Heat sink, heat dissipation module and electronic device

Abstract

This disclosure relates to a heat sink, a heat dissipation module, and an electronic device. The heat sink includes a housing and a reinforcing assembly. The housing includes a cavity and a liquid inlet and a liquid outlet communicating with the cavity. The reinforcing assembly includes a first reinforcing member and a second reinforcing member disposed inside the cavity. The first reinforcing member extends along a first direction, and the second reinforcing member extends along a second direction. Thus, the arrangement of the first and second reinforcing members increases the structural strength of the heat sink in the first and second directions, improving its pressure resistance and deformation resistance, to accommodate the circulation of cooling medium under higher pressure into the cavity, thereby enhancing the heat dissipation capacity of the heat sink.

Description

Technical Field

[0001] This disclosure relates to the field of heat dissipation technology for electronic devices, specifically to a heat sink, a heat dissipation module, and an electronic device. Background Technology

[0002] As chip power consumption increases, the demand for chip heat dissipation also increases. For example, in graphics card modules, as the power consumption and power density of the GPU increase, it is necessary to redesign new heat sinks to improve cooling capacity. Utility Model Content

[0003] The purpose of this disclosure is to provide a heat sink, a heat dissipation module, and an electronic device, wherein the heat sink has strong cooling capacity, thereby at least partially solving the related technical problems.

[0004] To achieve the above objectives, according to a first aspect of this disclosure, a heat sink is provided, comprising: The housing includes a cavity, and an inlet and an outlet communicating with the cavity; and The reinforcing component includes a first reinforcing member and a second reinforcing member disposed inside the cavity; wherein the first reinforcing member extends along a first direction and the second reinforcing member extends along a second direction.

[0005] Optionally, the first direction is perpendicular to the second direction.

[0006] Optionally, the first reinforcing member, the second reinforcing member, and the inner wall of the housing form a plurality of sub-cavities; The radiator also includes a heat dissipation component, which is correspondingly disposed in the sub-cavity.

[0007] Optionally, the two ends of the first reinforcing member and / or the second reinforcing member are respectively connected to the inner sidewall of the cavity.

[0008] Optionally, the housing further includes a frame, a bottom plate, and a cover plate, the frame, the bottom plate, and the cover plate forming the cavity, the heat dissipation component being disposed on the bottom plate, and the liquid inlet and the liquid return outlet being disposed at intervals on the cover plate.

[0009] Optionally, the radiator further includes a flow guiding structure disposed inside the cavity, the flow guiding structure being used to divide the cavity into an inlet channel and a return channel communicating with the inlet channel, the inlet channel communicating with the inlet port; the return channel communicating with the return port.

[0010] Optionally, the flow guiding structure includes a first flow guiding plate and two second flow guiding plates. In a second direction, the two second flow guiding plates are spaced apart and have flanges extending toward the bottom plate on their opposite side edges. In a first direction, the first ends of the two second flow guiding plates are connected to the inner sidewall of the frame, and the second ends of the two second flow guiding plates are connected to the middle of the first flow guiding plate. In the second direction, the inner sidewalls of the two second flow guiding plates, the first flow guiding plate, and the frame together form the liquid inlet channel. In the second direction, the flanges of the two second flow guiding plates, the first flow guiding plate, and the frame together form the liquid return channel.

[0011] Optionally, the radiator further includes at least one pressure block, which is disposed on the cover plate and extends toward the base plate to abut against the first reinforcing member and / or the second reinforcing member.

[0012] According to a second aspect of this disclosure, a heat dissipation module is provided, including the heat sink described above.

[0013] According to a third aspect of this disclosure, an electronic device is provided, including the heat dissipation module described above.

