Semiconductor tail gas treatment power supply
By employing a design that combines water-cooled heat sinks with air-cooled circulation in the semiconductor exhaust gas treatment power supply, and by setting up a rotatable side plate, the problems of insufficient heat dissipation and difficult maintenance are solved, achieving efficient heat dissipation and rapid maintenance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUXI MUSK WELDING & CUTTING EQUIP CO LTD
- Filing Date
- 2025-08-13
- Publication Date
- 2026-07-24
AI Technical Summary
Existing semiconductor exhaust gas treatment power supplies suffer from insufficient heat dissipation under high power and high repetition frequency conditions, resulting in a compact equipment layout, lack of operating space between components, cumbersome maintenance, difficulty in troubleshooting and component replacement, and low maintenance efficiency.
It adopts a heat dissipation design that combines water cooling radiators with air cooling circulation, and the outer shell is equipped with a rotatable side panel to directly expose the internal components, making it easy to quickly locate and deal with problems.
By combining air cooling and water cooling, the power supply's heat dissipation efficiency and stability are improved, the maintenance process is simplified, and maintenance efficiency is significantly increased.
Smart Images
Figure CN224555959U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power supply technology, and more specifically, to a semiconductor exhaust gas treatment power supply. Background Technology
[0002] In semiconductor manufacturing processes, steps such as wafer etching and ion implantation release highly hazardous and complex waste gases containing fluorine, chlorine, silanes, phosphine, and volatile gases. To efficiently decompose these waste gases into harmless substances at room temperature and pressure, existing systems generally employ a combination of a "high-frequency high-voltage pulse power supply + non-equilibrium plasma reactor." This power supply unit outputs steep-leading, narrow-pulse (nanosecond-level) high-voltage pulses to drive the reactor to generate corona discharge. Simultaneously, it provides stable, controllable, and safe energy to units such as the plasma source, electric heater, and high-voltage pulse module, serving as the "energy source and control center" of the entire system.
[0003] However, such power supplies operate at high power and high repetition frequency for extended periods, resulting in concentrated heat generation in key components such as high-frequency transformers. The equipment layout is compact, with insufficient operating space between components, and some key components are obstructed. Disassembly requires the removal of multiple related components, making the process cumbersome and increasing the difficulty of troubleshooting and component replacement. Overall, maintenance efficiency is low and time-consuming.
[0004] Therefore, there is an urgent need for a semiconductor exhaust gas treatment power supply device that combines efficient heat dissipation with rapid maintenance. Utility Model Content
[0005] The technical problem to be solved by this utility model is to provide a semiconductor exhaust gas treatment power supply. Through reasonable layout, the internal heat dissipation of the power supply is enhanced, and a rotatable side plate is set. Opening the side plate allows direct contact with the relevant internal components, enabling quick location and handling of problems, and greatly improving maintenance efficiency.
[0006] The technical solution adopted by this utility model to solve its technical problem is as follows: A semiconductor exhaust gas treatment power supply is provided, including a housing, a heating element, and a water-cooled radiator for dissipating heat from the heating element. The housing includes a front plate, a rear plate opposite to the front plate, a first side plate, and a second side plate opposite to the first side plate. An air outlet is provided on the front plate, an air inlet is provided on the rear plate, and an electronic control board is mounted on the second side plate. The second side plate can be opened from the side. Specifically, in this embodiment: a cooling water inlet and a cooling water outlet are provided on the front plate; a first lower side plate is provided at the lower end of the first side plate; and an air exchange port is provided at the lower end of the second lower side plate.
[0007] In this embodiment, specifically: the water-cooled radiator is arranged parallel to the first side plate and the second side plate between the front plate and the rear plate, and the water-cooled radiator is provided with a water inlet and a water outlet, and the water inlet and the water outlet are connected.
[0008] In this embodiment, specifically: the cooling water inlet is connected to the water inlet, and the cooling water outlet is connected to the water outlet.
[0009] In this embodiment, specifically, both the water inlet and the water outlet are located on one side of the water-cooled radiator.
[0010] In this embodiment, specifically: a rectifier bridge, a transistor, and a capacitor are installed on the side of the water-cooled radiator near the first side plate.
[0011] In this embodiment, specifically: a reactor, a first main transformer, and a second main transformer are installed on the side of the water-cooled radiator near the second side plate.
[0012] In this embodiment, specifically: a panel assembly is installed on the front panel, the panel assembly includes wiring terminals, terminals, a display screen, an alarm light, a potentiometer, an interface, a remote control / local control, a main switch, and a communication interface, the terminals include positive terminals and negative terminals, and the display screen includes an ammeter and a voltmeter.
[0013] In this embodiment, specifically: a high-frequency board is installed on the rear plate, and a fan is installed on the air inlet.
[0014] In this embodiment, specifically: a mounting plate is installed on the top of the water-cooled radiator, and an electrolytic capacitor and a control transformer are installed on the mounting plate.
