An electronic component housing with high heat dissipation

Abstract

The utility model belongs to the field of electronic equipment heat dissipation technology discloses a kind of electronic component shell of high efficiency heat dissipation.The shell body four sides are equipped with several heat dissipation fins, and several heat dissipation fins are distributed at equal intervals, and its four sides are equipped with a pair of air outlet, top end is equipped with air inlet, and the top end of air inlet is equipped with active heat dissipation mechanism, and inside is equipped with radiator plate, the bottom end middle part of radiator plate is equipped with temperature sensor, the bottom end outside of radiator plate is equipped with heat-conducting pad, the top end of radiator plate is still equipped with several heat dissipation fins, and several heat dissipation fins are distributed at equal intervals, the inside top end of shell body four corners is equipped with auxiliary laminating mechanism, and the bottom end of auxiliary laminating mechanism and the top end of radiator plate are connected.The utility model can effectively realize active heat dissipation function, improve heat dissipation efficiency, and have higher practical value.

Description

Technical Field

[0001] This utility model belongs to the field of heat dissipation technology for electronic devices, and specifically relates to a housing for electronic components with high-efficiency heat dissipation. Background Technology

[0002] With the rapid development of electronic technology, the performance of electronic components is constantly improving, but their power consumption is also increasing, generating a lot of heat during operation. If this heat cannot be dissipated in a timely and effective manner, the electronic components will be in a high-temperature environment for a long time, which will not only lead to a decline in component performance and a shortened lifespan, but may even cause malfunctions and affect the normal operation of the entire electronic device.

[0003] Based on the above, the present invention has found the following problems: most traditional electronic component casings rely on simple metal materials for natural heat dissipation, which has limited heat dissipation efficiency and is difficult to meet the heat dissipation requirements of today's high-power electronic components. Utility Model Content

[0004] The purpose of this invention is to provide a high-efficiency heat dissipation electronic component housing to solve the above-mentioned technical problems.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-efficiency heat dissipation electronic component housing, comprising a housing, a mounting base, an active heat dissipation mechanism, a first dustproof mesh, a second dustproof mesh, a first heat dissipation fin, a heat dissipation plate, a thermal pad, an auxiliary bonding mechanism, a temperature sensor, and control buttons;

[0006] The fixing base is located at the bottom of both sides of the housing. The active heat dissipation mechanism is located on the side of the first heat dissipation fin near the center. The first dustproof net is located around the housing. The second dustproof net is located above the active heat dissipation mechanism. Several first heat dissipation fins are installed on all four sides of the housing, and the several first heat dissipation fins are evenly distributed. The thermal pad and the heat dissipation plate are located inside the housing. The temperature sensor is located at the middle of the bottom end of the heat dissipation plate. The thermal pad is located on the outer side of the bottom end of the heat dissipation plate. The auxiliary bonding mechanism is located at the four corners of the top inside the housing, and its bottom end is connected to the top end of the heat dissipation plate. The control button is located at one corner of the top end of the housing.

[0007] The housing has a pair of air outlets on each of its four sides and an air inlet at its top. The active heat dissipation mechanism is installed at the top of the air inlet, and the first dustproof mesh is installed inside it.

[0008] The active heat dissipation mechanism includes a shroud, a mounting frame, a motor, and heat dissipation blades; the second dustproof net is disposed at the top of the shroud, the mounting frame is installed on the inner side of the shroud, the motor is installed on the inner side of the mounting frame, the heat dissipation blades are installed at the output end of the motor, and the heat dissipation blades are disposed above the motor.

[0009] Furthermore, 30-40 second heat dissipation fins are installed on the top of the heat sink, and the 30-40 second heat dissipation fins are distributed at equal intervals.

[0010] The auxiliary fitting mechanism includes a first limiting plate, a telescopic rod, a spring, and a second limiting plate. The top of the first limiting plate is fixedly connected to the inner top of the housing. The telescopic rod is installed at the bottom of the first limiting plate. A spring is sleeved on the outer side of the telescopic rod. The top of the spring is connected to the bottom of the first limiting plate, and the bottom of the spring is connected to the top of the second limiting plate. The second limiting plate is installed at the bottom of the telescopic rod, and the bottom of the second limiting plate is fixedly connected to the top of the heat sink.

[0011] Furthermore, the thermal pad is made of thermally conductive silicone.

