Foldable double-sided heat dissipation liquid cooling device for PCIE card

Abstract

The utility model relates to PCIE card heat dissipation technical field discloses a kind of foldable double-sided heat dissipation liquid cooling device for PCIE card, including PCIE unit, still including first radiating component, second radiating component and first connecting pipe;First radiating component is located on PCIE unit upper;Second radiating component is located on PCIE unit, and it is oppositely arranged with first radiating component;First connecting pipe is located between first radiating component and second radiating component;First radiating component includes first radiating part, second radiating part and third radiating part.Through setting first radiating component, second radiating component and first connecting pipe, and first connecting pipe uses stainless steel bellows, so that waterway between first radiating component and second radiating component is interconnected, forms a complete double-sided heat dissipation system, without being designed independent cold plate for upper and lower surface respectively, reduce the overall volume of radiator, effectively saved the valuable layout space of PCIE card.

Description

Technical Field

[0001] This utility model relates to the field of PCIe card heat dissipation technology, and in particular to a foldable double-sided heat dissipation liquid cooling device for PCIe cards. Background Technology

[0002] With the rapid development of information technology, the performance requirements of hardware devices in fields such as high-performance computing, data centers, and artificial intelligence are increasing. As an important expansion interface card in computer systems, PCIe cards are widely used in graphics processing, network communication, data storage, and many other areas. The continuous improvement of their performance is directly related to the operating efficiency and data processing capabilities of the entire system.

[0003] Currently, most PCIe cards use liquid cooling technology for heat dissipation. This effectively reduces the operating temperature of the core components inside the card, ensuring stable operation and extending its service life. However, due to the rigid design of the existing liquid cooling technology, it cannot cover both sides of high heat sources at the same time. It is necessary to design independent cold plates for the upper and lower surfaces, resulting in a large heat sink that occupies valuable layout space on the PCIe card. In addition, the long heat conduction path leads to increased thermal resistance and reduced heat dissipation efficiency.

[0004] Therefore, a new technical solution needs to be researched to address the above problems. Utility Model Content

[0005] In view of this, the present invention addresses the deficiencies of the existing technology, and its main objective is to provide a foldable double-sided heat dissipation liquid cooling device for PCIE cards.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A foldable double-sided liquid cooling device for PCIe cards includes a PCIe unit, a first heat dissipation component, a second heat dissipation component, and a first connecting pipe. The first heat dissipation component is disposed on the upper surface of the PCIe unit for heat dissipation of the upper surface of the PCIe unit. The second heat dissipation component is disposed on the PCIe unit and opposite to the first heat dissipation component for heat dissipation of the lower surface of the PCIe unit. The first connecting pipe is disposed between the first heat dissipation component and the second heat dissipation component for water circulation between the two components. The first heat dissipation component includes a first heat dissipation element, a second heat dissipation element, and a third heat dissipation element. The first heat dissipation element, the second heat dissipation element, and the third heat dissipation element are arranged side by side in sequence along the direction of coolant flow.

[0008] As further explained, the first heat dissipation component, the second heat dissipation component, and the third heat dissipation component are respectively connected by a second connecting pipe, and the third heat dissipation component is connected to the second heat dissipation assembly through a first connecting pipe.

[0009] As further explained, the first heat dissipation component includes a first top plate and a first middle frame; the first middle frame is disposed above the PCIe unit, and a first flow channel for coolant flow is provided inside the first middle frame, and multiple sets of first diverter plates are provided inside the first flow channel; the first top plate is fixedly disposed above the first middle frame; a first connecting nozzle communicating with the first flow channel is provided on the first middle frame, and the first connecting nozzle is connected to the second connecting pipe; an inlet head and an outlet head communicating with the first flow channel are provided on the first middle frame.

[0010] As further explained, the second heat dissipation component includes a second top plate, a second middle frame, and a second bottom plate; the second middle frame is located above the PCIe unit, and a second flow channel for coolant flow is provided inside the second middle frame; the second bottom plate is located below the second middle frame, and a mounting cavity for mounting the second bottom plate is provided on the bottom surface of the second middle frame, and the mounting cavity is connected to the second flow channel; the second top plate is fixedly located above the second middle frame; the second middle frame is provided with a second connecting nozzle connected to the second flow channel, and the second connecting nozzle is connected to the second connecting pipe.

