A pre-forming device for a dual-redundancy temperature sensor thermally-epoxy packaged

Abstract

The utility model discloses a kind of preforming devices of double-redundancy temperature sensor heat-conducting glue packaging, including support frame, the inside installation of support frame is shaped component, by shaped component and conveying component mutual cooperation, start second motor drive conveyor belt operation, element is conveyed to the just above shaped component, temperature sensor element is just located between the first group of shaping grooves of two groups of moulds at this time, first motor forward rotation, drive two groups of moulds along slide bar slide towards each other, until mould closes, shaping groove forms closed cavity, glue injection packaging is cooled, open mould, conveyor belt continues to drive the element of first packaging to carry out the position of second shaping groove, first shaping groove position is conveyed with new element, in turn, moulding glue injection is carried out, finally, element moved to blanking place after three heat-conducting glue packaging is taken down, to form stable flow operation, reduce process waiting time simultaneously.

Description

Technical Field

[0001] This utility model relates to the field of temperature sensor manufacturing technology, specifically to a pre-forming device for thermally conductive adhesive encapsulation of a dual-redundant temperature sensor. Background Technology

[0002] Dual-redundant temperature sensors are widely used in high-reliability scenarios (such as aircraft engine temperature control and nuclear power equipment monitoring) due to their dual-backup detection function. During their manufacturing process, thermally conductive adhesive is used to encapsulate the components to fix them and optimize their thermal conductivity. The encapsulation pre-forming process is a core step that requires ensuring uniform adhesive layer thickness, accurate component positioning, and compatibility with sensors of different specifications.

[0003] Existing thermal conductive adhesive encapsulation molding devices for temperature sensors typically place the temperature sensor element inside a shaping groove, fix it using a positioning structure, and then encapsulate it using an adhesive injection assembly. After encapsulating the thermal conductive adhesive, the element is removed for the next encapsulation. This method cannot achieve fast and accurate material loading, has a long material preparation time, and cannot form a continuous production line, resulting in low encapsulation efficiency. Therefore, we need to propose a pre-forming device for thermal conductive adhesive encapsulation of dual-redundancy temperature sensors. Utility Model Content

[0004] The purpose of this invention is to provide a pre-forming device for thermally conductive adhesive encapsulation of a dual-redundant temperature sensor. A second motor drives a conveyor belt to transport the component directly above the shaping assembly. At this point, the temperature sensor component is positioned between the first shaping slots of the two sets of molds. The first motor rotates forward, driving the two sets of molds to slide towards each other along a sliding rod until the molds close, forming a closed cavity in the shaping slots. After the adhesive encapsulation and cooling, the molds are opened, and the conveyor belt continues to move the first-encapsulated component to the position of the second shaping slot. New components are conveyed to the first shaping slot position, and the process is repeated sequentially with mold closing and adhesive injection. Finally, the component, after three thermally conductive adhesive encapsulations, moves to the unloading point and is removed, thus forming a stable assembly line operation, reducing process waiting time, and solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a pre-forming device for thermally conductive adhesive encapsulation of a dual-redundancy temperature sensor, comprising a support frame, a shaping component installed inside the support frame, a conveying component for conveying sensor elements installed on one side of the top of the support frame, and an injection component installed on the other side of the top of the support frame; the shaping component includes a first motor fixedly bolted to one side of the support frame, the output shaft of the first motor being keyed to a lead screw, one end of the lead screw being rotatably mounted through the inner wall of the support frame, and two sets of molds being connected by positive and negative threads in the middle of the lead screw, with three sets of shaping grooves of different specifications opened from the top on opposite sides of the two sets of molds; the conveying component includes a support plate fixedly installed on the top of the support frame, with several sets of rotating wheels rotatably mounted on one side of the support plate via several sets of rotating rods, and a conveyor belt for conveying is fitted onto the outer arc surface of the several sets of rotating wheels, with a dry assembly placement frame fixedly installed on the outer side of the conveyor belt, and several sets of positioning grooves opened on one side of the placement frame.

[0006] Preferably, a second motor is bolted to one side of the support plate, and the output shaft of the second motor is keyed to one end of one of the sets of rotating rods.

[0007] Preferably, two sets of sliding rods are fixedly installed on the inner side wall of the support frame. The two sets of sliding rods are arranged parallel to the lead screw, and the two sets of molds are slidably fitted onto the outer arc surface of the two sets of sliding rods.

