Miniaturized moisture-proof packaged temperature sensor probe structure

Abstract

This invention provides a miniaturized, moisture-proof encapsulated temperature sensor probe structure, belonging to the field of encapsulated sensor technology. It includes a main housing assembly and a sensor assembly. The main housing assembly includes a hollow cavity structure outer frame, a support leg at the bottom, and a first and a second heat-conducting sheet on the side wall of the outer frame. The sensor assembly includes a sensor housing, with a support base fixedly installed below the sensor housing and a heat sink fixedly connected to the outside of the sensor housing. This invention uses the outer frame as a basic load-bearing structure, and the support leg raises the distance between the outer frame and the mounting surface, reducing temperature interference and direct moisture erosion from the mounting surface. The first and second heat-conducting sheets quickly conduct the ambient temperature to the core, ensuring a fast temperature response. As a support for the core, they, along with a sealing column, block the intrusion path of external moisture. The heat sink accelerates the dissipation of heat from inside the sensor housing, preventing moisture condensation inside under high temperatures.

Description

Technical Field

[0001] This utility model belongs to the field of packaged sensor technology, specifically relating to a miniaturized moisture-proof packaged temperature sensor probe structure. Background Technology

[0002] Temperature sensors, as key components for acquiring temperature information, are widely used in numerous fields. In industrial production, processes in industries such as chemical engineering, metallurgy, and machinery manufacturing require precise temperature control to ensure product quality and production safety. In the smart home sector, automatic indoor temperature regulation and temperature monitoring of home appliances all rely on temperature sensors. In the medical field, the demand for temperature sensors is also increasing in scenarios such as body temperature detection, drug storage temperature monitoring, and temperature control of medical equipment.

[0003] Some miniaturized temperature sensors on the market, while achieving size reduction, often sacrifice some performance, such as measurement accuracy and response speed. While existing moisture-proof packaging technologies can improve the moisture resistance of temperature sensors to some extent, several problems remain. For example, some packaging materials have limited moisture resistance and are prone to failure after prolonged use in humid environments; some packaging structures are overly complex, increasing production costs and manufacturing difficulty, and also hindering the miniaturization design of sensors. Summary of the Invention

[0004] The purpose of this invention is to provide a miniaturized, moisture-proof encapsulated temperature sensor probe structure, which aims to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: A miniaturized, moisture-proof encapsulated temperature sensor probe structure includes, The main body shell assembly includes an outer frame, a support leg fixedly connected to the bottom of the outer frame, and a first heat-conducting plate and a second heat-conducting plate sequentially disposed on the side wall of the outer frame. A hollow cavity is provided inside the outer frame. The sensor assembly includes a sensor housing fixedly connected inside the outer frame, a support base fixedly installed below the sensor housing, a heat sink fixedly connected to the outside of the sensor housing, and a core inserted into the sealing post, wherein the sealing post is fixedly installed on the outside of the heat sink.

[0006] As a preferred embodiment of this utility model, the core end is inserted into the inner side of the hollow cavity in the side wall of the outer frame, and the first heat-conducting sheet and the second heat-conducting sheet are respectively disposed at both ends of the outer frame.

[0007] As a preferred embodiment of this utility model, the sealing post is sleeved on the side wall of the heat sink, and the sealing post is located on the side away from the sensor housing, and sealant is installed at the connection between the inner side of the sealing post and the outer side wall of the heat sink.

[0008] As a preferred embodiment of this utility model, the lower end of the support base is connected to the bottom of the outer frame, and the support base is symmetrically arranged on the side wall of the sensor housing.

[0009] According to the miniaturized moisture-proof encapsulated temperature sensor probe structure of the claim, the core is characterized in that: a wire is provided inside the core, and one end of the wire is fixedly connected to the side wall of the first heat dissipation fin and the second heat dissipation fin.

