Semiconductor laser marking feeding device

Abstract

The utility model provides a kind of feeding device for semiconductor laser marking, it is related to laser marking technical field, including base, the top of base is provided with feeding tray, the upper end surface of feeding tray is provided with two groups of positioning disc in up-down combination use, the surface side of two groups of positioning disc is opened with multiple positioning ports, the surface side of two groups of positioning disc is opened with multiple positioning ports, the surface side of two groups of positioning disc is opened with multiple positioning ports, the inside of two groups of positioning ports is provided with the bearing disc that is connected with its inner wall, the top of positioning disc is provided with automatic feeding slide, the inside of two groups of positioning ports that are consistent in up-down position is uniformly provided with two groups of symmetrically arranged auxiliary block, bearing disc is made into positioning port by automatic feeding slide one by one slide, ensure to carry out accurate marking processing one by one on semiconductor on bearing disc, while auxiliary block is positioned to bearing disc, bearing disc will not be out of because of eccentric in positioning port, the device solves the current feeding misplacement, accumulation or the problem of easy deviation.

Description

Technical Field

[0001] This utility model belongs to the field of laser marking technology, and in particular relates to a feeding device for semiconductor laser marking. Background Technology

[0002] The semiconductor industry is the cornerstone of modern electronics manufacturing. Products such as chips, wafers, and packaged devices require permanent, clear, and traceable marking during the production process. Laser marking, with its advantages of being non-contact, high-precision, high-speed, permanent, consumable-free, and environmentally friendly, has become the main marking and identification technology in the semiconductor industry.

[0003] Semiconductor laser marking feeding devices are an indispensable key link in the automated, intelligent, high-yield, and high-efficiency semiconductor manufacturing production chain. They directly solve core challenges such as automated handling, precise positioning, contamination control, and damage protection for small, high-value, and high-cleanliness semiconductor materials during laser marking.

[0004] In traditional equipment, the carrier tray used to hold semiconductor workpieces cannot accurately fall into the marking station, often leading to misalignment or accumulation of materials, affecting the accuracy and efficiency of laser marking. Furthermore, the carrier tray is prone to shifting or dislodging from the positioning port as it rotates with the turntable, causing processing interruptions or workpiece damage. This phenomenon has become a problem urgently needing to be solved by those in the field. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a semiconductor laser marking feeding device that can ensure precise marking of each semiconductor on the carrier disk while maintaining the stability of the carrier disk.

[0006] The technical solution adopted by this utility model to solve the above-mentioned technical problems is as follows: A semiconductor laser marking feeding device includes a base, a feeding tray positioned directly above the base, and two sets of positioning discs arranged in an upper and lower configuration on the upper surface of the feeding tray. Multiple positioning openings are evenly distributed in a ring along the circumference of the two positioning discs. Two adjacent positioning openings on the surfaces of the two positioning discs are vertically aligned. A bearing plate is installed inside each positioning opening, connected to its inner wall. An automatic feeding chute is positioned above the positioning discs, with its lower end aligned vertically with the positioning opening. A motor connected to the feeding tray is fixed to the upper surface of the base. A laser frame is positioned above the positioning discs, with its vertical position aligned vertically with the corresponding positioning opening. Each of the two vertically aligned positioning openings contains two sets of symmetrically arranged auxiliary blocks.

[0007] Furthermore, in this invention, the laser frame is mounted on the base by a plate frame connected by bolts on the surface of the laser frame, and the laser frame and the automatic feeding slide are evenly distributed in a ring along the periphery of the feeding tray.

[0008] Furthermore, the present invention includes a U-shaped frame located above the center of the positioning plate, with both ends fixedly connected to the upper surface of the base, and an assembly strip bolted between the surface wall of the automatic feeding slide and the U-shaped frame.

[0009] Furthermore, in this invention, the end faces of the two sets of positioning discs that are connected are provided with square openings at the positions of each set of auxiliary blocks, and each square opening is connected to the interior of the corresponding positioning port.

[0010] Furthermore, in this invention, the arc surfaces of each set of auxiliary blocks are arranged opposite to each other, and a spring is fixed to the straight side of each set of auxiliary blocks in the square opening. The other end of each spring is fixed with an adhesive plate that is bonded to the short side inside the square opening. The adhesive plate is bonded to the inner wall of the square opening with adhesive tape. Therefore, when it is necessary to remove the auxiliary block from the positioning opening, the adhesive plate can be pulled directly to remove it from the square opening. When installing the auxiliary block, the adhesive plate can be placed in the square opening and squeezed to bond it to the inner wall of the square opening.

[0011] Furthermore, the present invention provides support plates on the upper surfaces of the bases on both sides of the motor, and an abutment plate is provided directly above each set of support plates, thereby providing stable support for the feeding tray through the two sets of support plates and the abutment plate.