[0011] As further explained, the second base plate is provided with multiple sets of parallel heat dissipation teeth; the multiple sets of heat dissipation teeth form multiple sets of heat dissipation protrusions, and the heat dissipation protrusions are located in the mounting cavity.

[0012] As further explained, the second middle frame is provided with a locking frame for fixing; the four corners of the locking frame are provided with first locking screws that are fixedly connected to the second heat dissipation assembly, and an elastic element is provided between the first locking screws and the locking frame;

[0013] The second middle frame has outwardly extending connecting bosses at both ends, and the connecting bosses are connected to the locking frame by a second locking screw.

[0014] As further explained, the third heat dissipation component includes a third top plate and a third middle frame; the third middle frame is disposed above the PCIe unit, and a third flow channel for coolant flow is provided inside the third middle frame; the third top plate is fixedly disposed above the third middle frame; a third connecting nozzle communicating with the third flow channel is provided on the third middle frame, and the third connecting nozzle is connected to the second connecting pipe; the third top plate is provided with a fourth connecting nozzle communicating with the first connecting pipe.

[0015] As further explained, the second heat dissipation component includes a heat-conducting plate and a third connecting pipe; the heat-conducting plate is located below the PCIe unit, and multiple sets of slots are provided between the heat-conducting plate and the PCIe unit; the third connecting pipe is located inside the heat-conducting plate on the side away from the PCIe unit, and the first and last ends of the third connecting pipe are respectively connected to the first connecting pipe.

[0016] As further explained, the third connecting pipe includes a liquid inlet, an arc-shaped section, and a liquid outlet; the liquid inlet and the liquid outlet are arranged side by side at one end of the heat-conducting plate, the arc-shaped section is located at the other end of the heat-conducting plate, and the liquid inlet, the arc-shaped section, and the liquid outlet are connected end to end in sequence.

[0017] As further explained, the first connecting pipe is a stainless steel corrugated pipe, which includes a first straight section, a corrugated section and a second straight section connected end to end in sequence; the corrugated section has multiple sets of corrugated segments connected end to end in sequence, and the multiple sets of corrugated segments form a flexible deformation structure; the first straight section is connected to the first heat dissipation component, and the second straight section is connected to the second heat dissipation component.

[0018] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution:

[0019] 1. By setting up a first heat dissipation component, a second heat dissipation component, and a first connecting pipe, and the first connecting pipe is made of stainless steel corrugated pipe, the water channels between the first heat dissipation component and the second heat dissipation component are interconnected, forming a complete double-sided heat dissipation system. There is no need to design independent cold plates for the upper and lower surfaces, which reduces the overall size of the heat sink and avoids the space waste caused by the combination of multiple independent cold plates, effectively saving the valuable layout space of the PCIe card.

[0020] 2. The first connecting pipe is made of stainless steel corrugated pipe, which has multiple sets of corrugated segments connected end to end in the corrugated section to form a flexible deformation structure. This allows the first and second heat dissipation components to be folded to cover the upper and lower surfaces of the PCIe card, eliminating the need to design separate cold plates for the upper and lower surfaces and reducing the overall size of the heat sink. At the same time, the first and second heat dissipation components can dissipate heat from both sides of the PCIe card simultaneously, which can reduce the overall temperature of the PCIe unit more quickly, avoid performance degradation or damage caused by local overheating, and improve the stability and reliability of the device. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of the overall structure of a foldable double-sided heat dissipation liquid cooling device for PCIE cards provided by this utility model;

[0023] Figure 2 An exploded view of a foldable double-sided heat dissipation liquid cooling device for PCIe cards provided by this utility model;

[0024] Figure 3 A schematic diagram of the internal structure of the first middle frame, the second middle frame, and the third middle frame provided for this utility model;

[0025] Figure 4 This is a partial structural diagram of the second base plate provided by this utility model;

[0026] Figure 5 This is a schematic diagram of the overall structure of the second heat dissipation component provided by this utility model;

[0027] Figure 6 This is a structural diagram showing the unfolded and bent states of the first connecting tube provided by this utility model.

