanism (2) further includes: The weight sensor (2-3) is used to sense and control the amount of material fed in a single operation, and the weight sensor (2-3) is also used to record the weight of the material to be processed in the storage bin (2-1).

6. The automatic BGA solder ball screening machine according to claim 1, characterized in that, The lower screening and collecting mechanism (3) includes: The lower screen collection bin (3-1) is used to collect the screened material; The lower screen collection plate (3-2) is installed at an incline on the lower screen collection bin (3-1).

7. The automatic BGA solder ball screening machine according to claim 1, characterized in that, The upper screening and collecting mechanism (4) includes: Upper screen collection bin (4-1), the upper screen collection bin (4-1) is used to collect the screened material; The upper screen collecting plate (4-2) is installed at an incline on the upper screen collecting bin (4-1).

8. The automatic BGA solder ball screening machine according to claim 1, characterized in that, The chamber atmosphere control mechanism (5) includes: Nitrogen cylinder (5-1), which is connected to the housing via a pipe; Oxygen content regulator (5-2) is connected between nitrogen tank (5-1) and the box body. The oxygen content regulator (5-2) can sense the oxygen content in the box body and control the opening and closing of nitrogen tank (5-1) and the flow rate of nitrogen filling.

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