An electronic device

Abstract

The embodiment of the present application provides an electronic device, comprising: a frame body, the frame body comprising a side frame and a bottom plate connected to the side frame, the side frame and the bottom plate enclosing a containing cavity, and a first supporting portion being arranged at the connection of the side frame and the bottom plate; a screen assembly, the screen assembly being arranged in the containing cavity, the screen assembly being provided with a second supporting portion at a position opposite to the first supporting portion; and an adhesive layer, the adhesive layer being connected between the first supporting portion and the second supporting portion to connect and seal the screen assembly and the frame body. In the embodiment of the present application, the frame body is connected and sealed with the second supporting portion of the display module through the first supporting portion, and the adhesive layer is no longer needed between the bottom plate of the frame body and the display module, thereby saving the space occupied by the adhesive layer between the display module and the bottom plate of the frame body, reducing the thickness of the electronic device, and further improving the use experience of the electronic device.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, and specifically relates to an electronic device. Background Technology

[0002] With the development of electronic device technology, consumers' demands for the visual experience of electronic devices are constantly increasing. In order to enhance the user's visual experience, electronic devices are showing a trend of increasing screen-to-body ratio and reducing screen bezel size.

[0003] In related technologies, injection molding the edges of the display module can effectively reduce the size of the screen bezel. However, this method requires an adhesive layer between the display module and the base plate to ensure the protection of the electronic device, which increases the thickness of the device and, to some extent, limits further optimization of the user experience. Utility Model Content

[0004] This application aims to provide an electronic device that solves the problem of increased thickness caused by screen bezel optimization.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] This application discloses an electronic device, the electronic device comprising:

[0007] A frame, the frame including a side frame and a base plate connected to the side frame, the side frame and the base plate forming a receiving cavity, and a first support part provided at the connection between the side frame and the base plate;

[0008] A screen assembly is disposed within the receiving cavity, and the screen assembly has a second support portion disposed at a position opposite to the first support portion;

[0009] And an adhesive layer, which is connected between the first support portion and the second support portion, to connect and seal the screen assembly to the frame.

[0010] In this embodiment, the frame includes interconnected side frames and a bottom plate. Since a first support portion is provided at the connection between the side frames and the bottom plate, and a second support portion is provided at the position opposite to the first support portion of the display module, under the above structure, the adhesive layer can be provided between the first support portion and the second support portion in this application, thereby realizing the connection and sealing between the display module and the frame. In this way, the frame is connected and sealed to the second support portion of the display module through the first support portion, and no adhesive layer is needed between the bottom plate of the frame and the display module, thereby saving the space occupied by the adhesive layer between the display module and the bottom plate of the frame, reducing the thickness of the electronic device, and further improving the user experience of the electronic device.

[0011] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0012] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0013] Figure 1 It is a partial cross-sectional view of an electronic device in the related art;

[0014] Figure 2 This is a partial cross-sectional view of another electronic device in the related technology;

[0015] Figure 3 This is a schematic diagram of the stacked structure of the display module in an embodiment of this application;

[0016] Figure 4 This is a partial cross-sectional view of the electronic device in the embodiments of this application;

[0017] Figure 5 This is a schematic diagram of the black border of the screen of the electronic device in the embodiments of this application.

[0018] Reference numerals: 10 - frame, 11 - side frame, 12 - base plate, 13 - receiving cavity, 101 - first support part, 1011 - first surface, 20 - screen assembly, 201 - second support part, 2011 - second surface, 21 - display module, 211 - display panel, 212 - first structural layer, 2121 - reinforcing layer, 2122 - first connecting layer, 2123 - buffer layer, 2124 - protective layer, 2125 - shielding layer, 213 - second structural layer, 2131 - polarizer, 2132 - optical adhesive layer, 22 - protective layer, 23 - cover plate, 30 - adhesive layer. Detailed Implementation

[0019] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0020] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0021] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0022] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0023] In related technologies, the width of the adhesive layer between the screen cover and the frame affects the size of the screen bezel. To reduce the width of this adhesive layer, the screen sides can be injection molded to protect and support the screen. Simultaneously, the gap between the screen sides and the frame can be reduced, thus decreasing the screen bezel. However, this optimization design makes it difficult to simultaneously consider the thickness of the electronic device, which to some extent restricts further improvements in electronic device performance and user experience.