[0028] The following are the labeling elements in the figure:

[0029] 10. PCIe unit;

[0030] 20. First heat dissipation component; 21. First top plate; 22. First middle frame; 23. First flow channel; 231. First flow divider plate; 24. First connecting nozzle; 25. Liquid inlet head; 26. Liquid outlet head;

[0031] 30. Second heat dissipation component; 31. Second top plate; 32. Second middle frame; 321. Connecting boss; 33. Second flow channel; 34. Second connecting nozzle; 35. Second bottom plate; 351. Heat dissipation teeth; 36. Locking frame; 37. First locking screw; 371. Elastic element;

[0032] 40. Third heat dissipation component; 41. Third top plate; 42. Third middle frame; 43. Third flow channel; 44. Third connecting nozzle; 45. Fourth connecting nozzle;

[0033] 50. Second heat dissipation component; 51. Heat-conducting plate; 511. Groove; 52. Third connecting pipe; 521. Liquid inlet; 522. Arc-shaped part; 523. Liquid outlet;

[0034] 60. First connecting pipe; 601. First straight section; 602. Corrugated section; 603. Second straight section; 61. Second connecting pipe. Detailed Implementation

[0035] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0036] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0037] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0039] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments.

[0040] In one embodiment of this utility model, such as Figure 1-6As shown, a foldable double-sided liquid cooling device for PCIe cards is provided, including a PCIe unit 10, a first heat dissipation component, a second heat dissipation component 50, and a first connecting pipe 60. The first heat dissipation component is disposed on the PCIe unit 10 and is used for heat dissipation of the upper surface of the PCIe unit 10. The second heat dissipation component 50 is disposed on the PCIe unit 10 and is disposed opposite to the first heat dissipation component, and is used for heat dissipation of the lower surface of the PCIe unit 10. The first connecting pipe 60 is disposed between the first heat dissipation component and the second heat dissipation component 50 for water channel communication between the first heat dissipation component and the second heat dissipation component 50. The first heat dissipation component 20, the second heat dissipation component 30, and the third heat dissipation component 40 are arranged side by side in sequence along the coolant flow direction.

[0041] By setting up a first heat dissipation component, a second heat dissipation component 50, and a first connecting pipe 60, with the first connecting pipe 60 being a stainless steel corrugated pipe, the water channels between the first heat dissipation component and the second heat dissipation component 50 are interconnected, forming a complete double-sided heat dissipation system. There is no need to design separate cold plates for the upper and lower surfaces, which reduces the overall size of the heat sink and avoids the space waste caused by the combination of multiple independent cold plates, effectively saving valuable layout space for PCIe cards.

[0042] The first connecting pipe 60 is made of stainless steel corrugated pipe, and its corrugated part 602 has multiple sets of corrugated segments connected end to end in sequence to form a flexible deformation structure. This allows the first heat dissipation component and the second heat dissipation component 50 to be folded to cover the upper and lower surfaces of the PCIe card, eliminating the need to design separate cold plates for the upper and lower surfaces and reducing the overall size of the heat sink. At the same time, by dissipating heat from both sides of the PCIe card simultaneously through the first heat dissipation component and the second heat dissipation component 50, the overall temperature of the PCIe unit 10 can be reduced more quickly, avoiding performance degradation or damage caused by local overheating and improving the stability and reliability of the device.

[0043] Preferably, the first heat dissipation component 20, the second heat dissipation component 30, and the third heat dissipation component 40 are connected to each other via second connecting pipes 61, and the third heat dissipation component 40 is connected to the second heat dissipation assembly 50 via the first connecting pipe 60. This modular design facilitates flexible adjustment and expansion of the heat dissipation assembly according to actual heat dissipation needs. In this embodiment, the second connecting pipe 61 is a hollow copper pipe. The connection between the first heat dissipation component 20, the second heat dissipation component 30, and the third heat dissipation component 40 via second connecting pipes 61 allows the coolant to flow sequentially through the first heat dissipation component 20, the second heat dissipation component 30, and the third heat dissipation component 40, fully absorbing heat from the PCIe card surface and improving the uniformity and efficiency of heat dissipation. Moreover, the modular design of the first heat dissipation component 20, the second heat dissipation component 30, and the third heat dissipation component 40 also facilitates production and maintenance, reducing costs.

