A gas uniform mechanism for a PECVD plate-type apparatus
By combining the process chamber, the first guide plate, and the second guide plate, the problem of insufficient film uniformity in PECVD equipment is solved, and the uniformity of gas distribution and film uniformity are improved, adapting to adjustments under different operating conditions.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU ZHONGSHENG MICRO TECHNOLOGY CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-07-24
AI Technical Summary
In existing PECVD equipment, the gas uniform plate is difficult to effectively solve the problem of insufficient film uniformity caused by excessively high gas concentration in the middle of the film, and it is also difficult to adjust the local density to adapt to changes in operating conditions.
The system employs a combination structure of a process chamber, a first guide plate, and a second guide plate. By using the blocking part and gap design of the first guide plate, combined with the horizontal flow and spray hole arrangement of the second guide plate, the gas flow path is adjusted to prevent gas from accumulating in the middle and improve the uniformity of gas distribution.
It effectively improves the uniformity of the film, reduces the gas density in the middle, adapts to the gas distribution adjustment under different working conditions, and meets production needs.
Smart Images
Figure CN224548537U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of deposition equipment, and in particular to a gas equalization mechanism for PECVD plate equipment. Background Technology
[0002] When performing plasma-enhanced chemical vapor deposition (PECVD) using a plate-type device, a gas equalization mechanism is needed to split the process gas or cleaning gas that is centrally introduced into the chamber into multiple streams, so that the gas is uniformly filled in the deposition chamber, thereby ensuring the uniformity of plasma distribution and resulting in a thin film with high uniformity.
[0003] In existing technologies, a gas equalization plate is typically used for gas equalization. The lower surface of the equalization plate has multiple through-holes evenly distributed, through which gas enters the deposition chamber, preventing direct gas entry from the inlet and thus avoiding gas stagnation. However, even with the equalization plate diverting the gas, the gas concentration in the central area directly corresponding to the inlet remains high, resulting in a thicker film in the center. In production, some of the central through-holes are often blocked, creating a sparser center and denser edges to reduce the gas density in the center. While this method can improve film uniformity, the improvement is limited, and it may be difficult to meet production requirements under deposition conditions that easily lead to low film uniformity. Furthermore, adjusting the local density to adapt to changing deposition conditions is challenging. Utility Model Content
[0004] The purpose of this invention is to provide a gas equalization mechanism for PECVD plate equipment that helps improve the uniformity of thin films.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] A gas equalization mechanism for a PECVD plate-type equipment includes:
[0007] The process chamber is constructed as a hollow shell structure, having an inlet surface and an outlet surface opposite to the inlet surface. The inlet surface of the process chamber is connected to an air inlet, and the outlet surface of the process chamber is provided with a plurality of regularly arranged through-hole spray holes.
[0008] The first guide plate includes a blocking part, which is disposed between the inlet surface and the outlet surface of the process cavity. The projection of the blocking part on the inlet surface of the process cavity completely covers the inner wall of the air inlet, and there is a gap between the blocking part and the inlet surface of the process cavity.
[0009] The second guide plate is constructed as a plate and is disposed between the blocking portion of the first guide plate and the outlet surface of the process cavity. The projection of the second guide plate on the blocking portion of the first guide plate completely covers the blocking portion of the first guide plate.
[0010] Optionally, the first guide plate further includes a longitudinal portion, one end of which is connected to the edge of the blocking portion, and the other end extends obliquely toward the inlet surface of the process cavity, with the extension direction inclined toward the outside of the blocking portion. The longitudinal portion is provided with a plurality of air guide holes, the direction of which extends toward the outlet surface of the process cavity and is inclined toward the outside of the blocking portion.
[0011] Optionally, the air inlet has a chamber end connected to the process chamber and an air passage end opposite to the chamber end. A flow surface is formed on the inner wall of the chamber end of the air inlet. The flow surface is constructed as an annular inclined surface, and one end of it away from the air passage end of the air inlet is inclined towards the outside of the air inlet.
[0012] Optionally, the first guide plate further includes an annular portion connected to the inlet surface of the process cavity, the annular portion being constructed as an annular sheet and having its inner edge connected to one end of the longitudinal portion away from the blocking portion.
