Antenna module

Abstract

The application discloses an antenna module, comprising an antenna substrate; the upper surface of the antenna substrate is provided with an antenna pattern and a recess structure; a first element and a connecting circuit are arranged in the recess structure; and the first element is electrically connected to the antenna pattern through the connecting circuit. The first element and the connecting circuit are arranged in the recess structure on the upper surface of the antenna substrate, and the first element is electrically connected to the antenna pattern on the antenna substrate through the connecting circuit, so that more electrical benefits or use space can be added to the antenna module product, and the problem of space waste of the recess structure is solved.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, specifically to an antenna module. Background Technology

[0002] Current antenna-in-package (AiP) products, such as those for 5G millimeter-wave antennas, have been miniaturized to near their limits. Improving performance necessitates increasing product size. However, current AiP products still suffer from space wastage. For example... Figure 1 The antenna module shown has electronic components 02 set on the radio frequency substrate 01 and encapsulated. Then, a stepped structure 04 is made on the back antenna substrate 03 using molding material to form the shape of the antenna transmission and focusing. However, there is still wasted space between the stepped structures 04. Utility Model Content

[0003] This application proposes an antenna module to reduce space waste and improve space utilization.

[0004] This application proposes an antenna module, including an antenna substrate; the upper surface of the antenna substrate has an antenna pattern and a recessed structure, and a first element and a connecting line are disposed in the recessed structure, wherein the first element is electrically connected to the antenna pattern through the connecting line.

[0005] In some alternative embodiments, the upper surface of the antenna substrate also has a stepped structure, with recessed structures formed between the stepped structures that are recessed downward relative to the stepped structures, and the connecting lines surrounding the stepped structures in a top view.

[0006] In some alternative embodiments, the upper surface of the antenna substrate is provided with a first cladding layer covering the antenna pattern and a second cladding layer covering the first element, the first cladding layer forming the stepped structure above the antenna pattern, and the second cladding layer surrounding the stepped structure in a top view.

[0007] In some alternative implementations, the first coating layer and the second coating layer are made of different materials.

[0008] In some alternative implementations, the first cladding layer, the second cladding layer, and at least one side of the antenna substrate are substantially flush.

[0009] In some alternative implementations, the upper surfaces of the first and second covering layers are substantially flush.

[0010] In some alternative embodiments, the second overlay includes a first portion disposed at the bottom of the recessed structure, the connection line being formed above the first portion, the first element being disposed above the connection line, and the second overlay also includes a second portion covering the first element and the connection line.

[0011] In some alternative embodiments, the connection lines are electrically connected to the antenna substrate via vias, and in turn, electrically connected to the antenna pattern.

[0012] In some alternative implementations, the first element is interconnected with each other in series and / or parallel via the connection lines.

[0013] In some alternative embodiments, the antenna module further includes a second element disposed below the antenna substrate, wherein the first element serves as an impedance matching circuit connecting the second element and the antenna pattern.

[0014] In some alternative embodiments, the antenna module further includes a radio frequency substrate located between the antenna substrate and the second element, the second element being covered by a third cladding layer on the lower surface of the radio frequency substrate.

[0015] In some alternative implementations, the second element overlaps with the first element in the vertical direction.

[0016] In some alternative implementations, the first element is a passive element, and the direction of the connection between the two terminals of the first element is substantially perpendicular to the direction of the long side extension of the antenna substrate.

[0017] In some alternative embodiments, the connection lines are formed by curing a conductive paste.

[0018] To address the problem of wasted space in the recessed areas between the stepped structures on an antenna module, this application discloses an antenna module. By setting a first element and connecting lines within the recessed structure on the upper surface of the antenna substrate, and electrically connecting the first element to the antenna pattern on the antenna substrate via the connecting lines, more electrical benefits (such as impedance matching) or space utilization (such as placing passive components originally configured on the RF substrate on the antenna substrate) can be added to the antenna module product, thus solving the problem of wasted space in the antenna module. Attached Figure Description

[0019] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0020] Figure 1-2 These are, respectively, a longitudinal cross-sectional structural diagram and a top view structural diagram of a current antenna module;

[0021] Figure 3-4 These are, respectively, a longitudinal cross-sectional structural diagram and a top view structural diagram of an embodiment 3a of the antenna module according to this application;

[0022] Figure 5-10 These are schematic diagrams illustrating the manufacturing steps of one embodiment of the antenna module of this application;

[0023] Figure 11-16 They are Figure 5-10 The corresponding top-view structural diagram.

