A ceramic tile bonding system deformation detection device

Abstract

The utility model provides a kind of ceramic tile bonding system deformation detection device, it is related to ceramic tile bonding system deformation detection technical field, comprising: base, the upside of base is provided with bearing part, bearing part is used to bear ceramic tile bonding sample;Multiple distance measurement components, distance measurement component is set in the top of base, and the measuring end of distance measurement component is towards bearing part;Timing switch component, timing switch component is connected with distance measurement component, and can open and close distance measurement component in time, to make distance measurement component intermittent work;Solve the problem that special detection device for the deformation condition of ceramic tile in ceramic tile bonding system is lacked in prior art, it is difficult to conveniently and accurately detect the deformation condition of ceramic tile in ceramic tile bonding system.

Description

Technical Field

[0001] This utility model belongs to the field of deformation detection technology of tile bonding system, and more specifically, relates to a deformation detection device for tile bonding system. Background Technology

[0002] The safety and durability of wall tile installation are crucial for protecting residents' lives and property. For a long time, due to factors such as materials, construction techniques, and installation skills, the problem of wall tiles falling off has been frequent, even resulting in injuries. A tile adhesive system consists of a base layer, an interface layer, an adhesive layer, and the tile itself. Because the coefficients of shrinkage and expansion of each layer differ due to temperature and humidity variations, stress transmitted from the base layer, interface layer, and adhesive layer can cause tiles to warp or become concave. Over long-term use, this can lead to hollowing, warping, or even tile detachment. To ensure the long-term safety of tile adhesive systems, it is necessary to test the deformation of tiles in different systems to reflect the degree to which stress transmitted from the base layer, interface layer, and adhesive layer affects tile deformation, providing a basis for improving tile adhesive systems.

[0003] Unfortunately, there is currently no dedicated testing device for tile deformation in tile bonding systems. Currently, industry technicians primarily rely on manual tapping with a hollow-sounding hammer to detect hollow areas and destructive methods such as cutting and pulling tests to obtain bonding data for indirect evaluation. Radar scanning imaging is also used to assess the internal structure of the tile bonding system, but the scanned data requires noise reduction, resulting in significant discrepancies between the processed data and the actual deformation. None of these methods can obtain the actual deformation data of the tiles in the tile bonding system. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by providing a deformation detection device for tile bonding systems. This solves the problem that existing technologies lack dedicated detection devices for tile deformation in tile bonding systems, making it difficult to conveniently and accurately detect tile deformation in tile bonding systems.

[0005] To achieve the above objectives, this utility model provides a deformation detection device for a ceramic tile bonding system, comprising:

[0006] A base, wherein a support portion is provided on the upper side of the base, the support portion being used to support the tile bonding sample;

[0007] Multiple distance measuring components are provided, which are disposed above the base and with their measuring ends facing the support portion.

[0008] A timing switch component is connected to the distance measuring component and is capable of opening and closing the distance measuring component at regular intervals, so that the distance measuring component operates intermittently.

[0009] Optionally, it also includes a temperature and humidity control box, and the base can be installed inside the temperature and humidity control box.

[0010] Optionally, a support component is movably disposed above the base, and the distance measuring component is connected to the support component.

[0011] Optionally, the distance measuring component is a telescopic micrometer, the measuring end of which is used to contact the tile bonding sample in a pre-compressed state.

[0012] Optionally, the support component includes at least two crossbeams, each crossbeam being provided with at least two distance measuring components, and each crossbeam having columns connected to both ends, the columns being connected to the base via a movable guide structure.

[0013] Optionally, the motion guiding structure includes:

[0014] Guide grooves, which are provided in pairs on the upper side of the base, and a nut is provided at the lower end of the guide grooves;

[0015] A connecting plate is disposed at the lower end of the column, and through holes are provided on both sides of the column.

[0016] A screw that passes through the through hole and the guide groove and is connected to the nut.

[0017] Optionally, the crossbeam has a mounting hole, the distance measuring component is installed in the mounting hole, and a first set screw is provided on one side of the mounting hole.

[0018] Optionally, the crossbeam has sliding holes at both ends, the column passes through the sliding holes, and a second set screw is provided on one side of the sliding hole.