[0013] Optionally, the air guide hole is constructed as an arc-shaped waist-shaped hole, and the central angles of the three air guide holes are the same, and each is any value between 100° and 115°.
[0014] Optionally, the second guide plate is connected to the inlet surface of the process chamber by a plurality of bolts.
[0015] Optionally, the second guide plate is provided with a number of regularly arranged connecting holes, or the spray holes are arranged in a regular pattern with sparse central areas and dense peripheral areas.
[0016] Optionally, the outlet surface of the process cavity is constructed as a rectangle, and the extension directions of its two adjacent sides are respectively a first direction and a second direction. The center of the first guide plate and the second guide plate both correspond to the center position of the outlet surface of the process cavity. The diameter of the second guide plate is any value between 5% and 7% of the length of the outlet surface of the process cavity in the first direction, and is also any value between 5% and 7% of the length of the outlet surface of the process cavity in the second direction.
[0017] The beneficial effects of this invention are as follows: Gas enters the process chamber from the inlet, reaches the top of the blocking portion of the first guide plate, and flows out from the gap between the blocking portion of the first guide plate and the process chamber. It then reaches the second guide plate, flows horizontally to the lower side, and partly flows towards the center of the outlet surface of the process chamber, while partly flows towards the edge of the outlet surface, exiting the process chamber through each spray hole. The first guide plate directs the gas to the side, suppressing gas accumulation caused by the center of the outlet surface of the process chamber being directly opposite the inlet. The second guide plate extends the distance between the central spray hole and the initial position of the airflow, preventing gas accumulation caused by a large amount of gas flowing to the central spray hole, thereby improving the uniformity of gas distribution and the uniformity of the deposited film.
[0018] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the gas equalization mechanism for a PECVD plate equipment as shown in Embodiment 1 of this utility model;
[0020] Figure 2 This is a schematic diagram of the structure of the first guide plate shown in Embodiment 1 of this utility model.
[0021] Legend: 1-Process chamber, 11-Inlet surface, 12-Outlet surface, 121-Spray hole, 13-Air inlet, 131-Cavity end, 132-Air passage end, 133-Flow direction surface, 2-First guide plate, 21-Annular part, 22-Longitudinal part, 221-Air guide hole, 23-Blocking part, 3-Second guide plate. Detailed Implementation
[0022] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0023] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0024] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0025] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.
[0026] This utility model application protects a gas equalization mechanism for a PECVD plate-type equipment, including a process chamber 1, a first guide plate 2, and a second guide plate 3. The process chamber 1 is a hollow shell structure with an inlet surface 11 and an outlet surface 12 opposite to the inlet surface 11. An air inlet 13 is connected to the inlet surface 11 of the process chamber 1, and multiple regularly arranged through-hole spray holes 121 are provided on the outlet surface 12 of the process chamber 1. The first guide plate 2 includes a plate-shaped blocking portion 23, which is disposed between the inlet surface 11 and the outlet surface 12 of the process chamber 1, and the projection of the blocking portion 23 on the inlet surface 11 of the process chamber 1 completely covers the inner wall of the air inlet 13. A gap exists between the blocking portion 23 and the inlet surface 11 of the process chamber 1. The second guide plate 3 is also plate-shaped and is disposed between the blocking portion 23 of the first guide plate 2 and the outlet surface 12 of the process chamber 1. The projection of the second guide plate 3 onto the blocking portion 23 of the first guide plate 2 completely covers the blocking portion 23 of the first guide plate 2.
[0027] Gas enters the process chamber 1 through the inlet 13, reaches the top of the blocking portion 23 of the first guide plate 2, and flows out through the gap between the blocking portion 23 of the first guide plate 2 and the process chamber 1. It then reaches the second guide plate 3, flows horizontally to the lower side, and partially flows towards the center of the outlet surface 12 of the process chamber 1, while partially flows towards the edge of the outlet surface 12, exiting the process chamber 1 through the respective spray holes 121. The first guide plate 2 directs the gas to the side, suppressing gas accumulation caused by the center of the outlet surface 12 of the process chamber 1 being directly opposite the inlet 13. The second guide plate 3 extends the distance between the central spray hole 121 and the initial position of the airflow, preventing gas accumulation caused by a large amount of gas flowing to the central spray hole 121, thereby improving the uniformity of gas distribution and the uniformity of the deposited film.