[0024] In today's digital age, electronic devices have become indispensable tools in people's daily lives, work, and entertainment, with smartphones, tablets, smartwatches, and other electronic devices being widely adopted. As consumers' demands for visual experience continue to rise, and with the rapid development of display technology, the screen-to-body ratio of electronic devices has gradually become one of the key indicators for measuring their performance and quality. Increasing the screen-to-body ratio can bring users a more immersive visual experience, thereby significantly improving the user experience of electronic devices.

[0025] Among them, the black border of the screen is the non-display area between the edge of the screen and the device frame, and its width directly affects the visual effect and screen ratio of electronic devices.

[0026] Reference Figure 1 The diagram shows a partial structural schematic of an electronic device in the related art, such as... Figure 1 As shown, the width W of the black border of an electronic device screen consists of three parts: the width of the adhesive layer W4, the gap width W3 between the display panel and the frame, and the width W2 of the black border of the display panel. In this structure of the electronic device, the width W of the black border is relatively large. A feasible solution to reduce the width W is to reduce the gap width W3 between the display panel and the frame. However, reducing the gap W3 decreases the distance between the side of the display module and the frame, which greatly increases the probability of damage to the screen assembly.

[0027] In related technologies, to reduce screen bezels and improve the reliability of screen components, Lipo (Low-Injection Pressure Overmolding) technology has been developed. In this approach, the edges of the display module within the screen assembly are injection molded, and this protective layer serves to protect, support, and waterproof the display module. For example... Figure 2 As shown, the width W of the screen black border in this solution is composed of the distance W1 between the display panel and the cover plate, and the width W2 of the display panel black border. Compared to Figure 1 The proposed solution saves the adhesive layer width W4, effectively reducing the size of the black border on the screen.

[0028] However, in Figure 2 In the illustrated solution, the waterproofing of the electronic device relies on the adhesive layer between the protective layer and the base plate of the frame. Therefore, the thickness of this adhesive layer increases the overall thickness of the electronic device, making the overall thickness of the electronic device more than... Figure 1 The thicker design in the previous version makes it impossible to balance the size of the screen bezel with the thickness of the electronic device, which to some extent restricts further optimization of the user experience.

[0029] Based on the above problems, embodiments of this application provide an electronic device, such as... Figure 4 and Figure 5As shown, the electronic device provided in this application embodiment may specifically include: a frame 10, a screen assembly 20, and an adhesive layer 30; wherein, the frame 10 includes a side frame 11 and a base plate 12 connected to the side frame 11, the side frame 11 and the base plate 12 enclose a receiving cavity 13, and a first support portion 101 is provided at the connection between the side frame 11 and the base plate 12; the screen assembly 20 is disposed in the receiving cavity 13 formed by the frame 10, and a second support portion 201 is provided on the screen assembly 20 at a position opposite to the first support portion 101; the adhesive layer 30 is connected between the first support portion 101 and the second support portion 201 to connect and seal the screen assembly 20 to the frame 10.

[0030] Specifically, the frame 10 serves as the external protective structure of the electronic device, including a side frame 11 and a base plate 12. The side frame 11 is a continuous structure extending circumferentially along the electronic device and has a certain thickness. The base plate 12 is generally a planar structure, connected to one side of the side frame 11 along the thickness direction of the electronic device, and together with the side frame 11, forms a receiving cavity 13. This receiving cavity 13 can be used to arrange internal structures such as circuit boards, batteries, camera modules, and speaker modules. The base plate 12 serves as the rear structure of the electronic device, supporting the aforementioned internal structures such as circuit boards, batteries, camera modules, and speaker modules. The side of the side frame 11 facing away from the base plate 12 along the thickness direction of the electronic device is used to install the display cover 23 to form the front of the electronic device. In this embodiment, the side frame 11 intersects with the base plate 12, and a first support portion 101 is also provided at the intersection of the side frame 11 and the base plate 12. The first support portion 101 is a support structure protruding into the receiving cavity 13 from the inner walls of the side frame 11 and the base plate 12.

