High-precision integrated circuit signal testing instrument for smartphones

By designing an integrated circuit signal testing instrument with automatic alignment and flipping, the problems of cumbersome operation and low testing accuracy in the existing technology have been solved, and efficient operation that can adapt to circuit boards of different sizes and perform double-sided testing has been achieved.

CN224594775UActive Publication Date: 2026-08-04SHENZHEN YUSHENG ELECTRONIC TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN YUSHENG ELECTRONIC TECHNOLOGY CO LTD
Filing Date
2025-06-23
Publication Date
2026-08-04

AI Technical Summary

Technical Problem

Existing integrated circuit signal testing instruments for smartphones are cumbersome to operate, affect testing accuracy, cannot be adapted to integrated circuit boards of different sizes, and can only perform single-sided testing.

Method used

An integrated circuit signal testing instrument, comprising a signal tester body and a support platform, was designed. It employs components such as a slide bar, rotating shaft, fixing clamp, cylinder, universal sleeve, and bubble level to achieve automatic alignment and flipping of the integrated circuit board, ensuring that the tester is parallel to the circuit board, adapting to circuit boards of different sizes, and enabling double-sided testing.

Benefits of technology

It achieves convenient operation, improves testing accuracy, can adapt to integrated circuit boards of different sizes and can perform double-sided testing, thus improving testing efficiency.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224594775U_ABST
Patent Text Reader

Abstract

The utility model discloses a high accuracy integrated circuit signal testing instrument for smart phone relates to integrated circuit signal test technical field, including signal testing appearance body and support platform, the support platform on the sliding setting has the slide, rotates and is installed in the slide the pivot, is established in the fixed clamp the clamping groove, is installed on the support platform the upper U type support board, is installed on the upper U type support board the pneumatic cylinder, the universal joint sleeve inside swingly be provided with universal joint adjusting ball, the universal joint sleeve inside screw has fixed bolt, signal testing appearance body with the fixed clamp all are installed with horizontal bubble level and longitudinal bubble level, is installed on the slide the surface changing motor, the pivot's number has a group, a pivot is installed in the output of surface changing motor, the utility model discloses, one test procedure can test the two sides of integrated circuit board, and the operation is relatively convenient, can make signal testing appearance body and integrated circuit board keep the parallel state on the space, avoid signal testing appearance body and integrated circuit board not parallel influence signal testing appearance body's test precision.
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Description

Technical Field

[0001] This utility model relates to the field of integrated circuit signal testing technology, and in particular to a high-precision integrated circuit signal testing instrument for smartphones. Background Technology

[0002] The strength of the integrated circuit signal in a mobile phone is crucial to its usability. A stronger integrated circuit signal results in a faster response time, smoother operation, and a better user experience. Therefore, during the manufacturing process, the signal strength of the integrated circuits on the circuit board needs to be tested to ensure that the signal strength is within a reasonable range.

[0003] The prior art patent CN210927709U discloses a high-precision integrated circuit signal testing instrument for smartphones. This device tests the signal strength of the integrated circuit using an integrated circuit signal tester. However, the device relies on a threaded rod to level the bottom of the device, thus ensuring the integrated circuit signal tester is horizontal. This approach is cumbersome, lacking a leveling and comparison instrument. Furthermore, the device's horizontal alignment does not necessarily equate to the horizontal alignment of the integrated circuit board and the integrated circuit signal tester, affecting testing accuracy. Additionally, the device is not adaptable to fixing integrated circuit boards of different sizes, and can only test one side of the integrated circuit board at a time. Utility Model Content

[0004] The purpose of this invention is to provide a high-precision integrated circuit signal testing instrument for smartphones, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-precision integrated circuit signal testing instrument for smartphones, comprising a signal testing instrument body and a support platform. A slide rod is slidably mounted on the support platform, and a rotating shaft is rotatably mounted inside the slide rod. A fixing clamp is mounted on the rotating shaft, and a slot is provided on the fixing clamp. An upper U-shaped support plate is mounted on the support platform, and a cylinder is mounted on the upper U-shaped support plate. A universal sleeve is mounted on the output end of the cylinder, and a universal adjusting ball is movably mounted inside the universal sleeve. A fixing bolt is screwed into the universal sleeve. A horizontal bubble level and a vertical bubble level are mounted on both the signal testing instrument body and the fixing clamp.