[0015] The beneficial effects of this utility model are as follows: This utility model provides a semiconductor exhaust gas treatment power supply, including a housing, a heating element, and a water-cooled radiator for dissipating heat from the heating element. The housing includes a front plate, a rear plate opposite the front plate, a first side plate, and a second side plate opposite the first side plate. An air outlet is provided on the front plate, and an air inlet is provided on the rear plate. Airflow enters the housing through the air inlet, passes through the water-cooled radiator and the heating element, and finally exits from the air outlet. An electronic control board is mounted on the second side plate. The second side plate can be opened from the side. Through this reasonable layout, internal heat dissipation of the power supply is enhanced. The rotatable side plate allows direct access to internal components, enabling quick location and troubleshooting, significantly improving maintenance efficiency. Attached Figure Description
[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0017] In the picture:Figure 1 This is a schematic diagram of the structure of a semiconductor exhaust gas treatment power supply according to the present invention; Figure 2 for Figure 1 Front view of the power supply Figure 3 for Figure 1 Rear view of the power supply; Figure 4 for Figure 1 Left view of the power supply; Figure 5 for Figure 1 Right view of the power supply; Figure 6 for Figure 1 A schematic diagram of the second side panel of the power supply in the open state; Figure 7 for Figure 1 A schematic diagram of the internal structure of the power supply after removing the first side plate and the first lower side plate; Figure 8 for Figure 1 A schematic diagram of the internal structure of the power supply after removing the second side plate and the second lower side plate; Figure 9 for Figure 7 or Figure 8 A schematic diagram of the structure of the heat sink.
[0018] 100. Power supply; 1. Housing; 11. Front panel; 111. Cooling water inlet; 112. Cooling water outlet; 113. Air outlet; 12. Rear panel; 121. Air inlet; 122. High-frequency board; 123. Fan; 13. First side panel; 14. Second side panel; 15. First lower side panel; 16. Second lower side panel; 161. Air vent; 17. Mounting plate; 2. Panel assembly; 21. Wiring terminal; 22. Terminal; 221. Positive terminal; 222. Negative terminal; 23. 1. Display screen; 231. Ammeter; 232. Voltmeter; 24. Alarm light; 25. Potentiometer; 26. Interface; 27. Remote and local control; 28. Main switch; 29. Communication interface; 3. Water-cooled radiator; 31. Water inlet; 32. Water outlet; 4. Heating element; 41. Electrolytic capacitor; 42. Control transformer; 43. Rectifier bridge; 44. Reactor; 45. Transistor; 46. Capacitor; 47. Electronic control board; 48. First main transformer; 49. Second main transformer. Detailed Implementation
[0019] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will now be described in detail with reference to the accompanying drawings. This drawing is a simplified schematic diagram, illustrating only the basic aspects of the present utility model, and therefore only shows the components relevant to the present utility model. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.
[0020] like Figure 1-9 As shown, this utility model provides a semiconductor exhaust gas treatment power supply 100, including a housing 1, a panel assembly 2 installed on the housing 1, a water-cooled heat sink 3 disposed inside the housing 1, and heating components 4 disposed on both sides of the water-cooled heat sink 3.
[0021] In this embodiment, specifically: the outer shell 1 includes a front panel 11, a rear panel 12 opposite to the front panel 11, a first side panel 13, and a second side panel 14 opposite to the first side panel 13. An air outlet 113 is provided on the front panel 11, and an air inlet 121 is provided on the rear panel 12. Airflow enters the outer shell 1 through the air inlet 121, passes through the water-cooled radiator 3 and the heating element 4, and is finally discharged from the air outlet 113. An electronic control board 47 is installed on the second side panel 14, and the second side panel 14 can be opened from the side.
[0022] In this embodiment, specifically: the front plate 11 is provided with a cooling water inlet 111 and a cooling water outlet 112, the lower end of the first side plate 13 is provided with a first lower side plate 15, the lower end of the second lower side plate 16 is provided with an air exchange port 161, the second lower side plate 16 is provided with an air exchange port 161, and the top of the water-cooled radiator 3 is equipped with an mounting plate 17.
[0023] In this embodiment, specifically: a high-frequency board 122 is installed on the rear plate 12, and a fan 123 is installed on the air inlet 121.
[0024] In this embodiment, specifically: a panel assembly 2 is installed on the front panel 11. The panel assembly 2 includes wiring terminals 21, terminals 22, a display screen 23, an alarm light 24, a potentiometer 25, an interface 26, a remote control / local control 27, a main switch 28, and a communication interface 29. Terminals 22 include a positive terminal 221 and a negative terminal 222. The display screen 23 includes an ammeter 231 and a voltmeter 232.
[0025] In this embodiment, specifically: the water-cooled radiator 3 is arranged parallel to the first side plate 13 and the second side plate 14 between the front plate 11 and the rear plate 12. The water-cooled radiator 3 is provided with an inlet 31 and an outlet 32, and the inlet 31 and the outlet 32 are connected.
[0026] In this embodiment, specifically: the water-cooled radiator 3 faces the first side plate 13 and the second side plate 14 on both sides.
[0027] In this embodiment, specifically: the cooling water inlet 111 is connected to the water inlet 31, and the cooling water outlet 112 is connected to the water outlet 32.
[0028] In this embodiment, specifically, the inlet 31 and the outlet 32 are both located on one side of the water-cooled radiator 3.
