A chip testing system
The staggered pre-assembled chip testing system solves the problems of high-functionality integration testing of photonic chips and damage during transportation, achieving global testing and safe and stable transportation.
CN224553423UActive Publication Date: 2026-07-24LIGHTSTANDARD CO LTD
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Patent Information
- Application Number
- CN202521561353.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-24
- Publication Date
- 2026-07-24
- Estimated Expiration
- 2035-07-24
AI Technical Summary
Technical Problem
In existing technologies, probe testing is difficult to meet the testing requirements of high-functionality integration of photonic chips, and the chips are easily damaged during transportation.
Method used
The multi-layer sheet structure is pre-assembled in an interlaced manner using connectors. Components such as temperature controllers, temperature measuring devices, and fiber optic arrays are pre-assembled through recesses and enclosures. Combined with bolt fixing and adhesive materials, a stable chip testing system is formed.
Benefits of technology
It achieves global testing and safety and stability of optical chips during transportation, reduces the risk of chip damage, and is suitable for long-distance transportation.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224553423U_ABST
Abstract
The application relates to the technical field of optical chip testing, and relates to a chip testing system, which comprises a connecting piece, a temperature control device, a chip and a temperature measuring device.The connecting piece is provided with a recess, and the edge of the recess forms a corresponding enclosing part.The lower surface of the temperature control device is arranged in the recess through adhesive material.The chip is arranged on the upper surface of the temperature control device through adhesive material.The temperature measuring device is arranged on the upper surface of the temperature control device through adhesive material.The recess is extendedly provided with an outlet channel, and the signal lines of the temperature control device and the temperature measuring device are led out through the outlet channel.The testing system provided by the application is beneficial to realizing global testing of the chip.
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