Intelligent school uniform with RFID

Abstract

The utility model discloses a kind of wisdom school uniform with RFID, including school uniform body and integrated school badge module, cuff module, upper garment lower edge module. Upper garment lower edge module contains non-woven carrier, main RFID unit, protective film and sewing reinforcement layer, main RFID unit is fixed in the center of carrier, protective film hot-pressing seals main RFID unit, sewing reinforcement layer fixes carrier with school uniform lower edge;School badge module contains non-woven base, first carrier and first auxiliary RFID chip, base is stitched with chest interlayer, first auxiliary RFID chip is embedded between base and carrier;Cuff module contains second auxiliary RFID chip and protective cloth cover, protective cloth cover wraps chip and is fixed on the outside of cuff by magic tape. Main RFID unit supports long-distance reading storage, auxiliary chip assists quick identification, forms double redundancy, auxiliary chip can replace when main unit fails;Protective film and interlayer design make upper garment lower edge and school badge module can be machine washed, cuff module can be detached, easy to clean and reduce maintenance cost.

Description

Technical Field

[0001] This utility model belongs to the field of radio frequency identification technology for clothing, specifically a smart school uniform with RFID. Background Technology

[0002] Against the backdrop of rapid development in educational informatization, the construction of smart campuses has become a trend. RFID technology, due to its non-contact identification and large information storage capacity, is widely used in scenarios such as campus attendance and security management. School uniforms with RFID functionality, serving as a link between students and the campus management system, can achieve functions such as student identification and activity tracking, effectively improving campus management efficiency. Currently, various school uniform products integrating RFID technology are emerging, but there is still room for improvement in terms of functional stability, ease of use, and maintenance cost control. The industry urgently needs smart school uniforms that combine high reliability and practicality.

[0003] Existing RFID-enabled school uniform products have many technical problems. Most of them adopt a single RFID unit design, and once the unit is damaged, the whole function will fail, lacking redundancy. The identification distance and location adaptability of the RFID unit are insufficient, making it difficult to meet the needs of long-distance non-intrusive identification and close-range rapid interaction. The RFID module of some products has poor protection performance and cannot withstand daily washing, or the complex fixing method makes disassembly difficult, increasing the difficulty of cleaning and maintenance costs, and affecting the actual user experience.

[0004] The patent application number 202220987320.0 discloses a smart collar label for clothing, which includes a flexible cover (1) and a flexible RFID tag (2), wherein the RFID tag (2) is disposed inside the cover (1). This design lacks redundancy protection, and the overall function fails once the unit is damaged. At the same time, the RFID module has poor protection performance and cannot withstand daily washing. Utility Model Content

[0005] The purpose of this invention is to provide a smart school uniform with RFID to solve the following problems mentioned in the background art:

[0006] Most existing technologies use a single RFID unit design, which lacks redundancy and is also difficult to withstand daily washing.

[0007] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0008] A smart school uniform with RFID includes a uniform body and a school badge module, a cuff module, and a hem module integrated into the uniform body. The hem module includes a non-woven fabric carrier, a main RFID unit, a protective film, and a sewn reinforcement layer. The main RFID unit is fixed to the center of the non-woven fabric carrier. The protective film covers the surface of the main RFID unit and is heat-sealed with the non-woven fabric carrier. The sewn reinforcement layer sewn the non-woven fabric carrier to the inner layer of the hem fabric of the uniform body. The school badge module includes a non-woven fabric base, a first carrier, and a first auxiliary RFID chip. The non-woven fabric base is sewn to the chest fabric of the uniform body. The first carrier is fixed to the surface of the non-woven fabric base. The first auxiliary RFID chip is embedded between the non-woven fabric base and the first carrier. The cuff module includes a second auxiliary RFID chip and a protective cover. The protective cover wraps the second auxiliary RFID chip and is fixed to the outside of the cuff of the uniform body with Velcro.

[0009] Furthermore, the sewn reinforcement layer of the upper garment hem module is the same fabric layer as the hem fabric of the school uniform body.