[0014] The above technical solution involves a radiator comprising a housing and a reinforcing assembly. The housing includes a cavity and an inlet and an outlet communicating with the cavity. The reinforcing assembly includes a first reinforcing member and a second reinforcing member disposed within the cavity. The first reinforcing member extends along a first direction, and the second reinforcing member extends along a second direction. Thus, by using the first and second reinforcing members extending in different directions, the overall structure of the radiator can be strengthened, allowing for the circulation of cooling medium under higher pressure into the cavity, thereby improving the radiator's heat dissipation capacity.

[0015] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0016] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the accompanying drawings...

[0017] Figure 1 This is an exploded view of a heat sink provided in some embodiments of this disclosure.

[0018] Figure 2 This is a schematic diagram of the assembly of a heat sink and a base plate according to some embodiments of this disclosure.

[0019] Figure 3 This is a schematic diagram of the assembly of the frame, flow channel plate and reinforcing components provided in some embodiments of this disclosure.

[0020] Figure 4 This is a schematic diagram of a flow guiding structure provided in some embodiments of this disclosure.

[0021] Figure 5 This is a schematic diagram of the assembly of the cover plate and the pressure block provided in some embodiments of this disclosure.

[0022] Explanation of reference numerals in the attached figures 1-Shell; 11-Cavity; 12-Inlet; 13-Outlet; 14-Frame; 15-Base plate; 16-Cover plate; 17-Inlet channel; 18-Outlet channel; 19-Pressure block; 2-Reinforcing assembly; 21-First reinforcing member; 22-Second reinforcing member; 3-Sub-cavity; 4-Heat dissipation component; 5-Flow guiding structure; 51-First guide plate; 52-Second guide plate; 53-Flanged edge. Detailed Implementation

[0023] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0024] In this disclosure, unless otherwise stated, directional terms such as "first direction" are used for reference. Figure 1 In the X direction, the "second direction" can be referenced. Figure 1 In the Y direction; "inner" and "outer" refer to the contours of the corresponding components themselves. The terms "first," "second," etc., used in this disclosure are for distinguishing one element from another and do not indicate sequence or importance. When the following description relates to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0025] In related technologies, chip power consumption is increasing, and so are the heat dissipation requirements. For example, in graphics card modules, as the power consumption and power density of GPUs (Graphics Processing Units) increase, existing heat sinks (cold plates) can no longer meet the heat dissipation requirements after the increase in power consumption. That is, heat sinks have moved from a stage where they have sufficient heat dissipation margin to a stage where they need to be more refined. For example, the power density of GPUs has now increased from 50-60W / cm². 2 (Average) rapidly increases by 80-100 W / cm 2 The ultimate power density even reaches 300W / cm². 2 Therefore, it is necessary to optimize the existing heat sink to improve its heat dissipation capacity.

[0026] To achieve the above objectives, such as Figures 1 to 5As shown, according to a first aspect of this disclosure, a radiator is provided, comprising: a housing 1 and a reinforcing assembly 2, wherein the housing 1 includes a cavity 11, and an inlet 12 and an outlet 13 communicating with the cavity 11, wherein a cooling medium enters the cavity 11 of the housing 1 from the inlet 12 and exits from the outlet 13, thereby facilitating the circulation of low-temperature cooling medium into the cavity 11; the reinforcing assembly 2 includes a first reinforcing member 21 and a second reinforcing member 22 disposed inside the cavity 11; the first reinforcing member 21 extends along a first direction X, and the second reinforcing member 22 extends along a second direction Y, wherein the arrangement of the first reinforcing member 21 and the second reinforcing member 22 can increase the structural strength of the radiator in the X and Y directions, improve the pressure resistance and deformation resistance of the radiator, so as to adapt to the circulation of cooling medium under higher pressure into the cavity 11, thereby improving the heat dissipation capacity of the radiator.

