Semiconductor material cleaning mechanism and semiconductor material cleaning apparatus

Abstract

This utility model discloses a semiconductor material cleaning mechanism and a semiconductor material cleaning device, belonging to the technical field of semiconductor material processing equipment. The semiconductor material cleaning mechanism includes a cleaning chamber, a positioning component, and a holding component. The cleaning chamber includes a cleaning space and an opening along a first direction connecting the cleaning space to the outside. The cleaning chamber is used to clean semiconductor materials. The positioning component is disposed outside the cleaning chamber and includes a positioning element. The positioning element is telescopically arranged along a second direction to selectively support a carrier containing semiconductor materials. The first and second directions intersect. The positioning element includes a support portion and a positioning portion. The support portion supports the carrier, and the positioning portion restricts the periphery of the carrier. The holding component is disposed inside the cleaning chamber and is movable along the first direction to selectively hold the carrier within and outside the cleaning space. This utility model can improve the positional accuracy of semiconductor materials placed on the cleaning table.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor material processing equipment technology, and in particular to a semiconductor material cleaning mechanism and a semiconductor material cleaning device. Background Technology

[0002] Hybrid bonding technology, as an emerging packaging process, is being widely adopted in substrate manufacturing and 3D packaging. Hybrid bonding includes a cleaning process, which removes particulate, organic, and metallic contaminants from the semiconductor material surface to ensure its cleanliness meets material processing standards.

[0003] During cleaning, individual semiconductor materials (such as wafers) are often placed on a cleaning table using a robotic arm. The cleaning table then holds the semiconductor material in place, and the table is rotated for cleaning. However, neither the robotic arm nor the cleaning table has a positioning function, which can lead to misalignment or even detachment of the semiconductor material placed on the cleaning table.

[0004] This section provides background information related to this application, which is not necessarily prior art. Utility Model Content

[0005] The purpose of this invention is to provide a semiconductor material cleaning mechanism and a semiconductor material cleaning device, which can improve the positional accuracy of semiconductor materials placed on the cleaning table.

[0006] To achieve the above objectives, the following technical solution is provided:

[0007] A semiconductor material cleaning mechanism, comprising:

[0008] A cleaning chamber includes a cleaning space and an opening connecting the cleaning space to the outside along a first direction, the cleaning chamber being used to clean semiconductor materials;

[0009] A positioning component is disposed outside the cleaning chamber. The positioning component includes a positioning member disposed around the opening. The positioning member is telescopically disposed along a second direction to selectively support a carrier carrying semiconductor material. The first direction intersects the second direction. The positioning member includes a support portion and a positioning portion. The support portion is used to support the carrier, and the positioning portion is used to limit the periphery of the carrier.

[0010] As an alternative to the semiconductor material cleaning mechanism, the support portion protrudes from the positioning portion in the direction toward the opening, and along the first direction, a portion of the positioning portion is located on the side of the support portion facing away from the cleaning space.

[0011] As an alternative to the semiconductor material cleaning mechanism, a first motion component is also included, which is used to drive the retainer to rotate about the axis in the first direction.

[0012] As an optional solution for the semiconductor material cleaning mechanism, it further includes a second motion component and a fixing component. The fixing component includes a fixing platform and a fixing rod. The cleaning chamber and the positioning component are disposed on the same side of the fixing platform along the first direction. The fixing rod is fixedly connected to the side of the fixing platform facing away from the cleaning chamber. The second motion component is movably connected to the fixing rod along the first direction and is drively connected to the retaining member.

[0013] As an optional solution for the semiconductor material cleaning mechanism, the positioning component further includes a driving member and a protective housing. The driving member is used to drive the positioning member to extend and retract along the second direction, and the driving member is disposed inside the protective housing.

[0014] As an optional solution for the semiconductor material cleaning mechanism, the holding member includes a holding platform and a holding portion. The holding portion protrudes from the holding platform in a direction toward the opening and is disposed on the periphery of the holding platform. The holding platform holds one side of the carrier member along the first direction, and the holding portion holds the sidewall of the carrier member.

