Optical communication device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2025-07-11
- Publication Date
- 2026-08-07
AI Technical Summary
[0004]由于设备内部的光模块具有插拔维护需求,外壳通常需要采用可拆卸壳体,其中一部分壳体能够拆卸打开,但是壳体的拆卸和安装较为繁琐,导致光通信设备的插拔维护效率较低
[0040] In some possible implementations, there are multiple optical cages arranged in parallel at intervals, with the spacing between any two adjacent optical cages being the same or different. This allows for flexible adjustment of the heat density at the location of the optical cages by flexibly arranging the spacing between them, ensuring a balanced heat distribution across all optical cages and preventing heat concentration at the location of the optical cages.
Smart Images

Figure CN224609298U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of optical communication technology, and in particular to optical communication equipment. Background Technology
[0002] Optical line termination (OLT) equipment provides an interface between the network side and the local switch, and can connect one or more optical distribution nodes to communicate with the user-side optical network unit.
[0003] Optical communication equipment, which needs to be used outdoors, is generally sealed with a metal casing. The casing and internal heat-generating components such as optical modules are connected by thermally conductive materials to form a heat-conducting channel for heat dissipation.
[0004] Because the optical modules inside the equipment require plugging and unplugging for maintenance, the outer casing usually needs to be detachable. Some parts of the casing can be disassembled and opened, but the disassembly and installation of the casing is cumbersome, resulting in low plugging and unplugging maintenance efficiency of optical communication equipment. Utility Model Content
[0005] This application provides an optical communication device that can solve the technical problems existing in related technologies.
[0006] Specifically, the technical solution is as follows.
[0007] An optical communication device, the optical communication device comprising: a housing module and a circuit board module;
[0008] The housing module includes a first housing and a second housing, which are connected and cover each other to form a receiving cavity. The first housing has a window, which is covered by a window cover.
[0009] The circuit board module is located within the receiving cavity;
[0010] The circuit board module includes a circuit board body and at least one optical cage. The circuit board body is located inside the second housing, and the at least one optical cage is located on the circuit board body. The optical fiber interface end of the at least one optical cage is located inside the area where the window is located.
[0011] In this embodiment of the optical communication equipment, the housing module is formed by the connection of a first housing and a second housing, which together form an internal cavity. The circuit board body and the optical cage on it are located inside the cavity. In order to realize the insertion and removal maintenance of the optical cage, a window is opened on the first housing. By opening the window cover, the optical fiber interface end of the optical cage can be inserted and removed through the window. Other parts of the first housing do not need to be disassembled. This is beneficial to improving the convenience of maintenance operations of the optical communication equipment and improving the maintenance efficiency of the optical communication equipment.
[0012] For example, the fiber optic interface of the optical cage is used to couple optical signals in and out through a fiber optic adapter, and the electrical interface is electrically connected to the circuit board body through gold fingers or connectors. When performing plugging and unplugging maintenance on the optical cage, the fiber optic connector is mainly plugged and unplugged at the fiber optic interface. Therefore, in this embodiment, the fiber optic interface is located in the area where the window is located.
[0013] In some possible implementations, the electrical interface terminal of the at least one optical cage is located outside the area where the window is located; the electrical interface terminal is respectively connected to the inner wall of the first housing through a first thermally conductive structure and to the inner wall of the second housing through a second thermally conductive structure.
[0014] The thermally conductive contact between the electrical interface terminal of the optical cage and the inner walls of the first and second housings does not need to be severed. The optical cage can maintain an efficient and consistent thermally conductive contact with the first housing using the first thermally conductive structure (or a shell-mounted thermally conductive connection), and maintain an efficient and consistent thermally conductive contact with the second housing using the second thermally conductive structure. The heat dissipation effect of the optical cage is not affected by plugging and unplugging maintenance. The first and second housings can simultaneously provide effective heat dissipation for the optical cage. The optical cage has a large effective heat dissipation area, which helps to improve the heat dissipation performance of the optical cage and optical communication equipment, and meets the development needs of high port density in optical communication equipment.
[0015] In some possible implementations, the first thermally conductive structure and the second thermally conductive structure each include at least one of a thermally conductive pad and thermally conductive grease. The first thermally conductive structure and the second thermally conductive structure can establish a stable and reliable thermal conductive path between the optical cage and the housing module. The heat generated by the optical cage can be quickly transferred to the housing module through the first thermally conductive structure and the second thermally conductive structure, and then dissipated by the housing module. The surface of the first housing of the housing module, excluding the window, and the entire surface of the second housing can all serve as the effective heat dissipation area of the optical cage.