[0029] In this embodiment, specifically: the heating component 4 includes an electrolytic capacitor 41, a control transformer 42, a rectifier bridge 43, a reactor 44, a transistor 45, a capacitor 46, an electronic control board 47, a first main transformer 48, and a second main transformer 49.
[0030] In this embodiment, specifically: an electrolytic capacitor 41 and a control transformer 42 are mounted on the mounting plate 17.
[0031] In this embodiment, specifically: a rectifier bridge 43, a transistor 45 and a capacitor 46 are installed on the side of the water-cooled radiator 3 near the first side plate 13.
[0032] In this embodiment, specifically: a reactor 44, a first main transformer 48, and a second main transformer 49 are installed on the side of the water-cooled radiator 3 near the second side plate 14.
[0033] The working process of the semiconductor exhaust gas treatment power supply of this utility model is as follows: External cold air enters through the air inlet 121 of the rear panel 12, is driven by the fan 123, flows through the water-cooled radiator 3 and the heat-generating component 4 in sequence, and is finally discharged from the air outlet 113 of the front panel 11, forming a forced air-cooling cycle.
[0034] Cooling water enters from the cooling inlet 111 of the front panel 11, flows in through the inlet 31 of the water-cooled radiator 3, absorbs heat and flows out from the outlet 32, and is finally discharged through the cooling water outlet 112, achieving efficient water cooling.
[0035] The control board 47 is mounted on the rotatable second side panel 14 for easy maintenance.
[0036] The beneficial effects of this semiconductor exhaust gas treatment power supply are as follows: 1. The design combines air cooling and water cooling to specifically cool the heat-generating components 4, avoiding localized overheating and improving power supply stability and lifespan.
[0037] 2. The second side panel 14 can be rotated open to directly expose the electronic control board 47 and internal components, allowing fault location without disassembling the entire machine, greatly improving maintenance efficiency.
[0038] 3. The heat-generating components 4, water-cooled heat sink 3, and fans 123 are arranged in a reasonable manner to balance heat dissipation and compactness, and to meet the high power requirements of semiconductor exhaust gas treatment.
[0039] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0040] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.
[0041] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the scope of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.
Claims
1. A semiconductor exhaust gas treatment power supply, characterized in that: The device includes a housing (1), a heating element (4), and a water-cooled radiator (3) for dissipating heat from the heating element (4). The housing (1) includes a front panel (11), a rear panel (12) opposite to the front panel (11), a first side panel (13), and a second side panel (14) opposite to the first side panel (13). An air outlet (113) is provided on the front panel (11), an air inlet (121) is provided on the rear panel (12), and an electronic control board (47) is installed on the second side panel (14). The second side panel (14) can be opened from the side.
2. The semiconductor exhaust gas treatment power supply according to claim 1, characterized in that: The front panel (11) is provided with a cooling water inlet (111) and a cooling water outlet (112). The lower end of the first side panel (13) is provided with a first lower side panel (15). The outer shell (1) also includes a second lower side panel (16), and the second lower side panel (16) is provided with an air exchange vent (161).
3. The semiconductor exhaust gas treatment power supply according to claim 2, characterized in that: The water-cooled radiator (3) is arranged parallel to the first side plate (13) and the second side plate (14) between the front plate (11) and the rear plate (12). The water-cooled radiator (3) is provided with an inlet (31) and an outlet (32), and the inlet (31) and the outlet (32) are connected.
4. The semiconductor exhaust gas treatment power supply according to claim 3, characterized in that: The cooling water inlet (111) is connected to the water inlet (31), and the cooling water outlet (112) is connected to the water outlet (32).
5. A semiconductor exhaust gas treatment power supply according to claim 3, characterized in that: The inlet (31) and outlet (32) are both located on one side of the water-cooled radiator (3).
6. The semiconductor exhaust gas treatment power supply according to claim 1, characterized in that: The water-cooled radiator (3) has a rectifier bridge (43), a transistor (45) and a capacitor (46) installed on the side near the first side plate (13).
7. The semiconductor exhaust gas treatment power supply according to claim 1, characterized in that: The water-cooled radiator (3) has a reactor (44), a first main transformer (48), and a second main transformer (49) installed on the side near the second side plate (14).
8. The semiconductor exhaust gas treatment power supply according to claim 1, characterized in that: The front panel (11) is equipped with a panel assembly (2), which includes a wiring terminal (21), a terminal (22), a display screen (23), an alarm light (24), a potentiometer (25), an interface (26), a remote control and a local control (27), a main switch (28), and a communication interface (29). The terminal (22) includes a positive terminal (221) and a negative terminal (222). The display screen (23) includes an ammeter (231) and a voltmeter (232).
9. A semiconductor exhaust gas treatment power supply according to claim 1, characterized in that: A high-frequency board (122) is installed on the rear plate (12), and a fan (123) is installed on the air inlet (121).
10. A semiconductor exhaust gas treatment power supply according to claim 1, characterized in that: The water-cooled radiator (3) has an mounting plate (17) installed on its top, and an electrolytic capacitor (41) and a control transformer (42) are installed on the mounting plate (17).