[0027] The above technical solution involves a radiator comprising a housing 1 and a reinforcing assembly 2. The housing 1 includes a cavity 11 and a liquid inlet 12 and a liquid outlet 13 communicating with the cavity 11. The reinforcing assembly 2 includes a first reinforcing member 21 and a second reinforcing member 22 disposed within the cavity 11. The first reinforcing member 21 extends along a first direction X, and the second reinforcing member 22 extends along a second direction Y. Thus, by using the first reinforcing member 21 and the second reinforcing member 22 extending in different directions, the radiator can be reinforced in the X and Y directions, thereby enabling the cooling medium under higher pressure to circulate into the cavity 11, thereby improving the heat dissipation capacity of the radiator.

[0028] The radiator needs to withstand a cooling medium under certain pressure. However, the cavity 11 inside the housing 1 reduces the overall structural strength of the radiator. To increase the strength of the radiator, a reinforcing member is usually provided in one direction, such as in the first direction X or the second direction Y. As the heat dissipation capacity requirement of the radiator increases, the pressure of the cooling medium that the radiator needs to withstand also increases. At this time, the structural strength of the radiator with a reinforcing member in one direction is limited. Therefore, in order to accommodate the cooling medium under higher pressure, in some feasible ways, a first reinforcing member 21 extending in the first direction X and a second reinforcing member 22 extending in the second direction Y are provided in the cavity 11. This strengthens the structure of the radiator in two directions, thereby improving the overall structural strength of the radiator, accommodating the circulatory cooling medium under higher pressure into the cavity 11, and improving the heat dissipation capacity of the radiator.

[0029] In some feasible embodiments, the first direction X is perpendicular to the second direction Y, that is, the extending direction of the first reinforcing member 21 is perpendicular to the extending direction of the second reinforcing member 22. The mutually perpendicular arrangement of the first reinforcing member 21 and the second reinforcing member 22 facilitates installation within the cavity 11. Furthermore, the two ends of the first reinforcing member 21 and / or the second reinforcing member 22 respectively abut against the inner wall of the cavity 11, thereby enabling the first reinforcing member 21 and / or the second reinforcing member 22 to form a truss-like support structure with the inner wall of the housing 1, distributing the cooling medium pressure and / or assembly pressure to the edge of the radiator, significantly reducing the risk of localized deformation. Figure 1 As shown, the two ends of the second reinforcing member 22 in the second direction are respectively abutted and fixed to the inner sidewall of the cavity 11, thereby enabling the second reinforcing member 22 and the inner sidewall of the housing 1 to form a truss-like support structure, dispersing the cooling medium pressure and / or assembly pressure to the edge of the radiator, significantly reducing the risk of local deformation. Of course, it is understood that the above embodiment of abutting and fixing the second reinforcing member 22 to the inner sidewall of the housing 1 is illustrative. In other embodiments, both ends of the first reinforcing member 21 and the second reinforcing member 22 can be abutted and fixed to the inner sidewall of the housing 1.

[0030] It is understood that the perpendicularity of the extension directions of the first reinforcing member 21 and the second reinforcing member 22 described above is illustrative. In other embodiments, the direction can be selected according to the specific working conditions. For example, the first reinforcing member 21 and the second reinforcing member 22 can also be any other angle that is not perpendicular, as long as the first reinforcing member 21 and the second reinforcing member 22 in the cavity 11 can strengthen the shell 1 in the first direction X and the second direction Y.

[0031] Of course, it is understandable that there can be multiple first reinforcing members 21 and second reinforcing members 22. For example, there can be two first reinforcing members 21 and two second reinforcing members 22. The two first reinforcing members 21 extend along the first direction and are spaced apart along the second direction, and the two second reinforcing members 22 extend along the second direction and are spaced apart along the first direction, thereby forming a grid-shaped structure, which further improves the structural strength of the radiator, so that the radiator can withstand the circulation of the cooling medium under greater pressure, thereby improving the heat dissipation capacity of the radiator.