[0016] In some possible implementations, the at least one optical cage is located on the surface of the circuit board body facing the first housing, and the first thermally conductive structure is located on the surface of the at least one optical cage facing the first housing.
[0017] The circuit board body covered by the at least one optical cage has a heat dissipation window, and the second heat-conducting structure passes through the heat dissipation window and makes heat-conducting contact with the surface of the at least one optical cage facing the circuit board body.
[0018] With the above arrangement, the optical cage can be made thermally conductively connected to the second housing through the heat dissipation window of the circuit board body. The heat on the optical cage can be transferred to the second housing through the second heat-conducting structure, and the second housing can be used for heat dissipation. The heat conduction path between the optical cage and the second heat-conducting structure and the second housing is stable and reliable, and will not be affected by the insertion and removal maintenance of the optical cage.
[0019] Moreover, the circuit board body structure around the heat dissipation window is complete, and plated circuits or pad structures that are soldered or electrically connected to the photocell can be arranged, which can ensure a reliable and normal connection between the photocell and the circuit board body.
[0020] In some possible implementations, the circuit board body is located outside the area where the window is located, the at least one optical cage is located at the edge of the circuit board body facing the window, and the optical fiber interface end of each optical cage extends into the inner part of the area where the window is located.
[0021] With the above arrangement, the circuit board body avoids the area where the window is located. The circuit board body only needs to extend to the edge of the area where the window is located, so that the fiber optic interface end of the optical cage arranged at the edge of the circuit board body can extend into the area where the window is located. In this way, on the one hand, the area of the circuit board body can be reduced, saving the cost of the circuit board body. On the other hand, there is no interference from the circuit board body at the bottom of the optical fiber interface end of the optical cage, and the insertion and removal maintenance of the optical cage has a larger operating space, which is conducive to improving the work efficiency of insertion and removal maintenance.
[0022] In some possible implementations, at least one of the first housing and the second housing has heat dissipation fins on its outer wall.
[0023] In this embodiment, the heat from the optical cage can be transferred to the first and second housings respectively through the first and second heat-conducting structures, and then the first and second housings exchange heat with the outside air to dissipate the heat. To further improve the heat exchange efficiency between the first and second housings and the outside air, heat dissipation fins are arranged on the outer walls of the first and / or second housings to increase the effective heat dissipation area of the first or second housing, thereby improving the heat exchange efficiency between the first and second housings and the outside air.
[0024] For example, the optical cage is a metal thermally conductive structure, and the first thermally conductive structure and the second thermally conductive structure are respectively in contact with the outer surface of the optical cage. When the circuit board body has a heat dissipation window, the area of the heat dissipation window is less than or equal to the surface area of the optical cage and the circuit board body in contact.
[0025] In some possible implementations, the optical communication device further includes a power module located within the housing cavity and on the side of the at least one optical cage facing away from the window, with a shielding cover between the power module and the at least one optical cage.
[0026] With the above arrangement, the optical communication equipment can be powered by the power module. In order to prevent electromagnetic interference between the power module and the optical cage, a shielding cover is arranged between the power module and the optical cage, which helps to improve the signal transmission accuracy of the optical cage.
[0027] In addition to shielding the electromagnetic interference between the power module and the optical cage, the shielding cover can also shield the thermal radiation generated by the power module and the optical cage, thereby preventing the heat from accumulating between the power module and the optical cage and improving the heat dissipation effect of the optical cage.
[0028] For example, the power module is located within the area of the window and on the side of the light cage facing away from the window, and a shielding cover is arranged on the side of the power module facing the window to separate the power module from the window.
[0029] In some possible implementations, the shielding cover is thermally connected to the second housing;
[0030] Furthermore, the shielding cover extends between the electrical interface end of the at least one optical cage and the inner wall of the second housing, and the second thermally conductive structure is located on the shielding cover.
[0031] With the above arrangement, the shielding cover is thermally connected to the second housing. The heat on the shielding cover can be transferred to the second housing and then dissipated outward from the second housing. Based on this, the shielding cover extends between the electrical interface end and the second housing, so that the second heat-conducting structure can be integrated into the shielding cover. The heat from the electrical interface end is first transferred to the shielding cover through the heat dissipation window using the second heat-conducting structure, and then transferred to the second housing from the shielding cover. The second heat-conducting structure does not need to be manufactured and assembled separately. Moreover, the integrated second heat-conducting structure and the shielding cover have better thermal conductivity and thermal conductivity consistency, which is beneficial to improving the thermal conductivity between the electrical interface end and the second housing.