[0028] In some embodiments, the first guide plate 2 further includes a longitudinal portion 22, one end of which is connected to the edge of the blocking portion 23, and the other end extends obliquely toward the inlet surface 11 of the process chamber 1, with the extension direction inclined toward the outside of the blocking portion 23. A plurality of air guide holes 221 are provided on the longitudinal portion 22, with the air guide holes 221 extending toward the outlet surface 12 of the process chamber 1 and inclined toward the outside of the blocking portion 23. By constraining the direction of the longitudinal portion 22 and the air guide holes 221 of the first guide plate 2, gas flows out obliquely downwards from the edge of the blocking portion 23 of the first guide plate 2, which helps to improve the uniformity of gas distribution.
[0029] In some embodiments, the air inlet 13 has a chamber end 131 connected to the process chamber 1 and an air passage end 132 opposite to the chamber end 131. A flow surface 133 is formed on the inner wall of the chamber end 131 of the air inlet 13. The flow surface 133 is constructed as an annular inclined surface, and its end away from the air passage end 132 of the air inlet 13 is inclined towards the outside of the air inlet 13. By adjusting the direction of the airflow through the flow surface 133, the airflow direction is directed towards the inclined air guide hole 221, which helps to constrain the airflow direction and improve the uniformity of gas distribution.
[0030] In some embodiments, the first guide plate 2 further includes an annular portion 21 connected to the inlet surface 11 of the process chamber 1. The annular portion 21 is constructed as an annular sheet and its inner edge is connected to the end of the longitudinal portion 22 away from the blocking portion 23, which helps to improve the connection strength of the first guide plate 2 and prevent the first guide plate 2 from falling off due to the direct impact of a large amount of airflow.
[0031] In some embodiments, the air guide hole 221 is constructed as an arc-shaped waist-shaped hole, and the central angle of the three air guide holes 221 is the same, and each of them is any value between 100° and 115°, for example, any value among 100°, 105°, 110° and 115°, to reduce the obstruction of gas by the longitudinal part 22.
[0032] In some embodiments, the second guide plate 3 is connected to the inlet surface 11 of the process chamber 1 by multiple bolts, which helps to reduce side obstruction while ensuring connection.
[0033] In some embodiments, the second guide plate 3 is provided with a plurality of regularly arranged connecting holes, or the spray holes 121 are arranged in a regular pattern with sparser holes in the middle and denser holes at the edges. Since the gas uniformity of the first guide plate 2 and the second guide plate 3 is directly affected by parameters such as gas pressure and gas density, the uniformity of gas distribution varies with changes in process parameters. By opening holes in the second guide plate 3 to increase the gas concentration in the middle, or by making the spray holes 121 sparser inside and denser outside to reduce the gas concentration in the middle, different operating conditions can be adapted to ensure the uniformity of the thin film.
[0034] In some embodiments, the outlet surface 12 of the process chamber 1 is constructed as a rectangle, and the extension directions of its two adjacent sides are respectively a first direction and a second direction. The centers of the first guide plate 2 and the second guide plate 3 both correspond to the center position of the outlet surface 12 of the process chamber 1. The diameter of the second guide plate 3 is any value between 5% and 7% of the length of the outlet surface 12 of the process chamber 1 in the first direction, for example, any value among 5%, 5.5%, 6%, 6.5%, and 7%. The diameter of the second guide plate 3 is also any value between 5% and 7% of the length of the outlet surface 12 of the process chamber 1 in the second direction, for example, any value among 5%, 5.5%, 6%, 6.5%, and 7%. By constraining the length ratio, it helps to ensure that the second guide plate 3 can fully function, thereby effectively reducing the gas density in the middle and improving the uniformity of gas distribution.
[0035] Please refer to the following examples for details.
[0036] Example 1:
[0037] Please see Figure 1 The gas distribution mechanism for a PECVD plate-type equipment, as shown in a preferred embodiment of this application, includes a process chamber 1, a first guide plate 2, and a second guide plate 3. The process chamber 1 is a horizontally arranged rectangular cavity structure with a horizontal length of 4.11m and a horizontal width of 4.13m, and a vertical height of 17.1mm. It is entirely closed, with only partial surface openings connecting the inside and outside. Both the first guide plate 2 and the second guide plate 3 are disposed within the process chamber 1 and connected to the inner wall of the process chamber 1.