[0044] Specifically, the first heat dissipation component 20 includes a first top plate 21 and a first middle frame 22. The first middle frame 22 is located above the PCIe unit 10, and a first flow channel 23 for coolant flow is provided inside the first middle frame 22. Multiple sets of first diverter plates 231 are provided inside the first flow channel 23. The first top plate 21 is fixedly located above the first middle frame 22. A first connecting nozzle 24 communicating with the first flow channel 23 is provided on the first middle frame 22, and the first connecting nozzle 24 is connected to a second connecting pipe 61. An inlet head 25 and an outlet head 26 communicating with the first flow channel 23 are provided on the first middle frame 22. By setting the first flow channel 23 and the first diverter plates 231, the first diverter plates 231 can increase the flow path and turbulence of the coolant in the first flow channel 23, so that the coolant can fully contact the first middle frame 22, thereby more effectively absorbing heat and improving the heat dissipation effect. At the same time, by setting the inlet head 25 and the outlet head 26, the entry and exit of coolant are facilitated, and it is convenient to connect and integrate with external cooling equipment.

[0045] Specifically, in this embodiment, the second heat dissipation component 30 is located above the GPU inside the PCIe card, and dissipates heat from the GPU through the second heat dissipation component 30. The second heat dissipation component 30 includes a second top plate 31, a second middle frame 32, and a second bottom plate 35. The second middle frame 32 is located above the PCIe unit 10, and a second flow channel 33 for coolant flow is provided inside the second middle frame 32. The second bottom plate 35 is located below the middle frame, and a mounting cavity for mounting the second bottom plate 35 is provided on the bottom surface of the second middle frame 32, and the mounting cavity is connected to the second flow channel 33. The second top plate 31 is fixedly mounted above the second middle frame 32. The second middle frame 32 is provided with a second connecting nozzle 34 that communicates with the second flow channel 33, and the second connecting nozzle 34 is connected to the second connecting pipe 61.

[0046] By setting the second flow channel 33, the coolant can flow in the second flow channel 33, and the second base plate 35 can be in close contact with the upper surface of the PCIe unit 10 to conduct heat to the mounting cavity. The mounting cavity is connected to the second flow channel 33 and conducts heat to the coolant in the second flow channel 33, thereby effectively absorbing heat and improving the heat dissipation effect.

[0047] Furthermore, the second base plate 35 is provided with multiple sets of parallel heat dissipation teeth 351. The multiple sets of heat dissipation teeth 351 form multiple sets of heat dissipation protrusions, and the heat dissipation protrusions are located in the mounting cavity. By setting the heat dissipation teeth 351, the heat dissipation area is increased through multiple sets of heat dissipation teeth 351, so that heat can be effectively transferred to the coolant in the second flow channel 33, thereby improving the heat dissipation efficiency.

[0048] More preferably, the second middle frame 32 is provided with a locking frame 36 for fixing. The locking frame 36 is provided with a first locking screw 37 at each of its four corners, which is fixedly connected to the second heat dissipation assembly 50, and an elastic element 371, which is a spring, is provided between the first locking screw 37 and the locking frame 36.

[0049] The second middle frame 32 has outwardly extending connecting bosses 321 at both ends, and the connecting bosses 321 are connected to the locking frame 36 by second locking screws. By setting the first locking screw 37 and the elastic element 371, the elastic element 371 can play a buffering role when the first locking screw 37 is tightened, avoiding damage to the second heat dissipation component 30 and the PCIe unit 10 due to excessive tightening force. At the same time, the connection between the connecting bosses 321 and the locking frame 36 by the second locking screw makes the installation and removal of the second heat dissipation component 30 and the locking frame 36 more convenient, and facilitates maintenance and replacement.

[0050] Specifically, the third heat dissipation component 40 includes a third top plate 41 and a third middle frame 42. The third middle frame 42 is located above the PCIe unit 10, and a third flow channel 43 for coolant flow is provided inside the third middle frame 42. The third top plate 41 is fixedly located above the third middle frame 42. The third middle frame 42 is provided with a third connecting nozzle 44 that communicates with the third flow channel 43 and is connected to the second connecting pipe 61. The third top plate 41 is provided with a fourth connecting nozzle 45 that communicates with the first connecting pipe 60. By providing the third flow channel 43, the coolant can fully contact the third middle frame 42, thereby more effectively absorbing heat. At the same time, by providing the fourth connecting nozzle 45, the coolant can smoothly flow from the third heat dissipation component 40 into the first connecting pipe 60, and then into the second heat dissipation assembly 50, forming a complete coolant circulation path.