[0010] As a preferred embodiment of this utility model, the sensor housing is characterized in that: a first sealing colloid is provided at the upper part of the interior of the sensor housing, a second sealing colloid is provided at the lower part of the interior of the sensor housing, and the interior of the sensor housing is filled with a sealing material, which is filled between the first sealing colloid and the second sealing colloid.

[0011] As a preferred embodiment of this utility model, the core extends through the inside of the sensor housing, and the two ends of the core are respectively fixedly connected to the side walls of the first heat-conducting sheet and the second heat-conducting sheet.

[0012] Compared with the prior art, the beneficial effects of this utility model are: the outer frame serves as the basic load-bearing structure, and the support legs raise the distance between the outer frame and the mounting surface, reducing temperature interference and direct water vapor erosion on the mounting surface; the first and second heat-conducting sheets quickly conduct the temperature of the environment to be measured to the core, ensuring the temperature measurement response speed; as the through support of the core, they work with the sealing column to block the path of external water vapor intrusion; and the heat sink accelerates the dissipation of heat inside the sensor housing, preventing moisture from condensing inside under high temperature conditions. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a frontal cross-sectional view of the present invention. Figure 3 This is a top view cross-sectional structural diagram of the present invention; Figure 4This is a top view of the structure of this utility model from the left side.

[0014] In the diagram: 100, main body shell assembly; 101, outer frame; 102, support leg; 103, first heat-conducting sheet; 104, second heat-conducting sheet; 200, sensor assembly; 201, core; 202, heat sink; 203, sealing column; 204, first sealing gel; 205, second sealing gel; 206, sealing material; 207, wire; 208, sensor shell; 209, support base. Detailed Implementation

[0015] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0016] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0017] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single embodiment or an embodiment selectively excluded from other embodiments. Example

[0018] Reference Figure 1-4 This embodiment of the present invention provides a miniaturized, moisture-proof encapsulated temperature sensor probe structure, comprising: The main body shell assembly 100 includes an outer frame 101, a support leg 102 fixedly connected to the bottom of the outer frame 101, and a first heat-conducting plate 103 and a second heat-conducting plate 104 sequentially disposed on the side wall of the outer frame 101. A hollow cavity is provided inside the outer frame 101. The sensor assembly 200 includes a sensor housing 208 fixedly connected inside the outer frame 101, a support base 209 fixedly installed below the sensor housing 208, a heat sink 202 fixedly connected to the outside of the sensor housing 208, and a core 201 inserted into the sealing post 203. The sealing post 203 is fixedly installed on the outside of the heat sink 202.

[0019] Specifically, the core 201 is inserted into the hollow cavity inside the side wall of the outer frame 101. This connection method ensures a stable fit between the core 201 and the outer frame 101, while also facilitating heat conduction. The first heat-conducting plate 103 and the second heat-conducting plate 104 are respectively disposed at both ends of the outer frame 101, which can evenly distribute heat and improve heat dissipation efficiency. Furthermore, the sealing post 203 is fitted onto the side wall of the heat sink 202 and is located away from the sensor housing 208. Sealing adhesive is installed at the connection between the inner side of the sealing post 203 and the outer side wall of the heat sink 202. This design can effectively enhance the sealing performance and prevent external moisture and other impurities from entering the interior and affecting the operation of the sensor. Preferably, the lower end of the support base 209 is connected to the bottom of the inner frame 101 and is symmetrically arranged on the side wall of the sensor housing 208. The symmetrical structural design can make the sensor housing 208 bear the force evenly, improve the stability of the overall structure, and avoid damage to components caused by uneven force. It should be noted that the core 201 contains a wire 207. One end of the wire 207 is fixedly connected to the side wall of the core 201, and the other end is fixedly connected to the side walls of the first heat-conducting sheet 103 and the second heat-conducting sheet 104. The reasonable arrangement of the wires ensures stable transmission of electrical signals without affecting the compactness of the overall structure. Inside the sensor housing 208, a first sealing gel 204 is located at the top, and a second sealing gel 205 is located at the bottom. The interior is filled with a sealing material 206, which is placed between the first and second sealing gels. This multi-layered sealing structure further enhances the sensor's moisture resistance. The core 201 extends through the interior of the sensor housing 208, with its two ends fixedly connected to the side walls of the first and second heat-conducting sheets 103 and 104, respectively. This connection ensures the stable installation of the core and facilitates rapid heat dissipation through the heat-conducting sheets.