[0008] Preferably, each end of the two sets of molds is connected to a set of connecting pipes, and the four sets of connecting pipes are respectively connected to the cooling pipe and the return pipe of the cooling system.

[0009] Preferably, the glue injection assembly includes a mounting plate fixedly installed on the top of the support frame. Three sets of glue barrels with automatic heating function are installed on the top of the mounting plate. The outer arc surface of each glue barrel is connected to a set of glue injection nozzles through a telescopic tube. The glue injection port of each set of glue injection nozzles is respectively aligned with the feed port of a set of shaping grooves.

[0010] Preferably, a fixing plate is fixedly installed on the top of one set of molds, and the set of injection nozzles is fixedly installed above the set of molds through the fixing plate.

[0011] Preferably, two sets of material frames are movably placed at the bottom of the inner cavity of the support frame, and the two sets of material frames are located directly below the loading end and unloading end of the conveying component, respectively.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] This invention utilizes a combination of a shaping component and a conveying component. A second motor drives the conveyor belt to transport the component directly above the shaping component. At this point, the temperature sensor component is positioned between the first shaping slots of the two sets of molds. The first motor rotates forward, driving the two sets of molds to slide towards each other along the slide bar until the molds close, forming a closed cavity in the shaping slot. After the adhesive is injected, sealed, and cooled, the mold is opened, and the conveyor belt continues to move the first-sealed component to the position of the second shaping slot. New components are conveyed to the first shaping slot, and the process is repeated sequentially with mold closing and adhesive injection. Finally, the component, after being sealed with thermally conductive adhesive three times, moves to the unloading point and is removed. This creates a stable assembly line operation, reducing process waiting time while providing three-stage sealing of the component, avoiding the situation where a single thermally conductive adhesive seal is insufficient.

[0014] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention can be realized and obtained through the structures pointed out in the description and the accompanying drawings. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the installation structure of the glue injection assembly of this utility model;

[0017] Figure 3 This is a schematic diagram of the installation structure of the standardized components of this utility model;

[0018] Figure 4 This is an exploded view of the transmission component of this utility model;

[0019] Figure 5 This is an exploded structural diagram of the glue injection assembly of this utility model;

[0020] Figure 6 A schematic diagram of the positioning groove of this utility model.

[0021] In the diagram: 1. Support frame; 2. Shaping assembly; 21. First motor; 22. Lead screw; 23. Mold; 24. Shaping groove; 25. Slide rod; 26. Connecting pipe; 3. Conveying assembly; 31. Support plate; 32. Rotating rod; 33. Rotating wheel; 34. Conveyor belt; 35. Placement rack; 36. Positioning groove; 37. Second motor; 4. Glue injection assembly; 41. Mounting plate; 42. Glue bucket; 43. Telescopic pipe; 44. Glue injection nozzle; 45. Fixing plate; 5. Material frame. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-6 This utility model provides a pre-forming device for thermally conductive adhesive encapsulation of a dual-redundancy temperature sensor, including a support frame 1. A shaping component 2 is installed inside the support frame 1. A conveying component 3 for transporting sensor elements is installed on one side of the top of the support frame 1, and an adhesive injection component 4 is installed on the other side of the top of the support frame 1. The shaping component 2 includes a first motor 21 fixedly bolted to one side of the support frame 1. The output shaft of the first motor 21 is keyed to a lead screw 22. One end of the lead screw 22 is rotatably mounted through the inner wall of the support frame 1. Two sets of molds 23 are connected to the middle of the 22 by positive and negative threads. Three sets of shaping grooves 24 of different specifications are opened from the top on the opposite sides of the two sets of molds 23. The conveying assembly 3 includes a support plate 31 fixedly installed on the top of the support frame 1. Several sets of rotating wheels 33 are rotatably installed on one side of the support plate 31 through several sets of rotating rods 32. The outer arc surface of several sets of rotating wheels 33 is fitted with a conveyor belt 34 for conveying. A dry assembly placement frame 35 is fixedly installed on the outside of the conveyor belt 34. Several sets of positioning grooves 36 are opened on one side of the placement frame 35.