[0010] Furthermore, the protective film of the hem module is made of thermoplastic polyurethane film or polyethylene film.

[0011] Furthermore, the reinforcing layer is sewn with a zigzag stitch with a stitch length of 0.25-0.35cm, and 402 polyester-cotton thread is used for sewing.

[0012] Furthermore, the first carrier is bonded and fixed to the non-woven fabric substrate by hot heat adhesive.

[0013] Furthermore, the protective cloth cover is 4-6cm long and 2-3cm wide.

[0014] Furthermore, the Velcro includes a female patch and a female patch. The female patch is sewn onto the outer edge of the protective fabric cover, and the female patch is sewn onto the corresponding position on the outer cuff of the school uniform body.

[0015] Furthermore, a 2-3cm wide fabric interlayer is reserved at the chest position of the school badge module and the hem position of the upper garment module on the school uniform body. The non-woven fabric base is embedded in the chest fabric interlayer, and the non-woven fabric carrier is embedded in the hem fabric interlayer.

[0016] Furthermore, the protective cover for the cuff module is an elastic knitted fabric cover.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] In this invention, the main RFID unit of the hem module supports long-distance information reading; the auxiliary chip of the school badge module can assist in information reading and facilitate rapid identification; and the cuff module allows students to easily raise their hands for scanning and identification. The three modules form a double redundancy guarantee. When the main RFID unit fails, the auxiliary chip can be temporarily replaced to ensure uninterrupted function. The protective film and interlayer design allow the hem and school badge module to be machine washed directly. The detachable cuff module further improves the convenience of cleaning. At the same time, replacing the damaged cuff module chip separately can significantly reduce campus maintenance costs. Attached Figure Description

[0019] Figure 1 This is one of the overall structural schematic diagrams of this utility model;

[0020] Figure 2 This is a partial structural diagram of the hem module of the garment according to this utility model;

[0021] Figure 3 This is a partial structural diagram of the school emblem module of this utility model;

[0022] Figure 4 This is a partial structural diagram of the cuff module of this utility model;

[0023] Figure 5 This is the second schematic diagram of the overall structure of this utility model.

[0024] The markings in the diagram are: 1-School uniform body, 2-School badge module, 3-Cuff module, 4-Hem module, 5-Non-woven fabric carrier, 6-Main RFID unit, 7-Sewing reinforcement layer, 8-Protective film, 9-Non-woven fabric substrate, 10-First carrier, 11-First auxiliary RFID chip, 12-Hook and loop fastener, 13-Protective cover, 14-Second auxiliary RFID chip, 15-Arm patch module. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] Example:

[0027] A smart school uniform with RFID, such as Figure 1 As shown, it includes the school uniform body 1 and the school badge module 2, cuff module 3, and upper hem module 4 integrated on the school uniform body 1; as Figure 2As shown, the upper garment hem module 4 includes a non-woven fabric carrier 5, a main RFID unit 6, a protective film 8, and a sewn reinforcement layer 7. The main RFID unit 6 is fixed to the center of the non-woven fabric carrier 5. The protective film 8 covers the surface of the main RFID unit 6 and is heat-sealed with the non-woven fabric carrier 5. The sewn reinforcement layer 7 sewn and fixed the non-woven fabric carrier 5 to the inner interlayer of the hem fabric of the school uniform body 1. Figure 3 As shown, the school badge module 2 includes a non-woven fabric base 9, a first carrier 10, and a first auxiliary RFID chip 11. The non-woven fabric base 9 is sewn and fixed to the chest fabric of the school uniform body 1. The first carrier 10 is fixed to the surface of the non-woven fabric base 9, and the first auxiliary RFID chip 11 is embedded between the non-woven fabric base 9 and the first carrier 10. Figure 4 As shown, the cuff module 3 includes a second auxiliary RFID chip 14 and a protective fabric cover 13. The protective fabric cover 13 wraps around the second auxiliary RFID chip 14 and is fixed to the outside of the cuff of the school uniform body 1 using Velcro 12. Both the non-woven fabric carrier 5 and the non-woven fabric base 9 are made of waterproof non-woven fabric. The protective film 8 and the first carrier 10 are also made of waterproof materials. The protective fabric cover 13 is made of abrasion-resistant material. The school uniform body fabric is a polyester-cotton blend. It should be noted that RFID is a wireless communication technology that identifies specific targets and reads and writes relevant data through radio signals without mechanical contact. The RFID chips in this invention all use existing technology.

