PCB power cord solder structure and power adapter

Abstract

This invention provides a PCB power cord soldering structure and a power adapter. The PCB power cord soldering structure includes: a PCB board (1), comprising a board body (11) and a planar pad (13) on a first side of the board body (11) surface (12); and a power cord (2), disposed on one side of the PCB board (1) and soldered along the board surface (12) onto the planar pad (13). According to the PCB power cord soldering structure of this invention, soldering is simple and convenient, and the soldering defect rate is low.

Description

Technical Field

[0001] This utility model relates to the field of power line soldering technology for PCB boards, and more specifically, to a PCB power line soldering structure and a power adapter. Background Technology

[0002] In the manufacturing of electronic devices, the connection between power cables and PCBs (Printed Circuit Boards) is a crucial assembly step. Traditionally, the connection is achieved by creating through-holes on the PCB, through which the power cable passes and forms solder joints. Specifically, workers or automated equipment first straighten the power cable, ensuring it passes through the through-holes on the PCB, and then form a circular pyramid-shaped solder joint on the other side to connect the power cable to the PCB pads.

[0003] Soldering power cables to the PCB using the above method requires the power cables to pass through through-holes on the PCB before soldering can be performed, which is difficult and results in a high rate of soldering defects. Utility Model Content

[0004] The main purpose of this utility model is to provide a PCB power cord soldering structure and a power adapter, which is simple and convenient to solder and has a low soldering defect rate.

[0005] To achieve the above objectives, according to one aspect of the present invention, a PCB power line soldering structure is provided, comprising: a PCB board, including a board body and a planar pad on a first side of the board body; and a power line disposed on one side of the PCB board and soldered along the board surface to the planar pad.

[0006] Furthermore, the planar pads include a first pad and a second pad spaced apart, and the power line includes a negative electrode and a positive electrode. The negative electrode is soldered to the first pad, and the positive electrode is soldered to the second pad. A solder resist protrusion is provided between the first pad and the second pad, and the negative electrode and the positive electrode are separated by the solder resist protrusion.

[0007] Furthermore, the plate surface is recessed to form a welding groove, the flat solder pad is located in the welding groove, and a solder resist protrusion is formed between two adjacent welding grooves.

[0008] Furthermore, an avoidance notch is formed on one side of the board, and a planar solder pad is set in the area corresponding to the avoidance notch. The power line includes a soldering section and a wire body. The wire body connected to the soldering section is located inside the avoidance notch, and the solder resist protrusion extends from the board body laterally toward the avoidance notch.

[0009] Furthermore, the line body is routed around the second side of the plate body through the avoidance gap, wherein the first side and the second side of the plate body are opposite to each other.

[0010] Furthermore, components are provided on the second side of the board.

[0011] Furthermore, the planar pads are comb-shaped.

[0012] Furthermore, the PCB power line soldering structure also includes a housing, with the PCB board set inside the housing, the power lines passing through the housing, and the portion of the power lines located inside the housing soldered to the planar pads.

[0013] Furthermore, the portion of the power cord located inside the housing is fixed to the housing by adhesive; or, the portion of the power cord located inside the housing is fixed to the PCB board and the housing by adhesive.

[0014] According to another aspect of the present invention, a power adapter is provided, including a PCB power line soldering structure, wherein the PCB power line soldering structure is the PCB power line soldering structure described above.

[0015] By applying the technical solution of this utility model, the power cord is directly soldered to the PCB board surface using planar solder pads instead of traditional through-hole soldering. This eliminates the need for through-hole solder pads, and the power cord does not need to pass through the through-holes on the PCB board during the soldering process. Instead, it is directly soldered to the planar solder pads on the PCB board surface, eliminating the difficult through-hole operation, significantly simplifying the soldering process, reducing the number of operation steps, lowering the operation difficulty, and reducing the soldering defect rate. This achieves a faster and more reliable connection between the power cord and the PCB board, greatly improving the efficiency and quality of electronic equipment assembly. Attached Figure Description

[0016] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0017] Figure 1 A schematic diagram of the PCB board and power line welding structure according to an embodiment of the present invention is shown.

[0018] Figure 2 A schematic diagram of the pad structure of a PCB power line soldering structure according to an embodiment of the present invention is shown.

[0019] Figure 3 A schematic diagram of the assembly structure of a PCB power line soldering structure according to an embodiment of the present invention is shown; and

[0020] Figure 4 A schematic diagram of the internal structure of a PCB power line soldering structure according to an embodiment of the present invention is shown.