[0031] The screen assembly 20 is the core component for interaction between the electronic device and the user, serving to display information, provide touch interaction, and protect the internal structure. In this embodiment, the screen assembly 20 is at least partially disposed within the receiving cavity 13 formed by the frame 10. The screen assembly 20 has side surfaces and a bottom surface arranged at an angle, wherein the side surfaces are opposite to the side frame 11 in the length and / or width direction of the electronic device, and the bottom surface is opposite to the base plate 12 in the thickness direction of the electronic device. It should be noted that in this embodiment, the length direction of the electronic device is... Figure 4 , Figure 5 The direction indicated by the middle arrows X / Y represents the thickness direction of the electronic device. Figure 4 , Figure 5 The direction indicated by arrow Z. The screen assembly 20 is further provided with a second support portion 201 between the side and the bottom surface. The second support portion 201 is at least partially opposite to the first support portion 101. A gap is formed between the first support portion 101 and the second support portion 201, which can be used to accommodate the adhesive layer 30.

[0032] In this embodiment of the application, the adhesive layer 30 is formed by filling the gap between the first support portion 101 and the second support portion 201 with a certain fluidity of colloid and then curing it. In practical applications, the adhesive layer 30 may include, but is not limited to, one or more of epoxy resin adhesive, polyurethane adhesive, hot melt adhesive, and UV curable adhesive.

[0033] In this embodiment, the frame 10 includes a side frame 11 and a bottom plate 12 connected to each other. Since a first support part 101 is provided at the connection between the side frame 11 and the bottom plate 12, and a second support part 201 is provided at the position opposite to the first support part 101 of the display module 21, under the above structure, the adhesive layer 30 can be provided between the first support part 101 and the second support part 201 in this application, so as to realize the connection and sealing between the display module 21 and the frame 10. In this way, the frame 10 is connected and sealed to the second support part 201 of the display module 21 through the first support part 101. The adhesive layer 30 is no longer needed between the bottom plate 12 of the frame 10 and the display module 21, thereby saving the space occupied by the adhesive layer 30 between the display module 21 and the bottom plate 12 of the frame 10, reducing the thickness of the electronic device, and further improving the user experience of the electronic device.

[0034] It should be noted that the design of the first support 101 also optimizes the structure of the frame 10, reducing stress concentration in the frame 10. Specifically, Figure 2 The perpendicular structure of the side frame 11 and the base plate 12 causes severe stress concentration at the connection between the side frame 11 and the base plate 12 in the frame 10. However, in this embodiment, by setting a first support part 101, which is inclined to the side frame 11 and the base plate 12, there is a smoother angle transition between the first support part 101 and the frame 10, and between the first support part 101 and the base plate 12. The stress is more dispersed, thereby improving the structural stability of the frame 10 and extending its service life.

[0035] Optionally, the first support portion 101 has a first surface 1011 facing the second support portion 201, and the second support portion 201 has a second surface 2011 facing the first support portion 101. The first surface 1011 and the second surface 2011 are arranged in parallel, thereby improving the uniformity of the thickness of the adhesive layer 30 between the first support portion 101 and the second support portion 201, and ensuring the stability and reliability of the connection between the screen assembly 20 and the frame 10. In addition, the parallel arrangement of the first surface 1011 and the second surface 2011 enables the adhesive layer 30 to form a continuous sealing layer, which significantly improves the protection effect of electronic devices against external impurities such as dust and moisture.

[0036] Specifically, such as Figure 4As shown, the first surface 1011 is set at an angle to the side frame 11 and the bottom plate 12 of the frame 10. The second surface 2011 is set at intervals and is parallel to the first surface 1011. A uniform interval is formed between the first surface 1011 and the second surface 2011.

[0037] Optionally, both the first surface 1011 and the second surface 2011 are planar, thus ensuring the bonding effect of the adhesive layer 30 between the first surface 1011 and the second surface 2011.