[0032] In some possible implementations, the second thermally conductive structure includes a protrusion on the surface of the shielding cover facing the electrical interface end, the protrusion having the same shape as the heat dissipation opening and making thermally conductive contact with the surface of the at least one optical cage facing the circuit board body through the heat dissipation opening.
[0033] With the above arrangement, the protruding structure of the shielding cover facing the heat dissipation window is used as the second heat conduction structure. The second heat conduction structure has a simple structure and is easier to process and assemble.
[0034] For example, when a raised structure is used as the second thermally conductive structure, thermally conductive silicone grease is used to fill the space between the second thermally conductive structure and the photocage.
[0035] In some possible implementations, the shielding cover is a high thermal conductivity metal die-cast structure, and / or, the first housing and the second housing are both high thermal conductivity metal die-cast structures.
[0036] Die casting is a highly efficient manufacturing process that involves injecting molten metal into a precision mold cavity under high pressure and then rapidly cooling it to form the final shape. It is particularly suitable for the mass production of thin-walled metal parts with complex geometries. Using die casting to manufacture shielding covers offers a simple processing method, high forming efficiency, and allows for the rapid prototyping of both the secondary heat-conducting structure and the shielding cover.
[0037] In some possible implementations, the circuit board module further includes a heating element located on the surface of the circuit board body facing the second housing and connected to the inner wall of the second housing through a third thermally conductive structure.
[0038] With the above arrangement, the heat-generating device on the circuit board body is arranged on the surface of the circuit board body facing the second housing, and is connected to the inner wall of the second housing through the third heat-conducting structure. The heat generated by the heat-generating device can be transferred to the second housing through the third heat-conducting structure, and then dissipated outward from the second housing.
[0039] For example, the heat-generating devices include, but are not limited to, electronic components such as driver chips, storage units, and amplifiers. These electronic components generate more heat than other electronic components. Therefore, by arranging the heat-generating devices on the surface of the circuit board body facing the second housing, they can not only be directly connected to the second housing through the third heat-conducting structure, but also be placed on opposite sides of the circuit board body with the photocell that also generates a large amount of heat, thus achieving thermal isolation.
[0040] In some possible implementations, there are multiple optical cages arranged in parallel at intervals, with the spacing between any two adjacent optical cages being the same or different. This allows for flexible adjustment of the heat density at the location of the optical cages by flexibly arranging the spacing between them, ensuring a balanced heat distribution across all optical cages and preventing heat concentration at the location of the optical cages. Attached Figure Description
[0041] Figure 1 This is a schematic diagram of the optical communication device provided in the embodiment of this application in the state of the window cover being closed;
[0042] Figure 2This is an exploded view of the optical communication device provided in the embodiment of this application with the window cover open.
[0043] Figure 3 This is a structural cross-sectional view of the optical communication device provided in the embodiments of this application;
[0044] Figure 4 This is a schematic diagram of the circuit board module provided in the embodiments of this application;
[0045] Figure 5 yes Figure 3 Enlarged view of the local structure at point A;
[0046] Figure 6 This is a schematic diagram of the structure of the shielding cover provided in the embodiment of this application;
[0047] Figure 7 This is another exploded view of the optical communication device provided in the embodiment of this application in the open window state.
[0048] The reference numerals in the attached figures represent:
[0049] 1. Housing module;
[0050] 11. First housing; 111. Window; 112. Window cover; 12. Second housing; 13. Heat dissipation fins; 14. Top protective plate;
[0051] 2. Circuit board module;
[0052] 21. Circuit board body; 211. Heat dissipation window; 22. Optical cage; 22a. Fiber optic interface end; 22b. Electrical interface end; 23. Heat-generating device;
[0053] 3. First heat-conducting structure;
[0054] 4. Second heat-conducting structure;
[0055] 5. Power supply module;
[0056] 6. Shielding cover;
[0057] 7. Third heat-conducting structure. Detailed Implementation
[0058] In the description of the embodiments of this application, it should be understood that the terms "upper", "lower", "inner", "outer", "length", "width", "thickness", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. When the product is placed in different postures, the orientation may change, and therefore should not be construed as a limitation on the embodiments of this application.
[0059] Combination Figure 1 and Figure 2 As shown, this embodiment provides an optical communication device, which includes a housing module 1 and a circuit board module 2.