[0006] Preferably, a face-changing motor is mounted on the slide bar, and there is a set of rotating shafts, with one rotating shaft installed at the output end of the face-changing motor.

[0007] Preferably, the support platform has a guide hole, and the slide rod is slidably installed in the guide hole.

[0008] Preferably, a connecting rod is rotatably mounted on the bottom end of the slide rod, and a rotating rod is rotatably mounted on the connecting rod.

[0009] Preferably, a lower U-shaped support plate is installed at the bottom of the support platform, a drive motor is installed on the lower U-shaped support plate, and the rotating rod is installed at the output end of the drive motor.

[0010] Preferably, a limiting groove is formed on the inner wall of the guide hole, and a limiting block is installed on the slide rod, with the limiting block slidably installed in the limiting groove.

[0011] Preferably, a set of retaining blocks is fixedly sleeved on another of the rotating shafts, and the set of retaining blocks are respectively distributed on the front and rear sides of one of the sliding rods, and a support column is installed at the bottom of the support platform.

[0012] The beneficial effects of this utility model are:

[0013] This invention allows one end of an integrated circuit board to be inserted into a slot. A set of sliding rods slide in a guide hole and move closer to each other, which can move the integrated circuit board and insert the other side into a slot belonging to another fixing clip. This allows it to adapt to and fix integrated circuit boards of different sizes. The rotation of the fixing clip can cause the integrated circuit board to flip. One test process can test both sides of the integrated circuit board, making the operation relatively convenient.

[0014] This invention involves observing the positions of the bubbles in the horizontal and vertical bubble levels on the fixed clamp, and then observing the positions of the bubbles in the horizontal and vertical bubble levels on the signal tester body. By twisting the universal adjusting ball within the universal sleeve, the angle of the signal tester body can be adjusted in all directions, ensuring that the positions of the bubbles in the horizontal and vertical bubble levels on the signal tester body are the same as those in the fixed clamp. This allows the signal tester body and the integrated circuit board to maintain a spatially parallel state, preventing the signal tester body from being non-parallel and affecting the testing accuracy of the signal tester body. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the high-precision integrated circuit signal testing instrument for smartphones proposed in this utility model;

[0016] Figure 2 This is a schematic diagram of the fixed clamp, rotating rod, and other structures of the high-precision integrated circuit signal testing instrument for smartphones proposed in this utility model.

[0017] Figure 3 This is a schematic diagram of the support platform, limiting groove, and other structures of the high-precision integrated circuit signal testing instrument for smartphones proposed in this utility model.

[0018] Figure 4This is a schematic diagram of the structure of the high-precision integrated circuit signal testing instrument for smartphones proposed in this utility model, including the universal sleeve and universal adjusting ball.

[0019] In the diagram: 1. Signal tester body; 2. Support platform; 3. Slide rod; 4. Rotating shaft; 5. Fixing clamp; 6. Slot; 7. Upper U-shaped support plate; 8. Cylinder; 9. Universal sleeve; 10. Universal adjusting ball; 11. Fixing bolt; 12. Horizontal bubble level; 13. Longitudinal bubble level; 14. Changing motor; 15. Guide hole; 16. Connecting rod; 17. Rotating rod; 18. Lower U-shaped support plate; 19. Drive motor; 20. Limiting block; 21. Limiting groove; 22. Fixing block; 23. Support column. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Example:

[0022] like Figure 1-4As shown, this embodiment provides a high-precision integrated circuit signal testing instrument for smartphones, including a signal testing instrument body 1 and a support platform 2. A slide rod 3 is slidably arranged on the support platform 2, and a rotating shaft 4 is rotatably installed inside the slide rod 3. A fixing clamp 5 is installed on the rotating shaft 4, and a slot 6 is opened on the fixing clamp 5. An upper U-shaped support plate 7 is installed on the support platform 2, and a cylinder 8 is installed on the upper U-shaped support plate 7. A universal sleeve 9 is installed at the output end of the cylinder 8. A universal adjusting ball 10 is movably arranged inside the universal sleeve 9, and a fixing bolt 11 is screwed into the universal sleeve 9. A horizontal bubble level 12 and a vertical bubble level 13 are installed on both the signal testing instrument body 1 and the fixing clamp 5. When one end of the integrated circuit board is inserted into the slot 6, a set of slide rods 3 slides and moves closer to each other, which can drive the integrated circuit board to move and make its other side insert into the slot 6 of another fixing clamp 5, thereby adapting to and fixing integrated circuit boards of different sizes. At this point, observe the positions of the bubbles in the horizontal bubble level 12 and the vertical bubble level 13 on the fixed clamp 5, and then observe the positions of the bubbles in the horizontal bubble level 12 and the vertical bubble level 13 on the signal tester body 1. Twisting the universal adjusting ball 10 within the universal sleeve 9 allows for universal adjustment of the angle of the signal tester body 1, ensuring that the positions of the bubbles in the horizontal bubble level 12 and the vertical bubble level 13 on the signal tester body 1 are the same as those on the fixed clamp 5. Then, fix the adjusted state of the universal adjusting ball 10 using the fixing bolt 11. This ensures that the signal tester body 1 and the integrated circuit board remain spatially parallel, preventing misalignment from affecting the testing accuracy of the signal tester body 1. During testing, the extension of the cylinder 8 will cause the signal tester body 1 to descend and test the signal strength of the integrated circuit board. After one side of the integrated circuit board is tested, the cylinder 8 retracts, causing the signal tester body 1 to rise. The rotating shaft 4 rotates, which in turn causes the fixing clamp 5 to rotate. The rotation of the fixing clamp 5 can cause the integrated circuit board to flip. One test process can test both sides of the integrated circuit board.

[0023] Specifically, in order to drive the rotating shaft 4 to rotate and flip the integrated circuit board, a flipping motor 14 is installed on the slide bar 3. There is a set of rotating shafts 4, with one rotating shaft 4 installed at the output end of the flipping motor 14. The rotation of the flipping motor 14 will drive the rotating shaft 4 to rotate, and the rotation of the rotating shaft 4 will drive the fixing clamp 5 to rotate, and the rotation of the fixing clamp 5 can flip the integrated circuit board.

[0024] Furthermore, to guide the movement of the slide rod 3, a guide hole 15 is provided on the support platform 2. The slide rod 3 is slidably installed in the guide hole 15. A limit groove 21 is provided on the inner wall of the guide hole 15. A limit block 20 is installed on the slide rod 3 and is slidably installed in the limit groove 21. Since the slide rod 3 is slidably installed in the guide hole 15, the movement of the slide rod 3 can be guided through the guide hole 15, so that the slide rod 3 can only slide along the guide hole 15. Moreover, the sliding of the limit block 20 in the limit groove 21 can play a vertical limiting role for the slide rod 3, which can prevent the slide rod 3 from moving up and down.

[0025] Specifically, to drive a set of clamping clips 5 to hold and fix the integrated circuit board, a connecting rod 16 is rotatably mounted on the bottom end of the slide rod 3, and a rotating rod 17 is rotatably mounted on the connecting rod 16. A lower U-shaped support plate 18 is mounted on the bottom of the support platform 2, and a drive motor 19 is mounted on the lower U-shaped support plate 18. The rotating rod 17 is mounted on the output end of the drive motor 19. The rotation of the drive motor 19 will drive the rotating rod 17 to rotate, and the rotation of the rotating rod 17 will drive the set of connecting rods 16 to rotate. The rotation of the set of connecting rods 16 will pull the set of slide rods 3 to slide in the guide hole 15 and move closer to each other, thereby driving the integrated circuit board to move and insert its other side into the slot 6 of another clamping clip 5, thus adapting to and fixing integrated circuit boards of different sizes.

[0026] Furthermore, in order to support the support platform 2 and limit the movement of the rotating shaft 4, a set of retaining blocks 22 are fixedly sleeved on another rotating shaft 4. The set of retaining blocks 22 are distributed on the front and rear sides of a slide rod 3, and a support column 23 is installed at the bottom of the support platform 2. The support column 23 can provide stable support for the support platform 2, and the retaining blocks 22 can limit the movement of the rotating shaft 4, preventing the rotating shaft 4 from moving back and forth on the slide rod 3.