[0038] It should be noted that, under normal circumstances, the adhesive layer 30 is formed by filling the gap between the first surface 1011 and the second surface 2011 with a certain fluidity of the colloid and then curing it. When both the first surface 1011 and the second surface 2011 are flat, the flow rate of the aforementioned fluid colloid can be more uniform during the process of filling the gap between the first surface 1011 and the second surface 2011. The amount of colloid filled between different positions of the first surface 1011 and the second surface 2011 can also be more uniform, thereby enhancing the bonding strength and bonding effect between the first surface 1011 and the second surface 2011, and ensuring the connection reliability and sealing performance between the frame 10 and the display module 21.

[0039] Optionally, the first surface 1011 and the second surface 2011 have a first preset angle α with the base plate 12, and the first preset angle α satisfies: 30°≤α≤60°. By limiting the range of the first preset angle α, on the one hand, a reasonable angle setting allows the adhesive layer 30 to fill the space between the first surface 1011 and the second surface 2011 more completely before curing, which helps the adhesive layer 30 to adhere more tightly between the first support portion 101 and the second support portion 201, forming a more effective sealing layer; on the other hand, by adjusting the first preset angle α, the internal space utilization of the electronic device can be optimized while ensuring structural strength.

[0040] Specifically, such as Figure 5As shown, the plane containing the base plate 12 is the XY plane. Both the first surface 1011 and the second surface 2011 are set at an angle to the plane containing the base plate 12, and this angle is a first preset angle α. It should be understood that since the adhesive layer 30 is formed by filling the space between the first surface 1011 and the second surface 2011 with a fluid colloid and then curing it, when the angle of the first preset angle α is too large, the colloid flows faster. Before the colloid has filled the space between the first surface 1011 and the second surface 2011, it may have already flowed to the base plate 12 of the frame 10. After the adhesive layer 30 is cured, the structural continuity of the adhesive layer 30 decreases, which adversely affects the sealing effect between the frame 10 and the screen assembly 20. When the first preset included angle α is too small, although it can provide better structural support for the screen component 20, it will also occupy more space on the base plate 12. In this case, the end of the first support part 101 away from the side frame 11 will also compress the size of the display module 21 in the XY plane, thereby affecting the structure and performance of the display module 21.

[0041] Optionally, along the direction perpendicular to the second surface 2011, the thickness of the second support portion 201 is a first thickness H1, satisfying: 0.2≤H1≤0.3mm.

[0042] It should be noted that, in cases such as Figure 5 In the partial structural schematic diagram of the electronic device shown, the display module 21 includes a display panel 211 and a plurality of first structural layers 212 stacked sequentially along the thickness direction of the electronic device. The edges of the display panel 211 and the plurality of first structural layers 212 are all straight. Under this structure, when the display panel 211 and the plurality of first structural layers 212 are stacked, a stepped structure will be formed between their edges, which makes it impossible for the thickness of the second support portion 201 to be consistent. In this embodiment, the first thickness is the thickness between the plane formed by the line connecting the bottom edges of the plurality of first structural layers 212 and the second surface 2011 of the second support portion 201.

[0043] In this embodiment, by controlling the thickness H1 of the second support portion 201 within the range of 0.2-0.3 mm, it can be ensured that the second support portion 201 has sufficient structural strength to withstand the weight of the screen assembly 20 and possible external impacts. Furthermore, under the above structure, while ensuring structural strength, controlling the thickness of the second support portion 201 within a reasonable range helps to optimize the space utilization inside the electronic device.

[0044] Optionally, the first support 101 is integrally formed with the side frame 11 and / or the base plate 12.

[0045] Specifically, in some optional embodiments, the first support portion 101 and the side frame 11 are integrally formed; in other optional embodiments, the first support portion 101 and the base plate 12 are integrally formed; and in still other optional embodiments, the first support portion 101, the side frame 11, and the base plate 12 are all integrally formed. It is understood that by designing the first support portion 101 and the side frame 11 or the base plate 12 as an integrally formed structure, or by designing the first support portion 101, the side frame 11, and the base plate 12 as an integrally formed structure, the number of components in the electronic device's frame 10 can be reduced, thereby simplifying the structure of the electronic device's frame 10. This not only simplifies the assembly process but also helps improve the overall integrity of the electronic device's frame 10. The side frame 11 and the base plate 12 can both be made of metal, alloy, or plastic, and the materials of the first support portion 101, the side frame 11, and the base plate 12 can be the same or different. For example, the first support portion 101, the side frame 11, and the base plate 12 are integrally formed. The side frame 11 and the base plate 12 are made of the same material. When the first support portion 101, the side frame 11, and the base plate 12 are all made of the same material, the frame 10 can be formed by a one-time molding process. When the first support portion 101, the side frame 11, and the base plate 12 are made of different materials, the side frame 11 and the base plate 12 can be integrally formed by one-time molding, and then the integral formed by the first support portion 101, the side frame 11, and the base plate 12 can be joined by a secondary injection molding process. This application does not specifically limit the integral molding process of the first support portion 101, the side frame 11, and the base plate 12.

