A small short pin rectifier bridge

Abstract

The application relates to a small short-lead rectifier bridge, belonging to the technical field of semiconductors. The rectifier bridge comprises a first base island, a second base island, a third base island and a fourth base island which are arranged at intervals; the four base islands are arranged in a lateral arrangement and L-shaped layout, so that the volume is reduced and the high-density layout requirement is met. Meanwhile, the long-strip-shaped connecting parts, i.e. a first connecting part, a second connecting part and a third connecting part, and multiple long-strip-shaped holes form heat dissipation channels, so that the heat dissipation area loss caused by miniaturization is compensated, and the heat conduction efficiency is improved. The second base island is located between the first base island and an extension part; the second base island is provided with an expansion fin close to the side of the third base island, so that the second base island can be electrically connected with a jumper D conveniently, and the heat dissipation area is increased and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a small short-pin rectifier bridge. Background Technology

[0002] A rectifier bridge is a bridge circuit composed of four diodes, mainly used to convert alternating current (AC) into direct current (DC). Its working principle is to convert both the positive and negative half-cycles of the alternating current into pulsating DC output in the same direction through the unidirectional conduction characteristics of the diodes.

[0003] With the development of technology, consumer electronics products such as smart TVs and fast charging adapters are becoming thinner and lighter, requiring the flattening of internal components. For example, the YBS6 series surface-mount rectifier bridge has a 21% smaller size, effectively adapting to the high-density layout requirements of TV power modules. However, the heat dissipation area is drastically reduced under miniaturization. Therefore, how to meet space requirements while ensuring heat dissipation efficiency in the context of miniaturization is a key technical problem that needs to be solved in this project. Utility Model Content

[0004] To address the above problems, this utility model provides a compact, high-efficiency, small short-pin rectifier bridge.

[0005] The technical solution of this utility model is: A small, short-pin rectifier bridge, comprising: The first base island includes a first connecting part and a first pin connected in sequence; the first connecting part is elongated. The second base island is disposed on the side of the first base island; it includes a second connecting part and a second pin connected in sequence; one end of the second connecting part is provided with a first chip mounting position, and the other end is provided with an elongated hole A; The third base island is located on the side of the first base island; it includes a third connecting part, an extension part, and a third pin connected in sequence; one end of the third connecting part is provided with a second chip mounting position, and the other end is provided with an elongated hole B; the extension part is provided with an elongated hole C; The fourth base island is located on the side of the third base island; it includes a fourth connecting part A, a fourth connecting part B and a fourth pin connected in sequence; the fourth connecting part A is provided with a third chip mounting position; the fourth connecting part B is provided with a fourth chip mounting position; and an elongated hole D is provided between the fourth connecting part A and the fourth connecting part B.

[0006] Specifically, a chip A is bonded to the first chip mounting position; The chip A is electrically connected to the first base island via jumper A.

[0007] Specifically, the second chip mounting position is provided with a bonded chip B; The chip B is electrically connected to the first base island via jumper B.

[0008] Specifically, a chip C is bonded to the third chip mounting position; The chip C is electrically connected to the third base island via jumper C.

[0009] Specifically, the fourth chip mounting position is provided with a bonded chip D; The chip D is electrically connected to the second base island via jumper D.

[0010] Specifically, the lateral width of the fourth connecting part A is equal to the lateral width of the fourth connecting part B.

[0011] Specifically, a transition portion is provided between the fourth connecting portion A and the fourth connecting portion B; The lateral width of the transition section is smaller than the lateral width of the fourth connecting section A.

[0012] Specifically, the elongated hole D is disposed on the transition section.

[0013] Specifically, the first base island, the second base island, the third base island, and the fourth base island are each encapsulated in a plastic encapsulation. The first pin, the second pin, the third pin, and the fourth pin extend out of the plastic package.

[0014] Specifically, the third base island has an L-shaped structure and is located between the first base island and the fourth base island.