[0012] Furthermore, the control button is electrically connected to the temperature sensor and the motor via wires, respectively.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model greatly expands the contact area with the outside air by installing several first heat dissipation fins on all four sides of the shell. Heat can be quickly dissipated into the air through the fins, improving natural heat dissipation efficiency. The design of the air outlet and air inlet creates a smooth airflow channel, promoting timely exhaust of hot air and continuous replenishment of cold air, accelerating the heat dissipation process. The internal heat dissipation plate improves the heat dissipation efficiency of electrical components. A temperature sensor installed at the bottom center of the heat dissipation plate accurately monitors the temperature of electrical components in real time, providing crucial data for subsequent intelligent heat dissipation control. A thermal pad installed on the bottom outer side of the heat dissipation plate ensures close contact with electronic components, filling tiny gaps and efficiently conducting heat to the heat dissipation plate with minimal thermal resistance, ensuring heat dissipation. To ensure timely heat dissipation, several second heat dissipation fins are installed at the top of the heat sink, further expanding the heat dissipation surface area. Combined with the overall heat dissipation design of the casing, the heat dissipation efficiency is enhanced from multiple directions. Heat dissipation blades are installed at the motor output end to achieve active air cooling, improving heat dissipation efficiency. The setting of the first and second dustproof nets prevents dust from entering the casing. The setting of the first limit plate, telescopic rod and second limit plate allows the height of the heat sink to be adjusted to accommodate electrical components of different sizes. The spring sleeve on the outside of the telescopic rod improves the adhesion between the thermal pad and the electrical components. The thermal pad is made of thermally conductive silicone, which has a high thermal conductivity and can quickly conduct the heat generated by the electronic components to the heat sink. A control button is installed at one corner of the top of the casing to make the equipment controllable and increase the convenience of product use.

[0014] To more clearly illustrate the functional characteristics and structural parameters of this utility model, the following description is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0015] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0016] Figure 1 This is one of the three-dimensional structural schematic diagrams disclosed in the embodiments of this utility model;

[0017] Figure 2 This is the second three-dimensional structural schematic diagram disclosed in the embodiment of this utility model;

[0018] Figure 3 This is one of the disassembled three-dimensional structural diagrams disclosed in the embodiments of this utility model;

[0019] Figure 4 This is the second disassembled three-dimensional structural diagram disclosed in the embodiment of this utility model;

[0020] Figure 5 The embodiments disclosed herein Figure 3 A magnified schematic diagram of structure A in the middle.

[0021] The reference numerals in the figure are as follows: 100, housing; 10001, air outlet; 10002, air inlet; 101, mounting base; 102, active cooling mechanism; 10201, hood; 10202, mounting bracket; 10203, motor; 10204, cooling blades; 103, first dustproof net; 104, second dustproof net; 105, first cooling fin; 106, heat dissipation plate; 10601, second cooling fin; 107, thermal pad; 108, auxiliary bonding mechanism; 10801, first limiting plate; 10802, telescopic rod; 10803, spring; 10804, second limiting plate; 109, temperature sensor; 110, control button. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0023] This utility model provides a high-efficiency heat dissipation electronic component housing, combined with... Figure 1 , Figure 2 and Figure 4 It includes a housing 100, a mounting base 101, an active heat dissipation mechanism 102, a first dustproof mesh 103, a second dustproof mesh 104, a first heat dissipation fin 105, a heat dissipation plate 106, a thermal pad 107, an auxiliary bonding mechanism 108, a temperature sensor 109, and a control button 110;

[0024] The fixing base 101 is located at the bottom ends of both sides of the housing 100. The active heat dissipation mechanism 102 is located on the side of the first heat dissipation fin 105 near the center. The first dustproof net 103 is located around the housing 100. The second dustproof net 104 is located above the active heat dissipation mechanism 102. Several first heat dissipation fins 105 are installed on all four sides of the housing 100, and the several first heat dissipation fins 105 are evenly distributed. The thermal pad 107 and the heat dissipation plate 106 are located inside the housing 100. The temperature sensor 109 is located at the middle of the bottom end of the heat dissipation plate 106. The thermal pad 107 is located on the outer side of the bottom end of the heat dissipation plate 106. The auxiliary bonding mechanism 108 is located at the four corners of the top inside the housing 100, and its bottom end is connected to the top end of the heat dissipation plate 106. The control button 110 is located at one corner of the top end of the housing 100.

[0025] Combination Figure 3 The housing 100 has a pair of air outlets 10001 on each of its four sides, and an air inlet 10002 is provided at the top of the housing 100. The active heat dissipation mechanism 102 is installed at the top of the air inlet 10002, and the first dustproof net 103 is installed inside it.

[0026] Combination Figure 3 and Figure 5 The active heat dissipation mechanism 102 includes a shroud 10201, a mounting frame 10202, a motor 10203, and heat dissipation blades 10204. The second dustproof net 104 is disposed at the top of the shroud 10201. The mounting frame 10202 is installed on the inner side of the shroud 10201. The motor 10203 is installed on the inner side of the mounting frame 10202. The heat dissipation blades 10204 are installed at the output end of the motor 10203. The heat dissipation blades 10204 are disposed above the motor 10203.