[0032] It should be noted that the aforementioned heatsink can be applied to GPU (Graphics Processing Unit) modules. This means that mounting holes are provided on the edge of the heatsink, and it is fixedly connected to the GPU module frame using spring screws. This allows the GPU chip of the GPU module to contact the heat dissipation surface of the heatsink, thus enabling heat dissipation for the GPU chip when the cooling medium circulates into the cavity 11. It is understood that the aforementioned heatsink can also be applied to CPU (Central Processing Unit) modules, power supply modules, etc. This embodiment will describe a specific example of a heatsink cooling a GPU module.

[0033] The main heat source in a GPU module is the GPU chip. To ensure timely heat dissipation from the GPU chip, in some feasible implementations, the heat sink includes multiple heat sink components 4. A first reinforcing member 21, a second reinforcing member 22, and the inner wall of the housing 1 form multiple sub-cavities 3. Each heat sink component 4 is correspondingly disposed in one sub-cavity 3. The surface of the housing 1 corresponding to the heat sink component 4 is in contact with the GPU chip. The heat sink component 4 can be a skived fin, which increases the heat dissipation area and quickly dissipates the heat from the GPU chip. When pressurized cooling medium circulates into the cavity 11, it can quickly dissipate heat from the GPU chip. Especially for structures with multiple GPU chips, multiple corresponding heat sink components 4 can quickly dissipate heat from each GPU chip.

[0034] When the heat sink 4 is configured as a spade-shaped fin, the pressurized cooling medium placed in the cavity 11 will impact the spade-shaped fin, causing it to deform. In addition, the heat sink 4 is also prone to deformation when it comes into contact with the GPU chip due to heat. To improve the structural strength of the spade-shaped fin, a thicker spade-shaped fin is usually used. However, a thicker spade-shaped fin will create a large thermal resistance, which is not conducive to heat dissipation. In this embodiment, a thinner spade-shaped fin is used, and multiple sub-cavities 3 are formed by the first reinforcing member 21, the second reinforcing member 22 and the inner sidewall of the shell 1. The spade-shaped fin is set in the corresponding sub-cavities 3, that is, the first reinforcing member 21 and the second reinforcing member 22 are set in the gap between adjacent spade-shaped fins. Thus, when the pressurized cooling medium is placed in the cavity 11, the flow path of the cooling medium can be optimized by the first reinforcing member 21 and the second reinforcing member 22, so that the flow rate of the cooling medium is evenly distributed and the pressure drop is reduced. Of course, the setting of the first reinforcing member 21 and the second reinforcing member 22 can also reduce turbulence and avoid local high pressure impact on the edge of the spade-shaped fin. Thus, the first reinforcing member 21 and the second reinforcing member 22 can accommodate a thinner heat sink 4 to be placed inside the cavity 11, further improving the heat dissipation capacity of the heat sink.

[0035] In some feasible embodiments, the heat sink is reinforced in both the first direction X and the second direction Y by the setting of the first reinforcing member 21 and the second reinforcing member 22, which improves the overall structural strength of the heat sink. In particular, it effectively prevents the deformation of the surface of the heat sink shell 1 that is attached to the GPU chip, so that the heat sink can meet the pressure holding test requirements of 0.6-0.8MPa. That is, the heat sink needs to meet the requirement of no leakage of cooling medium and the flatness of the surface deformation of the heat sink that is attached to the GPU chip within 50um during the pressure holding test.

[0036] It is understood that the first reinforcing member 21 and the second reinforcing member 22 mentioned above can be in the shape of a strip, and both can be fixedly connected to the shell 1 by brazing.