[0012] Furthermore, in this invention, a vertical rod is fixed between the abutment plate and the support plate. The upper end surface of the abutment plate is rotatably embedded with ball bearings that connect with the upper end of the feeding tray. The abutment plate and the support plate are connected by the vertical rod, so that the abutment plate and the support plate cooperate to support the feeding tray. At the same time, the support plate is installed on the base by bolts, which makes it convenient to limit and disassemble the support plate and the base.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: (1) In this application, multiple sets of carrier trays are placed vertically into the automatic feeding slide. The carrier trays will fall along the automatic feeding slide to the upper end of the positioning tray. Therefore, when the feeding tray drives the positioning tray to rotate and controls the positioning port to move to the lower end of the automatic feeding slide, the carrier trays in the automatic feeding slide will fall directly into the positioning port, and the carrier trays can fall into the corresponding positioning ports one by one, ensuring that the semiconductors on the carrier trays are marked accurately one by one.

[0014] (2) After the carrier plate slides into the positioning port, the two sets of auxiliary blocks inside the positioning port limit the carrier plate. When the feeding plate drives the positioning plate to rotate, the carrier plate will not be dislodged in the positioning port due to deviation, thus ensuring that the carrier plate is in a stable position in the positioning port. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a structural assembly diagram of the feeding tray in this utility model; Figure 3 This is an exploded view of the positioning disk and auxiliary block in this utility model; Figure 4 This is a structural diagram of the auxiliary block in this utility model; Figure 5 This is a structural diagram of the support plate in this utility model.

[0016] In the diagram: 1. Base; 101. U-shaped frame; 2. Laser frame; 3. Feeding tray; 301. Motor; 302. Bearing tray; 303. Positioning tray; 304. Auxiliary block; 305. Square opening; 306. Positioning port; 307. Spring; 308. Adhesive plate; 4. Automatic feeding slide; 401. Assembly strip; 5. Support plate; 501. Abutment plate; 502. Ball bearing; 503. Upright pole. Detailed Implementation

[0017] The technical solution of this utility model will be further described in detail below in non-limiting terms, with reference to the accompanying drawings and preferred embodiments.

[0018] like Figure 1-5 As shown, the present invention provides the following technical solution: A semiconductor laser marking feeding device includes a base 1, a feeding tray 3 is positioned directly above the base 1, and two sets of positioning trays 303 arranged in an upper and lower configuration are positioned on the upper surface of the feeding tray 3. Multiple positioning openings 306 are evenly distributed in a ring along the periphery of the two sets of positioning trays 303. The two sets of adjacent positioning openings 306 on the surface of the two sets of positioning trays 303 are vertically aligned. A bearing tray 302 is installed inside each of the two sets of positioning openings 306 and is connected to its inner wall. An automatic feeding chute 4 is positioned above the positioning trays 303, and the lower end of the automatic feeding chute 4 is vertically aligned with the positioning opening 306. A motor 301, which is connected to the feeding tray 3, is fixed to the upper surface of the base 1. A laser frame 2 is positioned above the positioning trays 303, and the laser frame 2 is vertically aligned with the corresponding positioning opening 306. Each of the two sets of positioning openings 306, which are vertically aligned, has two sets of symmetrically arranged auxiliary blocks 304 inside.

[0019] Multiple sets of carrier trays 302 are placed vertically into the automatic feeding chute 4. The carrier trays 302 fall along the automatic feeding chute 4 to the upper end of the positioning tray 303. Therefore, the feeding tray 3 drives the positioning tray 303 to rotate, and controls the positioning port 306 to move to the lower end of the automatic feeding chute 4. The carrier trays 302 in the automatic feeding chute 4 will fall directly into the positioning port 306. Then, the motor 301 controls the feeding tray 3 to rotate, which drives the positioning tray 303 to rotate. The positioning ports 306 on the positioning tray 303 pass through the lower end of the laser frame 2 one by one. Each time they pass through, the motor 301 controls the feeding tray 3 to pause for a period of time. Therefore, the laser frame 2 will directly mark the semiconductor on the carrier tray 302. The control method of the motor 301 is a common method in the field. Any control system that controls the motor 301 and achieves its control effect through PLC, controller, etc. can be applied to this application and achieve its technical effect. This application does not make any specific limitations.

[0020] After the carrier plate 302 slides into the positioning port 306, the two sets of auxiliary blocks 304 inside the positioning port 306 limit the carrier plate 302. When the feeding plate 3 drives the positioning plate 303 to rotate, the carrier plate 302 will not be dislodged in the positioning port 306 due to deviation, thus ensuring that the carrier plate 302 is in a stable position in the positioning port 306.

[0021] It should be noted that the thickness of the two sets of positioning ports 306 is the same as the thickness of the bearing plate 302. Therefore, when the positioning plate 303 drives the bearing plate 302 to rotate, it will not drive the bearing plate 302 located above to rotate synchronously, so that the bearing plates 302 can slide into the positioning ports 306 one by one.

[0022] The laser frame 2 is mounted on the base 1 by bolts. The laser frame 2 and the automatic feeding slide 4 are evenly distributed in a ring along the perimeter of the feeding tray 3. A U-shaped frame 101 with both ends fixedly connected to the upper surface of the base 1 is provided above the center of the positioning plate 303. An assembly strip 401 that is bolted to both is provided between the surface of the automatic feeding slide 4 and the U-shaped frame 101.

