Scratch-proof transfer device for semiconductor wafer

Abstract

This utility model discloses a scratch-resistant transport device for semiconductor wafers. The top of the rotating assembly is equipped with a storage component for storing the semiconductor wafers. The protective device includes a fixed component fixedly installed on the transport vehicle for movably connecting with the rotating assembly. The fixed component contains an adjustment component for rotation, and a clamping component for threaded connection with the adjustment component to clamp and fix the semiconductor wafers within the storage component. Thus, when transporting semiconductor wafers, the wafers are placed on a support plate, and rotating the rotating disk moves the four storage cylinders to the operator's view, allowing for quick storage of the wafers into the cylinders, with the cylinders positioned directly below the clamping plate. Rotating the handwheel drives the threaded rod, causing the clamping plate to move downwards along the storage cylinders, compressing the spring on the sliding rod to protect the semiconductor wafers. When the clamping plate moves upwards, the spring's elasticity causes the support plate to move upwards with the wafers, allowing for quick removal of the semiconductor wafers.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor manufacturing, and in particular to a scratch-resistant transport device for semiconductor wafers. Background Technology

[0002] Semiconductor wafers refer to silicon wafers used to manufacture silicon semiconductor circuits. Their raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single-crystal silicon. During the transportation process, in order to avoid scratches on the semiconductor wafers, protective devices are usually installed on the transportation equipment.

[0003] Existing transfer devices use suction cups to hold semiconductor wafers in place to prevent them from shifting during transfer and causing scratches.

[0004] However, when using a suction cup to adsorb and fix semiconductor wafers, the lack of a protective device for the semiconductor wafer in the transfer device will expose the semiconductor wafer to the outside, which can easily cause particulate matter to stick to the surface of the semiconductor wafer, thus affecting the subsequent wafer bumping process. Utility Model Content

[0005] This utility model aims to at least partially solve one of the technical problems in the related art.

[0006] Therefore, this utility model proposes a scratch-resistant transfer device for semiconductor wafers. When transferring semiconductor wafers, the semiconductor wafer is placed on a support plate, and the rotating disk is rotated to move four storage cylinders in front of the operator, allowing the wafer to be quickly stored in the storage cylinders, with the storage cylinders positioned directly below the clamping plate. Rotating the handwheel drives the threaded rod, causing the clamping plate to move downwards along the storage cylinders, compressing the spring on the slide rod to protect the semiconductor wafer. When the clamping plate moves upwards, the elasticity of the spring causes the support plate to move upwards with the wafer, allowing the semiconductor wafer to be quickly removed.

[0007] To achieve the above objectives, this utility model proposes a scratch-resistant transport device for semiconductor wafers, comprising a transport cart, a storage device for storing semiconductor wafers at the top of the transport cart, and a protective device for clamping and fixing the semiconductor wafers in the storage device above the transport cart. The storage device includes a rotating assembly disposed above the transport cart for rotation, and a storage assembly for storing semiconductor wafers at the top of the rotating assembly. The protective device includes a fixing assembly fixedly installed on the transport cart for movably connecting with the rotating assembly, an adjusting assembly for rotation within the fixing assembly, and a clamping assembly for clamping and fixing the semiconductor wafers in the storage assembly by threaded connection with the adjusting assembly within the fixing assembly.

[0008] In addition, the anti-scratch transport device for semiconductor wafers proposed in this application may also have the following additional technical features:

[0009] Specifically, a handle for driving the transfer vehicle to move is fixedly installed on the left end of the transfer vehicle, and four casters for driving the transfer vehicle to move are fixedly installed on the bottom end of the transfer vehicle. An annular groove for the rotating component to rotate is opened on the top end of the transfer vehicle.

[0010] Specifically, the rotating assembly includes a rotating disk mounted on a fixed assembly for rotation, four support rods fixedly mounted at the bottom end of the rotating disk, and sliders for sliding within an annular groove fixedly mounted at the bottom ends of the four support rods.

[0011] Specifically, the storage assembly includes a storage cylinder fixedly installed on the top of the rotating disk for storing semiconductor wafers, and the cylinder has four long slots.

[0012] Specifically, a sliding rod is fixedly installed on the four elongated slots. A movable plate for moving up and down is fitted on the rod of the sliding rod. A support plate for placing semiconductor wafers is fixedly installed on the block of the movable plate. A spring for ejecting semiconductor wafers from the support plate into the storage cylinder is fitted on the rod of the sliding rod.