[0024] In operation, the rotating rod 32 rotates while driving the rotating wheel 33 to rotate, which in turn drives the conveyor belt 34 to rotate. The rotating conveyor belt 34 drives the components inside the positioning groove 36 to move, transporting the components to the top of the shaping assembly 2. At this time, the temperature sensor component is exactly located between the first shaping groove 24 of the two sets of molds 23. The first motor 21 rotates clockwise, driving the lead screw 22 to rotate. The lead screw 22 rotates, driving the two sets of molds 23 to move towards each other along the slide bar 25 until the molds 23 close, and the shaping groove 24 forms a closed cavity. Through the setting of the glue injection assembly 4, after the glue injection and encapsulation are cooled, the first motor 21 rotates counterclockwise to open the mold 23. The conveyor belt 34 continues to drive the first encapsulated component to the position of the second shaping groove 24. New components are conveyed to the position of the first shaping groove 24, and the mold is closed and glue is injected again. Finally, the component encapsulated with thermally conductive glue three times moves to the unloading point and is removed, thus forming a stable assembly line operation and reducing the waiting time of the process.

[0025] A second motor 37 is bolted to one side of the support plate 31. The output shaft of the second motor 37 is keyed to one end of one set of rotating rods 32. When the second motor 37 is started, it rotates and drives one set of rotating rods 32 to rotate. The rotating rods 32 drive the conveyor belt to move through the rotating wheel 33. The other rotating rods 32 and rotating wheels 33 follow the rotation. In order to improve the stability of the conveyor belt, the conveyor belt is made of steel belt, and the interface between the conveyor belt and the roller is designed to be meshed, thereby achieving the accuracy of component movement.

[0026] Two sets of slide rods 25 are fixedly installed on the inner side wall of the support frame 1. The two sets of slide rods 25 are arranged parallel to the lead screw 22, and the two sets of molds 23 are slidably fitted onto the outer arc surface of the two sets of slide rods 25. By setting the slide rods 25, the two sets of molds 23 can only slide along the outer arc surface of the slide rods 25, preventing the two sets of molds 23 from rotating with the lead screw 22 and improving the stability of the movement of the two sets of molds 23.

[0027] Both ends of the two sets of molds 23 are connected to a set of connecting pipes 26. The four sets of connecting pipes 26 are respectively connected to the cooling pipe and return pipe of the cooling system. Through the connection pipes 26, the coolant of the cooling system can enter the inner cavity of the mold 23 through the connecting pipes 26 to circulate and absorb heat, thereby achieving the effect of rapid cooling and shaping of the thermally conductive adhesive and reducing the shaping waiting time.

[0028] The glue injection assembly 4 includes a mounting plate 41 fixedly installed on the top of the support frame 1. Three sets of glue tanks 42 with automatic heating function are installed on the top of the mounting plate 41. Each set of glue tanks 42 has a set of glue injection nozzles 44 connected to its outer arc surface through a telescopic tube 43. The glue injection port of each set of glue injection nozzles 44 is aligned with the inlet of a set of shaping grooves 24. A fixing plate 45 is fixedly installed on the top of one set of molds 23. The set of glue injection nozzles 44 is fixedly installed above the set of molds 23 through the fixing plate 45. Each set of glue tanks 42 is connected to the glue injection nozzles 44 through the telescopic tube 43. The glue injection nozzles 44 are fixed to the top of one set of molds 23 through the fixing plate 45 to ensure that the outlet of the glue injection nozzle 44 is precisely aligned with the inlet of the shaping groove 24. The telescopic tube 43 can adaptively extend and retract with the opening and closing of the molds 23.

[0029] Two sets of material frames 5 are movably placed at the bottom of the inner cavity of the support frame 1. The two sets of material frames 5 are located directly below the loading end and unloading end of the conveying component 3, respectively. The setting of the material frames 5 facilitates centralized material preparation and centralized material collection, thereby improving work efficiency.