[0021] The above figures include the following reference numerals:

[0022] 1. PCB board; 11. Board body; 12. Board surface; 13. Planar pad; 131. First pad; 132. Second pad; 14. Solder mask bump; 15. Component; 16. Clearance notch; 2. Power line; 21. Negative terminal; 22. Positive terminal; 23. Soldering section; 24. Line body; 3. Housing. Detailed Implementation

[0023] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0024] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0025] In this utility model, unless otherwise stated, directional terms such as "upper" and "lower" are generally used in relation to the direction shown in the accompanying drawings, or in relation to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" are generally used in relation to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0026] See also Figures 1 to 4 As shown, according to an embodiment of the present invention, the PCB power line soldering structure includes: a PCB board 1, including a board body 11 and a planar pad 13 on a board surface 12 located on a first side of the board body 11; and a power line 2, disposed on one side of the PCB board 1 and soldered along the board surface 12 onto the planar pad 13.

[0027] In the PCB power cord soldering structure of this utility model, the power cord 2 is directly soldered to the surface 12 of the PCB board 1 using a flat solder pad 13, instead of the traditional through-hole soldering. The through-hole solder pad is eliminated, and the power cord 2 does not need to pass through the through hole on the PCB board 1 during the soldering process. Instead, it is directly soldered to the flat solder pad 13 on the surface 12 of the PCB board 1. This eliminates the difficult through-hole operation, significantly simplifies the soldering process, reduces the number of operation steps, reduces the operation difficulty, and at the same time reduces the soldering defect rate. This achieves a faster and more reliable connection between the power cord 2 and the PCB board 1, and greatly improves the efficiency and quality of electronic equipment assembly.

[0028] In one embodiment, a component 15 is provided on the second side 17 of the board 11, and the component 15 and the planar pad 13 are respectively located on two opposite sides of the board 11.

[0029] The second side 17 of the board 11 is equipped with components 15, while the planar pads 13 are placed on the opposite first side. This double-sided, opposite-side layout enables independent operation of power line 2 soldering and component 15 installation, avoids interference of components with the soldering structure, makes the arrangement of planar pads 13 more flexible, greatly simplifies the complexity of power line soldering, and improves production efficiency and overall design flexibility of the circuit board.

[0030] In one embodiment, the planar pad 13 includes a first pad 131 and a second pad 132 spaced apart, and the power line 2 includes a negative electrode 21 and a positive electrode 22. The negative electrode 21 is soldered to the first pad 131, and the positive electrode 22 is soldered to the second pad 132. A solder resist protrusion 14 is provided between the first pad 131 and the second pad 132, and the negative electrode 21 and the positive electrode 22 are separated by the solder resist protrusion 14.

[0031] By dividing the planar pad 13 into a first pad 131 and a second pad 132, and using solder mask protrusion 14 to form a physical isolation between them, when the power line 2 is led out from the planar pad 13 to the side where the component 15 is located, the solder mask protrusion 14 automatically separates the two power lines 2. This structurally avoids the risk of short circuit on the inner side of the tin-plated end, effectively preventing short circuits that may occur between the negative terminal 21 and the positive terminal 22 of the power line 2 during the soldering process. This not only greatly simplifies the soldering process between the power line and the PCB board, but also significantly enhances electrical safety, ensuring the efficiency of the soldering operation and the reliability of the product.

[0032] In one embodiment, the plate surface 12 is recessed to form a welding groove, the flat pad 13 is located in the welding groove, and a solder resist protrusion 14 is formed between two adjacent welding grooves.

[0033] In this embodiment, during the design process of PCB board 1, by making the board surface 12 of PCB board recessed in the welding area to form a welding groove, the planar solder pad 13 can be placed in the groove. The solder resist protrusion 14 naturally formed between adjacent welding grooves serves as insulation isolation, thereby achieving precise positioning and effective prevention of short circuits during the power line welding process, optimizing welding quality and production efficiency, and reducing the amount of solder used.

[0034] In one embodiment, on the side of the soldering groove near the power line 2, the board 11 has a clearance notch 16. The clearance notch 16 provides space for the routing of the power line 2, allowing the power line 2 to reach the side of the planar pad 13 from the clearance notch 16 on the side where the component 15 is located. This facilitates the soldering of the power line 2 to the planar pad 13, while eliminating the need for additional space to accommodate the routing of the power line 2, resulting in a more compact structure.

[0035] In one embodiment, a clearance notch 16 is formed on one side of the board 11, and a planar pad 13 is provided in the area corresponding to the clearance notch 16. The power line 2 includes a soldering section 23 and a line body 24. The line body 24 connected to the soldering section 23 is located inside the clearance notch 16, and the solder resist protrusion 14 protrudes from the board 11 laterally toward the clearance notch 16.