[0024] Explanation of reference numerals / symbols in the attached diagram:

[0025] 01-RF substrate; 02-Electronic components; 03-Antenna substrate; 04-Stepped structure;

[0026] 100-Antenna substrate; 101-Antenna pattern; 102-Recessed structure; 103-First element; 104-Connection line; 105-Step structure; 106-First cladding layer; 107-Second cladding layer; 1071-First portion; 1072-Second portion; 108-Through hole; 109-Second element; 110-RF substrate; 111-Third cladding layer; 112-Third element;

[0027] f1 - First direction; f2 - Second direction.

[0028] ASE Confidential / Security-B Detailed Implementation

[0029] The specific embodiments of this application will be described below with reference to the accompanying drawings and examples. Those skilled in the art can easily understand the technical problems solved by this application and the resulting technical effects through the content described herein. It is understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not intended to limit the invention. Furthermore, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0030] It should be readily understood that the meanings of “on,” “above,” and “on top of” in this application should be interpreted in the broadest sense, such that “on” means not only “directly on something,” but also “on something” including intermediate components or layers existing between the two.

[0031] Furthermore, for ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” may be used herein to describe the relationship of one element or component to another element or component shown in the accompanying drawings. In addition to the orientations described in the figures, spatial relative terms are also intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90° or otherwise), and the spatial relative descriptive terms used herein may be interpreted accordingly.

[0032] As used herein, the term "layer" refers to a portion of material comprising a region of a certain thickness. A layer may extend over the entirety of an underlying or upper layer structure, or may have a extent smaller than that of the underlying or upper layer structure. Furthermore, a layer may be a region of a homogeneous or heterogeneous continuous structure, with a thickness less than that of the continuous structure. For example, a layer may be located between the top and bottom surfaces of a continuous structure, or between any pair of horizontal planes therebetween. A layer may extend horizontally, vertically, and / or along a tapered surface. A substrate may be a single layer, which may include one or more layers, and / or may have one or more layers on, above, and / or below it. A single layer may include multiple layers. For example, a semiconductor layer may include one or more doped or undoped semiconductor layers, and may have the same or different materials.

[0033] As used herein, the term "substrate" refers to the material on which subsequent material layers are added. The substrate itself may be patterned. The material added on top of the substrate may be patterned or may remain unpatterned. Furthermore, the substrate may comprise a wide variety of semiconductor materials, such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate may be made of a non-conductive material, such as glass, plastic, or sapphire wafers. Further alternatively, the substrate may have semiconductor devices or circuits formed therein.

[0034] It should be noted that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and to facilitate understanding and reading of the contents described in the specification. They are not intended to limit the scope of this application and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives of this application, should still fall within the scope of the technical content disclosed in this application. Furthermore, terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0035] It should also be noted that the longitudinal section corresponding to the embodiment of this application can be the section corresponding to the front view direction, the transverse section can be the section corresponding to the right view direction, and the horizontal section can be the section corresponding to the top view direction.

[0036] Furthermore, where there is no conflict, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0037] refer to Figure 3-4 , Figure 3-4 These are, respectively, a longitudinal cross-sectional structural diagram and a top view structural diagram of an embodiment 3a of the antenna module according to this application.

[0038] like Figure 3-4 As shown, the antenna module 3a of this application includes: an antenna substrate 100; the upper surface of the antenna substrate 100 has an antenna pattern 101 and a recessed structure 102, and a first element 103 and a connecting line 104 are disposed in the recessed structure 102. The first element 103 is electrically connected to the antenna pattern 101 through the connecting line 104. The upper surface of the antenna substrate 100 may also have a stepped structure 105, and the recessed structure 102 may be a recessed space formed between the stepped structures 105, recessed downwards relative to the stepped structures 105.