[0015] The projection of the holding part along the first direction is spaced apart from the projection of the positioning part along the first direction.

[0016] As an alternative to the semiconductor material cleaning mechanism, the carrier includes at least one of an arc-shaped edge and a straight edge, and the retaining part includes a retaining side facing the retaining platform, the retaining side being configured to match the edge shape of the carrier.

[0017] As an optional solution for a semiconductor material cleaning mechanism, the carrier includes a carrier plate and a carrier film. The carrier plate has a through area, and the peripheral side of the carrier film is fixedly connected to the carrier plate. The carrier film covers the through area and is used to carry semiconductor materials.

[0018] The holding platform is provided with an adsorption section, which is used to adsorb at least one of the carrier film and the carrier plate.

[0019] As an optional solution for a semiconductor material cleaning mechanism, the adsorption section includes a first adsorption section and a second adsorption section arranged at intervals. The first adsorption section is used to adsorb the carrier film, and the second adsorption section is used to adsorb the carrier plate.

[0020] A semiconductor material cleaning apparatus is also provided, including the semiconductor material cleaning mechanism as described in any of the foregoing embodiments; and

[0021] A cleaning component for cleaning the semiconductor material held by the retainer within the opening.

[0022] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0023] The semiconductor material cleaning mechanism and device provided by this utility model include a cleaning chamber, a positioning component, and a retaining component. The positioning component is telescopically oriented along a second direction. When a carrier needs to be supported, the positioning component can extend beyond the opening in the direction towards the opening. The support portion of the positioning component can support the carrier, thereby improving the stability of the carrier held by the retaining component. The positioning portion of the positioning component is used to limit the periphery of the carrier, so that the position of the carrier is adjusted to a preset position, thereby improving the positional accuracy of the carrier placed on the retaining component, reducing the risk of carrier position deviation or even detachment, simplifying the clamping process of the carrier installed on the retaining component, shortening the loading time of semiconductor materials, reducing the exposure time of the carrier and semiconductor materials in the atmosphere, and reducing the probability of contamination. At the same time, when the positioning component is retracted, it can also provide movement space for the retaining component, reducing the possibility of interference between the positioning component and the retaining component. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0025] Figure 1 This is an axial view of a semiconductor material cleaning mechanism holding a support member according to an embodiment of the present invention;

[0026] Figure 2 This is an isometric view of a semiconductor material cleaning mechanism according to an embodiment of the present invention;

[0027] Figure 3 This is a cross-sectional schematic diagram of a semiconductor material cleaning mechanism according to an embodiment of the present invention, showing a retaining member holding a support member supporting a carrier member.

[0028] Figure 4 for Figure 3 A magnified structural diagram of P in the middle;

[0029] Figure 5 for Figure 4A schematic diagram of the enlarged structure of Q;

[0030] Figure 6 This is a cross-sectional schematic diagram of a semiconductor material cleaning mechanism in an embodiment of the present invention, showing the holding member moving into the cleaning space.

[0031] Figure 7 This is a schematic diagram of the connection between the second moving component and the fixed rod in a semiconductor material cleaning mechanism according to an embodiment of the present invention.

[0032] Figure label:

[0033] 100, Supporting component; 110, Supporting plate; 120, Supporting membrane; S1, Arc-shaped edge; S2, Straight edge; 10, Cleaning chamber; 11, Cleaning space; 12, Opening; 20, Positioning assembly; 21, Positioning component; 211, Support part; 212, Positioning part; 22, Driving component; 23, Protective shell; 24, Base; 30, Holding component; 31, Holding platform; 311, First adsorption part; 312, Second adsorption part; 32, First holding part; 33, Second holding part; 40, First motion assembly; 41, First driving component; 42, Rotary support; 43, Coupling; 44, Rotary joint; 50, Second motion assembly; 51, Second driving component; 52, Bracket; 60, Fixing assembly; 61, Fixing platform; 62, Fixing rod; X, First direction; Y, Second direction. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0035] In the description of this utility model, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0036] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0037] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0038] Figure 1 This is an axial side view of a semiconductor material cleaning mechanism holding a carrier in an embodiment of the present invention. Figure 2 This is an isometric view of a semiconductor material cleaning mechanism according to an embodiment of the present invention. Figure 3 This is a cross-sectional schematic diagram of a semiconductor material cleaning mechanism according to an embodiment of the present invention, showing a retaining member holding a support member supporting a carrier member. Figure 4 for Figure 3 A magnified schematic diagram of P. Figure 5 for Figure 4 A magnified schematic diagram of the Q-axis. Figure 6 This is a cross-sectional schematic diagram of a semiconductor material cleaning mechanism in an embodiment of the present invention, showing the holding member moving into the cleaning space. Figure 7 This is a schematic diagram of the connection between the second moving component and the fixed rod in a semiconductor material cleaning mechanism according to an embodiment of the present invention.

