Dual inverter and electric drive system

Abstract

The application relates to the technical field of inverters, and provides a double inverter and an electric drive system. The double inverter comprises two inverter modules arranged in a shell, a cooling partition member is further arranged in the shell, the two inverter modules are arranged symmetrically on two sides of the cooling partition member, and each inverter module comprises a power board, a drive board and a control board which are sequentially stacked, and at least the power board and the drive board are arranged in close contact with each other; the two inverter modules are connected in parallel with a group of DC busbars, and are connected with two groups of AC busbars respectively. The double inverter provided by the application realizes a compact and reliable structure through the stacked design of the inverter modules and the symmetry design with respect to the cooling partition member, and can realize efficient heat management and superior electrical performance. The double inverter provided by the application can be applied to an electric drive system and meet the requirements of high power and complex working conditions.

Description

Technical Field

[0001] This application relates to the field of inverter technology, and more specifically, to dual inverters and electric drive systems. Background Technology

[0002] As market demand for inverter power continues to increase and the requirements for electric drive systems become more stringent, dual inverters have emerged. A dual inverter contains two inverter modules that can convert DC power supplied by a battery into AC power, driving the motor independently or collaboratively, increasing motor power, and enabling complex drive modes.

[0003] However, designing the spatial layout and thermal management of dual inverters to facilitate their application in electric drive systems remains a challenge.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0005] This application provides a dual inverter and an electric drive system configured with the dual inverter, which enables a compact and reliable structural design, as well as efficient thermal management and superior electrical performance.

[0006] According to one aspect of this application, a dual inverter is provided, comprising two inverter modules disposed in a housing, wherein: a cooling baffle is further disposed in the housing, the two inverter modules are attached to both sides of the cooling baffle and arranged symmetrically about the cooling baffle, each inverter module includes a power board, a drive board and a control board stacked sequentially, wherein at least the power board and the drive board are attached to each other; the two inverter modules are connected in parallel to a set of DC buses and are respectively connected to two sets of AC buses.

[0007] In some embodiments, the DC busbar is disposed on one side of the cooling baffle, and the housing is provided with a DC busbar interface exposing the DC busbar.

[0008] In some embodiments, the dual inverter further includes a capacitor assembly encapsulated in the cavity of the cooling baffle and connected to the DC bus and the inverter module.

[0009] In some embodiments, the capacitor assembly is laid flat within the cavity of the cooling baffle.

[0010] In some embodiments, the dual inverter further includes a DC filter assembly disposed on one side of the cooling baffle and connected to the DC busbar and the capacitor assembly.

[0011] In some embodiments, the DC filter assembly is provided with a plurality of first mounting points.

[0012] In some embodiments, the AC busbar is disposed at one end of the inverter module, and the housing is provided with an AC busbar interface exposing the AC busbar; wherein the AC busbar extends from the end of the inverter module and is bent to align with the AC busbar interface.

[0013] In some embodiments, nuts are provided on the DC busbar and the AC busbar.

[0014] In some embodiments, the dual inverter further includes a signal connector, and the housing is provided with a signal interface for the signal connector to be inserted into, and the signal connector is connected to the inverter module.

[0015] In some embodiments, the signal connector is connected to the control board of one of the inverter modules, and the control boards of the two inverter modules are connected by a flexible busbar.

[0016] In some embodiments, the signal connector, the DC busbar connector of the DC busbar, and the AC busbar connector of the AC busbar are respectively disposed in different areas of the housing.

[0017] In some embodiments, the signal connector and the DC bus connector are located in housing areas corresponding to both sides of the cooling baffle; the AC bus connector is located in housing areas corresponding to the ends of the cooling baffle.

[0018] In some embodiments, the driver board and the power board are bonded together by a plate-shaped electrical connector, and the power board is formed as a chip-embedded circuit board; the driver board and the control board are spaced apart.

[0019] In some embodiments, the cooling baffle is provided with embedded threaded sleeves on both sides. The control board and the cooling baffle are mechanically connected and spaced apart by screws engaging with the embedded threaded sleeves, and the control board and the drive board are mechanically connected and spaced apart.

[0020] In some embodiments, each inverter module further includes a cooler disposed between the power board and the cooling baffle.

[0021] In some embodiments, the cooling baffle is provided with an inlet and an outlet communicating with its inner cavity, and the inlet and the outlet are distributed on both sides of the cooling baffle.