[0039] Here, in order to avoid wasting the space of the recessed structure 102 between the stepped structures 105, the first element 103 is set in the recessed structure 102 to realize the utilization of the recessed structure 102 and improve electrical efficiency.

[0040] Here, the first element 103 can be a passive element, including but not limited to resistors, inductors, capacitors, etc.

[0041] In some alternative implementations, such as Figure 4 As shown, in a top-down view, each step structure 105 is independent of the others, while the recessed structures 102 between them are interconnected.

[0042] In some alternative implementations, such as Figure 4 As shown, in a top view, the connecting line 104 surrounds the stepped structure 105 to make full use of the space resources within the recessed structure 102.

[0043] In some alternative implementations, such as Figure 3As shown, a first cladding layer 106 covering the antenna pattern 101 is provided on the upper surface of the antenna substrate 100. The first cladding layer 106 forms a stepped structure 105 above the antenna pattern 101. Optionally, the first cladding layer 106 may only include the first portion forming the stepped structure 105, or the first cladding layer 106 may also include a second portion covering the bottom of the recessed structure 102, the second portion being much thinner than the stepped structure 105. In the manufacturing process, while forming the stepped structure 105 by forming the first cladding layer 106 above the antenna pattern 101, a portion of the first cladding layer 106 is often formed at the bottom of the recessed structure 102 between the stepped structures 105, a situation that is difficult to avoid.

[0044] In some alternative embodiments, a second cladding layer 107 is further provided on the upper surface of the antenna substrate 100. The second cladding layer 107 fills the recessed structure 102, covers the first element 103, and covers the connecting line 104.

[0045] In some alternative implementations, such as Figure 4 As shown, in a top view, the second covering layer 107 surrounds the stepped structure 105.

[0046] In some alternative embodiments, the first covering layer 106 and the second covering layer 107 may be made of the same material or different materials.

[0047] Optionally, the first covering layer 106 can be formed from various molding compounds. Exemplary molding compounds may include epoxy resin, filler, catalyst, pigment, release agent, flame retardant, coupling agent, hardener, low stress absorber, adhesion promoter, ion trapping agent, etc. In some alternative embodiments, the first covering layer 106 may be EMC (epoxy molding compound).

[0048] Optionally, the second covering layer 107 can be formed of a dielectric material, molding material, silicone material, etc. For example, the second covering layer 107 can be made of silicone material. Silicone material is easy to manufacture and has a certain degree of elasticity / flexibility, which can provide shock and vibration protection.

[0049] In some alternative implementations, such as Figure 3 As shown, the first cladding layer 106 and the second cladding layer 107, as well as at least one side of the antenna substrate 100, are substantially flush.

[0050] In some alternative implementations, such as Figure 3 As shown, the upper surfaces of the first coating layer 106 and the second coating layer 107 are substantially flush.

[0051] In some alternative embodiments, due to process considerations, the second covering layer 107 is formed in two stages, thus it can be divided into a first portion 1071 and a second portion 1072. The first portion 1071 is located at the bottom of the recessed structure 102, while the connecting line 104 is formed above the first portion 1071, and the first element 103 is located above the connecting line 104. The second portion 1072 then covers the first element 103 and the connecting line 104. Here, the materials of the first portion 1071 and the second portion 1072 can be the same or different.

[0052] In some optional embodiments, the antenna module 3a of this application further includes a via 108, through which the connection line 104 can be electrically connected to the internal circuitry of the antenna substrate 100, and then electrically connected to the antenna pattern 101 via the internal circuitry. Here, the via 108 can penetrate the first portion 1071 of the second cladding layer 107 and the second portion of the first cladding layer 106 located at the bottom of the recessed structure 102.

[0053] In some alternative implementations, such as Figure 4 As shown, multiple first elements 103 can be interconnected in series and / or parallel via connecting lines 104 to achieve better electrical efficiency.