[0030] In practical use: The operator places the dual-redundant temperature sensor element into the material frame 5 at the loading end, and then embeds the element one by one into the positioning slot 36 of the placement rack 35 on the conveyor belt. The second motor 37 is started to drive the conveyor belt 34 to run, and the conveyor belt stops after transporting the element to the designated position directly above the shaping component 2. At this time, the temperature sensor element is exactly between the first shaping slot 24 of the two sets of molds 23. The first motor 21 rotates forward, driving the two sets of molds 23 to slide towards each other along the slide bar 25 until the molds 23 close, the shaping slot 24 forms a closed cavity, and the element is inside the closed cavity. The metering pump of the glue tank 42 starts, and the thermally conductive glue is injected into the shaping slot 24 through the telescopic tube 43 and the glue injection nozzle 44. After the glue injection is completed, the metering pump stops, and the cooling system is cooled. The system starts up, and cooling water enters the flow channel of mold 23 through connecting pipe 26 to cool and cure the thermally conductive adhesive. After curing, the first motor 21 reverses, the two sets of molds 23 separate, the conveyor belt 34 restarts, and the molded sensor element is transported to the position of the second shaping groove 24. The above operation is repeated to perform a second thermally conductive adhesive encapsulation. Then, the above operation is performed to encapsulate the element for the third time. The three thermally conductive adhesive encapsulations ensure that there is no leakage of the sensor element. After the three thermally conductive adhesive encapsulations, the element falls from the placement rack 35 into the material box 5 at the unloading end, completing the thermally conductive adhesive encapsulation of a set of temperature sensor elements. The entire encapsulation operation is a continuous process, reducing the waiting time between processes and improving the efficiency of encapsulation.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A pre-forming device for encapsulating a dual-redundant temperature sensor with thermally conductive adhesive, characterized in that: Includes a support frame (1), inside which a shaping component (2) is installed, a conveying component (3) for conveying sensor elements is installed on one side of the top of the support frame (1), and a glue injection component (4) is installed on the other side of the top of the support frame (1). The shaping component (2) includes a first motor (21) fixedly bolted to one side of the support frame (1). The output shaft of the first motor (21) is keyed to a lead screw (22). One end of the lead screw (22) is rotatably mounted through the inner wall of the support frame (1). The middle part of the lead screw (22) is connected to two sets of molds (23) with positive and negative threads. The opposite sides of the two sets of molds (23) are provided with three sets of shaping grooves (24) of different specifications from the top. The conveying assembly (3) includes a support plate (31) fixedly installed on the top of the support frame (1). A number of sets of rotating wheels (33) are rotatably installed on one side of the support plate (31) via a number of sets of rotating rods (32). The outer arc surfaces of the sets of rotating wheels (33) are fitted with a conveyor belt (34) for conveying. A set of placement racks (35) is fixedly installed on the outer side of the conveyor belt (34). A number of positioning grooves (36) are opened on one side of the placement rack (35).

2. The pre-forming device for encapsulating a dual-redundancy temperature sensor with thermally conductive adhesive according to claim 1, characterized in that: A second motor (37) is bolted to one side of the support plate (31), and the output shaft of the second motor (37) is keyed to one end of one of the sets of rotating rods (32).

3. The pre-forming device for encapsulating a dual-redundancy temperature sensor with thermally conductive adhesive according to claim 1, characterized in that: The inner wall of the support frame (1) is fixedly installed with two sets of slide rods (25). The two sets of slide rods (25) are arranged parallel to the lead screw (22), and the two sets of molds (23) are slidably fitted on the outer arc surface of the two sets of slide rods (25).

4. The pre-forming device for encapsulating a dual-redundancy temperature sensor with thermally conductive adhesive according to claim 1, characterized in that: Both ends of the two sets of molds (23) are connected to a set of connecting pipes (26), and the four sets of connecting pipes (26) are respectively connected to the cooling pipe and the return pipe of the cooling system.

5. The pre-forming device for encapsulating a dual-redundancy temperature sensor with thermally conductive adhesive according to claim 1, characterized in that: The glue injection assembly (4) includes a mounting plate (41) fixedly installed on the top of the support frame (1). Three sets of glue tanks (42) with automatic heating function are installed on the top of the mounting plate (41). The outer arc surface of each glue tank (42) is connected to a set of glue injection nozzles (44) through a telescopic tube (43). The glue injection port of each set of glue injection nozzles (44) is aligned with the feed port of a set of shaping grooves (24).

6. The pre-forming device for encapsulating a dual-redundancy temperature sensor with thermally conductive adhesive according to claim 5, characterized in that: A fixing plate (45) is fixedly installed on the top of one set of molds (23), and three sets of injection nozzles (44) are fixedly installed above one set of molds (23) through the fixing plate (45).

7. The pre-forming device for encapsulating a dual-redundancy temperature sensor with thermally conductive adhesive according to claim 1, characterized in that: Two sets of material frames (5) are movably placed at the bottom of the inner cavity of the support frame (1). The two sets of material frames (5) are located directly below the loading end and unloading end of the conveying component (3), respectively.

Images