[0022] In some embodiments, the housing is provided with transition channels that communicate with the liquid inlet and the liquid outlet respectively.

[0023] In some embodiments, the inlet and the outlet are each provided with a plurality of second mounting points.

[0024] In some embodiments, the cooling baffle has a plurality of third mounting points on its side.

[0025] According to another aspect of this application, an electric drive system is provided, the electric drive system being configured with a dual inverter as described in any of the above embodiments; wherein the dual inverter is mounted on the motor of the electric drive system via a housing, one set of DC buses of the dual inverter is connected to the battery of the electric drive system, and two sets of AC buses of the dual inverter are respectively connected to the motor.

[0026] The beneficial effects of this application compared to the prior art include at least the following:

[0027] The two inverter modules are fitted together on both sides of the cooling baffle to achieve efficient heat dissipation and compact layout. The two inverter modules are symmetrically arranged about the cooling baffle, which is conducive to the uniform distribution of thermal and mechanical stress and achieves thermal and mechanical balance.

[0028] Each inverter module includes a power board, a driver board, and a control board, enabling independent driving and control of each module. This allows the two inverters to achieve electrical performance independently or collaboratively as needed. Within each inverter module, the power board and driver board are bonded together using a stacking process, which effectively reduces axial dimensions, achieving a compact design, and significantly shortens the path between the drive signal and the power circuit, thus improving electrical performance.

[0029] Two inverter modules are connected in parallel to a set of DC buses to share DC power; the two inverter modules are each connected to two sets of AC buses, so that the output of the dual inverters can independently or collaboratively control one or more loads, increase power, and realize multiple drive modes.

[0030] The dual inverter of this application achieves a compact and reliable structure through a stacked design of the inverter modules and a symmetrical design of the cooling baffles, while also enabling efficient thermal management and superior electrical performance. This dual inverter can be applied in electric drive systems, power generation systems, energy storage systems, and other scenarios to meet the demands of high power and complex operating conditions.

[0031] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0032] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0033] Figure 1 This document shows a schematic diagram of the dual inverter structure in an embodiment of this application.

[0034] Figure 2 This diagram shows a schematic of the dual inverter structure with the housing hidden in an embodiment of this application.

[0035] Figure 3 This diagram shows an exploded view of the inverter module and cooling baffle in an embodiment of this application.

[0036] Figure 4 This invention provides a schematic diagram showing the layout of the mounting points for the dual inverters in an embodiment of this application.

[0037] Figure 5 This diagram shows the rear structure of the housing in an embodiment of this application. Detailed Implementation

[0038] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0039] The accompanying drawings are merely illustrative of this application and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar structures, and therefore, repeated descriptions of them will be omitted.

[0040] The use of terms such as "first," "second," and similar words in the specific description does not indicate any order, quantity, or importance, but is merely used to distinguish different components. The terms "front," "back," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The term "multiple" means two or more, unless otherwise explicitly specified. Furthermore, in the description of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be a connection within two elements.

[0041] It should be noted that, unless otherwise specified, the embodiments of this application and the features in different embodiments can be combined with each other.

[0042] Figure 1 The diagram illustrates the structure of the dual inverter in the embodiments of this application. Figure 2 This illustration shows the structure of the dual inverter with its housing hidden in an embodiment of this application. Figure 3 The diagram illustrates the exploded structure of the inverter module and cooling baffle in the embodiments of this application; combined with Figures 1 to 3 As shown, the dual inverter provided in this application embodiment includes two inverter modules 100 and a cooling baffle 200 disposed in a housing 300. The two inverter modules 100 are attached to both sides of the cooling baffle 200 and arranged symmetrically about the cooling baffle 200. Each inverter module 100 includes a power board 110, a drive board 120 and a control board 130 stacked in sequence, wherein at least the power board 110 and the drive board 120 are attached to each other. The two inverter modules 100 are connected in parallel to a set of DC busbars 310 and are respectively connected to two sets of AC busbars 320.

[0043] Two inverter modules 100 are fitted together on both sides of the cooling baffle 200 to achieve efficient heat dissipation and compact layout of the two inverter modules 100; the two inverter modules 100 are symmetrically arranged about the cooling baffle 200, which is conducive to the uniform distribution of thermal stress and mechanical stress, and to achieve thermal balance and mechanical balance.