[0054] In some alternative implementations, such as Figure 3 As shown, the antenna module 3a of this application also includes a second element 109 disposed below the antenna substrate 100. Exemplarily, the second element 109 may be an active element, such as a radio frequency chip. Here, the first element 103 may serve as an impedance matching circuit for the connection (connection line) between the second element 109 and the antenna pattern 101.

[0055] In some alternative implementations, such as Figure 3 As shown, the antenna module 3a of this application also includes a radio frequency substrate 110 located between the antenna substrate 100 and the second element 109. The second element 109 can be electrically connected below the radio frequency substrate 110, while the antenna substrate 100 can be electrically connected above the radio frequency substrate 110.

[0056] In some alternative implementations, such as Figure 3As shown, the antenna module 3a of this application further includes a third cladding layer 111 disposed below the radio frequency substrate 110, and the second element 109 can be covered by the third cladding layer 111 on the lower surface of the radio frequency substrate 110. Here, the material of the third cladding layer 111 can be the same as or different from the material of the first cladding layer 106 and the second cladding layer 107. For example, the third cladding layer 111 can be formed of various molding materials.

[0057] In some alternative implementations, such as Figure 3 As shown, the antenna module 3a of this application also includes a third element 112 disposed below the radio frequency substrate 110 and covered by a third cladding layer. The third element 112 can be a passive element, such as a resistor, capacitor, inductor, etc.

[0058] In some alternative implementations, such as Figure 3 As shown, the second element 109 overlaps with the first element 103 in the vertical direction. That is, the projection of the first element 103 in the vertical direction overlaps with the projection of the second element 109 in the vertical direction (they may overlap completely or partially).

[0059] In some alternative implementations, such as Figure 4 As shown, the connection direction of the two terminals of the first element 103 as a passive element (e.g.) Figure 4 The first direction f1 shown is different from the long side extension direction of the antenna substrate 100 (e.g., the direction of the antenna substrate 100). Figure 4 The second direction f2 shown is substantially perpendicular.

[0060] In some alternative embodiments, the connection lines 104 in this application are formed by curing conductive paste. In terms of manufacturing process, the connection lines 104 can be formed by directly printing and curing conductive paste. Conductive pastes include, but are not limited to, copper conductive ink or other types of conductive ink. For example, inkjet printing can be used to form the desired connection lines 104 from copper conductive ink.

[0061] One technical challenge of this application is that, if components are to be placed within the recessed structure 102 formed by the first cladding layer 106, conventional techniques require metal plating followed by etching to connect the first component 103. However, this conventional technique carries the following risks: ① The etching process risks etching away the first cladding layer 106; ② The metal plating process risks plating the radio frequency substrate 110, causing an electrical short circuit; ③ This conventional technique is also relatively expensive. Therefore, this application uses a conductive paste printing method to directly form the connection lines 104, thereby overcoming the aforementioned risks.

[0062] In some optional embodiments, both the antenna substrate 100 and the radio frequency substrate 110 in this application can be substrates composed of conductive and dielectric materials. Here, the dielectric material can include organic and / or inorganic materials, wherein organic materials can be, for example, polyamide (PA), polyimide (PI), epoxy resin, poly-p-phenylene benzobisoxazole (PBO) fiber, FR-4 epoxy glass cloth laminate, PP (PrePreg, also known as prepreg or semi-cured resin, semi-cured sheet), ABF (Ajinomoto Build-up Film), etc., while inorganic materials can be, for example, silicon (Si), glass, ceramic, silicon oxide, silicon nitride, tantalum oxide, etc. The conductive material can include a seed layer and a metal layer. Here, the seed layer can be, for example, titanium (Ti), tungsten (W), nickel (Ni), etc., while the metal layer can be, for example, gold (Au), silver (Ag), aluminum (Al), nickel (Ni), palladium (Pd), copper (Cu), or alloys thereof. The conductive materials in the antenna substrate 100 and the radio frequency substrate 110 can be the same or different, and the dielectric materials can also be the same or different.