[0039] This utility model provides a semiconductor material cleaning mechanism, which includes a cleaning chamber 10, a positioning component 20, and a retaining component 30. The cleaning chamber 10 includes a cleaning space 11 and an opening 12 connecting the cleaning space 11 to the outside along a first direction X. The cleaning chamber 10 is used to clean semiconductor materials. The positioning component 20 is disposed outside the cleaning chamber 10 and includes a positioning element 21. The positioning element 21 is disposed around the opening 12 and is extendable along a second direction Y to selectively support a carrier 100 carrying semiconductor materials. The first direction X intersects the second direction Y. The positioning element 21 includes a support portion 211 and a positioning portion 212. The support portion 211 supports the carrier 100, and the positioning portion 212 restricts the periphery of the carrier 100. The retaining component 30 is disposed inside the cleaning chamber 10 and is movable along the first direction X to selectively retain the carrier 100 for movement within and outside the cleaning space 11.

[0040] As an example, the cleaning chamber 10 has a hollow structure, forming a cleaning space 11. An opening 12 is provided on one side of the cleaning chamber 10 along the first direction X, connecting the cleaning space 11 to the outside. A carrier 100 carrying semiconductor material can enter and exit the cleaning space 11 through the opening 12.

[0041] As an example, this application embodiment does not limit the number of positioning elements 21, and the number of positioning elements 21 may include one or more. Multiple positioning elements 21 can be arranged around the opening 12.

[0042] The positioning member 21 can be extended and retracted along the second direction Y. The second direction Y can be parallel to the radial direction of the opening 12 (i.e., the first direction X is perpendicular to the second direction Y). Of course, the second direction Y can also intersect with the radial direction of the opening 12 (i.e., the first direction X intersects with the second direction Y but is not perpendicular).

[0043] As an example, when the positioning member 21 extends along the second direction Y to the first preset position, the support portion 211 can support the carrier 100 carrying the semiconductor material; when the positioning member 21 retracts along the second direction Y to the second preset position, the support portion 211 can release the carrier 100 carrying the semiconductor material. As the positioning member 21 extends along the second direction Y, the positioning portion 212 can abut against the periphery of the carrier 100. When the position of the carrier 100 shifts, as the positioning member 21 extends along the second direction Y to the first preset position, the positioning portion 212 can push the carrier 100 to move, so that when the positioning member 21 extends to the first preset position, the carrier 100 can be adjusted to the preset position.

[0044] The retainer 30 is movable along the first direction X to selectively retain the carrier 100 for transfer within and outside the cleaning space 11. Specifically, the positioning component 20 forms a positioning space, and the retainer 30 can retain the carrier 100 for transfer between the cleaning space 11 and the positioning space.

[0045] For example, the retainer 30 is disposed in the cleaning chamber 10. When the carrier 100 is adjusted to the preset position, the retainer 30 moves to the outside of the cleaning chamber 10 through the opening 12 along the first direction X. At this time, the retainer 30 can abut against the side of the carrier 100 opposite to the side carrying the semiconductor material. The positioning member 21 retracts to the second preset position along the second direction Y. The retainer 30 holds the carrier 100. After the retainer 30 completes holding the carrier 100, the retainer 30 moves to the cleaning chamber 10 along the first direction X and then cleans the semiconductor material.