[0060] The housing module 1 includes a first housing 11 and a second housing 12. The first housing 11 and the second housing 12 are connected and cover each other to form a receiving cavity (not shown in the figure). A window 111 is provided on the first housing 11, and a window cover 112 is provided on the window 111.
[0061] The circuit board module 2 is located within the receiving cavity; the circuit board module 2 includes a circuit board body 21 and at least one optical cage 22, the circuit board body 21 is located within the second housing 12, and at least one optical cage 22 is located on the circuit board body 21.
[0062] At least one optical fiber interface end 22a of the optical cage 22 is located inside the area where the window 111 is located, and at least one electrical interface end 22b of the optical cage 22 is located outside the area where the window 111 is located; the electrical interface end 22b is thermally connected to the inner wall of the first housing 11 through the first thermally conductive structure 3, and thermally connected to the inner wall of the second housing 12 through the second thermally conductive structure 4.
[0063] In this embodiment of the optical communication equipment, the housing module 1 is formed by the cover connection of a first housing 11 and a second housing 12, which together form an internal cavity. The circuit board body 21 and the optical cage 22 on it are located inside the cavity. In order to realize the insertion and removal maintenance of the optical cage 22, a window 111 is opened on the first housing 11. By opening the window cover 112, the optical fiber interface end 22a of the optical cage 22 can be inserted and removed through the window 111. Other parts of the first housing 11 do not need to be disassembled. This is beneficial to improving the convenience of maintenance operation of the optical communication equipment and improving the maintenance efficiency of the optical communication equipment.
[0064] For example, the optical fiber interface 22a of the optical cage 22 is used to couple optical signals in and out through an optical fiber adapter, and the electrical interface 22b is electrically connected to the circuit board body 21 through a gold finger or connector. When performing plugging and unplugging maintenance on the optical cage 22, the optical fiber connector is mainly plugged and unplugged at the optical fiber interface 22a. Therefore, in this embodiment, the optical fiber interface 22a is arranged in the area where the window 111 is located.
[0065] In some possible implementations, the first housing 11 and the second housing 12 are respectively thermally conductive metal die-cast housings, which have good structural strength and thermal conductivity. They can not only provide reliable sealing protection for optical communication equipment, but also enable rapid heat exchange between the optical communication equipment and the air, ensuring the natural cooling effect of the optical communication equipment.
[0066] In some possible implementations, the window cover 112 is rotatably connected to the first housing 11, so that when it is necessary to operate the window 111, the window 111 only needs to be rotated open without complete disassembly, which helps to improve maintenance efficiency and reduce the time for reclosing.
[0067] For example, the edge of the fiber optic interface segment of the window cover 112 away from the optical cage 22 is rotatably connected to the first housing 11. When the window cover 112 is rotated open, the fiber optic interface end 22a can be fully exposed, which facilitates plugging and unplugging and maintenance.
[0068] Understandably, the window cover 112 can also be opened by means other than rotation, such as sliding open, flip-opening, etc.
[0069] In some possible implementations, the number of optical cages 22 includes, but is not limited to, one, two, three, four, etc.
[0070] Combination Figure 1 ,and Figure 2 and Figure 3 As shown, in some possible implementations, the electrical interface terminal 22b of at least one optical cage 22 is located outside the area where the window 111 is located; the electrical interface terminal 22b is thermally connected to the inner wall of the first housing 11 through the first thermally conductive structure 3, and thermally connected to the inner wall of the second housing 12 through the second thermally conductive structure 4.
[0071] With the above arrangement, during the insertion and removal maintenance of optical communication equipment, only the window cover 112 needs to be opened, and the other parts of the first housing 11 do not need to be disassembled. The thermally conductive contact connection between the electrical interface end 22b of the optical cage 22 and the inner wall of the first housing 11 and the inner wall of the second housing 12 does not need to be cut off. The optical cage 22 can maintain an efficient and consistent thermally conductive contact connection (or shell-mounted thermally conductive connection) with the first housing 11 using the first thermally conductive structure 3, and maintain an efficient and consistent thermally conductive contact connection with the second housing 12 using the second thermally conductive structure 4. The heat dissipation effect of the optical cage 22 is not affected by the insertion and removal maintenance. The first housing 11 and the second housing 12 can simultaneously provide effective heat dissipation for the optical cage 22. The effective heat dissipation area of the optical cage 22 is large, which is conducive to improving the heat dissipation performance of the optical cage 22 and the optical communication equipment, and meeting the development needs of high port density of optical communication equipment.