[0046] In this embodiment, the thickness of the adhesive layer 30 is H2, satisfying: 0.3 ≤ H2 ≤ 0.4 mm. By rationally designing the thickness of the adhesive layer 30, sufficient adhesive thickness and adhesive force can be ensured, thereby firmly bonding the screen assembly 20 to the frame 10 and preventing the screen assembly 20 from loosening or falling off due to external forces. Furthermore, a reasonable thickness of the adhesive layer 30 helps to form a continuous sealing layer between the first support portion 101 and the second support portion 201, effectively preventing dust, moisture, and other impurities from entering the electronic device from the outside, protecting sensitive components inside the electronic device from damage, and improving the reliability and stability of the device.

[0047] Specifically, such as Figure 5As shown, the distance between the first surface 1011 of the first support portion 101 and the second surface 2011 of the second support portion 201 is the thickness of the adhesive layer 30. The thickness of the adhesive layer 30 can be the same or different at different positions between the first surface 1011 and the second surface 2011. When the first surface 1011 and the second surface 2011 are arranged parallel to each other, and the adhesive layer 30 completely fills the gap between the first surface 1011 and the second surface 2011, the thickness of the adhesive layer 30 is evenly distributed between the first surface 1011 and the second surface 2011. This improves the uniformity of the connection strength between the first support portion 101 and the second support portion 201. It should be noted that due to the influence of processing technology and assembly errors, the distance between the first surface 1011 and the second surface 2011 may not be the same, but the minimum thickness of the adhesive layer 30 needs to be controlled to ensure the effective connection between the first support portion 101 and the second support portion 201. Furthermore, when the thickness of the adhesive layer 30 is too large, that is, when the gap between the first surface 1011 and the second surface 2011 is too large, it will not only increase the material cost and cause unnecessary material waste, but also increase the curing time of the colloid, resulting in a decrease in production efficiency.

[0048] Optionally, the screen assembly 20 includes a display module 21 and a protective layer 22. The display module 21 has a side opposite to the side frame 11, and the protective layer 22 covers at least the side of the display module 21. A second support portion 201 is disposed on the protective layer 22.

[0049] Specifically, the display module 21 is the core structure of the screen assembly 20, mainly used for displaying images and text. For example... Figure 4 As shown, the display module 21 may include a display panel 211 and multiple structural layers stacked with the display panel 211 along the thickness direction of the electronic device. The display panel 211 and the multiple structural layers work together to realize functions such as information display and touch sensing. The protective layer 22, as a covering structure on the outside of the display module 21, covers at least the sides of the display module 21 to protect, support, waterproof, and dustproof the edges of the layers in the display module 21, thereby improving the integrity and structural strength of the display module 21 and ensuring its service life. In practical applications, the protective layer 22 is an injection-molded layer integrally injection molded with the display module 21.

[0050] In this embodiment, by placing the second support portion 201 on the protective layer 22 instead of directly on the display module 21, direct damage to the display module 21 can be avoided during the molding process of the adhesive layer 30. Simultaneously, the protective layer 22 typically has a smoother surface, resulting in better adhesive performance and ensuring a secure connection between the adhesive layer 30 and the screen assembly 20.

[0051] Optionally, the display module 21 includes a display panel 211 stacked along the thickness direction of the electronic device and a plurality of first structural layers 212. The plurality of first structural layers 212 are disposed on the side of the display panel 211 near the base plate 12. In the direction from the display panel 211 to the base plate 12, the edges of the plurality of first structural layers 212 are successively recessed inward relative to the edge of the display panel 211 in a direction away from the side frame 11, so that the side of the display module 21 is inclined to the base plate 12.