[0046] It is understood that "holding" here refers to fixing the carrier 100 to a specific area. Optionally, the fixing method may include vacuum adsorption, bonding, or placing the carrier 100 on the holding member 30 and relying on gravity or other load forces to achieve fixation.

[0047] In the semiconductor material cleaning mechanism provided in this application embodiment, the semiconductor material cleaning mechanism includes a cleaning chamber 10, a positioning component 20, and a retaining component 30. The positioning component 21 is telescopically arranged along the second direction Y. When it is necessary to support the carrier 100, the positioning component 21 can extend in the direction toward the opening 12 and exceed the opening 12. The support portion of the positioning component 21 can support the carrier 100 to improve the stability of the retaining component 30 in holding the carrier 100. The positioning portion 212 of the positioning component 21 is used to limit the periphery of the carrier 100 so that the position of the carrier 100 is adjusted to a preset position to improve the positional accuracy of the carrier 100 placed on the retaining component 30, reduce the risk of the carrier 100 shifting position or even falling off, simplify the clamping process of the carrier 100 on the retaining component 30, shorten the loading time of semiconductor materials, reduce the exposure time of the carrier 100 and semiconductor materials in the atmosphere, and reduce the probability of contamination. At the same time, when the positioning component 21 is retracted, it can also provide movement space for the retaining component 30, reducing the possibility of interference between the positioning component 21 and the retaining component 30.

[0048] In some alternative embodiments, the support portion 211 is provided to protrude from the positioning portion 212 in the direction toward the opening 12, and a portion of the positioning portion 212 is located on the side of the support portion 211 opposite to the cleaning space 11 in the first direction X.

[0049] Optionally, the support portion 211 is provided with increasing dimensions along the first direction X, in a direction away from the opening 12.

[0050] Optionally, the centroid of the positioning space enclosed by the positioning part 212 and the centroid of the holding member 30 are arranged to overlap along the first direction X.

[0051] In these alternative embodiments, the side of the support portion 211 facing away from the cleaning space 11 is used to support the carrier 100. The side surface of the positioning portion 212 facing the opening 12 is used to abut against the side wall of the carrier 100 to adjust the position of the carrier 100.

[0052] In some alternative embodiments, the semiconductor material cleaning mechanism further includes a first motion component 40 for driving the retainer 30 to rotate about an axis in a first direction X.

[0053] When cleaning semiconductor materials, the first motion component 40 drives the retainer 30 to rotate, thereby rotating the semiconductor material and cleaning the surface of the semiconductor material from all directions, improving the cleaning efficiency and cleanliness of the semiconductor material.

[0054] Optionally, the first motion component 40 includes a first drive element 41, which may be a rotary motor.

[0055] Optionally, the first motion component 40 further includes a rotating support 42, and the first drive component 41 is fixedly connected to the rotating support 42.

[0056] Optionally, the first motion assembly 40 further includes a coupling 43 that connects the shaft of the first drive member 41 to the retainer 30. Optionally, the axis of rotation of the retainer 30 passes through the centroid of the positioning space along a first direction.

[0057] Optionally, the first moving part further includes a rotary joint 44, which connects the coupling 43 to the shaft of the first driving part 41.

[0058] In some optional embodiments, the semiconductor material cleaning mechanism further includes a second motion component 50 and a fixing component 60. The fixing component 60 includes a fixing platform 61 and a fixing rod 62. The cleaning chamber 10 and the positioning component 20 are disposed on the same side of the fixing platform 61 along the first direction X. The fixing rod 62 is fixedly connected to the side of the fixing platform 61 facing away from the cleaning chamber 10. The second motion component 50 is movably connected to the fixing rod 62 along the first direction X and is drively connected to the retaining member 30.

[0059] Optionally, the fixed platform 61 may include a first fixed area, and the cleaning chamber 10 is disposed in the first fixed area.

[0060] Optionally, the fixed platform 61 may also include a second fixed area, in which the positioning component 20 is disposed. The second fixed area surrounds the first fixed area.