[0044] Each inverter module 100 includes a power board 110, a drive board 120, and a control board 130, enabling independent driving and control of each inverter module 100. This allows the two inverters to achieve electrical performance independently or collaboratively as needed. In each inverter module 100, the power board 110 and the drive board 120 are bonded together using a stacking process, which effectively reduces axial dimensions, achieving a compact design, and significantly shortens the path between the drive signal and the power circuit, thus improving electrical performance.

[0045] Two inverter modules 100 are connected in parallel to a set of DC busbars 310 to share DC power; the two inverter modules 100 are respectively connected to two sets of AC busbars 320, so that the output of the dual inverters can independently or collaboratively control one or more loads (such as the two windings of a motor), increase power, and realize multiple drive modes.

[0046] Therefore, the dual inverter of this application, through the stacked design of the inverter module 100 and the symmetrical design of the cooling baffle 200, achieves a compact and reliable structure, and enables efficient thermal management and superior electrical performance. The dual inverter of this application can be applied in scenarios such as electric drive systems, power generation systems, and energy storage systems, meeting the requirements of high power and complex operating conditions.

[0047] In some embodiments, the DC busbar 310 is disposed on one side of the cooling baffle 200, which can optimize the wiring path of the external wiring harness; the housing 300 is provided with a DC busbar interface 311 exposing the DC busbar 310, which facilitates the installation and maintenance of the wiring harness.

[0048] In some embodiments, the dual inverter also includes a capacitor assembly (not specifically shown) encapsulated within the cavity of the cooling partition 200 and connected to the DC bus 310 and the inverter module 100. Integrating the capacitor assembly into the interior of the cooling partition 200 saves space and further enables a compact design; in addition, the coolant in the cooling partition 200 can be used to efficiently cool the capacitor assembly, improving reliability.

[0049] In some embodiments, the capacitor assembly is laid flat within the cavity of the cooling baffle 200 to minimize the axial dimension of the dual inverter, thereby effectively reducing the axial dimension of the electric drive system when applied to it, achieving a thin design. Furthermore, the flat placement facilitates full contact between the capacitor assembly and the coolant, improving heat dissipation.

[0050] In some embodiments, the dual inverter further includes a DC filter assembly 360, which is disposed on one side of the cooling baffle 200 and connected to the DC bus 310 and the capacitor assembly. The DC filter assembly 360 may include a magnetic ring, a Y-capacitor, etc., to perform filtering, ensuring that the DC power input from the outside is filtered by the DC filter assembly 360 before entering the capacitor assembly and inverter module 100, providing optimal EMC (electromagnetic compatibility) performance for the system. The DC filter assembly 360 can be soldered to the leads of the DC bus 310 and the capacitor assembly to ensure reliable connection.

[0051] Figure 4 The diagram illustrates the layout of the mounting points for the dual inverters in this embodiment of the application, combined with... Figures 1 to 4 As shown, in some embodiments, the DC filter component 360 is provided with multiple first mounting points 410, which enable the DC filter component 360 to perform connection functions such as installation and grounding when the dual inverter is applied to scenarios such as electric drive systems. Multiple first mounting points 410 can ensure the stability of the DC filter component 360 in vibration environments, prevent abnormal noise or connection failure due to loosening, and thus ensure the EMC filtering effect.

[0052] In some embodiments, the AC busbar 320 is disposed at one end of the inverter module 100, and the housing 300 is provided with an AC busbar interface 322 exposing the AC busbar 320; wherein, the AC busbar 320 extends from the end of the inverter module 100 and is bent to align with the AC busbar interface 322. The bent design of the AC busbar 320 facilitates connection to the motor busbar of the electric drive system. In practical applications, the motor busbar can be modified appropriately so that the AC busbar 320 can be connected to the motor busbar in the simplest way.

[0053] In some embodiments, nuts (313, 323) are provided on the DC busbar 310 and the AC busbar 320. Pre-setting the nuts (313, 323) on the busbars facilitates connection with external wiring harnesses, simplifies assembly operations, and improves production efficiency and maintenance convenience.

[0054] In some embodiments, the dual inverter further includes a signal connector 350. The housing 300 is provided with a signal interface 355 for the signal connector 350 to be inserted into. The signal connector 350 is connected to the inverter module 100. The signal connector 350 enables communication between the dual inverter and a vehicle controller (e.g., a domain controller), achieving a reliable connection using a standard signal connector 350.