[0020] During use, the temperature sensor probe can be stably installed in the required detection environment, with the support leg 102 providing reliable support to prevent the overall structure from shaking. The core 201 can accurately sense the ambient temperature and transmit the signal to the relevant equipment through the internal wire 207. During operation, the generated heat is transferred through the core 201 to the first heat-conducting plate 103 and the second heat-conducting plate 104, and then dissipated to the outside. At the same time, the sealing structures effectively prevent moisture from entering, ensuring the normal operation of the sensor. In summary, this miniaturized, moisture-proof packaged temperature sensor probe has a reasonable structural design. Through ingenious structural arrangement and multiple sealing designs, it combines good stability, heat dissipation, and moisture resistance, and can meet the temperature detection needs in various scenarios. It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0021] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to implementing the present invention) may be omitted.

[0022] It should be understood that numerous specific implementation decisions can be made during the development of any actual implementation method, and in any engineering or design project. Such development efforts may be complex and time-consuming, but for those of ordinary skill in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0023] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A miniaturized, moisture-proof encapsulated temperature sensor probe structure, characterized in that, include: The main body shell assembly (100) includes an outer frame (101), a support leg (102) fixedly connected to the bottom of the outer frame (101), and a first heat-conducting plate (103) and a second heat-conducting plate (104) sequentially disposed on the side wall of the outer frame (101). A hollow cavity is provided inside the outer frame (101). The sensor assembly (200) includes a sensor housing (208) fixedly connected inside the outer frame (101), a support base (209) fixedly installed below the sensor housing (208), a heat sink (202) fixedly connected to the outside of the sensor housing (208), and a core (201) inserted into the sealing post (203), wherein the sealing post (203) is fixedly installed on the outside of the heat sink (202).

2. The miniaturized, moisture-proof encapsulated temperature sensor probe structure according to claim 1, characterized in that: The core (201) end is inserted into the hollow cavity inside the side wall of the outer frame (101), and the first heat-conducting plate (103) and the second heat-conducting plate (104) are respectively disposed at both ends of the outer frame (101).

3. The miniaturized, moisture-proof encapsulated temperature sensor probe structure according to claim 2, characterized in that: The sealing post (203) is sleeved on the side wall of the heat sink (202), and the sealing post (203) is located on the side away from the sensor housing (208). The inner side of the sealing post (203) is fitted with sealant at the connection between the inner side of the sealing post (203) and the outer side wall of the heat sink (202).

4. The miniaturized, moisture-proof encapsulated temperature sensor probe structure according to claim 3, characterized in that: The lower end of the support base (209) is connected to the bottom of the outer frame (101), and the support base (209) is symmetrically arranged on the side wall of the sensor housing (208).

5. The miniaturized, moisture-proof encapsulated temperature sensor probe structure according to claim 4, characterized in that: The core (201) is provided with a wire (207) inside, and the two ends of the wire (207) are respectively fixedly connected to the side wall of the first heat dissipation fin (103) and the second heat dissipation fin (104).

6. The miniaturized, moisture-proof encapsulated temperature sensor probe structure according to claim 5, characterized in that: The sensor housing (208) has a first sealing colloid (204) at the top inside and a second sealing colloid (205) at the bottom inside. The sensor housing (208) is filled with a sealing material (206) between the first sealing colloid (204) and the second sealing colloid (205).

7. The miniaturized, moisture-proof encapsulated temperature sensor probe structure according to claim 6, characterized in that: The core (201) extends through the inside of the sensor housing (208), and the two ends of the core (201) are fixedly connected to the side walls of the first heat-conducting sheet (103) and the second heat-conducting sheet (104), respectively.

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