[0061] Furthermore, the first fixed area is provided with a through hole, the area of ​​which is smaller than the area of ​​the cleaning space 11 along the first direction X. The through hole is used to allow the second motion component 50 to move in the first direction X, so that the second motion component 50 drives the retaining member 30 to move along the first direction X.

[0062] Optionally, the fixing rod 62 extends along the first direction X, and the second motion component 50 is movable along the extension direction of the fixing rod 62.

[0063] As an example, after the positioning component 20 supports the carrier 100 and completes the positioning of the carrier 100, the second motion component 50 can move along the first direction X toward the opening 12, so that the retaining member 30 extends out of the opening 12 along the first direction X and abuts against the side of the carrier 100 facing away from the semiconductor material. After the retaining member 30 has held the carrier 100, the second motion component 50 moves along the first direction X into the cleaning space 11, so that the retaining member 30 and the carrier 100 enter the cleaning space 11. After the retaining member 30 and the carrier 100 move to the preset position in the cleaning space 11, the first motion component 40 drives the retaining member 30 to rotate, thereby improving the cleaning efficiency of the semiconductor material.

[0064] Optionally, the second motion component 50 includes a second drive member 51 and a bracket 52. The bracket 52 connects the first motion component 40 to the second drive member 51. The second drive member 51 can extend and retract along the first direction X, thereby driving the bracket 52, the first motion component 40 and the retainer 30 to move along the first direction X.

[0065] In some alternative embodiments, the positioning component 20 further includes a drive member 22 and a protective housing 23, the drive member 22 being used to drive the positioning member 21 to extend and retract along the second direction Y, and the drive member 22 being disposed within the protective housing 23.

[0066] Optionally, the drive unit 22 can be fixedly connected to the fixed platform 61.

[0067] Optionally, the drive unit 22 includes a slide cylinder.

[0068] Optionally, the protective housing 23 may include a waterproof cover. The protective housing 23 covers the drive component 22 to reduce the possibility of cleaning liquid splashing into the drive component 22 and improve the service life of the drive component 22.

[0069] Optionally, the positioning component 20 also includes a base 24 that connects the fixed platform 61 to the drive member 22 to increase the distance of the drive member 22 from the fixed platform 61 along the first direction X.

[0070] In some alternative embodiments, the retainer 30 includes a retaining platform 31 and a retaining portion. The retaining portion protrudes from the retaining platform 31 in the direction toward the opening 12 and is disposed around the retaining platform 31. The retaining platform 31 retains one side of the carrier 100 along the first direction X, and the retaining portion retains the sidewall of the carrier 100. The projection of the retaining portion along the first direction X is spaced apart from the projection of the positioning portion 212 along the first direction X.

[0071] Optionally, the platform 31 keeps the carrier 100 facing away from the side used to carry the semiconductor material.

[0072] Optionally, the holding platform 31 is configured to keep the plane containing one side surface of the carrier 100 perpendicular to the first direction X.

[0073] Optionally, the number of retaining parts may include one or more.

[0074] The retaining part can hold the side wall of the carrier 100 in place; for example, the retaining part can clamp or abut against the side wall of the carrier 100.

[0075] The holding platform 31 can support and hold the carrier 100. The holding part can position and further fix the carrier 100, thereby reducing the risk of relative displacement or even detachment of the carrier 100 from the holding part 30 during rotation and improving the reliability of the holding part 30.

[0076] The projection of the retaining part along the first direction X and the projection of the positioning part 212 along the first direction X are spaced apart. During the process of the retaining member 30 transferring to the carrier member 100 supported by the positioning assembly 20, it is beneficial to reduce the possibility of interference between the retaining part and the positioning part 212 and improve the reliability of the retaining member 30.

[0077] In some alternative embodiments, the carrier 100 includes at least one of an arcuate edge S1 and a straight edge S2, and the retaining portion includes a retaining side facing the retaining platform 31, the retaining side being configured to match the edge shape of the carrier 100.