[0013] Specifically, the fixing component includes a fixing rod fixedly installed on the top of the transfer vehicle for movably connecting with the rotating disk, and the fixing rod has four square slots on its body.

[0014] Specifically, the adjustment assembly includes a threaded rod disposed within the fixed rod for driving the clamping assembly to move up and down, and a handwheel for driving the threaded rod to rotate is fixedly installed at the top end of the threaded rod.

[0015] Specifically, the clamping assembly includes a threaded sleeve plate disposed inside the fixed rod for threaded connection with the threaded rod. Four connecting plates are fixedly installed on the plate body of the threaded sleeve plate. A connecting rod is fixedly installed at the bottom end of the connecting plate. A clamping plate for clamping and fixing the semiconductor wafer in the storage cylinder is fixedly installed at the bottom end of the connecting rod.

[0016] Compared with the prior art, the beneficial effects of this application are as follows:

[0017] By setting up storage and protective devices, when transferring semiconductor wafers, the semiconductor wafers are placed on the support plate, and the rotating disk is rotated to move the four storage cylinders in front of the operator, so that the wafers can be quickly stored in the storage cylinders and the storage cylinders are positioned directly below the clamping plate; rotating the handwheel drives the threaded rod to move the clamping plate down along the storage cylinders, compressing the spring on the slide rod to protect the semiconductor wafers; when the clamping plate moves up, the elasticity of the spring causes the support plate to move the wafers up, so that the semiconductor wafers can be quickly removed.

[0018] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, in which:

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a front view of the present invention;

[0022] Figure 3 This is a schematic diagram of the storage device structure of this utility model;

[0023] Figure 4 For the present utility model Figure 3 Enlarged view of point A in the middle;

[0024] Figure 5 This is a schematic diagram of the protective device structure of this utility model;

[0025] Figure 6 For the present utility model Figure 5 Enlarged view of section B in the middle.

[0026] As shown in the figure: 100, transfer vehicle; 101, handle; 102, annular groove; 103, caster wheel; 200, storage device; 210, rotating assembly; 211, rotating disk; 212, support rod; 213, slider; 220, storage assembly; 221, storage cylinder; 222, long groove; 223, support plate; 224, moving plate; 225, sliding rod; 226, spring; 300, protective device; 310, fixing assembly; 311, fixing rod; 312, square groove; 320, adjusting assembly; 321, threaded rod; 322, handwheel; 330, clamping assembly; 331, threaded sleeve plate; 332, connecting plate; 333, connecting rod; 334, clamping plate. Detailed Implementation

[0027] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention. Rather, the embodiments of the present invention include all variations, modifications, and equivalents falling within the spirit and scope of the appended claims.

[0028] The following description, in conjunction with the accompanying drawings, describes a semiconductor wafer anti-scratch transfer device according to an embodiment of the present invention.

[0029] like Figures 1-6 As shown in the figure, a scratch-resistant transfer device for semiconductor wafers according to an embodiment of the present invention may include a transfer cart 100, a storage device 200 for storing semiconductor wafers is provided at the top of the transfer cart 100, a protective device 300 for clamping and fixing the semiconductor wafers in the storage device 200 is provided above the transfer cart 100, the storage device 200 includes a rotating component 210 disposed above the transfer cart 100 for rotating, a storage component 220 for storing semiconductor wafers is provided at the top of the rotating component 210, and the protective device 300 includes a fixing component 310 fixedly installed on the transfer cart 100 for movably connecting with the rotating component 210, an adjusting component 320 for rotating is provided inside the fixing component 310, and a clamping component 330 for clamping and fixing the semiconductor wafers in the storage component 220 by being threadedly connected to the adjusting component 320.

[0030] In one embodiment of this utility model, such as Figure 2 and Figure 3 As shown, a handle 101 for driving the transport vehicle 100 to move is fixedly installed at the left end of the transport vehicle 100, and four casters 103 for driving the transport vehicle 100 to move are fixedly installed at the bottom end of the transport vehicle 100. The four casters 103 are welded in a rectangular array at the four corners of the bottom end of the transport vehicle 100. The casters 103 are equipped with brake pads. The top of the transport vehicle 100 is provided with an annular groove 102 for the rotating component 210 to rotate. Thus, the handle 101 can be used to push the transport vehicle 100 to move, and the four casters 103 can be used to transfer the semiconductor wafers in the storage device 200.