[0052] Specifically, such as Figure 4 As shown, along the thickness direction of the electronic device, multiple first structural layers 212 are disposed on the side of the display panel 211 near the base plate 12. Specifically, along the thickness direction of the electronic device from the display panel 211 towards the base plate 12, the edges of the multiple first structural layers 212 successively taper inward, meaning the distance between the edges of the multiple first structural layers 212 and the side frame 11 successively increases, ultimately causing the side of the display module 21 to tilt towards the base plate 12, as shown. Figure 5 As shown, the lines connecting the edges of the multiple first structural layers 212 form an angle with the base plate 12. This beveled layered structure design of the display module 21 provides clearance for the placement of the first support portion 101 and also allows for a more uniform thickness of the protective layer 22 covering the sides of the display module 21. More importantly, with this beveled layered structure design, the display panel 211 in the display module 21 that is away from the base plate 12 can be designed to be larger in the XY plane, that is, the edge of the display panel 211 can be extended towards the side frame 11, such as... Figure 5 As shown, with the width W2 of the non-display area of ​​the display panel 211 fixed, the distance W1 between the edge of the display panel 211 and the cover plate 23 can be reduced, thereby reducing the width W of the black border of the screen, further optimizing the black border of the screen, increasing the screen ratio of the electronic device, and further improving the user experience.

[0053] Furthermore, the display module 21 also includes multiple second structural layers 213, such as Figures 3 to 5 As shown, along the thickness direction of the electronic device, a plurality of second structural layers 213 are disposed on the side of the display panel 211 away from the base plate 12. The plurality of second structural layers 213, the display panel 211 and the plurality of first structural layers 212 are disposed in sequence to work together to realize the display, touch and other functions of the screen assembly 20.

[0054] Exemplarily, in this embodiment of the application, along the thickness direction of the electronic device from the display panel 211 to the base plate 12, a plurality of first structural layers 212 sequentially include a reinforcing layer 2121, a first connecting layer 2122, a buffer layer 2123, a protective layer 2124, and a shielding layer 2125; wherein, the reinforcing layer 2121 can be a polyethylene terephthalate (PET) substrate layer, the buffer layer 2123 can be a foam structure, and the first connecting layer 2122 is double-sided adhesive for bonding the reinforcing layer 2121. The function of the buffer layer 2123 and the protective layer 2124 is to prevent the display module 21 from being punctured by external structures and damaged. The protective layer 2124 can be a polyethylene terephthalate substrate layer (PET). The protective layer 2124 can also be replaced with a pyrolytic graphite sheet (PGS) to improve the heat dissipation capacity of the display module 21. The shielding layer 2125 can be a copper layer or other metal layer. The shielding layer 2125 can reduce the interference to the display signal by absorbing or reflecting external electromagnetic interference.

[0055] Along the thickness direction of the electronic device, from the display panel 211 away from the base plate 12, a plurality of second structural layers 213 sequentially include a polarizer 2131 and an optical adhesive layer 2132. The polarizer 2131 is an optical film that allows light waves vibrating in a specific direction to pass through while blocking light waves vibrating in other directions. In the display module 21, the polarizer 2131 can eliminate the reflection of ambient light on the screen surface, improving screen visibility. For example, in strong outdoor light conditions, the polarizer 2131 can block most of the reflected light, allowing users to see the screen content more clearly. The optical adhesive layer 2132 is mainly composed of optical adhesive. In the display module 21, the optical adhesive can fill the tiny gaps between the display module 21 and the cover plate 23, eliminating light scattering caused by air layers and improving contrast and color saturation.

[0056] Optionally, the screen assembly 20 also includes a cover plate 23, which is connected to the side of the display module 21 away from the base plate 12 and covers the display module 21. The distance between the edge of the display panel 211 and the edge of the cover plate 23 is W1, which satisfies: 0.5≤W1≤0.75mm.

