Digital product metal shell structure facilitating heat dissipation

Abstract

The utility model discloses a digital product metal shell structure beneficial to heat dissipation, including metal shell body, the metal shell body includes metal shell and metal inner shell, and the surface of metal inner shell has the graphene heat conduction film of sticking, still include main heat dissipation structure, the main heat dissipation structure includes main guide vane and main heat dissipation channel, the main guide vane sets up at the center position of metal shell inside, and the main heat dissipation channel sets up between main guide vane, branch guide vane, the branch guide vane sets up in the metal shell inside of main heat dissipation structure both sides, and be provided with branch heat dissipation channel between the branch guide vane, main heat dissipation micropore, main heat dissipation micropore sets up on the metal outer wall of metal shell both ends of main heat dissipation structure. The utility model not only adopts double -deck structure, forms the heat dissipation space, and built -in multiple heat dissipation channel and heat conduction structure, increase the flowability of air current, thereby facilitate the emission of heat.

Description

Technical Field

[0001] This utility model relates to the field of digital product technology, specifically to a metal casing structure for digital products that facilitates heat dissipation. Background Technology

[0002] Digital products mainly include smartphones, digital cameras, computers, tablets, smart wearable devices (such as smartwatches), audio devices (such as headphones and speakers), storage devices (such as USB flash drives), and game consoles. Among them, mobile phones are digital products that people use frequently in their daily lives. When mobile phones are used frequently or perform high-load tasks, the processor and GPU need to operate at high speed, which generates a lot of heat and causes the temperature to rise. This not only affects the lifespan of the hardware, but also affects the user experience.

[0003] However, current metal casings are single-shell structures, resulting in slow heat dissipation and poor heat dissipation. Therefore, we propose a metal casing structure for digital products that facilitates heat dissipation. Utility Model Content

[0004] The purpose of this invention is to provide a metal casing structure for digital products that facilitates heat dissipation, thereby solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a heat dissipation-friendly metal casing structure for digital products, comprising a metal casing body, wherein the metal casing body includes a metal outer shell and a metal inner shell, and a graphene thermally conductive film is adhered to the surface of the metal inner shell, and further comprising... The main heat dissipation structure includes a main flow plate and a main heat dissipation channel. The main flow plate is located at the center inside the metal shell, and the main heat dissipation channel is located between the main flow plates. The branch guide plate is disposed inside the metal shell on both sides of the main heat dissipation structure, and a heat dissipation channel is provided between the branch guide plates; The main heat dissipation micropores are located on the outer walls of the metal outer shell at both ends of the main heat dissipation structure.

[0006] Preferably, a second arc-shaped guide plate is provided inside the metal shell on both sides of the branch guide plate, and a third heat dissipation channel is provided between the second arc-shaped guide plate and the branch guide plate.

[0007] Preferably, a first arc-shaped guide plate is provided inside the metal shell on one side of the second arc-shaped guide plate, and a second side heat dissipation channel is provided between the first arc-shaped guide plate and the second side heat dissipation channel. A first side heat dissipation channel is provided inside the metal shell on the side of the first arc-shaped guide plate away from the second side heat dissipation channel. According to the Coanda surface effect, the airflow flows along the convex surface of the arc. The provision of the heat dissipation channel allows air circulation, thereby facilitating heat dissipation.

[0008] Preferably, side heat dissipation micropores are provided on the outer wall of the metal casing at the locations of the first side heat dissipation channel, the second side heat dissipation channel, the third side heat dissipation channel, and the branch heat dissipation channel.

[0009] Preferably, a first dust filter and a second dust filter are adhered to the inner surface of the metal casing at the locations of the side heat dissipation micropores and the main heat dissipation micropores. The first dust filter and the second dust filter are made of a dense mesh structure of polyester fiber, which can intercept external dust and reduce the amount of dust entering the metal casing.

[0010] Preferably, the outer surface of the main flow plate is provided with equally spaced micro heat dissipation fins to further increase the heat dissipation area.

[0011] Preferably, the surface of the metal inner shell is provided with heat-conducting holes, and the heat-conducting holes correspond one-to-one with the main heat dissipation channel, the first side heat dissipation channel, the second side heat dissipation channel, the third side heat dissipation channel, and the branch heat dissipation channel.

[0012] Compared with the prior art, the beneficial effects of this utility model are: Because the metal casing adopts a double-layer structure, it forms a heat dissipation space. The inner metal casing is closely attached to the motherboard of the phone and is made of aluminum alloy. The graphene thermal conductive film on its surface quickly dissipates heat from the motherboard. The main heat dissipation structure inside the metal casing consists of a main airflow plate and a main heat dissipation channel, forming a Venturi acceleration channel. Airflow is facilitated through the main heat dissipation micro-holes, which further increases the heat dissipation area. The first arc-shaped airflow plate, the second arc-shaped airflow plate, and the branch airflow plate divide the internal space of the metal casing on both sides of the main heat dissipation structure into a first-side heat dissipation channel, a second-side heat dissipation channel, a third-side heat dissipation channel, and a branch heat dissipation channel. Because the first and second arc-shaped airflow plates are arc-shaped, according to the Coanda surface effect, airflow flows along the convex surface of the arc. The branch heat dissipation channel facilitates airflow, thus promoting heat dissipation. This metal casing structure adopts a double-layer structure, forming a heat dissipation space, and incorporates multiple heat dissipation channels and thermal conductive structures to increase airflow and facilitate heat dissipation. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the main structure of this utility model; Figure 2 This is a side sectional view of the present invention. Figure 3 This is a schematic diagram of the main heat dissipation structure of this utility model; Figure 4 This is a schematic diagram of the metal inner shell structure of this utility model.