[0036] In this embodiment, by opening a clearance notch 16 on one side of the board body 11 and setting a planar pad 13 on the board surface 12 at the corresponding position of the clearance notch 16, the soldering segment 23 of the power line 2 can be directly placed at the soldering position and soldered to the planar pad 13 without passing through the traditional through holes of the PCB board. The line 24 is naturally housed in the clearance notch 16, avoiding the complicated operation caused by traditional through holes. The solder mask protrusion 14 extends from the side of the board body 11 into the clearance notch 16. When the power line 2 is led out from the planar pad 13 to the side where the component 15 is located, the solder mask protrusion 14 automatically separates the positive and negative lines of the power line 2, structurally avoiding the risk of short circuit on the inner side of the tinned end, effectively preventing short circuit caused by contact between the positive and negative poles during the soldering process, greatly improving the convenience and safety of soldering, and also optimizing the layout design and space utilization of the PCB board, effectively utilizing the space of the PCB board, and making the product structure more compact.

[0037] In one embodiment, the clearance notch 16 is a rectangular notch through which the power line 2 passes directly from the side where the component 15 is located to the soldering point. The opening size of the clearance notch 16 fully considers the housing space required for the power line 2 to run, and also facilitates housing assembly.

[0038] In one embodiment, the line 24 is routed around the second side of the plate 11 via the clearance notch 16, wherein the first and second sides of the plate 11 are opposite to each other.

[0039] In this embodiment, the line 24 is guided from the first side of the board 11 to the opposite second side through the avoidance gap 16. This allows the power line 2 to effectively utilize the structure of the PCB board 1 to form the routing space for the power line 2 without changing the overall layout of the PCB board 1. No additional routing space is required, and the structural characteristics of the PCB board 1 can be fully utilized to achieve the optimized design of the PCB power line soldering structure. The routing path of the line 24 not only ensures the stable soldering connection between the power line 2 and the planar pad 13, but also avoids interference with other components. This greatly promotes flexible routing of the power line, reduces assembly difficulty, and improves the compactness and reliability of the product.

[0040] In one embodiment, the planar pad 13 is comb-shaped.

[0041] In this embodiment, the planar pad 13 adopts a comb-like design to form a through-hole-free welding structure. Through its unique structural form, it not only significantly increases the contact area between the pad and the welding section 23 of the power line 2, thereby improving the welding stability and conductivity, but also allows the wire 24 to naturally conform along the guide of the comb teeth during the welding process, reducing the requirement for precise alignment, greatly simplifying the welding operation, reducing the amount of solder used, effectively avoiding common welding defects such as cold solder joints, pinholes, and wire not extending beyond the lead, and improving production efficiency and product quality.

[0042] In one embodiment, the planar pad 13 may also adopt a flat plate structure or a U-shaped structure, etc.

[0043] In one embodiment, the PCB power line soldering structure further includes a housing 3, with the PCB board 1 disposed inside the housing 3, the power line 2 passing through the housing 3, and the portion of the power line 2 located inside the housing 3 being soldered to the planar pad 13.

[0044] In this embodiment, the PCB power cord welding structure utilizes the housing 3 as the overall frame. The PCB board 1 is installed inside the housing 3, and the power cord 2 passes through the reserved channel on the housing 3. This ensures that the part of the power cord 2 inside the housing 3 can be efficiently welded to the planar pad 13. This effectively combines the fixing and welding of the power cord 2 with the product packaging process, simplifies the assembly steps, avoids the power cord 2 from swinging randomly inside the device, and enhances the safety and stability of the electrical connection.

[0045] In one embodiment, the portion of the power cord 2 located inside the housing 3 is fixed to the housing 3 by adhesive.

[0046] In this embodiment, the power cord 2 is inserted into the housing 3 and forms a stable fixed connection with the housing 3 with the help of adhesive. This design not only ensures the precise and unchanged position of the power cord 2 during the combination, positioning and assembly of the PCB board 1, the power cord 2 and the housing 3, but also effectively prevents the power cord 2 from becoming loose or having poor contact due to vibration or external force, greatly improving the reliability of the electrical connection and the durability of the product. At the same time, the adhesive fixation also plays an insulating and protective role, further ensuring circuit safety, optimizing the internal space layout of the product, and making the overall design more compact.

[0047] The portion of the power cord 2 located inside the housing 3 is fixed to the PCB board 1 and the housing 3 by adhesive.

[0048] In this embodiment, by using adhesive to fix the power cord 2 to the PCB board 1 and the housing itself inside the housing 3, the precise positioning and stable connection of the power cord are ensured during the assembly and movement of the power cord. This significantly reduces the risk of power cord displacement or even breakage caused by mechanical vibration or external impact. It not only enhances the firmness and safety of electrical connections, but also further strengthens the electrical isolation of the circuit through the insulating properties of the adhesive, avoiding short circuits and other potential electrical faults.

