Wafer spacing measuring machine within wafer box

By designing a wafer pitch measuring machine inside a wafer box and utilizing a combination of multi-dimensional motion mechanisms and detection components, the problem of inaccurate pitch measurement inside the wafer box was solved, improving measurement accuracy and the reliability of automated operation.

CN224552325UActive Publication Date: 2026-07-24WUHU YIBAI VEHICLE PRECISION TECH CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Utility models(China)
Current Assignee / Owner
WUHU YIBAI VEHICLE PRECISION TECH CO LTD
Filing Date
2025-03-12
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

Existing technology cannot accurately measure the spacing between wafers inside the wafer cassette, leading to positional deviations when automated robotic arms pick up and place wafers, which may result in wafer damage or rework.

Method used

A wafer pitch measuring machine in a wafer box, including a frame, a multi-dimensional motion mechanism and a measuring component, is adopted. The multi-dimensional motion mechanism drives the fixed plate and the extension plate into the wafer box. The first detection element is used for image analysis and the second detection element is used to collect edge position data. The measurement accuracy is improved by combining a laser confocal sensor and a supplementary lighting mechanism.

Benefits of technology

It enables high-precision measurement of wafer pitch within the wafer cassette, reducing the risk of wafer damage and improving the accuracy and efficiency of automated pick-and-place.

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Abstract

The utility model discloses a wafer box inner wafer spacing measuring machine, it includes frame, multi -dimensional movement mechanism and measurement subassembly, multi -dimensional movement mechanism installs in the frame, measurement subassembly installs on multi -dimensional movement mechanism, measurement subassembly includes fixed plate, extension plate, first detection piece and second detection piece, and fixed plate is driven to be connected with multi -dimensional movement mechanism, and extension plate and first detection piece all install on the fixed plate, and second detection piece installs on extension plate, wherein, under the drive of multi -dimensional movement mechanism, fixed plate moves to the opening of wafer box, and first detection piece carries out image analysis detection to multiple wafers in wafer box, and extension plate extends into wafer box, and second detection piece is used for gathering the measurement data of the edge position of each wafer, solves the problem that conventional measurement mode can not measure in wafer box, and through the cooperation of two detection devices, improves the detection efficiency to wafer box.
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