[0014] In the diagram: 1. Metal casing body; 2. Metal outer shell; 3. Main heat dissipation structure; 4. Main guide plate; 5. Main heat dissipation channel; 6. First side heat dissipation channel; 7. First arc-shaped guide plate; 8. Second side heat dissipation channel; 9. Second arc-shaped guide plate; 10. Third side heat dissipation channel; 11. Branch guide plate; 12. Branch heat dissipation channel; 13. Side heat dissipation micropores; 14. First dust filter; 15. Main heat dissipation micropores; 16. Second dust filter; 17. Metal inner shell; 18. Graphene thermal conductive film; 19. Micro heat dissipation fins; 20. Heat conduction holes. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Therefore, the following detailed description of the embodiments of this utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but merely to illustrate selected embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0017] Please see Figure 1-4 This utility model provides an embodiment of a heat-dissipating metal casing structure for digital products, comprising a metal casing body 1, which includes a metal outer shell 2 and a metal inner shell 17, wherein a graphene thermally conductive film 18 is adhered to the surface of the metal inner shell 17, and further comprising... The main heat dissipation structure 3 includes a main flow plate 4 and a main heat dissipation channel 5. The main flow plate 4 is located at the center inside the metal shell 2, and the main heat dissipation channel 5 is located between the main flow plates 4. Specifically, the metal casing 1 adopts a double-layer structure, consisting of an outer metal outer shell 2 and an inner metal inner shell 17. The metal inner shell 17 is in close contact with the motherboard of the mobile phone. The metal inner shell 17 is made of aluminum alloy and the heat of the motherboard is quickly dissipated through the graphene thermal conductive film 18 on its surface. Secondly, the main heat dissipation structure 3 is set inside the metal casing 2. The main heat dissipation structure 3 is composed of a main flow plate 4 and a main heat dissipation channel 5, forming a Venturi acceleration channel. Air circulation is facilitated through the main heat dissipation micro-holes 15, which facilitates the dissipation of heat. The setting of micro heat dissipation fins 19 further increases the heat dissipation area. Branch guide plates 11 are installed inside the metal shells 2 on both sides of the main heat dissipation structure 3, and heat dissipation channels 12 are provided between the branch guide plates 11. Main heat dissipation micro-holes 15 are set on the outer walls of the metal shells 2 at both ends of the main heat dissipation structure 3. The metal shells 2 on both sides of the branch guide plate 11 are provided with a second arc-shaped guide plate 9, and a third heat dissipation channel 10 is provided between the second arc-shaped guide plate 9 and the branch guide plate 11. The first arc-shaped guide plate 7 is provided inside the metal shell 2 on one side of the second arc-shaped guide plate 9, and a second side heat dissipation channel 8 is provided between the first arc-shaped guide plate 7 and the second side heat dissipation channel 8. The first side heat dissipation channel 6 is provided inside the metal shell 2 on the side of the first arc-shaped guide plate 7 away from the second side heat dissipation channel 8. Side heat dissipation micro-holes 13 are provided on the outer wall of the metal shell 2 at the positions of the first side heat dissipation channel 6, the second side heat dissipation channel 8, the third side heat dissipation channel 10, and the branch heat dissipation channel 12. Specifically, the first arc-shaped guide plate 7, the second arc-shaped guide plate 9, and the branch guide plate 11 divide the internal space of the metal shell 2 on both sides of the main heat dissipation structure 3 into the first side heat dissipation channel 6, the second side heat dissipation channel 8, the third side heat dissipation channel 10, and the branch heat dissipation channel 12. Since the first arc-shaped guide plate 7 and the second arc-shaped guide plate 9 are arc-shaped structures, according to the Coanda surface effect, the airflow flows along the convex surface of the arc. The setting of the branch heat dissipation channel 12 enables air circulation, which is conducive to the dissipation of heat. The first dust filter 14 and the second dust filter 16 are adhered to the inner surface of the metal shell 2 at the positions of the side heat dissipation micro-holes 13 and the main heat dissipation micro-holes 15, and the first dust filter 14 and the second dust filter 16 are dense mesh structures made of polyester fiber. Furthermore, since the inner wall of the metal shell 2 at the location of the heat dissipation channel 12 and the main heat dissipation micro-hole 15 is provided with a first dust filter 14 and a second dust filter 16, the first dust filter 14 and the second dust filter 16 are dense mesh structures made of polyester fiber, which can intercept external dust and reduce dust from entering the metal shell body 1. The outer surface of the main flow plate 4 is provided with equally spaced micro heat dissipation fins 19; The surface of the metal inner shell 17 is provided with heat conduction holes 20, and the heat conduction holes 20 correspond one-to-one with the main heat dissipation channel 5, the first side heat dissipation channel 6, the second side heat dissipation channel 8, the third side heat dissipation channel 10, and the branch heat dissipation channel 12.