[0027] Working principle: In use, insert one end of the integrated circuit board into the slot 6, then start the drive motor 19. The rotation of the drive motor 19 will drive the rotating rod 17 to rotate, which in turn will drive a set of connecting rods 16 to rotate. The rotation of the connecting rods 16 will pull a set of sliding rods 3 to slide in the guide hole 15 and move closer to each other, thereby moving the integrated circuit board and inserting its other side into the slot 6 of another fixing clamp 5. This allows for the adaptation and fixing of integrated circuit boards of different sizes. At this time, observe the position of the bubbles in the horizontal bubble level 12 and the vertical bubble level 13 on the fixing clamp 5, and then observe the position of the bubbles in the horizontal bubble level 12 and the vertical bubble level 13 on the signal tester body 1. Twisting the universal adjusting ball 10 in the universal sleeve 9 can universally adjust the angle of the signal tester body 1, and make the horizontal adjustment ball on the signal tester body 1 more directional. The positions of the bubbles in the bubble level 12 and the longitudinal bubble level 13 are the same as those of the bubbles in the transverse bubble level 12 and the longitudinal bubble level 13 on the fixed clamp 5. This ensures that the signal tester body 1 and the integrated circuit board remain parallel in space, preventing the signal tester body 1 from being out of parallel with the integrated circuit board and affecting the testing accuracy of the signal tester body 1. During testing, the extension of the cylinder 8 causes the signal tester body 1 to descend and test the signal strength of the integrated circuit board. After testing one side of the integrated circuit board, the cylinder 8 retracts, causing the signal tester body 1 to rise and activating the face-changing motor 14. The rotation of the face-changing motor 14 causes the rotating shaft 4 to rotate, which in turn causes the fixed clamp 5 to rotate. The rotation of the fixed clamp 5 causes the integrated circuit board to flip. One test cycle can test both sides of the integrated circuit board, making the operation relatively convenient.

[0028] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.

Claims

1. A high-precision integrated circuit signal testing instrument for smartphones, comprising a signal testing instrument body (1) and a support platform (2), characterized in that: A sliding rod (3) is slidably arranged on the support platform (2). A rotating shaft (4) is rotatably installed inside the sliding rod (3). A fixing clamp (5) is installed on the rotating shaft (4). A slot (6) is opened on the fixing clamp (5). An upper U-shaped support plate (7) is installed on the support platform (2). A cylinder (8) is installed on the upper U-shaped support plate (7). A universal sleeve (9) is installed at the output end of the cylinder (8). A universal adjusting ball (10) is movably arranged inside the universal sleeve (9). A fixing bolt (11) is screwed into the universal sleeve (9). A horizontal bubble level (12) and a vertical bubble level (13) are installed on both the signal tester body (1) and the fixing clamp (5).

2. The high-precision integrated circuit signal testing instrument for smartphones according to claim 1, characterized in that: A face-changing motor (14) is installed on the slide bar (3), and there is a set of rotating shafts (4), with one rotating shaft (4) installed at the output end of the face-changing motor (14).

3. The high-precision integrated circuit signal testing instrument for smartphones according to claim 1, characterized in that: The support platform (2) has a guide hole (15), and the slide rod (3) is slidably installed in the guide hole (15).

4. The high-precision integrated circuit signal testing instrument for smartphones according to claim 3, characterized in that: A connecting rod (16) is rotatably mounted on the bottom end of the slide rod (3), and a rotating rod (17) is rotatably mounted on the connecting rod (16).

5. The high-precision integrated circuit signal testing instrument for smartphones according to claim 4, characterized in that: The support platform (2) has a lower U-shaped support plate (18) installed at the bottom, and a drive motor (19) is installed on the lower U-shaped support plate (18). The rotating rod (17) is installed at the output end of the drive motor (19).

6. The high-precision integrated circuit signal testing instrument for smartphones according to claim 3, characterized in that: A limiting groove (21) is provided on the inner wall of the guide hole (15), and a limiting block (20) is installed on the slide rod (3). The limiting block (20) is slidably installed in the limiting groove (21).

7. The high-precision integrated circuit signal testing instrument for smartphones according to claim 1, characterized in that: A set of retaining blocks (22) is fixedly sleeved on another rotating shaft (4). The set of retaining blocks (22) are respectively distributed on the front and rear sides of a slide rod (3). A support column (23) is installed at the bottom of the support platform (2).