[0078] Optionally, the carrier 100 may include only the arcuate edge S1; or, the carrier 100 may include only the straight edge S2; or, the carrier 100 may include both the arcuate edge S1 and the straight edge S2.

[0079] The side surface is configured to match the edge shape of the support member 100, which can be understood as the side surface abutting against and conforming to the side wall surface of the support member 100. The shape of the side surface projected along the first direction X is the same as the shape of the edge of the support member 100 projected along the first direction X. Optionally, the retaining part includes a first retaining part 32, the retaining side surface of the first retaining part 32 being a retaining arc surface, the shape of the retaining arc surface projected along the first direction X being the same as the shape of the arcuate edge S1 of the support member 100 projected along the first direction X, and the retaining arc surface can be used for positioning the support member 100 in the circumferential direction. Optionally, the retaining part includes a second retaining part 33, the retaining side surface of the second retaining part 33 being a retaining plane, the shape of the retaining plane projected along the first direction X being the same as the shape of the straight edge S2 of the support member 100 projected along the first direction X, and the retaining plane is used to reduce the possibility of relative rotation between the support member 100 and the retaining platform 31.

[0080] In these alternative embodiments, the holding side can increase the contact area with the side wall of the carrier 100, further improving the clamping force of the holding side on the carrier 100, improving the holding reliability of the holding member 30, which is beneficial to improving the rotation speed of the holding member 30 and expanding the applicability of the semiconductor material cleaning mechanism.

[0081] Optionally, the positioning part 212 abuts against and is tangential to the arc-shaped edge S1, so that the positioning part 212 can adjust the position of the carrier 100, while improving the positioning accuracy of the holding area between the carrier 100 and the holder 30, ensuring the stable clamping of the carrier 100 and improving production efficiency.

[0082] In some optional embodiments, the carrier 100 includes a carrier plate 110 and a carrier film 120. The carrier plate 110 has a through-region, and the carrier film 120 is fixedly connected to the carrier plate 110 on its periphery, covering the through-region. The carrier film 120 is used to carry semiconductor material. The holding platform 31 is provided with an adsorption part for adsorbing at least one of the carrier film 120 and the carrier plate 110.

[0083] Optionally, the carrier film 120 can be an adhesive blue film that can bond semiconductor materials.

[0084] The adsorption section may adsorb only the carrier membrane 120; or, the adsorption section may adsorb only the carrier plate 110; or, one adsorption section may adsorb both the carrier membrane 120 and the carrier plate 110; or, there may be multiple adsorption sections, with some adsorbing the carrier membrane 120 and others adsorbing the carrier plate 110.

[0085] Optionally, the adsorption part can be used to generate adsorption force, thereby increasing the fixing force on the carrier 100.

[0086] In these alternative embodiments, the number of adsorption parts, the adsorption area, and the adsorption shape can be designed according to design requirements, thereby adapting to different carriers 100 and improving the applicability of the retainer 30.

[0087] In some alternative embodiments, the adsorption section includes a first adsorption section 311 and a second adsorption section 312 disposed at intervals, the first adsorption section 311 being used to adsorb the carrier film 120, and the second adsorption section 312 being used to adsorb the carrier plate 110.

[0088] Optionally, the adsorption port of the first adsorption part 311 is shaped as an adsorption orifice.

[0089] Optionally, the adsorption port of the second adsorption section 312 is an arc-shaped hole.

[0090] Optionally, the shape of the adsorption port of the second adsorption part 312 can be matched with the edge shape of the support member 100 to improve the uniformity of force on the support member 100.

[0091] The first adsorption part 311 and the second adsorption part 312 can be opened simultaneously or selectively opened 12, which helps to increase the adsorption force and adsorption flexibility on the carrier 100 and improve the applicability of the retainer 30.

[0092] This embodiment provides a semiconductor material cleaning apparatus, including a semiconductor material cleaning mechanism and a cleaning component as described in any of the above embodiments. The cleaning component is used to clean the semiconductor material held in the holding member 30 within the opening 12. Since the semiconductor material cleaning apparatus provided in this application embodiment includes the semiconductor material cleaning mechanism of any of the above embodiments, it has the beneficial effects of the semiconductor material cleaning mechanism of any of the above embodiments, which will not be elaborated further here.