[0049] By using the above method, automated equipment can be used to apply glue after the PCB board 1 is installed in the housing 3, which not only strengthens the fixation between the power cord and the housing 3 on the basis of fixing the PCB board 1, but also meets the relevant safety standards and improves the mechanical reliability of the product.

[0050] The assembly process of the PCB power line soldering structure is as follows:

[0051] Place PCB board 1 in the fixture and use the fixture to limit the overall position of PCB board 1 to prevent PCB board 1 from shifting.

[0052] Fix the main body of the power cord 2 to the fixture to prevent the power cord 2 from shifting;

[0053] The positive terminal 22 and negative terminal 21 of the power line 2 are fixed in the fixture, and the tin-plated ends of the positive terminal 22 and the negative terminal 21 of the power line 2 are respectively placed on the comb-shaped planar pads 13 of the power line 2 on the PCB board 1.

[0054] A solder mask protrusion 14 is designed between the positive terminal 22 and the negative terminal 21 of the power line 2. The solder mask protrusion 14 is part of the PCB board 1 and is made of non-conductive material, which can prevent the positive terminal 22 and the negative terminal 21 of the power line 2 from being short-circuited.

[0055] After the power cord 2 is soldered to the flat pad 13, the power cord 2, PCB board 1, and housing 3 are assembled using a robotic arm and then fixed with adhesive.

[0056] According to an embodiment of the present invention, the power adapter includes a PCB power line soldering structure, which is the PCB power line soldering structure described above.

[0057] The PCB power line soldering structure of this utility model is innovative in that it eliminates the traditional through-hole soldering and instead adopts a design combining planar pads and comb-shaped pads. This not only reduces soldering difficulty and the soldering defect rate but also saves solder consumption, achieving highly efficient wire assembly and soldering. Compared with the traditional design, single-station efficiency is increased by at least 50%, solder consumption is reduced by more than 30%, and the soldering defect rate is reduced by more than 50%. The addition of solder resist protrusions 14 effectively prevents the risk of short circuits between the positive and negative terminals of the power line, improving product safety and reliability. The use of adhesive not only meets electrical safety regulations but also enhances the mechanical strength of the product, providing greater convenience for automated production and promoting further improvement in production efficiency and product quality.

[0058] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0059] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0060] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0061] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A PCB power line soldering structure, characterized in that, include: PCB board (1), including board body (11) and planar pads (13) on board surface (12) on a first side of said board body (11); A power cord (2) is provided on one side of the PCB board (1) and soldered along the board surface (12) onto the planar pad (13).

2. The PCB power line soldering structure according to claim 1, characterized in that, The planar pad (13) includes a first pad (131) and a second pad (132) spaced apart. The power line (2) includes a negative electrode (21) and a positive electrode (22). The negative electrode (21) is soldered to the first pad (131), and the positive electrode (22) is soldered to the second pad (132). A solder resist protrusion (14) is provided between the first pad (131) and the second pad (132). The negative electrode (21) and the positive electrode (22) are separated by the solder resist protrusion (14).

3. The PCB power line soldering structure according to claim 2, characterized in that, The plate surface (12) is recessed to form a welding groove, the planar solder pad (13) is located in the welding groove, and the solder resist protrusion (14) is formed between two adjacent welding grooves.

4. The PCB power line soldering structure according to claim 2, characterized in that, A clearance notch (16) is formed on one side of the plate (11), and the planar pad (13) is set in the area corresponding to the clearance notch (16). The power line (2) includes a soldering section (23) and a line body (24). The line body (24) connected to the soldering section (23) is located in the clearance notch (16). The solder resist protrusion (14) protrudes laterally from the plate (11) toward the clearance notch (16).

5. The PCB power line soldering structure according to claim 4, characterized in that, The line (24) is wound around the second side of the plate (11) through the clearance notch (16), wherein the first side and the second side of the plate (11) are opposite to each other.

6. The PCB power line soldering structure according to claim 5, characterized in that, The second side (17) of the plate (11) is provided with components (15).

7. The PCB power line soldering structure according to claim 1, characterized in that, The planar pad (13) is comb-shaped.

8. The PCB power line soldering structure according to claim 1, characterized in that, The PCB power line welding structure also includes a housing (3), the PCB board (1) is disposed inside the housing (3), the power line (2) passes through the housing (3), and the part of the power line (2) located inside the housing (3) is welded to the planar pad (13).

9. The PCB power line soldering structure according to claim 8, characterized in that, The portion of the power cord (2) located inside the housing (3) is fixed to the housing (3) by adhesive; or, the portion of the power cord (2) located inside the housing (3) is fixed to the PCB board (1) and the housing (3) by adhesive.

10. A power adapter, characterized in that, It includes a PCB power line soldering structure, wherein the PCB power line soldering structure is the PCB power line soldering structure according to any one of claims 1 to 9.

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