[0031] In one embodiment of this utility model, such as Figure 3 and Figure 4As shown, the rotating assembly 210 includes a rotating disk 211 mounted on the fixed assembly 310 for rotation. Four support rods 212 are fixedly installed at the bottom of the rotating disk 211. The four support rods 212 are welded to the bottom of the rotating disk 211 in a circumferential array. Slider blocks 213 for sliding in the annular groove 102 are fixedly installed at the bottom of the four support rods 212. Therefore, when it is necessary to store semiconductor wafers in the storage assembly 220, the four storage assemblies 220 can be moved to the operator's view by rotating the rotating disk 211, so that semiconductor wafers can be quickly stored in the storage assembly 220.

[0032] Furthermore, the storage assembly 220 includes a storage cylinder 221 fixedly installed on the top of the rotating disk 211 for storing semiconductor wafers, and there are four storage cylinders 221, which are welded to the top of the rotating disk 211 in a circumferential array; four long slots 222 are opened on the cylinder body of the storage cylinder 221, and the four long slots 222 are distributed in a circumferential manner on the inner wall of the storage cylinder 221.

[0033] Furthermore, slide rods 225 are fixedly installed on the four long slots 222. A movable plate 224 for vertical movement is fitted on the slide rod 225. The movable plate 224 can move up and down within the long slots 222. A support plate 223 for placing semiconductor wafers is fixedly installed on the movable plate 224. A spring 226 for ejecting semiconductor wafers from the support plate 223 into the storage cylinder 221 is fitted on the slide rod 225. Therefore, when it is necessary to store semiconductor wafers in the storage cylinder 221, the semiconductor wafers can be placed on the support plate 223. At the same time, the rotating disk 211 is used to move the four storage components 220 to the operator's view, so that the semiconductor wafers can be quickly stored in the storage components 220.

[0034] In one embodiment of this utility model, such as Figure 5 and Figure 6 As shown, the fixing assembly 310 includes a fixing rod 311 fixedly installed on the top of the transfer vehicle 100 for movably connecting with the rotating disk 211. The rod body of the fixing rod 311 is connected to the rotating disk 211 through a bearing, which facilitates the rotation of the rotating disk 211. Four square slots 312 are provided on the rod body of the fixing rod 311.

[0035] Furthermore, the adjusting assembly 320 includes a threaded rod 321 disposed within the fixed rod 311 for driving the clamping assembly 330 to move up and down, and the upper and lower ends of the threaded rod 321 are connected to the fixed rod 311 through bearings, thus facilitating the rotation of the threaded rod 321; a handwheel 322 for driving the rotation of the threaded rod 321 is fixedly installed at the top end of the threaded rod 321.

[0036] Furthermore, the clamping assembly 330 includes a threaded sleeve plate 331 disposed within the fixing rod 311 for threaded connection with the threaded rod 321. Four connecting plates 332 are fixedly mounted on the plate body of the threaded sleeve plate 331. The four connecting plates 332 are welded in a circumferential array within the threaded sleeve plate 331, wherein the four connecting plates 332 move within four square slots 312. A connecting rod 333 is fixedly mounted at the bottom end of the connecting plate 332, and a clamping device is fixedly mounted at the bottom end of the connecting rod 333 for clamping the semiconductor wafers within the storage cylinder 221. A fixed clamping plate 334 is provided, with a rubber pad adhered to the bottom end of the clamping plate 334 to prevent the clamping plate 334 from scratching the semiconductor wafer; therefore, the handwheel 322 can be used to drive the threaded rod 321 to rotate, which can cause the threaded sleeve 331 to move downward along the threaded rod 321, and cause the clamping plate 334 to move downward along the storage cylinder 221, and move the semiconductor wafer on the support plate 223 into the storage cylinder 221, and compress the spring 226 fitted on the slide rod 225, thus achieving the protection of the semiconductor wafer.