[0028] The smart school uniform with RFID technology achieves multi-functionality in a school setting through the coordinated operation of the school badge module 2, cuff module 3, and hem module 4. The hem module 4, as the main functional unit, stores complete identity data such as student name, student ID, class, parent contact information, and emergency medical information in its main RFID unit 6 at the center of its non-woven fabric carrier 5. This data can interact with long-range card readers within the school. The protective film 8 is heat-sealed to isolate it from moisture, dust, and friction. The sewn reinforcement layer 7 fixes the entire module to the inner layer of the hem of the uniform body 1, ensuring the main RFID unit 6 stably performs its core data storage and transmission functions. The non-woven fabric base 9 of the school badge module 2 is sewn to the chest fabric layer of the uniform body 1, and the first carrier 10 is fixed in place. On the substrate surface, the first auxiliary RFID chip 11 is embedded between the two, storing key student identification information, suitable for close-range rapid identification scenarios, and protected by the buffer layer formed by the substrate and the carrier; the second auxiliary RFID chip 14 of the cuff module 3 is wrapped in a protective cloth cover 13 and fixed to the outside of the cuff of the school uniform body 1 by Velcro 12, also storing key identification information, and the Velcro 12 is designed to be easy to remove before the school uniform is washed, which is convenient for maintenance and reuse. The three modules respectively play the roles of core interaction, high-frequency rapid identification and flexible operation and maintenance, and together serve the campus management.

[0029] The main RFID unit 6 of the hem module 4 supports long-distance information reading; the auxiliary chip of the school badge module 2 assists in information reading, facilitating rapid identification; and the cuff module 3 allows students to easily scan and identify the badge by raising their hands. These three modules form a double redundancy guarantee; if the main RFID unit 6 fails, the auxiliary chip can temporarily replace it, ensuring uninterrupted functionality. The protective film 8 and the interlayer design allow the hem module 4 and school badge module 2 to be machine washed directly. The detachable cuff module 3 further enhances cleaning convenience, and replacing the damaged cuff module 3 chip separately significantly reduces campus maintenance costs. All modules are hidden inside the uniform or in prominent locations, without compromising the uniform's wearing comfort.

[0030] In a preferred embodiment, the sewing reinforcement layer 7 of the upper hem module 4 is a fabric layer of the same type as the hem fabric of the school uniform body 1. Using the same fabric layer as the hem fabric of the school uniform body 1 enhances the firmness of the sewing by ensuring the fit of the homogeneous fabric, preventing seam cracking and carrier displacement after long-term wear due to differences in shrinkage and abrasion resistance between different fabrics. Furthermore, it ensures that the feel of the inner layer of the hem is consistent with the school uniform body 1, eliminating any foreign body sensation or friction discomfort, thus guaranteeing a comfortable wearing experience.

[0031] In a preferred embodiment, the protective film 8 of the upper hem module 4 is made of thermoplastic polyurethane film or polyethylene film. Thermoplastic polyurethane film has excellent flexibility and abrasion resistance, and can adapt to the wrinkles and stretches of the school uniform hem during daily activities, while being waterproof and sweatproof; polyethylene film has good sealing performance and low cost advantages, and can effectively prevent dust and moisture from entering. Both materials can be easily bonded to the non-woven fabric carrier 5 through hot pressing process to form a sealed protective space, preventing the main RFID unit 6 from being damaged by environmental factors and ensuring its long-term stable operation. At the same time, the material is thin and does not affect the comfort of wearing the school uniform.