[0037] In some feasible ways, such as Figures 1 to 5 As shown, the housing 1 may include a frame 14, a bottom plate 15, and a cover plate 16. The frame 14, the bottom plate 15, and the cover plate 16 form a cavity 11. The bottom plate 15 is placed at the bottom of the frame 14, and the outer edge of the bottom plate 15 is welded and fixed to the inner sidewall of the bottom of the frame 14. The cover plate 16 is placed at the top of the frame 14, and the outer edge of the cover plate 16 is welded and fixed to the inner sidewall of the top of the frame 14. Since a cooling medium needs to be injected into the housing 1, the welded frame 14, bottom plate 15, and cover plate 16 also need to meet the requirements of sealing. The number of heat sinks 4 can be four. The four heat sinks 4 are arranged in an array and fixed to the base plate 15 by welding. The first reinforcing member 21 and the second reinforcing member 22 are arranged perpendicularly to each other and are placed in the gap formed between the four heat sinks 4. The two ends of the first reinforcing member 21 are fixedly connected to the inner sidewall of the frame 14. The liquid inlet 12 and the liquid return port 13 are arranged at intervals on the cover plate 16. The liquid inlet 12 is used to receive pressurized cooling medium into the cavity 11. The GPU module is cooled by multiple heat sinks 4 and cooling medium. In particular, the arrangement of heat sinks 4 can directly cool the GPU chip.

[0038] In some feasible embodiments, for ease of heat dissipation, the frame 14, base plate 15, cover plate 16, heat sink 4, first reinforcing member 21, and second reinforcing member 22 in the housing 1 can all be made of copper. Of course, the above-described embodiment where the housing 1, heat sink 4, first reinforcing member 21, and second reinforcing member 22 are made of copper is illustrative. In other embodiments, the housing 1, heat sink 4, first reinforcing member 21, and second reinforcing member 22 can also be made of other materials; for example, aluminum alloy or copper-aluminum alloy can be selected depending on different operating conditions.

[0039] In some feasible ways, such as Figure 1 , Figure 3 and Figure 4As shown, to facilitate the flow of the cooling medium, the radiator also includes a flow guiding structure 5 located inside the cavity 11. The flow guiding structure 5 divides the cavity 11 into an inlet channel 17 and a return channel 18 connected to the inlet channel 17. The inlet channel 17 is connected to the inlet port 12; the return channel 18 is connected to the return port 13. Figure 3 and Figure 4 As shown, the flow guiding structure 5 may include a first flow guiding plate 51 and two second flow guiding plates 52. The first flow guiding plate 51 and the second flow guiding plate 52 may also be made of copper. In the second direction, the two second flow guiding plates 52 are spaced apart and have flanges 53 extending toward the bottom plate 15 on their opposite side edges. In the first direction, the first ends of the two second flow guiding plates 52 are connected to the inner sidewall of the frame 14, and the second ends of the two second flow guiding plates 52 are connected to the middle of the first flow guiding plate 51. Thus, the projection of the first flow guiding plate 51 and the two second flow guiding plates 52 in the planes of the first and second directions is U-shaped. In the second direction, the inner sidewalls of the two second flow guiding plates 52, the first flow guiding plate 51 and the frame 14 together form the liquid inlet channel 17. In the second direction, the flanges 53 of the two second flow guiding plates 52, the first flow guiding plate 51 and the frame 14 together form the liquid return channel 18. When the cover plate 16 is welded to the inner side wall of the top of the frame 14, the liquid inlet 12 on the cover plate 16 is connected to the liquid inlet channel 17. The cooling medium entering through the liquid inlet 12 is guided by the liquid inlet channel 17 into the corresponding sub-cavities 3, and then collects from the sub-cavities 3 into the return channel 18. The return port 13 on the cover plate 16 is connected to the return channel 18, and the cooling medium collected in the return channel 18 is discharged from the cavity 11 through the return port 13. In addition, the flange 53 is disposed above the first reinforcing member 21, and part of the flange 53 is pressed against the first reinforcing member 21. Thus, when pressurized cooling medium is placed into the cavity 11 inside the housing 1, the flange 53 can also share the impact of the pressurized cooling medium on the first reinforcing member 21.