[0063] In some alternative implementations, the antenna module 3a of this application includes:

[0064] The height of the stepped structure 105 (i.e., the first part of the first covering layer 106) (relative to the height of the recessed structure 102) can be between 0.2 and 0.5 mm, for example, 0.35 mm; while the thickness of the second part of the first covering layer 106 can be between 0.1 mm and 0.2 mm, for example, 0.15 mm.

[0065] The width of the step structure 105 can be between 2mm and 3mm, for example, it can be 2.4mm;

[0066] The width of the recessed structure 102 can be between 2mm and 3mm, for example, it can be 2.4mm;

[0067] The width of the stepped structure 105 from the edge of the antenna substrate 100 can be between 0.5mm and 1mm, for example, it can be 0.63mm;

[0068] The combined thickness of the antenna substrate 100 and the radio frequency substrate 110 can be between 1 mm and 2 mm, for example, 1.3 mm.

[0069] The present application proposes an antenna module. This antenna module can be an antenna in package (AiP) integrated with a system-in-package (SiP). This application develops a recessed space placement technology. By placing a first element 103 and a connecting line 104 within a recessed structure 102 on the upper surface of the antenna substrate 100, and electrically connecting the first element 103 to the antenna pattern 101 on the antenna substrate 100 via the connecting line 104, more electrical benefits (e.g., impedance matching) or space utilization (e.g., placing passive components originally configured on the RF substrate on the antenna substrate) can be achieved in the antenna module product, solving the problem of wasted space in the recessed structure 102. Furthermore, the second cladding layer 107 filling the recessed structure 102 of the antenna module can be made of an elastic, flexible material, thereby providing better protection for the product.

[0070] Furthermore, this application can remove a portion of the material above the antenna substrate using a laser drill, and then form the connection lines 104 and vias 108 using a circuit printing process. This allows the connection lines 104 to directly connect to the internal circuitry of the antenna substrate through the vias 108, enabling the wiring of the RF substrate 110 to be used on the antenna substrate 100. This allows passive components on the RF substrate 110 to be transferred to the recessed structure 102 above the antenna substrate 100. In this way, this application can obtain more placement space, allowing for the placement of more passive components than a typical AiP structure, thereby improving electrical efficiency. In addition, by providing a second cladding layer 107, this application can print the connection lines 104 on the first cladding layer 106 of any shape, thereby embedding components within the recessed structure 102. For example, this application can accommodate at least 72 more 0201 type capacitor components, increasing the component count by 146% compared to the original product.

[0071] It is worth noting that the technical solution of this application can be applied to all packaged products with stepped structures formed by molding, including but not limited to antenna modules. This solution can increase the electrical benefits, usable space, and protection performance of packaged products.

[0072] Next, refer to Figure 5-16 ,in, Figure 5-10 These are schematic diagrams illustrating the manufacturing steps of one embodiment of the antenna module of this application; Figure 11-16 They are Figure 5-10 The corresponding top-view structural diagram.

[0073] Step S1: Reference Figure 5 and Figure 11The present invention provides a semi-finished structure of an antenna module, which includes an antenna substrate 100 (located above) and an RF substrate 110 (located below) that have been bonded together. In this step, a molding process is completed on the upper surface of the antenna substrate 100 to form a first cladding layer 106. The first cladding layer 106 includes a first portion formed above the antenna pattern 101 on the upper surface of the antenna substrate 100 and a second portion outside the first portion. The first portion is higher than the second portion to form a stepped structure 105, and the second portion is located at the bottom of the recessed structure 102 formed between the stepped structures 105.

[0074] Step S2: Reference Figure 6 and Figure 12 For example, using a dispensing process, the structure encapsulated in step S1 is placed in the dispensing machine for the first dispensing, so that the silicone is evenly distributed in the recessed structure 102 between each step structure 105. After forming a certain thickness of silicone at the bottom of the recessed structure 102, it is dried to serve as the first part 1071 of the second coating layer 107.