[0027] To better visualize the active cooling mechanism 102, the fixing frame 10202, the motor 10203, and the cooling blades 10204 are partially enlarged; this portion is referred to as structure A. Figure 3 and Figure 5 In this context, A is used to represent it.

[0028] Furthermore, 30-40 second heat dissipation fins 10601 are installed on the top of the heat dissipation plate 106, and the 30-40 second heat dissipation fins 10601 are distributed at equal intervals.

[0029] Combination Figure 4The auxiliary fitting mechanism 108 includes a first limiting plate 10801, a telescopic rod 10802, a spring 10803, and a second limiting plate 10804. The top end of the first limiting plate 10801 is fixedly connected to the inner top end of the housing 100. The telescopic rod 10802 is installed at the bottom end of the first limiting plate 10801. The spring 10803 is sleeved on the outer side of the telescopic rod 10802. The top end of the spring 10803 is connected to the bottom end of the first limiting plate 10801. The bottom end of the spring 10803 is connected to the top end of the second limiting plate 10804. The second limiting plate 10804 is installed at the bottom end of the telescopic rod 10802. The bottom end of the second limiting plate 10804 is fixedly connected to the top end of the heat sink 106.

[0030] Furthermore, the thermal pad 107 is made of thermally conductive silicone.

[0031] Furthermore, the control button 110 is electrically connected to the temperature sensor 109 and the motor 10203 via wires.

[0032] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-efficiency heat dissipation electronic component housing, characterized in that, Includes housing (100), mounting base (101), active heat dissipation mechanism (102), first dustproof mesh (103), second dustproof mesh (104), first heat dissipation fins (105), heat dissipation plate (106), thermal pad (107), auxiliary bonding mechanism (108), temperature sensor (109), and control button (110). The fixing base (101) is located at the bottom of both sides of the housing (100). The active heat dissipation mechanism (102) is located on the side of the first heat dissipation fin (105) near the center. The first dustproof net (103) is located around the housing (100). The second dustproof net (104) is located above the active heat dissipation mechanism (102). A plurality of the first heat dissipation fins (105) are installed on all four sides of the housing (100), and the plurality of the first heat dissipation fins (105) are evenly spaced. The heat-conducting pad (107) and the heat sink (106) are disposed inside the housing (100). The temperature sensor (109) is disposed at the middle of the bottom end of the heat sink (106). The heat-conducting pad (107) is disposed on the outer side of the bottom end of the heat sink (106). The auxiliary bonding mechanism (108) is disposed at the four corners of the top of the inside of the housing (100), and its bottom end is connected to the top end of the heat sink (106). The control button (110) is disposed at one corner of the top end of the housing (100).

2. The high-efficiency heat dissipation electronic component housing according to claim 1, characterized in that, The housing (100) has a pair of air outlets (10001) on each of its four sides, and an air inlet (10002) is provided at the top of the housing (100). The active heat dissipation mechanism (102) is installed at the top of the air inlet (10002), and the first dustproof net (103) is installed on its inner side.

3. The high-efficiency heat dissipation electronic component housing according to claim 1, characterized in that, The active heat dissipation mechanism (102) includes a shroud (10201), a mounting bracket (10202), a motor (10203), and heat dissipation blades (10204). The second dustproof net (104) is disposed at the top of the shroud (10201). The mounting bracket (10202) is installed on the inner side of the shroud (10201). The motor (10203) is installed on the inner side of the mounting bracket (10202). The heat dissipation blades (10204) are installed at the output end of the motor (10203). The heat dissipation blades (10204) are disposed above the motor (10203).

4. The high-efficiency heat dissipation electronic component housing according to claim 1, characterized in that, The top of the heat sink (106) is equipped with 30-40 second heat sink fins (10601), and the 30-40 second heat sink fins (10601) are distributed at equal intervals.

5. The high-efficiency heat dissipation electronic component housing according to claim 1, characterized in that, The auxiliary fitting mechanism (108) includes a first limiting plate (10801), a telescopic rod (10802), a spring (10803), and a second limiting plate (10804). The top of the first limiting plate (10801) is fixedly connected to the inner top of the housing (100). The telescopic rod (10802) is installed at the bottom of the first limiting plate (10801). The spring (10803) is sleeved on the outer side of the telescopic rod (10802). The top of the spring (10803) is connected to the bottom of the first limiting plate (10801). The bottom of the spring (10803) is connected to the top of the second limiting plate (10804). The second limiting plate (10804) is installed at the bottom of the telescopic rod (10802). The bottom of the second limiting plate (10804) is fixedly connected to the top of the heat sink (106).

6. The high-efficiency heat dissipation electronic component housing according to claim 1, characterized in that, The thermal pad (107) is made of thermally conductive silicone.

7. The high-efficiency heat dissipation electronic component housing according to claim 3, characterized in that, The control button (110) is electrically connected to the temperature sensor (109) and the motor (10203) via wires.

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