[0018] In use, the embodiments of this application are as follows: First, the metal casing 1 adopts a double-layer structure, consisting of an outer metal outer shell 2 and an inner metal inner shell 17. The inner metal shell 17 is in close contact with the motherboard of the mobile phone and is made of aluminum alloy. The heat from the motherboard is quickly dissipated through the graphene thermal conductive film 18 on its surface. Second, the main heat dissipation structure 3 is set inside the metal casing 2. The main heat dissipation structure 3 consists of a main flow guide plate 4 and a main heat dissipation channel 5, forming a Venturi acceleration channel. Airflow is facilitated through the main heat dissipation micro-holes 15, which facilitates heat dissipation. The micro heat dissipation fins 19 further increase the heat dissipation area. Then, the first arc-shaped flow guide plate 7, the second arc-shaped flow guide plate 9, and the branch flow guide plate 11 connect the two layers of the main heat dissipation structure 3. The internal space of the side metal shell 2 is divided into a first side heat dissipation channel 6, a second side heat dissipation channel 8, a third side heat dissipation channel 10, and a branch heat dissipation channel 12. Since the first arc-shaped guide plate 7 and the second arc-shaped guide plate 9 are arc-shaped structures, according to the Coanda surface effect, airflow flows along the convex surface of the arc. The branch heat dissipation channel 12 facilitates air circulation, thereby promoting heat dissipation. Furthermore, since the inner wall of the metal shell 2 at the locations of the branch heat dissipation channel 12 and the main heat dissipation micro-holes 15 is equipped with a first dust filter 14 and a second dust filter 16, which are dense mesh structures made of polyester fiber, they can intercept external dust, reducing the amount of dust entering the metal shell body 1. This metal shell structure adopts a double-layer structure, forming a heat dissipation space, and incorporates multiple heat dissipation channels and heat-conducting structures to increase airflow, thereby facilitating heat dissipation.

[0019] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

Claims

1. A heat dissipation-friendly metal casing structure for digital products, comprising a metal casing body (1), wherein the metal casing body (1) includes a metal outer shell (2) and a metal inner shell (17), and a graphene thermally conductive film (18) is adhered to the surface of the metal inner shell (17), characterized in that: Also includes The main heat dissipation structure (3) includes a main flow plate (4) and a main heat dissipation channel (5). The main flow plate (4) is located at the center inside the metal shell (2), and the main heat dissipation channel (5) is located between the main flow plates (4). Branch guide plate (11), the branch guide plate (11) is set inside the metal shell (2) on both sides of the main heat dissipation structure (3), and a heat dissipation channel (12) is provided between the branch guide plates (11). Main heat dissipation micro-holes (15) are set on the outer walls of the metal shells (2) at both ends of the main heat dissipation structure (3).

2. The heat dissipation-friendly metal casing structure for digital products according to claim 1, characterized in that: The metal shells (2) on both sides of the branch guide plate (11) are provided with second arc-shaped guide plates (9), and a third heat dissipation channel (10) is provided between the second arc-shaped guide plate (9) and the branch guide plate (11).

3. The heat dissipation-friendly metal casing structure for digital products according to claim 2, characterized in that: The metal shell (2) on one side of the second arc-shaped guide plate (9) is provided with a first arc-shaped guide plate (7), and a second side heat dissipation channel (8) is provided between the first arc-shaped guide plate (7) and the second side heat dissipation channel (8). The metal shell (2) on the side of the first arc-shaped guide plate (7) away from the second side heat dissipation channel (8) is provided with a first side heat dissipation channel (6).

4. The heat dissipation-friendly metal casing structure for digital products according to claim 3, characterized in that: Side heat dissipation microholes (13) are provided on the outer wall of the metal shell (2) at the positions of the first side heat dissipation channel (6), the second side heat dissipation channel (8), the third side heat dissipation channel (10), and the branch heat dissipation channel (12).

5. The heat dissipation-friendly metal casing structure for digital products according to claim 4, characterized in that: The first dust filter (14) and the second dust filter (16) are adhered to the inner surface of the metal shell (2) at the location of the side heat dissipation micro-hole (13) and the main heat dissipation micro-hole (15), and the first dust filter (14) and the second dust filter (16) are dense mesh structures made of polyester fiber.

6. The heat dissipation-friendly metal casing structure for digital products according to claim 1, characterized in that: The outer surface of the main flow plate (4) is provided with equally spaced micro heat dissipation fins (19).

7. The heat dissipation-friendly metal casing structure for digital products according to claim 1, characterized in that: The surface of the metal inner shell (17) is provided with heat conduction holes (20), and the heat conduction holes (20) correspond one-to-one with the main heat dissipation channel (5), the first side heat dissipation channel (6), the second side heat dissipation channel (8), the third side heat dissipation channel (10), and the branch heat dissipation channel (12).

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