[0055] In some embodiments, the signal connector 350 is connected to the control board 130 of one inverter module 100, and the control boards 130 of two inverter modules 100 are connected by a flexible busbar. Thus, only one signal connector 350 is needed to control the dual inverters, saving the number of components. Furthermore, the control boards 130 are interconnected by a flexible busbar, achieving a highly reliable, vibration-resistant, and space-saving communication connection.

[0056] In some embodiments, the signal connector 355, the DC bus connector 311, and the AC bus connector 322 of the AC bus 320 are separately disposed in different areas of the housing 300 to achieve physical isolation between the interfaces, facilitate wiring, avoid electromagnetic interference, and improve the system's EMC performance and safety.

[0057] In some embodiments, refer to Figure 4 As shown, the signal connector 355 and the DC bus connector 311 are located in the housing areas corresponding to both sides (200a, 200b) of the cooling baffle 200; the AC bus connector 322 is located in the housing area corresponding to one end (200c) of the cooling baffle 200. The position of the signal connector 355 can be adjusted as needed; for example, it can also be arranged in the housing area corresponding to the other end (200d) of the cooling baffle 200, as long as it meets the layout requirements of scenarios such as electric drive systems used in dual inverters, making the wiring reasonable and simple.

[0058] Continue to combine Figures 1 to 4 As shown, in some embodiments, the driver board 120 and the power board 110 are bonded together via a plate-shaped electrical connector (not specifically shown in the figure) to achieve electrical connection and mechanical support; the power board 110 is formed as a chip-embedded circuit board so that its two sides are respectively bonded to the driver board 120 and the cooling partition 200. Specifically, six SiC chips can be embedded in the power board 110, but this is not a limitation. The driver board 120 and the control board 130 are spaced apart to leave space for surface-mounted electronic components.

[0059] In some embodiments, the cooling baffle 200 is provided with embedded threaded sleeves 220 on both sides. The control plate 130 and the cooling baffle 200 are mechanically connected and spaced apart by screws 222 engaging with the embedded threaded sleeves 220. The mechanical connection and spaced apartness between the control plate 130 and the drive plate 120 are also achieved by screws 222 engaging with the embedded threaded sleeves 220. This achieves mechanical fixation and precise spacing maintenance between the control plate 130, the drive plate 120, and the cooling baffle 200 in a simple, reliable, and low-cost manner. In other embodiments, the mechanical connection and spaced apartness can also be achieved by a frame disposed between the control plate 130 and the drive plate 120 / cooling baffle 200.

[0060] In some embodiments, each inverter module 100 further includes a cooler 140, which is disposed between the power board 110 and the cooling partition 200, which can further enhance the heat dissipation of the power chip and ensure that its temperature is controllable under extremely high loads.

[0061] In some embodiments, the cooling baffle 200 is provided with an inlet 250 and an outlet 260 communicating with its inner cavity. The inlet 250 and outlet 260 are distributed on both sides of the cooling baffle 200, which facilitates uniform flow of coolant within the cavity of the cooling baffle 200 and improves the cooling effect. The positions of the inlet 250 and outlet 260 can be adjusted and interchanged as needed.

[0062] In some embodiments, the housing 300 is provided with transition channels that communicate with the liquid inlet 250 and the liquid outlet 260 respectively, so as to enable the external cooling circuit to be connected to the liquid inlet 250 and the liquid outlet 260.

[0063] In some embodiments, the inlet 250 and the outlet 260 are respectively provided with a plurality of second mounting points 420, which enable the installation and connection function of the inlet 250 and the outlet 260 when the dual inverter is applied to scenarios such as electric drive systems, so as to prevent the joint from loosening under vibration and causing coolant leakage, thereby improving the reliability of the system.

[0064] In some embodiments, the cooling baffle 200 is provided with a plurality of third mounting points 430 on its side, which enable the installation and connection of the cooling baffle 200 when the dual inverter is applied to scenarios such as electric drive systems, thereby improving the reliability of the system.

[0065] In some embodiments, for the purpose of facilitating the cooperation between the cooling partition 200 and the inverter module 100 and facilitating the installation of the liquid cooling system, one or more additional cooling plates 200' may be provided and sandwiched between the cooling partition 200 and the inverter module 100.

[0066] In addition, refer to Figure 5 The back structure of the housing 300 is shown. The back of the housing 300 is provided with a mounting cavity 380 for assembling the housing 300 with components such as the motor of the electric drive system.