[0038] The process chamber 1 has a horizontally arranged inlet surface 11 and an outlet surface 12, with the inlet surface 11 being higher than the outlet surface 12. A vertically arranged cylindrical air inlet 13 is connected to the center of the inlet surface 11. The air inlet 13 has a chamber end 131 and a gas passage end 132, with the chamber end 131 being lower than the gas passage end 132. It is connected to the inlet surface 11 of the process chamber 1 and is flush with the inner wall of the inlet surface 11. The gas passage end 132 of the air inlet 13 is used to connect to the gas passage system of the plate deposition equipment, thereby introducing process gases, etc. The inner wall of the chamber end 131 of the air inlet 13 forms an annular flow surface 133, with the smaller diameter end of the flow surface 133 flush with the inner wall of the gas passage end 132 of the air inlet 13, and the larger diameter end located below and flush with the outer wall of the air inlet 13, facilitating the lateral diffusion of gas after leaving the air inlet 13. The outlet surface 12 of the process chamber 1 has a plurality of through-hole-shaped spray holes 121 evenly arranged. Gas leaves the process chamber 1 through the spray holes 121 and is distributed relatively evenly. In this embodiment, the spray holes 121 are arranged in multiple rows, and adjacent rows of spray holes 121 are staggered, covering the entire outlet surface 12 of the process chamber 1. The diameter of each spray hole 121 is 2.2 mm.
[0039] Please see Figure 1 and Figure 2 The first guide plate 2 includes an annular portion 21, a longitudinal portion 22, and a blocking portion 23. The longitudinal portion 22 is connected between the annular portion 21 and the blocking portion 23. The annular portion 21 is constructed as a circular plate and can be detachably connected to the inner wall of the inlet surface 11 of the process chamber 1 through screw holes and bolts. It is coaxial with the air inlet 13, and the diameter of its inner edge is larger than that of the outer wall of the air inlet 13. The inner edge extends vertically downward in a small amount to form a cylinder, which facilitates the connection to the longitudinal portion 22. The circular plate-shaped blocking portion 23 is located below the annular portion 21 and is coaxial with the annular portion 21. The diameter of the blocking portion 23 is equal to that of the outer wall of the air inlet 13, and there is a longitudinal distance between the blocking portion 23 and the air inlet 13. The two ends of the longitudinal portion 22 are respectively connected to the edges of the annular portion 21 and the blocking portion 23. Three arc-shaped air guide holes 221 are evenly formed on it. Each air guide hole 221 is an oblong hole with a central angle of 110° and covers the entire longitudinal portion. The end of the air guide hole 221 facing the inner side of the first guide plate 2 is at a higher height, so that its orientation is close to the flow surface 133, which facilitates the diffusion of the gas flowing in from the air inlet 13 towards the outer and lower side of the first guide plate 2.
[0040] The second guide plate 3 is a circular plate structure, horizontally and coaxially positioned below the first guide plate 2, and detachably connected to the inner wall of the inlet surface 11 of the process chamber 1 through multiple evenly arranged screw holes and bolts. The diameter of the second guide plate 3 is larger than that of the first guide plate 2, which is 250 mm in this embodiment.
[0041] Since parameters such as airflow velocity and density affect the uniformity of airflow between the first guide plate 2 and the second guide plate 3, the installation methods of the first guide plate 2 and the second guide plate 3 in this embodiment are designed for easy disassembly and replacement. When deposition parameters change, the uniformity of airflow can be adjusted by changing the diameter and height of the first guide plate 2 and the second guide plate 3, thereby ensuring the uniformity of the deposited film. Verification under various production conditions shows that, with simple adjustments, the deviation between the maximum and minimum film thicknesses can be less than 5% in large-area deposition within the process chamber 1.
[0042] Example 2:
[0043] The only difference between this embodiment and Embodiment 1 is that the second guide plate 3 is uniformly provided with multiple connecting holes. When the flow rate of the introduced gas is high or the density is low, the connecting holes help to increase the density of the gas flowing out of the middle of the process chamber 1, thereby improving the uniformity of gas distribution. When the flow rate or density of the introduced gas increases, it can be adjusted by blocking some or all of the connecting holes to ensure the uniformity of gas distribution.