[0037] In summary, the anti-scratch transfer device for semiconductor wafers according to this embodiment of the present invention allows the semiconductor wafer to be placed on the support plate 223 when it is necessary to transfer the semiconductor wafer. Simultaneously, the rotating disk 211 is used to move the four storage cylinders 221 in front of the operator, thus quickly storing the semiconductor wafer in the storage cylinders 221. The four storage cylinders 221 on the rotating disk 211 are positioned directly below the clamping plate 334. Then, the handwheel 322 drives the threaded rod 321 to rotate, causing the threaded sleeve 331 to move downwards along the threaded rod 321, and the clamping plate 334 to move downwards along the storage cylinders 221. The semiconductor wafer on the support plate 223 is moved into the storage cylinder 221, and the spring 226 mounted on the slide bar 225 is compressed, thus protecting the semiconductor wafer. When the clamping plate 334 moves upward, the elastic action of the compressed spring 226 allows the support plate 223 to move upward along the storage cylinder 221, which can quickly remove the semiconductor wafer stored in the storage cylinder 221. This solves the problem that semiconductor wafers are exposed to the outside during the transfer process, which can easily cause particles to stick to the surface of the semiconductor wafer, thus affecting the subsequent wafer bumping process.

[0038] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0040] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A scratch-resistant transport device for semiconductor wafers, comprising a transport cart (100), characterized in that: The top of the transfer vehicle (100) is provided with a storage device (200) for storing semiconductor wafers. Above the transfer vehicle (100) is a protective device (300) for clamping and fixing the semiconductor wafers in the storage device (200). The storage device (200) includes a rotating assembly (210) disposed above the transfer vehicle (100) for rotation. The top of the rotating assembly (210) is provided with a storage assembly (220) for storing semiconductor wafers. The protective device (300) includes a fixing assembly (310) fixedly installed on the transfer vehicle (100) for movably connecting with the rotating assembly (210). The fixing assembly (310) is provided with an adjusting assembly (320) for rotation. The fixing assembly (310) is provided with a clamping assembly (330) for threaded connection with the adjusting assembly (320) to clamp and fix the semiconductor wafers in the storage assembly (220).

2. The anti-scratch transport device for semiconductor wafers according to claim 1, characterized in that: The left end of the transfer vehicle (100) is fixedly equipped with a handle (101) for driving the transfer vehicle (100) to move. The bottom end of the transfer vehicle (100) is fixedly equipped with four casters (103) for driving the transfer vehicle (100) to move. The top end of the transfer vehicle (100) is provided with an annular groove (102) for the rotating component (210) to rotate.

3. The anti-scratch transport device for semiconductor wafers according to claim 2, characterized in that: The rotating assembly (210) includes a rotating disk (211) mounted on a fixed assembly (310) for rotation. Four support rods (212) are fixedly installed at the bottom end of the rotating disk (211), and sliders (213) for sliding in an annular groove (102) are fixedly installed at the bottom end of the four support rods (212).

4. The anti-scratch transport device for semiconductor wafers according to claim 3, characterized in that: The storage assembly (220) includes a storage cylinder (221) fixedly installed on the top of the rotating disk (211) for storing semiconductor wafers, and the cylinder (221) has four elongated slots (222) on its body.

5. The anti-scratch transport device for semiconductor wafers according to claim 4, characterized in that: A slide rod (225) is fixedly installed on the groove of each of the four long slots (222). A movable plate (224) for moving up and down is fitted on the slide rod (225). A support plate (223) for placing semiconductor wafers is fixedly installed on the block of the movable plate (224). A spring (226) for ejecting semiconductor wafers from the support plate (223) into the storage cylinder (221) is fitted on the slide rod (225).

6. The anti-scratch transport device for semiconductor wafers according to claim 4, characterized in that: The fixing component (310) includes a fixing rod (311) fixedly installed on the top of the transfer vehicle (100) for movably connecting with the rotating disk (211), and the fixing rod (311) has four square slots (312) on its body.

7. The anti-scratch transport device for semiconductor wafers according to claim 6, characterized in that: The adjusting assembly (320) includes a threaded rod (321) disposed in the fixed rod (311) for driving the clamping assembly (330) to move up and down, and a handwheel (322) for driving the threaded rod (321) to rotate is fixedly installed at the top end of the threaded rod (321).

8. The anti-scratch transport device for semiconductor wafers according to claim 7, characterized in that: The clamping assembly (330) includes a threaded sleeve plate (331) disposed inside the fixed rod (311) for threaded connection with the threaded rod (321). Four connecting plates (332) are fixedly installed on the plate body of the threaded sleeve plate (331). A connecting rod (333) is fixedly installed at the bottom end of the connecting plate (332). A clamping plate (334) for clamping and fixing the semiconductor wafer in the storage cylinder (221) is fixedly installed at the bottom end of the connecting rod (333).

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