[0019] Optionally, it also includes a data receiving unit, which is provided with multiple data interfaces, each of which is connected to one of the distance measuring components.

[0020] Optionally, a data storage unit and a data display unit are provided, and the data storage unit and the data display unit are connected to the data receiving unit.

[0021] This utility model provides a deformation detection device for a tile bonding system. Its advantages are as follows: the device has a support portion on the upper side of the base to hold the tile bonding sample, and multiple distance measuring components are arranged above the base. Under the control of a timing switch, the multiple distance measuring components intermittently measure the deformation data of the tile surface. That is, at each set interval, the timing switch controls the multiple distance measuring components to measure once. In this way, multiple sets of measurement data are intermittently obtained through multiple distance measuring components distributed at different positions above the tile bonding sample, enabling convenient and accurate detection of tile deformation in the tile bonding system. Users can use these sets of measurement data to analyze and evaluate the tile deformation in the tile bonding system.

[0022] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0023] The above and other objects, features and advantages of the present invention will become more apparent from the accompanying drawings, in which like reference numerals generally represent like parts.

[0024] Figure 1 A schematic diagram of a deformation detection device for a tile bonding system according to an embodiment of the present invention is shown.

[0025] Figure 2 A schematic diagram of the moving guide structure of a deformation detection device for a tile bonding system according to an embodiment of the present invention is shown.

[0026] Figure 3 A schematic diagram of the structure of a tile bonding sample of a tile bonding system deformation detection device according to an embodiment of the present invention is shown.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Base; 2. Guide groove; 3. Tile bonding sample; 4. Column; 5. Horizontal beam; 6. Handle screw; 7. Dial gauge; 8. Cable; 9. Hub; 10. Computer; 11. Concrete base; 12. Waterproof layer; 13. Tile adhesive layer; 14. Interface layer; 15. Tile layer. Detailed Implementation

[0029] Preferred embodiments of the present invention will now be described in more detail. While preferred embodiments of the present invention are described below, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0030] like Figure 1 As shown, this utility model provides a deformation detection device for a ceramic tile bonding system, comprising:

[0031] Base 1, with a bearing part on the upper side of the base 1, the bearing part is used to support the tile bonding sample 3;

[0032] Multiple distance measuring components are provided, with the measuring ends of the distance measuring components facing the support unit.

[0033] The timing switch component is connected to the distance measuring component and can turn the distance measuring component on and off at regular intervals so that the distance measuring component can work intermittently.

[0034] Specifically, to address the lack of a dedicated detection device for tile deformation in existing tile bonding systems, which hinders convenient and accurate detection of tile deformation, this invention provides a tile bonding system deformation detection device. The device features a support portion on the upper side of a base 1 to hold the tile bonding sample 3. Multiple distance measuring components are positioned above the base 1. Under the control of a timing switch, these components intermittently measure the deformation data of the tile surface. Specifically, the timing switch controls each component to take a measurement once at set intervals. This intermittent acquisition of multiple sets of measurement data from the various distance measuring components distributed at different positions above the tile bonding sample 3 enables convenient and accurate detection of tile deformation in the tile bonding system. Users can then use this measurement data to analyze and evaluate the tile deformation in the tile bonding system.

[0035] Optionally, it also includes a temperature and humidity control box, and the base 1 can be installed inside the temperature and humidity control box.

[0036] Specifically, the temperature and humidity control box is used to control and regulate the temperature and humidity within its internal space. It includes a box body, an air circulation system, a refrigeration system, a heating system, a temperature control system, and a humidity control system. The box body houses the base 1 and its various components to provide the temperature and humidity conditions for testing the deformation detection device of the tile bonding system. For example, the tile bonding sample 3 can be tested in a controlled variable manner to analyze or evaluate the effect of temperature or humidity on the tile deformation of the tile bonding sample 3.

[0037] Furthermore, during testing, deformation indicators can be set. For example, when the amount of warping deformation at the edge of the tile reaches a first set value, it is determined that the tile bonding system is damaged under the given temperature and humidity conditions. In this case, the damage to the tile bonding system can be used as the end standard for testing, and no testing duration can be set. Alternatively, a testing duration can be set, such as setting the testing duration to 10 days, and intermittently measuring the deformation data of the tile as the temperature or humidity changes during this period.