[0093] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A semiconductor material cleaning mechanism, characterized in that, include: A cleaning chamber (10) includes a cleaning space (11) and an opening (12) connecting the cleaning space (11) to the outside along a first direction. The cleaning chamber (10) is used to clean semiconductor materials. A positioning component (20) is disposed outside the cleaning chamber (10). The positioning component (20) includes a positioning element (21) disposed around the opening (12). The positioning element (21) is telescopically disposed along a second direction to selectively support a carrier (100) carrying semiconductor material. The first direction intersects the second direction. The positioning element (21) includes a support portion (211) and a positioning portion (212). The support portion (211) is used to support the carrier (100), and the positioning portion (212) is used to limit the periphery of the carrier (100). A retainer (30) is disposed in the cleaning chamber (10) and is movable along the first direction to selectively retain the carrier (100) for transfer between the inside and outside of the cleaning space (11).

2. The semiconductor material cleaning mechanism according to claim 1, characterized in that, The support portion (211) is provided to protrude from the positioning portion (212) in the direction toward the opening (12), and along the first direction, a portion of the positioning portion (212) is located on the side of the support portion (211) facing away from the cleaning space (11).

3. The semiconductor material cleaning mechanism according to claim 1, characterized in that, It also includes a first motion component (40) for driving the retainer (30) to rotate about the axis in the first direction.

4. The semiconductor material cleaning mechanism according to claim 1, characterized in that, It also includes a second motion component (50) and a fixing component (60), the fixing component (60) including a fixing platform (61) and a fixing rod (62), the cleaning chamber (10) and the positioning component (20) are disposed on the same side of the fixing platform (61) along the first direction, and the fixing rod (62) is fixedly connected to the side of the fixing platform (61) facing away from the cleaning chamber (10); The second motion component (50) is movably connected to the fixed rod (62) along the first direction, and the second motion component (50) is drively connected to the retainer (30).

5. The semiconductor material cleaning mechanism according to claim 1, characterized in that, The positioning component (20) further includes a driving member (22) and a protective housing (23). The driving member (22) is used to drive the positioning member (21) to extend and retract along the second direction. The driving member (22) is disposed inside the protective housing (23).

6. The semiconductor material cleaning mechanism according to claim 1, characterized in that, The retaining member (30) includes a retaining platform (31) and a retaining part. The retaining part protrudes from the retaining platform (31) in a direction toward the opening (12) and is disposed on the periphery of the retaining platform (31). The retaining platform (31) retains one side of the carrier (100) along the first direction, and the retaining part retains the sidewall of the carrier (100). The projection of the holding part along the first direction is spaced apart from the projection of the positioning part (212) along the first direction.

7. The semiconductor material cleaning mechanism according to claim 6, characterized in that, The carrier (100) includes at least one of an arc-shaped edge (S1) and a straight edge (S2), and the retaining part includes a retaining side facing the retaining platform (31), the retaining side being configured to match the edge shape of the carrier (100).

8. The semiconductor material cleaning mechanism according to claim 6, characterized in that, The carrier (100) includes a carrier plate (110) and a carrier film (120). The carrier plate (110) has a through area. The carrier film (120) is fixedly connected to the carrier plate (110) on its periphery. The carrier film (120) covers the through area. The carrier film (120) is used to carry semiconductor materials. The holding platform (31) is provided with an adsorption section, which is used to adsorb at least one of the carrier film (120) and the carrier plate (110).

9. The semiconductor material cleaning mechanism according to claim 8, characterized in that, The adsorption section includes a first adsorption section (311) and a second adsorption section (312) arranged at intervals. The first adsorption section (311) is used to adsorb the carrier film (120), and the second adsorption section (312) is used to adsorb the carrier plate (110).

10. A semiconductor material cleaning apparatus, comprising: The semiconductor material cleaning mechanism as described in any one of claims 1 to 9; A cleaning component for cleaning the semiconductor material held in the holder (30) within the opening (12).

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