[0040] In some implementable embodiments, the radiator further includes at least one pressure block 19, which is disposed on the cover plate 16 extending toward the base plate 15, for abutting against the first reinforcement 21 and / or the second reinforcement 22. For example... Figure 1 and Figure 4 As shown, there are two pressure blocks 19, which are located on both sides of the liquid inlet 12 in the first direction. When the cover plate 16 is welded and fixed to the frame 14, the two pressure blocks 19 pass through the gap between the inner walls of the two second guide plates 52 and abut against the second reinforcing member 22. In this way, by pressing the second reinforcing member 22 with the pressure blocks 19, the impact of the pressurized cooling medium on the second reinforcing member 22 can be shared.

[0041] According to a second aspect of this disclosure, a heat dissipation module is provided, including the heatsink described above. For example, the heat dissipation module can be a graphics card module, including a graphics card substrate, a GPU mounted on the graphics card substrate, and a heatsink divided into multiple heat dissipation sections. At least one heatsink section contains a heatsink component, and the heatsink section containing the heatsink component is used to dissipate heat from the GPU chip, while the remaining heatsink sections are used to dissipate heat from other electronic components in the graphics card module. It is understood that the above-described heat dissipation module encompasses all the beneficial effects of the heatsink described above, and will not be elaborated further here.

[0042] According to a third aspect of this disclosure, an electronic device is provided, which includes the aforementioned heat dissipation module. Therefore, this electronic device also possesses all the advantages of the aforementioned heat dissipation module, which will not be elaborated upon here.

[0043] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0044] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0045] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A radiator, characterized in that, include: The housing includes a cavity, and an inlet and an outlet communicating with the cavity; and The reinforcing component includes a first reinforcing member and a second reinforcing member disposed inside the cavity; wherein the first reinforcing member extends along a first direction and the second reinforcing member extends along a second direction.

2. The radiator according to claim 1, characterized in that, The first direction is perpendicular to the second direction.

3. The radiator according to claim 1 or 2, characterized in that, The first reinforcing member, the second reinforcing member, and the inner wall of the housing form a plurality of sub-cavities; The radiator also includes a heat dissipation component, which is correspondingly disposed in the sub-cavity.

4. The radiator according to claim 3, characterized in that, The two ends of the first reinforcing member and / or the second reinforcing member are respectively connected to the inner sidewall of the cavity.

5. The radiator according to claim 3, characterized in that, The housing includes a frame, a bottom plate, and a cover plate. The frame, the bottom plate, and the cover plate form the cavity. The heat dissipation component is disposed on the bottom plate. The liquid inlet and the liquid return outlet are both disposed at intervals on the cover plate.

6. The radiator according to claim 5, characterized in that, The radiator also includes a flow guiding structure disposed inside the cavity, the flow guiding structure being used to divide the cavity into an inlet channel and a return channel communicating with the inlet channel, the inlet channel communicating with the inlet port; the return channel communicating with the return port.

7. The radiator according to claim 6, characterized in that, The flow guiding structure includes a first flow guiding plate and two second flow guiding plates. In a second direction, the two second flow guiding plates are spaced apart and have opposing side edges with flanges extending toward the bottom plate. In a first direction, the first ends of the two second flow guiding plates are connected to the inner sidewall of the frame, and the second ends of the two second flow guiding plates are connected to the middle of the first flow guiding plate. In the second direction, the inner sidewalls of the two second flow guiding plates, the first flow guiding plate, and the frame together form the liquid inlet channel. In the second direction, the flanges of the two second flow guiding plates, the first flow guiding plate, and the frame together form the liquid return channel.

8. The radiator according to claim 5, characterized in that, The radiator further includes at least one pressure block, which is disposed on the cover plate and extends toward the base plate to abut against the first reinforcing member and / or the second reinforcing member.

9. A heat dissipation module, characterized in that, Includes the heat sink as described in any one of claims 1-8.

10. An electronic device, characterized in that, Includes the heat dissipation module as described in claim 9.

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