[0038] Optionally, a support component is movably provided above the base 1, and the distance measuring component is connected to the support component.

[0039] Specifically, the movement of the support component allows for easy changes in the measurement position of the distance measuring component, making it easier to adapt to different tile bonding sample sizes and different test position requirements.

[0040] Optionally, the distance measuring component is a telescopic micrometer, the measuring end of which is used to contact the tile-bonded sample 3 in a pre-compressed state.

[0041] Specifically, the measuring end of the telescopic micrometer is telescopic. By contacting the upper surface of the tile bonded sample 3 with the measuring end, the telescopic micrometer can accurately measure the amount of deformation when the tile deforms. The pre-compression setting allows the micrometer to accurately measure the bidirectional deformation of the tile by setting the pre-compression state to zero.

[0042] In this embodiment, the telescopic micrometer is a dial gauge micrometer 7, which has high measurement accuracy.

[0043] Optionally, the support component includes at least two crossbeams 5, each crossbeam 5 is provided with at least two distance measuring components, and the two ends of the crossbeams 5 are connected to columns 4, which are connected to the base 1 through a movable guide structure.

[0044] Specifically, the crossbeam 5 is connected above the base 1 via the column 4 to support the distance measuring component. The lower end of the column 4 is connected to the base 1 via a movable guide structure, which facilitates the movement of the column 4 and the crossbeam 5, thereby making it easier to change the measurement position and adapt to different sizes of tile bonding samples 3.

[0045] In this embodiment, there are two crossbeams 5, and three telescopic micrometers are evenly spaced on each crossbeam 5.

[0046] Optionally, the motion guide structure includes:

[0047] Guide groove 2, guide groove 2 is provided in pairs on the upper side of base 1, and a nut is provided at the lower end of guide groove 2;

[0048] A connecting plate is provided at the lower end of the column 4, and through holes are provided on both sides of the column 4.

[0049] The screw passes through the through hole and guide groove 2 and is connected to the nut.

[0050] Specifically, such as Figure 2 As shown, the connecting plate can be tightened or loosened by turning the screws. When loosened, the connecting plate, column 4, and crossbeam 5 can move along the guide groove 2. When tightened, the position of the distance measuring component can be locked.

[0051] In this embodiment, the screw is a handle screw 6, which is convenient to tighten manually.

[0052] Optionally, the crossbeam 5 has a mounting hole, the distance measuring component is installed in the mounting hole, and a first set screw is provided on one side of the mounting hole.

[0053] Specifically, the distance measuring component is inserted into the mounting hole and secured by the first set screw.

[0054] In this embodiment, the telescopic micrometer is fixed by the first fastening screw after reaching the pre-compression state during installation.

[0055] Optionally, the two ends of the crossbeam 5 are provided with sliding holes, the column 4 passes through the sliding holes, and a second set screw is provided on one side of the sliding hole.

[0056] Specifically, the height of the crossbeam 5 is also adjustable. Through the sliding holes at both ends of the crossbeam 5, it can slide and cooperate with the column 4 to adapt to the testing of ceramic tile bonding samples 3 of different thicknesses.

[0057] In this embodiment, both the first set screw and the second set screw are handle screws 6.

[0058] Optionally, it also includes a data receiving unit, which is provided with multiple data interfaces, each of which is connected to a distance measuring component.

[0059] Specifically, the measurement results of the distance measuring components are received by the data receiving unit. The data receiving unit receives the measurement results of the distance measuring components at different locations through multiple data interfaces, which facilitates subsequent processing and analysis.

[0060] In this embodiment, a hub 9 is used to provide multiple data interfaces, and the cable 8 of each retractable micrometer is connected to one data interface of the hub 9.

[0061] Optionally, the data storage unit and the data display unit are connected to the data receiving unit.

[0062] Specifically, the measurement results of the distance measuring component can be stored by the data storage unit and displayed by the data display unit, facilitating data preservation and retrieval.