[0032] In a preferred embodiment, the reinforcing layer 7 is sewn with a zigzag stitch with a stitch spacing of 0.25-0.35cm, and 402 polyester-cotton thread is used. The zigzag stitch enhances the interlocking between the fabric and the non-woven carrier 5 through the interlacing stitches, and is more resistant to pulling than straight stitches, preventing the module from shifting during student activities; the dense stitch spacing of 0.25-0.35cm reduces the gap between the seams, further improving the fixation stability, while preventing wear on the fabric edges; the 402 polyester-cotton thread combines the toughness of polyester with the softness of cotton, is not easy to break and has good compatibility with school uniform fabrics, which can reduce the stiffness at the seams, ensure wearing comfort, and make the fixation of the upper hem module 4 more durable and fit better.

[0033] In a preferred embodiment, the first carrier 10 is bonded to the non-woven fabric substrate 9 using hot-press adhesive. The first carrier 10 can form a buffer layer to protect the embedded first auxiliary RFID chip 11 and reduce damage to the chip from collisions. The hot-press adhesive bonding eliminates the need for stitching, ensuring a firm fit and avoiding the impact of needle holes from sewing on the waterproof effect. It is also convenient to operate and does not affect the overall flatness and wearing comfort of the school badge module 2.

[0034] In a preferred embodiment, the protective sleeve 13 is 4-6cm long and 2-3cm wide. The protective sleeve 13, with a length of 4-6cm and a width of 2-3cm, can completely cover the second auxiliary RFID chip 14, preventing the chip from being exposed, falling off, or being damaged by friction. It is not too large, which would make the cuff bulky and affect the student's arm movement, nor too small, which would make it difficult to fix and remove the Velcro 12. It balances the protective effect on the chip with the flexibility and comfort of wearing the cuff.

[0035] In a preferred embodiment, the Velcro 12 includes a female patch and a female patch. The female patch is sewn onto the outer edge of the protective cover 13, and the female patch is sewn onto the corresponding position on the outer side of the cuff of the school uniform body 1. The precise alignment of the female and female patches allows for quick fixation of the protective cover 13, preventing displacement during wear or activity and ensuring the stable position of the second auxiliary RFID chip 14 for successful identification. Furthermore, sewing is more secure than gluing, making it less prone to detachment due to friction. The easy separation of the female and female patches also facilitates quick removal of the protective cover 13 before washing the school uniform, thus combining stability in use with ease of maintenance.

[0036] In a preferred embodiment, the school uniform body 1 has 2-3cm wide fabric interlayers at the chest position of the school badge module 2 and at the hem position of the upper garment hem module 4. The non-woven fabric base 9 is embedded in the chest fabric interlayer, and the non-woven fabric carrier 5 is embedded in the hem fabric interlayer. The 2-3cm wide fabric interlayers at the chest and hem positions of the school uniform body 1 provide precise embedding space for the non-woven fabric base 9 and the non-woven fabric carrier 5, achieving a seamless fit between the module and the school uniform fabric and preventing module protrusions from affecting wearing comfort. Furthermore, the interlayer structure physically encapsulates the internal RFID chip, reducing direct damage to the components from daily friction and collisions. It also hides module traces, maintaining the neatness of the school uniform's appearance, and helps to fix the module's position, preventing displacement after long-term wear.

[0037] In a preferred embodiment, the protective cover 13 of the cuff module 3 is an elastic knitted fabric cover, which can tightly wrap the second auxiliary RFID chip 14 with elasticity to prevent the chip from shifting during student activities, and can also adapt to the daily stretching and bending of the cuff without restricting arm movement; at the same time, the knitted fabric is soft and skin-friendly, and does not cause friction discomfort when it fits the outside of the cuff, and has a certain degree of abrasion resistance, which can reduce the chip from being damaged by external friction, thus taking into account protection, comfort and flexibility of movement.

