LED lamp with lens that is not easily loosened

Abstract

The utility model discloses a lens's LED lamp of not easy to loosen, including first substrate, be equipped with LED chip on the first substrate, still have the annular dam that surrounds in the chip peripheral side, have the first optical lens of alignment LED chip on the dam, first substrate, the dam and first optical lens jointly enclose the chip containing cavity, and the chip is located in the chip containing cavity, and the dam is opened and has the air hole to let the chip containing cavity with to communicate with the outside world. When the chip emits light, the air in the cavity of chip containing cavity expands under the heat, can be discharged to the outside world through the air hole, and the air pressure in the cavity will not greatly increase due to the air expansion, and the outward pressure that the air in the cavity exerts to the lens is smaller, and the lens is not easy to be loosened.

Description

Technical Field

[0001] This utility model relates to the field of lighting technology, specifically to an LED lamp with a lens that is not easily detached. Background Technology

[0002] An LED light consists of a substrate, on which an LED chip is soldered. A ring-shaped dam is attached around the chip, and an optical lens is attached to the dam. The substrate, dam, and lens together form a sealed chip housing cavity, within which the chip is located. The substrate draws power from the outside to power the chip, causing it to emit light. The light emitted by the chip passes through the lens and is projected outwards. When the chip emits light, it generates heat. The air inside the chip housing expands due to the heat, causing a significant increase in air pressure. This air exerts outward pressure on the substrate, dam, and lens, potentially causing the lens to detach, leading to decreased light output performance and product reliability. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide an LED lamp in which the air inside the chip housing cavity does not easily loosen the lens top when heated and expanded.

[0004] To solve the above-mentioned technical problems, the present invention provides an LED lamp with a lens that is not easily detached, comprising a first substrate, on which an LED chip is disposed, and an annular dam is attached around the chip. A first optical lens aligned with the LED chip is attached to the dam. The first substrate, the dam, and the first optical lens together form a chip housing cavity, in which the chip is located. The dam has a vent hole to allow the chip housing cavity to communicate with the outside.

[0005] Furthermore, the dam is specifically an open-loop structure with a gap, which serves as a ventilation hole.

[0006] Furthermore, there are multiple gaps, arranged circumferentially.

[0007] Furthermore, the width of the vent holes is 1.5% to 2.5% of the inner circumference of the dam.

[0008] Furthermore, the inner ring of the dam is a circle with a diameter of 4mm, and the width of the vent holes is 0.3mm.

[0009] Furthermore, the first optical lens is hemispherical, arching outwards towards the direction away from the chip, with the inner ring of the dam being circular and the outer ring being square.

[0010] Furthermore, the dam was made of metal.

[0011] Furthermore, the surface of the dam is coated with a silver reflective layer.

[0012] Furthermore, the first substrate, chip, dam, and first optical lens together constitute an LED module; this LED lamp has multiple LED modules and also has a second substrate, on which the multiple LED modules are disposed and arranged in a polygon.

[0013] Furthermore, a lens mounting bracket is bolted onto the second substrate. The lens mounting bracket surrounds the periphery of multiple LED modules and a hemispherical second optical lens is mounted on it. The side of the second optical lens away from the chip is an exposed flat surface, and the side closer to the chip is a convex surface hidden inside the lens mounting bracket.

[0014] When the chip emits light, the air inside the chip cavity expands due to heat and can be discharged to the outside through the vent. The air pressure inside the cavity will not increase significantly due to the expansion of the air. The outward pressure exerted by the air inside the cavity on the lens is relatively small, making it less likely to loosen the top of the lens. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of an LED light.

[0016] Figure 2 This is an exploded view of an LED light.

[0017] Figure 3 This is an AA cross-sectional view of an LED light.

[0018] Figure 4 This is a schematic diagram of the LED module and the copper substrate.

[0019] Figure 5 This is an exploded view of the LED module after the single-source focusing lens has been removed with the view facing upwards.

[0020] Figure 6 It is a three-dimensional cross-sectional view of the LED module and the copper substrate. Detailed Implementation

[0021] The present invention will be further described in detail below with reference to specific embodiments.

[0022] LED lights Figure 1 and Figure 2 The system includes a copper substrate 1, on which multiple LED modules 2 are soldered, arranged in a hexagonal pattern. A lens mounting bracket 3 is provided on the copper substrate 1, consisting of upper and lower brackets 31 and 32. (See...) Figure 3 The lower frame 32 has an external thread (not shown in the figure) at its top 321, and the upper frame 31 has an internal thread (not shown in the figure) at its bottom 311. The upper and lower frames 31 and 32 are connected together via the internal and external threads 311 and 321. The lower frame 32 is as follows... Figure 1 and Figure 2It is mounted on the copper substrate 1 using bolt connections, surrounding multiple LED modules 2, and a first multi-source focusing lens 4 facing downwards and aligned with the multiple LED modules 2 is attached to it. A second multi-source focusing lens 5 is attached to the upper frame 31, such as... Figure 3 The lens 5 is hemispherical, with its upper surface 51 being an exposed flat surface and its lower surface 52 being a convex surface hidden within the upper frame 31, facing downwards towards the first multi-source focusing lens 4. The copper substrate 1, the lower frame 32 of the lens mounting bracket 3, and the first multi-source focusing lens 4 together form a module receiving cavity 10, within which multiple LED modules 2 are located. The copper substrate 1 draws power from the outside and supplies power to the multiple LED modules 2, causing them to emit light. The light emitted by the multiple LED modules 2 is focused by the first multi-source focusing lens 4 and the second multi-source focusing lens 5 before being projected upwards. Because the lower frame 32 of the lens mounting bracket 3 is not installed with adhesive but with bolts, there are tiny assembly gaps 30 between the lower frame 32 of the lens mounting bracket 3 and the copper substrate 1. The module receiving cavity 10 is connected to the outside through these gaps 30. The heat generated when multiple LED modules 2 emit light will cause the air inside the module housing cavity 10 to expand due to heat. The air inside the cavity can be discharged to the outside of the cavity through the aforementioned gap 30. Therefore, the air pressure inside the cavity will not increase significantly due to the expansion of the air. The outward pressure exerted by the air inside the cavity on the first multi-light source focusing lens 4 is relatively small, making it difficult to loosen the top of the lens 4.