[0015] This invention includes four base islands arranged at intervals: a first base island, a second base island, a third base island, and a fourth base island. The four base islands are arranged laterally in an L-shaped layout, achieving volume reduction and meeting the requirements of high-density layout. Simultaneously, the elongated connecting portions (first, second, and third) and multiple elongated holes form heat dissipation channels, compensating for the heat dissipation area loss caused by miniaturization and improving heat conduction efficiency. The second base island is located between the first base island and the extension portion; the second base island has extension fins near the third base island, which not only facilitates electrical connection with jumper wire D but also increases the heat dissipation area and improves heat dissipation efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the side structure of this utility model; Figure 3 This is a schematic diagram of the mounting structure of chips A, B, C, and D; Figure 4 This is a schematic diagram of the third base island structure; Figure 5 This is a schematic diagram of the structure after plastic sealing; In the diagram, 100 is the first base island, 110 is the first connecting part, and 120 is the first pin. 200 is the second base island, 210 is the second connecting part, 211 is the elongated hole A, and 220 is the second pin. 300 is the third base island, 310 is the third connecting part, 311 is the elongated hole B, 320 is the extension part, 321 is the elongated hole C, and 330 is the third pin. 400 is the fourth base island, 410 is the fourth connection part A, 420 is the fourth connection part B, 430 is the fourth pin, and 440 is the elongated hole D. 510 is chip A, 520 is chip B, 530 is chip C, and 540 is chip D. Detailed Implementation

[0017] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0018] In the description of this utility model, it should be understood that the terms "upper," "lower," "left," "right," "vertical," "horizontal," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0019] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0020] The following is for reference. Figure 1-5 Description according to this utility model; A small, short-pin rectifier bridge, comprising: The first base island 100 includes a first connecting part 110 and a first pin 120 connected in sequence; the first connecting part 110 is elongated; a first elongated hole 111 is provided on the first base island 100 between jumper A and jumper B; The second base island 200 is disposed on the side of the first base island 100; it includes a second connecting part 210 and a second pin 220 connected in sequence; one end of the second connecting part 210 is provided with a first chip mounting position, and the other end is provided with an elongated hole A211; The second base island 200 is located between the first base island 100 and the extension 320; the second base island 200 is provided with an extension fin on the side near the third base island 300, which not only facilitates electrical connection with the jumper D, but also increases the heat dissipation area and improves heat dissipation efficiency. The third base island 300 is disposed on the side of the first base island 100; it includes a third connecting part 310, an extension part 320 and a third pin 330 connected in sequence; one end of the third connecting part 310 is provided with a second chip mounting position and the other end is provided with an elongated hole B311; the extension part 320 is provided with an elongated hole C321. The fourth base island 400 is disposed on the side of the third base island 300; it includes a fourth connecting part A410, a fourth connecting part B420 and a fourth pin 430 connected in sequence; the fourth connecting part A410 is provided with a third chip mounting position; the fourth connecting part B420 is provided with a fourth chip mounting position; and an elongated hole D440 is provided between the fourth connecting part A410 and the fourth connecting part B420.

[0021] The four base islands are arranged laterally in an L-shaped layout to reduce volume and meet the requirements of high-density layout. At the same time, the elongated connecting parts 110, 210, and 310, together with multiple elongated holes, form heat dissipation channels to compensate for the heat dissipation area loss caused by miniaturization and improve heat conduction efficiency.

[0022] The first chip mounting position is provided with a bonded chip A510; The chip A510 is electrically connected to the first base island 100 via jumper A.

[0023] The second chip mounting position is equipped with a bonded chip B520; The chip B520 is electrically connected to the first base island 100 via jumper B.

[0024] The third chip mounting position is provided with a bonded chip C530; The chip C530 is electrically connected to the third base island 300 via jumper C.

[0025] The fourth chip mounting position is provided with a bonded chip D540; The chip D540 is electrically connected to the second base island 200 via jumper D.

[0026] In this case, chips A510, B520, C530, and D540 are all 100mil chips.

[0027] The lateral width of the fourth connecting part A410 is equal to the lateral width of the fourth connecting part B420.

[0028] A transition portion is provided between the fourth connecting portion A410 and the fourth connecting portion B420; The lateral width of the transition section is smaller than the lateral width of the fourth connecting section A410.

[0029] The elongated hole D440 is provided on the transition section.