[0067] This application also provides an electric drive system, which is configured with dual inverters as described in any of the above embodiments; wherein, the dual inverters are mounted on the motor of the electric drive system through a housing 300, one set of DC busbars 310 of the dual inverters is connected to the battery of the electric drive system, and the two sets of AC busbars 320 of the dual inverters are respectively connected to the motor of the electric drive system.

[0068] The electric drive system utilizes a dual-inverter inverter module 100 to efficiently convert DC power supplied by the battery into AC power, driving the motor independently or collaboratively, increasing motor power, enabling complex drive modes, and meeting various operating conditions. Furthermore, the stacked design of the inverter module 100 and the symmetrical design of the cooling baffle 200 achieve a compact and reliable structure, effectively shortening the axial dimension of the motor, enabling miniaturization, efficient thermal management, and superior electrical performance.

[0069] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.

Claims

1. A dual inverter, comprising two inverter modules disposed in a housing, characterized in that: The housing is also provided with a cooling baffle, and the two inverter modules are attached to both sides of the cooling baffle and arranged symmetrically about the cooling baffle. Each inverter module includes a power board, a drive board and a control board stacked in sequence, wherein at least the power board and the drive board are attached to each other. The two inverter modules are connected in parallel to a set of DC busbars and are also connected to two sets of AC busbars respectively.

2. The dual inverter of claim 1, wherein, The DC busbar is located on one side of the cooling baffle, and the housing has a DC busbar interface that exposes the DC busbar.

3. The dual inverter of claim 1, wherein, It also includes a capacitor assembly, which is encapsulated in the cavity of the cooling baffle and connected to the DC bus and the inverter module.

4. The dual inverter of claim 3, wherein, The capacitor assembly is laid flat in the cavity of the cooling baffle.

5. The dual inverter of claim 3, wherein, It also includes a DC filter assembly, which is disposed on one side of the cooling baffle and connected to the DC busbar and the capacitor assembly.

6. The dual inverter of claim 5, wherein, The DC filter component is provided with multiple first mounting points.

7. The dual inverter of claim 1, wherein, The AC busbar is located at one end of the inverter module, and the housing is provided with an AC busbar interface that exposes the AC busbar; The AC busbar extends from the end of the inverter module and is then bent to align with the AC busbar interface.

8. The dual inverter of claim 1, wherein, Nuts are provided on the DC busbar and the AC busbar.

9. The dual inverter of claim 1, wherein, It also includes a signal connector, and the housing is provided with a signal interface for the signal connector to be inserted into, and the signal connector is connected to the inverter module.

10. The dual inverter of claim 9, wherein, The signal connector is connected to the control board of one of the inverter modules, and the control boards of the two inverter modules are connected by a flexible busbar.

11. The dual inverter of claim 9, wherein, The signal connector, the DC busbar connector of the DC busbar, and the AC busbar connector of the AC busbar are respectively located in different areas of the housing.

12. The dual inverter of claim 11, wherein, The signal connector and the DC bus connector are located in the housing area corresponding to both sides of the cooling baffle. The AC busbar interface is located in the housing area corresponding to the end of the cooling baffle.

13. The dual inverter of claim 1, wherein, The driver board and the power board are bonded together by a plate-shaped electrical connector, and the power board is formed as a chip-embedded circuit board. The drive board and the control board are spaced apart.

14. The dual inverter of claim 13, wherein, The cooling baffle is provided with embedded threaded sleeves on both sides. The control board and the cooling baffle are mechanically connected and spaced apart by screws engaging with the embedded threaded sleeves, and the control board and the drive board are mechanically connected and spaced apart.

15. The dual inverter of claim 13, wherein, Each inverter module also includes a cooler, which is fitted between the power board and the cooling baffle.

16. The dual inverter of claim 1, wherein, The cooling baffle is provided with an inlet and an outlet communicating with its inner cavity, and the inlet and outlet are distributed on both sides of the cooling baffle.

17. The dual inverter of claim 16, wherein, The housing is provided with transition channels that communicate with the liquid inlet and the liquid outlet respectively.

18. The dual inverter of claim 16, wherein, The inlet and outlet are each provided with multiple second mounting points.

19. The dual inverter of claim 1, wherein, The cooling baffle has multiple third mounting points on its side.

20. An electric drive system characterized by, It is equipped with a dual inverter as described in any one of claims 1 to 19; The double inverters are assembled on the motor of the electric driving system through the shell, a group of DC busbars of the double inverters are connected with the battery of the electric driving system, and two groups of AC busbars of the double inverters are connected with the motor respectively.

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