[0063] In this embodiment, the data storage unit and the data display unit can adopt an integrated design of PC, that is, the retractable micrometer is connected to the PC through the hub 9, and the data is stored and displayed in the PC. In this way, the PC can also be used to organize or process the data, such as drawing data change curves on the PC.

[0064] In summary, when using the tile bonding system deformation detection device provided by this utility model, taking the detection of a single tile bonding sample 3 for a set detection time as an example: Figure 3 As shown, the structure of the tile bonding sample 3 includes, from bottom to top, a concrete base layer 11, a waterproof layer 12, a tile adhesive layer 13, an interface layer 14, and a tile layer 15. The testing period is set to 10 days. Under the set temperature conditions, humidity is set as a variable, and the tile deformation of the tile bonding sample 3 is tested. The prepared tile bonding sample 3 is placed on the bearing part on the upper side of the base 1. The bearing part is recessed to facilitate the positioning of the tile bonding sample 3. Then, the column 4 and the crossbeam 5 are installed. The bottom of the column 4 is connected to the base 1 through a movable guide structure. After adjusting the position of the crossbeam 5, the screws are tightened. The connection between the column 4 and the crossbeam 5 is secured with the second set screw after adjusting the height of the crossbeam 5. Next, the micrometer 7 is passed through the mounting hole of the crossbeam 5, so that the measuring end of the micrometer 7 is in a pre-compressed state. Tighten the first set screw; then, connect the dial gauge 7, hub 9, and computer 10 via cable 8. Each dial gauge 7 corresponds to one channel in hub 9. Power on and check the connection to ensure a stable connection signal; zero each dial gauge 7 by pressing the button to display a value of 0.0000. After confirming that there is no error, start the test; the test ends after ten days. Organize and analyze multiple sets of data in computer 10. The data trend can be analyzed, and the data can be exported at any time for the study of deformation.

[0065] The various embodiments of the present invention have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments.

Claims

1. A deformation detection device for a ceramic tile bonding system, characterized in that, include: A base, wherein a support portion is provided on the upper side of the base, the support portion being used to support the tile bonding sample; Multiple distance measuring components are provided, which are disposed above the base and with their measuring ends facing the support portion. A timing switch component is connected to the distance measuring component and is capable of opening and closing the distance measuring component at regular intervals, so that the distance measuring component operates intermittently.

2. The tile bonding system deformation detection device according to claim 1, characterized in that, It also includes a temperature and humidity control box, and the base can be installed inside the temperature and humidity control box.

3. The tile bonding system deformation detection device according to claim 1, characterized in that, A support component is movably disposed above the base, and the distance measuring component is connected to the support component.

4. The tile bonding system deformation detection device according to claim 1, characterized in that, The distance measuring component is a telescopic micrometer, and the measuring end of the telescopic micrometer is used to contact the tile bonding sample in a pre-compressed state.

5. The tile bonding system deformation detection device according to claim 3, characterized in that, The support component includes at least two crossbeams, each crossbeam is provided with at least two distance measuring components, and the two ends of the crossbeams are connected to columns, which are connected to the base through a movable guide structure.

6. The tile bonding system deformation detection device according to claim 5, characterized in that, The motion guidance structure includes: Guide grooves, which are provided in pairs on the upper side of the base, and a nut is provided at the lower end of the guide grooves; A connecting plate is disposed at the lower end of the column, and through holes are provided on both sides of the column. A screw that passes through the through hole and the guide groove and is connected to the nut.

7. The tile bonding system deformation detection device according to claim 5, characterized in that, The crossbeam has a mounting hole, the distance measuring component is installed in the mounting hole, and a first set screw is provided on one side of the mounting hole.

8. The tile bonding system deformation detection device according to claim 5, characterized in that, The crossbeam has sliding holes at both ends, the column passes through the sliding holes, and a second set screw is provided on one side of the sliding hole.

9. The tile bonding system deformation detection device according to claim 1, characterized in that, It also includes a data receiving unit, which is provided with multiple data interfaces, each of which is connected to one of the distance measuring components.

10. The tile bonding system deformation detection device according to claim 9, characterized in that, The data storage unit and the data display unit are connected to the data receiving unit.

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