[0030] The gradient width design of the transition section, combined with the elongated D440 hole, alleviates thermal expansion stress and extends device life.

[0031] The first base island 100, the second base island 200, the third base island 300 and the fourth base island 400 are respectively encapsulated by plastic encapsulation; The first pin 120, the second pin 220, the third pin 330 and the fourth pin 430 extend out of the plastic package.

[0032] The first base island 100, the second base island 200, the third base island 300 and the fourth base island 400 are each made of 0.35mm copper.

[0033] The third base island 300 has an L-shaped structure and is located between the first base island 100 and the fourth base island 400.

[0034] by Figure 5 For example, the horizontal length is 13-14.3mm, the vertical width is 10-11mm, and the thickness is 12.5-3.5mm.

[0035] Regarding the information disclosed in this case, the following points need to be clarified: (1) The accompanying drawings of the embodiments disclosed in this case only involve the structures involved in the embodiments disclosed in this case. Other structures can refer to the general design. (2) Where there is no conflict, the embodiments and features disclosed in this case can be combined with each other to obtain new embodiments; The above are merely specific embodiments disclosed in this case, but the scope of protection of this disclosure is not limited thereto. The scope of protection disclosed in this case shall be determined by the scope of protection of the claims.

Claims

1. A small, short-pin rectifier bridge, characterized in that, include: The first base island (100) includes a first connecting part (110) and a first pin (120) connected in sequence; the first connecting part (110) is elongated. The second base island (200) is disposed on the side of the first base island (100); it includes a second connecting part (210) and a second pin (220) connected in sequence; one end of the second connecting part (210) is provided with a first chip mounting position, and the other end is provided with an elongated hole A (211). The third base island (300) is disposed on the side of the first base island (100); it includes a third connecting part (310), an extension part (320) and a third pin (330) connected in sequence; one end of the third connecting part (310) is provided with a second chip mounting position, and the other end is provided with an elongated hole B (311); the extension part (320) is provided with an elongated hole C (321). The fourth base island (400) is disposed on the side of the third base island (300); it includes a fourth connecting part A (410), a fourth connecting part B (420) and a fourth pin (430) connected in sequence; the fourth connecting part A (410) is provided with a third chip mounting position; the fourth connecting part B (420) is provided with a fourth chip mounting position; and an elongated hole D (440) is provided between the fourth connecting part A (410) and the fourth connecting part B (420).

2. A miniature short-pin rectifier bridge according to claim 1, characterized in that, The first chip mounting position is provided with a chip A (510) that is bonded together. The chip A (510) is electrically connected to the first base island (100) via jumper A.

3. A small short-pin rectifier bridge according to claim 1, characterized in that, The second chip mounting position is provided with a bonded chip B (520); The chip B (520) is electrically connected to the first base island (100) via jumper B.

4. A small short-pin rectifier bridge according to claim 1, characterized in that, The third chip mounting position is provided with a bonded chip C (530). The chip C (530) is electrically connected to the third base island (300) via jumper C.

5. A small short-pin rectifier bridge according to claim 1, characterized in that, The fourth chip mounting position is provided with a bonded chip D (540). The chip D (540) is electrically connected to the second base island (200) via jumper D.

6. A small short-pin rectifier bridge according to claim 1, characterized in that, The lateral width of the fourth connecting part A (410) is equal to the lateral width of the fourth connecting part B (420).

7. A small short-pin rectifier bridge according to claim 1 or 6, characterized in that, A transition section is provided between the fourth connecting part A (410) and the fourth connecting part B (420); The lateral width of the transition section is less than the lateral width of the fourth connecting section A (410).

8. A small short-pin rectifier bridge according to claim 7, characterized in that, The elongated hole D (440) is provided on the transition section.

9. A miniature short-pin rectifier bridge according to claim 1, characterized in that, The first base island (100), the second base island (200), the third base island (300) and the fourth base island (400) are respectively encapsulated by plastic encapsulation; The first pin (120), the second pin (220), the third pin (330) and the fourth pin (430) extend out of the plastic package.

10. A small short-pin rectifier bridge according to claim 1, characterized in that, The third base island (300) has an L-shaped structure and is located between the first base island (100) and the fourth base island (400).

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