[0023] See each LED module 2. Figure 4 and Figure 5 The system includes a ceramic substrate 21, which is soldered onto a copper substrate 1. An LED chip 22 and a power supply circuit 211 are mounted on the ceramic substrate 21. An annular copper dam 23 is also attached around both the chip 22 and the power supply circuit 211. The inner ring 231 of the copper dam 23 is circular, while the outer ring 232 is square. An annular mounting groove 233 is formed at the top edge of the inner ring 231. A hemispherical single-light source focusing lens 24, arched upwards and aligned downwards with the chip 22, is attached to the mounting groove 233. (See...) Figure 6The ceramic substrate 21, copper dam 23, and single-light-source focusing lens 24 together form a chip housing cavity 20, within which the chip 22 is located. The copper dam 23 has an open-loop structure with two circumferentially arranged notches 235 and 236 on the left and right sides, through which the chip housing cavity 20 connects to the module housing cavity 10. The two notches 235 and 236 on the left and right sides of the copper dam 23 serve as vents. The copper substrate 1 supplies power to the chip 22 via the power supply circuit 211 on the ceramic substrate 21, causing the chip 22 to emit light. When the chip 22 emits light, it generates heat, causing the air inside the chip housing cavity 20 to expand. This heat is released through the two notches 235 and 236 into the module housing cavity 10, and then through the gap 30 between the lower frame 32 of the lens mounting bracket 3 and the copper substrate 1 to the outside. The air pressure inside the chip housing cavity 10 will not increase significantly due to air expansion, and the outward pressure exerted by the air inside the cavity on the single-light source focusing lens 24 is relatively small, making it less likely to loosen the lens 24. The copper dam 23 has strong thermal conductivity, which can conduct the heat generated by the chip 22 to the outside of the chip housing cavity 10, thus playing a good role in heat dissipation. The outer ring 232 of the copper dam 23 is square, which has a larger surface area than a circle, resulting in a larger contact area with air and better heat dissipation. The copper dam 23 has an open-ring structure, and the left and right notches 235 and 236 provide space for the copper dam 23 to expand under heat, which can effectively prevent cracking caused by limited thermal expansion. The surface of the copper dam 23 is plated with a silver heat dissipation layer (not shown in the figure), which not only further enhances the heat dissipation effect, but also serves as a reflective layer, reflecting the light projected onto the surface of the copper dam 23 and reducing light absorption loss. The width of each notch 235 and 236 is 1.5% to 2.5% of the circumference of the inner ring of the copper dam 23. In this embodiment, the diameter of the inner ring 231 of the copper dam 23 is 4mm, and the width of the notches 235 and 236 is 0.3mm. This is neither too small to affect air permeability nor too large to cause excessive light leakage, thus balancing exhaust performance and optical sealing.

[0024] The above description is merely an embodiment of the present invention and does not limit the scope of patent protection. Any non-substantial changes or substitutions made by those skilled in the art based on the present invention will still fall within the scope of patent protection.

Claims

1. An LED lamp with a lens that is not easily detached, comprising a first substrate, an LED chip disposed on the first substrate, and an annular dam surrounding the chip, wherein a first optical lens aligned with the LED chip is attached to the dam, the first substrate, the dam, and the first optical lens together form a chip receiving cavity, the chip being located within the chip receiving cavity, characterized in that: The dam has ventilation holes to allow the chip housing cavity to connect to the outside world.

2. The LED lamp according to claim 1, characterized in that: The dam is specifically an open-loop structure with a gap, which serves as a ventilation hole.

3. The LED lamp according to claim 2, characterized in that: There are multiple gaps, arranged circumferentially.

4. The LED lamp according to any one of claims 1 to 3, characterized in that: The width of the ventilation holes is 1.5% to 2.5% of the inner circumference of the dam.

5. The LED lamp according to claim 4, characterized in that: The inner ring of the dam is a circle with a diameter of 4mm, and the width of the vent holes is 0.3mm.

6. The LED lamp according to claim 1, characterized in that: The first optical lens is hemispherical, arching outwards towards the direction away from the chip, with the inner ring of the dam being circular and the outer ring being square.

7. The LED lamp according to claim 1, characterized in that: The dam is made of metal.

8. The LED lamp according to claim 1 or 7, characterized in that: The surface of the dam is coated with a silver reflective layer.

9. The LED lamp according to claim 1, characterized in that: The first substrate, chip, dam and first optical lens together constitute an LED module; this LED lamp has multiple LED modules and also has a second substrate, on which the multiple LED modules are arranged in a polygon.

10. The LED lamp according to claim 9, characterized in that: A lens mounting bracket is bolted onto the second substrate. The lens mounting bracket surrounds multiple LED modules and a hemispherical second optical lens is mounted on it. The side of the second optical lens away from the chip is an exposed flat surface, and the side closer to the chip is a convex surface hidden inside the lens mounting bracket.

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