[0051] Preferably, the second heat dissipation assembly 50 includes a heat-conducting plate 51 and a third connecting pipe 52. The heat-conducting plate 51 is located below the PCIe unit 10, and the heat-conducting plate 51 is an aluminum plate, with multiple sets of slots 511 between the heat-conducting plate 51 and the PCIe unit 10. The third connecting pipe 52 is located inside the heat-conducting plate 51 on the side away from the PCIe unit 10, and the third connecting pipe 52 is a hollow copper pipe, with its two ends connected to the first connecting pipe 60 respectively. By setting up a heat-conducting plate 51 and a third connecting pipe 52, the heat-conducting plate 51 contacts the PCIe unit 10. Furthermore, by setting up multiple sets of slots 511, the contact area between the heat-conducting plate 51 and the PCIe unit 10 can be increased, allowing heat to be conducted from the PCIe unit 10 to the heat-conducting plate 51 more quickly. At the same time, the coolant in the third connecting pipe 52 absorbs the heat on the heat-conducting plate 51, thereby dissipating heat from the lower surface of the PCIe unit 10. The coolant after heat exchange is then returned to the first heat dissipation assembly through the first connecting pipe 60 and discharged into the external cooling equipment, thus achieving heat dissipation for the PCIe unit 10.

[0052] Specifically, the third connecting pipe 52 includes a liquid inlet 521, an arc-shaped portion 522, and a liquid outlet 523. The liquid inlet 521 and the liquid outlet 523 are arranged side by side at one end of the heat-conducting plate 51, and the arc-shaped portion 522 is located at the other end of the heat-conducting plate 51. The liquid inlet 521, the arc-shaped portion 522, and the liquid outlet 523 are connected end to end in sequence. By setting the liquid inlet, the arc-shaped portion 522, and the liquid outlet 523, the third connecting pipe 52 forms a circulating cooling circuit, which makes the flow of coolant in the fourth connecting pipe smoother, reduces flow resistance, and improves the circulation efficiency of coolant. In addition, the structure of the arc-shaped portion 522 can be adjusted according to the shape of the heat-conducting plate 51, making the connection between the third connecting pipe 52 and the heat-conducting plate 51 tighter and improving the heat dissipation effect.

[0053] Preferably, the first connecting pipe 60 is a stainless steel corrugated pipe, comprising a first straight section 601, a corrugated section 602, and a second straight section 603 connected end-to-end. The corrugated section 602 contains multiple sets of corrugated segments connected end-to-end, forming a flexible deformable structure. The first straight section 601 is connected to the first heat dissipation assembly, and the second straight section 603 is connected to the second heat dissipation assembly 50. By setting the corrugated section 602 and its multiple corrugated segments to form a flexible deformable structure, the first connecting pipe 60 possesses good flexibility and bendability. It can be bent at corresponding angles within a fixed space according to actual conditions, facilitating the installation and adjustment of the first and second heat dissipation assemblies 50 on the upper and lower surfaces of the PCIe card to meet different installation space and layout requirements. This eliminates the need for separate cold plates for the upper and lower surfaces, effectively reducing the size of the heatsink and avoiding encroachment on the valuable layout space of the PCIe card.

[0054] The above are merely preferred embodiments of the present utility model, and only specifically describe the technical principles of the present utility model. These descriptions are only for explaining the principles of the present utility model and should not be construed as limiting the scope of protection of the present utility model in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model, as well as other specific embodiments of the present utility model that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present utility model.

Claims

1. A foldable double-sided liquid cooling device for PCIe cards, comprising a PCIe unit, characterized in that, Also includes: A first heat dissipation component is disposed on the PCIe unit and is used for heat dissipation of the upper surface of the PCIe unit. The second heat dissipation component is disposed on the PCIe unit and is disposed opposite to the first heat dissipation component, and is used for heat dissipation of the lower surface of the PCIe unit; A first connecting pipe is disposed between the first heat dissipation component and the second heat dissipation component, and is used for water passage communication between the first heat dissipation component and the second heat dissipation component; The first heat dissipation component includes a first heat dissipation component, a second heat dissipation component, and a third heat dissipation component; the first heat dissipation component, the second heat dissipation component, and the third heat dissipation component are arranged side by side in sequence along the flow direction of the coolant.