[0023] With the above-described structure, the automatic feeding slide 4 and the U-shaped frame 101 are assembled together by the assembly strip 401. At the same time, the assembly strip 401 can be removed from the U-shaped frame 101 or the automatic feeding slide 4, making it easy to assemble and disassemble the automatic feeding slide 4 and the U-shaped frame 101.

[0024] The end faces of the two sets of positioning discs 303 that meet each other are provided with square openings 305 at the positions of each set of auxiliary blocks 304, and each square opening 305 is connected to the interior of the corresponding positioning opening 306. The arc surfaces of each set of auxiliary blocks 304 are arranged opposite each other. A spring 307 is fixed in the square opening 305 on the straight side of each set of auxiliary blocks 304, and the other end of the spring 307 is fixed with an adhesive plate 308 that is glued to the short surface inside the square opening 305.

[0025] When it is necessary to remove the carrier plate 302 from inside the positioning port 306, the carrier plate 302 can be directly controlled to slide outward from the positioning port 306. The carrier plate 302 will control the auxiliary block 304 to move to the square port 305. At this time, the auxiliary block 304 no longer limits the carrier plate 302, so the carrier plate 302 can be directly removed from the positioning port 306. At the same time, when the auxiliary block 304 moves into the square port 305, it will compress the spring 307. Therefore, the carrier plate 302 initially slides into the positioning port 306. After the spring 307 pushes the auxiliary block 304, the auxiliary block 304 limits the carrier plate 302.

[0026] Support plates 5 are provided on the upper surfaces of the bases 1 on both sides of the motor 301. An abutment plate 501 is provided directly above each set of support plates 5. A vertical rod 503 is fixed between the abutment plate 501 and the support plate 5. A ball bearing 502 that is connected to the upper end of the feeding tray 3 is rotatably embedded in the upper surface of the abutment plate 501. The support plate 5, the upright 503 and the abutment plate 501 are used to support the feeding plate 3. At the same time, when the feeding plate 3 rotates, it will drive the ball bearing 502 to roll at the upper end of the abutment plate 501, thereby supporting the feeding plate 3 and reducing the friction on the feeding plate 3.

[0027] Finally, it should be noted that although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can modify or make equivalent substitutions to the technical solutions described in the foregoing embodiments, and such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A feeding device for semiconductor laser marking, comprising a base (1), characterized in that: A feeding tray (3) is provided directly above the base (1). Two sets of positioning trays (303) are provided on the upper surface of the feeding tray (3) for use in an upper and lower combination. Multiple positioning holes (306) are evenly distributed in a ring along the peripheral wall on the surface of the two sets of positioning trays (303). The positioning holes (306) on the surface of the two sets of positioning trays (303) are in the same vertical position. A bearing tray (302) is provided inside the two sets of positioning holes (306) and is connected to its inner wall. An automatic feeding slide (4) is provided above the base (1), and the lower end of the automatic feeding slide (4) is aligned with the upper and lower positions of the positioning port (306). A motor (301) connected to the feeding plate (3) is fixed on the upper end face of the base (1). A laser frame (2) is provided above the positioning plate (303), and the laser frame (2) is aligned with the upper and lower positions of the corresponding positioning port (306). Both sets of positioning ports (306) with aligned upper and lower positions have two sets of symmetrically arranged auxiliary blocks (304) inside.

2. The feeding device for semiconductor laser marking according to claim 1, characterized in that: The plate frame connected to the surface of the laser frame (2) is installed on the base (1), and the laser frame (2) and the automatic feeding slide (4) are evenly distributed in a ring along the periphery of the feeding tray (3).

3. The feeding device for semiconductor laser marking according to claim 1, characterized in that: A U-shaped frame (101) is provided above the middle of the positioning plate (303) with both ends fixedly connected to the upper surface of the base (1). An assembly strip (401) is provided between the surface wall of the automatic feeding slide (4) and the U-shaped frame (101) and bolted to both.

4. The feeding device for semiconductor laser marking according to claim 1, characterized in that: The two sets of positioning disks (303) are connected at the end face corresponding to the position of each set of auxiliary blocks (304) and each square opening (305) is connected to the interior of the corresponding positioning port (306).

5. The feeding device for semiconductor laser marking according to claim 4, characterized in that: The arc surfaces of each set of auxiliary blocks (304) are arranged opposite each other. Each set of auxiliary blocks (304) has a spring (307) fixed in the square opening (305) on its straight side, and the other end of the spring (307) is fixed with an adhesive plate (308) bonded to the inner section of the square opening (305).

6. The feeding device for semiconductor laser marking according to claim 1, characterized in that: Support plates (5) are provided on the upper surface of the base (1) on both sides of the motor (301), and an abutment plate (501) is provided directly above each set of support plates (5).

7. The feeding device for semiconductor laser marking according to claim 6, characterized in that: A vertical rod (503) is fixed between the abutment plate (501) and the support plate (5), and the upper end surface of the abutment plate (501) is rotatably embedded with a ball bearing (502) that is connected to the upper end of the feeding tray (3).

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