[0057] The cover plate 23 can be a glass cover plate 23. As the outermost structure of the screen assembly 20, the cover plate 23 is connected to the side frame 11 on the side away from the base plate 12 along the thickness direction of the electronic device, and protects the display module 21 to prevent the screen from being damaged. In this embodiment, by controlling the distance between the edge of the display panel 211 and the edge of the cover plate 23 to 0.5-0.75mm, it can be ensured that the cover plate 23 provides sufficient protection for the edge of the display module 21, and also reduces the size of the black border of the screen to a certain extent. Specifically, the width W of the black border of the screen in this embodiment is mainly composed of the distance W1 between the display panel 211 and the cover plate 23 and the width W2 of the black border of the display panel 211. By controlling the distance W1 between the display panel 211 and the cover plate 23, the size W of the black border of the electronic device screen can be controlled within a smaller range, thereby ensuring the screen ratio and display effect of the electronic device.

[0058] In summary, the electronic device provided in this application embodiment may include at least the following advantages:

[0059] In this embodiment, the frame includes interconnected side frames and a bottom plate. Since a first support portion is provided at the connection between the side frames and the bottom plate, and a second support portion is provided at the position opposite to the first support portion of the display module, under the above structure, the adhesive layer can be provided between the first support portion and the second support portion in this application, thereby realizing the connection and sealing between the display module and the frame. In this way, the frame is connected and sealed to the second support portion of the display module through the first support portion, and no adhesive layer is needed between the bottom plate of the frame and the display module, thereby saving the space occupied by the adhesive layer between the display module and the bottom plate of the frame, reducing the thickness of the electronic device, and further improving the user experience of the electronic device.

[0060] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0061] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, The electronic device includes: The frame (10) includes a side frame (11) and a bottom plate (12) connected to the side frame (11). The side frame (11) and the bottom plate (12) enclose a receiving cavity (13). A first support part (101) is provided at the connection between the side frame (11) and the bottom plate (12). A screen assembly (20) is disposed in the receiving cavity (13), and the screen assembly (20) has a second support (201) disposed at a position opposite to the first support (101); And an adhesive layer (30) is connected between the first support portion (101) and the second support portion (201) to connect and seal the screen assembly (20) to the frame (10).

2. The electronic device according to claim 1, characterized in that, The first support portion (101) has a first surface (1011) facing the second support portion (201), and the second support portion (201) has a second surface (2011) facing the first support portion (101), and the first surface (1011) and the second surface (2011) are arranged parallel to each other.

3. The electronic device according to claim 2, characterized in that, Both the first surface (1011) and the second surface (2011) are planar.

4. The electronic device according to claim 3, characterized in that, The first surface (1011) and the second surface (2011) have a first preset angle α with respect to the base plate (12), and the first preset angle α satisfies: 30°≤α≤60°.

5. The electronic device according to claim 3, characterized in that, Along the direction perpendicular to the second surface (2011), the thickness of the second support (201) is a first thickness H1, satisfying: 0.2≤H1≤0.3mm.

6. The electronic device according to any one of claims 1 to 5, characterized in that, The first support part (101) is integrally formed with the side frame (11) and / or the base plate (12).

7. The electronic device according to any one of claims 1 to 5, characterized in that, The thickness of the adhesive layer (30) is H2, which satisfies: 0.3≤H2≤0.4mm.

8. The electronic device according to any one of claims 1 to 5, characterized in that, The screen assembly (20) includes a display module (21) and a protective layer (22). The display module (21) has a side opposite to the side frame (11). The protective layer (22) covers at least the side of the display module (21). The second support (201) is disposed on the protective layer (22).

9. The electronic device according to claim 8, characterized in that, The display module (21) includes a display panel (211) stacked along the thickness direction of the electronic device and a plurality of first structural layers (212). The plurality of first structural layers (212) are disposed on the side of the display panel (211) near the base plate (12). In the direction from the display panel (211) to the base plate (12), the edges of the plurality of first structural layers (212) are successively recessed inward relative to the edge of the display panel (211) in a direction away from the side frame (11), so that the side of the display module (21) is inclined to the base plate (12).

10. The electronic device according to claim 9, characterized in that, The screen assembly (20) further includes a cover plate (23), which is connected to the side of the display module (21) away from the base plate (12) and covers the display module (21). The distance between the edge of the display panel (211) and the edge of the cover plate (23) is W1, which satisfies: 0.5≤W1≤0.75mm.

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