2. The foldable double-sided heat dissipation liquid cooling device for PCIe cards according to claim 1, characterized in that, The first heat dissipation component, the second heat dissipation component, and the third heat dissipation component are respectively connected to each other through a second connecting pipe, and the third heat dissipation component is connected to the second heat dissipation assembly through a first connecting pipe.

3. The foldable double-sided heat dissipation liquid cooling device for PCIe cards according to claim 2, characterized in that, The first heat dissipation component includes a first top plate and a first middle frame; the first middle frame is disposed above the PCIe unit, and a first flow channel for coolant flow is provided inside the first middle frame, and multiple sets of first diverter plates are provided inside the first flow channel; the first top plate is fixedly disposed above the first middle frame; a first connecting nozzle communicating with the first flow channel is provided on the first middle frame, and the first connecting nozzle is connected to a second connecting pipe; an inlet head and an outlet head communicating with the first flow channel are provided on the first middle frame.

4. The foldable double-sided heat dissipation liquid cooling device for PCIe cards according to claim 2, characterized in that, The second heat dissipation component includes a second top plate, a second middle frame, and a second bottom plate; the second middle frame is located above the PCIe unit, and a second flow channel for coolant flow is provided inside the second middle frame; the second bottom plate is located below the second middle frame, and a mounting cavity for mounting the second bottom plate is provided on the bottom surface of the second middle frame, and the mounting cavity is connected to the second flow channel; the second top plate is fixedly located above the second middle frame; the second middle frame is provided with a second connecting nozzle connected to the second flow channel, and the second connecting nozzle is connected to the second connecting pipe.

5. The foldable double-sided heat dissipation liquid cooling device for PCIe cards according to claim 4, characterized in that, The second base plate is provided with multiple sets of parallel heat dissipation teeth; the multiple sets of heat dissipation teeth form multiple sets of heat dissipation protrusions, and the heat dissipation protrusions are located in the mounting cavity.

6. The foldable double-sided heat dissipation liquid cooling device for PCIe cards according to claim 4 or 5, characterized in that, The second middle frame is provided with a locking frame for fixing; the four corners of the locking frame are provided with first locking screws that are fixedly connected to the second heat dissipation assembly, and an elastic element is provided between the first locking screws and the locking frame; The second middle frame has outwardly extending connecting bosses at both ends, and the connecting bosses are connected to the locking frame by a second locking screw.

7. The foldable double-sided heat dissipation liquid cooling device for PCIe cards according to claim 2, characterized in that, The third heat dissipation component includes a third top plate and a third middle frame; the third middle frame is located above the PCIe unit, and a third flow channel for coolant flow is provided inside the third middle frame; the third top plate is fixedly located above the third middle frame; the third middle frame is provided with a third connecting nozzle that communicates with the third flow channel, and the third connecting nozzle is connected to the second connecting pipe; the third top plate is provided with a fourth connecting nozzle that communicates with the first connecting pipe.

8. The foldable double-sided heat dissipation liquid cooling device for PCIe cards according to claim 1, characterized in that, The second heat dissipation component includes a heat-conducting plate and a third connecting pipe; the heat-conducting plate is located below the PCIe unit, and multiple sets of slots are provided between the heat-conducting plate and the PCIe unit; the third connecting pipe is located inside the heat-conducting plate on the side away from the PCIe unit, and the first and last ends of the third connecting pipe are respectively connected to the first connecting pipe.

9. The foldable double-sided heat dissipation liquid cooling device for PCIe cards according to claim 8, characterized in that, The third connecting pipe includes a liquid inlet, an arc section, and a liquid outlet; the liquid inlet and the liquid outlet are arranged side by side at one end of the heat-conducting plate, the arc section is located at the other end of the heat-conducting plate, and the liquid inlet, the arc section, and the liquid outlet are connected end to end in sequence.

10. The foldable double-sided heat dissipation liquid cooling device for PCIe cards according to claim 1, characterized in that, The first connecting pipe is a stainless steel corrugated pipe, which includes a first straight section, a corrugated section and a second straight section connected end to end in sequence; the corrugated section has multiple sets of corrugated segments connected end to end in sequence, and the multiple sets of corrugated segments form a flexible deformation structure; the first straight section is connected to the first heat dissipation component, and the second straight section is connected to the second heat dissipation component.

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