[0075] Step S3: Reference Figure 7 and Figure 13 For example, a laser drilling process is used to form a hole at the bottom of the recessed structure 102 that penetrates downward through the first part 1071 of the second cladding layer 107 and the second part of the first cladding layer 106 to reach the connection pad on the antenna substrate 100, so as to serve as a via 108.

[0076] Step S4: Reference Figure 8 and Figure 14 For example, a circuit printing process can be used to directly print conductive paste on the bottom of the recessed structure 102. The conductive paste can fill the drilled holes to form the through holes 108 and can form the connecting lines 104. The connecting lines 104 can be used as connecting pads for subsequent setting of passive components.

[0077] Step S5: Reference Figure 9 and Figure 15 For example, using SMT (Surface Mount Technology) process to place components, the first component 103 is electrically connected to the connection line 104. The first component 103 can be a passive component, such as a capacitor, resistor or inductor.

[0078] Step S6: Reference Figure 10 and Figure 16 For example, a dispensing process can be used to apply a second layer of adhesive, filling the recessed structure 102 with silicone as the second portion 1072 of the second covering layer 107. This second portion 1072 covers the first component 103 and the connecting line 104. Here, the second covering layer 107 can completely fill the recessed structure 102 and be flush with the upper surface of the stepped structure 105.

[0079] Although this application has been described and illustrated with reference to specific embodiments thereof, such description and illustration are not limiting of this application. It will be readily understood by those skilled in the art that various changes can be made and equivalent elements can be substituted within embodiments without departing from the true spirit and scope of this application as defined by the appended claims. Illustrations may not be drawn to scale. Differences may exist between the technical representation in this application and actual implementation due to variables in the manufacturing process, etc. Other embodiments of this application may exist that are not specifically described. The description and illustrations should be considered illustrative rather than restrictive. Modifications can be made to adapt particular circumstances, materials, composition, methods, or processes to the objectives, spirit, and scope of this application. All such modifications fall within the scope of the appended claims. While the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations can be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this application. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit this application.

Claims

1. An antenna module, characterized in that, Including antenna substrate; The upper surface of the antenna substrate has an antenna pattern and a recessed structure. A first element and a connecting line are disposed in the recessed structure. The first element is electrically connected to the antenna pattern through the connecting line.

2. The antenna module according to claim 1, characterized in that, The upper surface of the antenna substrate also has a stepped structure, and a recessed structure is formed between the stepped structures that is recessed downward relative to the stepped structure. In a top view, the connecting lines surround the stepped structure.

3. The antenna module according to claim 2, characterized in that, The antenna substrate has a first cladding layer covering the antenna pattern and a second cladding layer covering the first element on its upper surface. The first cladding layer forms a stepped structure above the antenna pattern, and the second cladding layer surrounds the stepped structure in a top view.

4. The antenna module according to claim 3, characterized in that, The first coating layer and the second coating layer are made of different materials.

5. The antenna module according to claim 3, characterized in that, The first cladding layer, the second cladding layer, and at least one side of the antenna substrate are substantially flush.

6. The antenna module according to claim 3, characterized in that, The second covering layer includes a first portion disposed at the bottom of the recessed structure, the connecting line being formed above the first portion, the first element being disposed above the connecting line, and the second covering layer further includes a second portion covering the first element and the connecting line.

7. The antenna module according to claim 1, characterized in that, The first element is interconnected with each other in series and / or parallel via the connection line.

8. The antenna module according to claim 1, characterized in that, It also includes a second element disposed below the antenna substrate, wherein the first element serves as an impedance matching circuit for the connection between the second element and the antenna pattern.

9. The antenna module according to claim 8, characterized in that, It also includes a radio frequency substrate located between the antenna substrate and the second element, wherein the second element is covered by a third cladding layer on the lower surface of the radio frequency substrate.

10. The antenna module according to claim 1, characterized in that, The first element is a passive element, and the direction of the connection between the two terminals of the first element is substantially perpendicular to the extension direction of the long side of the antenna substrate.

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