[0038] In a preferred embodiment, such as Figure 5 As shown, an arm patch module 15 is installed near the heel of the sleeve of the school uniform body 1. The arm patch module 15 includes a third auxiliary RFID chip, a flexible waterproof shell, and a hidden snap. The flexible waterproof shell covers the third auxiliary RFID chip. The female snap of the hidden snap is fixed to the outside of the flexible waterproof shell, and the female snap is sewn to a preset position on the inside of the sleeve near the heel of the school uniform body 1. The arm patch module 15 is detachably connected to the school uniform body 1 via the hidden snap. During installation, the third auxiliary RFID chip is placed into the flexible waterproof shell and the shell cover is fastened. The shell cover adopts a snap-on design and can be manually removed without tools. Align the female snap on the outside of the waterproof shell with the female snap on the inside of the sleeve and press them together. A "click" sound indicates that the chip is fixed. During maintenance, if the chip is damaged, the snap can be directly separated to remove the waterproof shell, open the shell cover, and replace the chip, greatly improving maintenance efficiency. Before washing the school uniform, the arm patch module can be quickly removed to avoid a decrease in the sealing performance of the waterproof shell due to long-term immersion.

[0039] In the description of this utility model, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "side", "top", "inner", "front", "center", "both ends", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0040] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "setting," "connection," "fixing," "screw connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0041] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A smart school uniform with RFID, characterized in that: It includes the school uniform body (1) and the school badge module (2), cuff module (3) and upper hem module (4) integrated on the school uniform body (1); The upper garment hem module (4) includes a non-woven fabric carrier (5), a main RFID unit (6), a protective film (8), and a sewing reinforcement layer (7). The main RFID unit (6) is fixed to the center of the non-woven fabric carrier (5). The protective film (8) covers the surface of the main RFID unit (6) and is heat-sealed with the non-woven fabric carrier (5). The sewing reinforcement layer (7) sewn the non-woven fabric carrier (5) to the inner interlayer of the hem fabric of the school uniform body (1). The school badge module (2) includes a non-woven fabric base (9), a first carrier (10) and a first auxiliary RFID chip (11). The non-woven fabric base (9) is sewn and fixed to the chest fabric of the school uniform body (1). The first carrier (10) is fixed to the surface of the non-woven fabric base (9). The first auxiliary RFID chip (11) is embedded between the non-woven fabric base (9) and the first carrier (10). The cuff module (3) includes a second auxiliary RFID chip (14) and a protective cloth cover (13). The protective cloth cover (13) wraps the second auxiliary RFID chip (14) and is fixed to the outside of the cuff of the school uniform body (1) by Velcro (12).

2. The smart school uniform with RFID according to claim 1, characterized in that: The sewing reinforcement layer (7) of the upper garment hem module (4) is the same fabric layer as the hem fabric of the school uniform body (1).

3. The smart school uniform with RFID according to claim 1, characterized in that: The protective film (8) of the upper garment hem module (4) is made of thermoplastic polyurethane film or polyethylene film.

4. The smart school uniform with RFID according to claim 1, characterized in that: The reinforcing layer (7) is sewn with a zigzag stitch with a stitch length of 0.25-0.35cm. 402 polyester-cotton thread is used for sewing.

5. A smart school uniform with RFID according to claim 1, characterized in that: The first carrier (10) is bonded and fixed to the non-woven fabric substrate (9) by hot heat adhesive.

6. A smart school uniform with RFID according to claim 1, characterized in that: The protective cloth cover (13) is 4-6cm long and 2-3cm wide.

7. A smart school uniform with RFID according to claim 1, characterized in that: The Velcro (12) includes a female patch and a female patch. The female patch is sewn onto the outer edge of the protective fabric cover (13), and the female patch is sewn onto the corresponding position on the outer cuff of the school uniform body (1).

8. A smart school uniform with RFID according to claim 1, characterized in that: The school uniform body (1) has a 2-3cm wide fabric interlayer at the chest position of the school badge module (2) and the hem position of the upper garment hem module (4). The non-woven fabric base (9) is embedded in the chest fabric interlayer, and the non-woven fabric carrier (5) is embedded in the hem fabric interlayer.

9. A smart school uniform with RFID according to claim 1, characterized in that: The protective cover (13) of the cuff module (3) is an elastic knitted fabric cover.

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