[0044] Example 3:
[0045] The only difference between this embodiment and Embodiment 1 is that the spray holes 121 are arranged in a regular pattern of sparse in the middle and dense at the edges. When the flow rate of the gas is slow or the density is high, the density of the gas flowing out of the middle of the process chamber 1 is further reduced, thereby improving the uniformity of gas distribution.
[0046] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0047] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A gas distribution mechanism for a PECVD plate-type device, characterized in that, Comprising: A process chamber (1), configured as a hollow shell-like structure, having an inlet surface (11) and an outlet surface (12) opposite to the inlet surface (11). An air inlet (13) is connected to the inlet surface (11) of the process chamber (1), and a plurality of regularly arranged through-hole-like spray holes (121) are provided on the outlet surface (12) of the process chamber (1). A first deflector plate (2), including a blocking portion (23). The blocking portion (23) is disposed between the inlet surface (11) and the outlet surface (12) of the process chamber (1). The projection of the blocking portion (23) on the inlet surface (11) of the process chamber (1) completely covers the inner wall of the air inlet (13), and there is a gap between the blocking portion (23) and the inlet surface (11) of the process chamber (1). A second deflector plate (3), configured as a plate-like structure, is disposed between the blocking portion (23) of the first deflector plate (2) and the outlet surface (12) of the process chamber (1). The projection of the second deflector plate (3) on the blocking portion (23) of the first deflector plate (2) completely covers the blocking portion (23) of the first deflector plate (2).
2. The gas distribution mechanism for the PECVD plate equipment according to claim 1, wherein The first deflector plate (2) further includes a longitudinal portion (22). One end of the longitudinal portion (22) is connected to the edge of the blocking portion (23), and the other end extends obliquely toward the inlet surface (11) of the process chamber (1), and the extending direction is inclined toward the outside of the blocking portion (23). A plurality of air guide holes (221) are provided on the longitudinal portion (22). The direction of the air guide holes (221) extends toward the outlet surface (12) of the process chamber (1) and is inclined toward the outside of the blocking portion (23).
3. The gas distribution mechanism for the PECVD plate equipment according to claim 2, wherein The air inlet (13) has a chamber end (131) connected to the process chamber (1) and an air path end (132) opposite to the chamber end (131). A flow surface (133) is formed on the inner wall of the chamber end (131) of the air inlet (13). The flow surface (133) is configured as an annular inclined surface, and one end thereof away from the air path end (132) of the air inlet (13) is inclined toward the outside of the air inlet (13).
4. The gas distribution mechanism for the PECVD plate-type equipment according to claim 2, wherein, The first deflector plate (2) further includes an annular portion (21) connected to the inlet surface (11) of the process chamber (1). The annular portion (21) is configured as a ring-shaped sheet, and the inner edge is connected to one end of the longitudinal portion (22) away from the blocking portion (23).
5. The gas distribution mechanism for the PECVD plate-type equipment according to claim 2, wherein The air guide holes (221) are configured as arc-shaped waist-shaped holes. The central angles of the three air guide holes (221) are the same and are any value in the range of 100° to 115°.
6. The gas distribution mechanism for the PECVD plate equipment according to claim 1, wherein, The second deflector plate (3) is connected to the inlet surface (11) of the process chamber (1) by a plurality of bolts.
7. The gas distribution mechanism for the PECVD plate equipment according to claim 1, wherein A number of regularly arranged communication holes are provided on the second deflector plate (3), or the spray holes (121) are arranged regularly with a sparse middle and dense edges.
8. The gas distribution mechanism for the PECVD plate-type equipment according to claim 1, wherein The outlet surface (12) of the process chamber (1) is configured as a rectangle, and the extending directions of two adjacent sides thereof are the first direction and the second direction respectively. The centers of the first deflector plate (2) and the second deflector plate (3) both correspond to the center position of the outlet surface (12) of the process chamber (1). The diameter of the second deflector plate (3) is any value within 5% to 7% of the length of the outlet surface (12) of the process chamber (1) in the first direction, and is also any value within 5% to 7% of the length of the outlet surface (12) of the process chamber (1) in the second direction.