[0072] In some possible implementations, the first thermally conductive structure 3 and the second thermally conductive structure 4 respectively include at least one of thermally conductive pad and thermally conductive grease. The first thermally conductive structure 3 and the second thermally conductive structure 4 can establish a stable and reliable thermally conductive path between the optical cage 22 and the housing module 1. The heat generated by the optical cage 22 can be quickly transferred to the housing module 1 through the first thermally conductive structure 3 and the second thermally conductive structure 4, and dissipated by the housing module 1. The surface of the first housing 11 of the housing module 1, except for the window 111, and the entire surface of the second housing 12 can all serve as the effective heat dissipation area of the optical cage 22.
[0073] For example, the thermal pad is a thermally conductive silicone pad, which is soft and can fit tightly to the heating element and the heat sink, filling the interface gaps. Its thermal conductivity is generally between 1-5 W / (m·K), and it has good insulation and strong weather resistance.
[0074] Thermal grease, also known as thermal paste, is a paste-like substance with strong filling ability. It can eliminate tiny gaps and has a thermal conductivity of 0.5-3 W / (m·K). However, it has no fixed form and can be used with thermal pads.
[0075] In some possible implementations, the first thermally conductive structure 3 includes a thermally conductive pad and thermally conductive grease. Thermally conductive grease is used to fill the space between the thermally conductive pad and the optical cage 22, as well as between the thermally conductive pad and the inner wall of the first housing 11, ensuring higher thermal conductivity between the thermally conductive pad, the optical cage 22, and the first housing 11. Since thermally conductive grease is non-reusable, the electrical connection between the optical cage 22 and the first housing 11 in this embodiment is semi-permanent, ensuring the long-term effectiveness of the thermally conductive grease without damage during insertion and removal maintenance.
[0076] Combination Figure 4 and Figure 5 As shown, in some possible implementations, at least one optical cage 22 is located on the surface of the circuit board body 21 facing the first housing 11, and the first heat-conducting structure 3 is located on the surface of at least one optical cage 22 facing the first housing 11.
[0077] The circuit board body 21 covered by at least one optical cage 22 is provided with a heat dissipation window 211, and the second heat conduction structure 4 passes through the heat dissipation window 211 and makes heat conduction contact with the surface of at least one optical cage 22 facing the circuit board body 21.
[0078] With the above arrangement, the optical cage 22 can be thermally connected to the second housing 12 through the heat dissipation window 211 of the circuit board body 21. The heat on the optical cage 22 can be transferred to the second housing 12 through the second heat-conducting structure 4, and the second housing 12 can be used for heat dissipation. The heat conduction path between the optical cage 22 and the second heat-conducting structure 4 and the second housing 12 is stable and reliable, and will not be affected by the insertion and removal maintenance of the optical cage 22.
[0079] Moreover, the circuit board body 21 around the heat dissipation window 211 has a complete structure, and can be arranged with plated circuits or pad structures that are soldered or electrically connected to the optical cage 22, which can ensure a reliable and normal connection between the optical cage 22 and the circuit board body 21.
[0080] In some possible implementations, at least one optical cage 22 is provided with a connector (not shown in the figure), the connector and the optical cage 22 are respectively connected to the circuit board body 21, and the first heat-conducting structure 3 and the second heat-conducting structure 4 are respectively in thermal contact with the outer surface of the optical cage 22.
[0081] Through the above arrangement, the optical cage 22 can not only provide electromagnetic protection for the connector, but also ensure the positioning accuracy of the connector and fiber optic connector during the insertion process, guarantee the accurate docking of the connector, and lock and fix the fiber optic connector inserted into the optical cage 22.
[0082] For example, the optical cage is a metal thermally conductive structure, and the first thermally conductive structure 3 and the second thermally conductive structure 4 are respectively in contact with the outer surface of the optical cage. When the circuit board body 21 is provided with a heat dissipation window 211, the area of the heat dissipation window 211 is less than or equal to the surface area of the optical cage 22 and the circuit board body 21 in contact.
[0083] Combination Figure 5 As shown, in some possible implementations, the circuit board body 21 is located outside the area where the window 111 is located, at least one optical cage 22 is located at the edge of the circuit board body 21 facing the window 111, and the optical fiber interface end 22a of each optical cage 22 extends to the inside of the area where the window 111 is located.
[0084] With the above arrangement, the circuit board body 21 avoids the area where the window 111 is located. The circuit board body 21 only needs to extend to the edge of the area where the window 111 is located, so that the fiber optic interface end 22a of the optical cage 22 arranged at the edge of the circuit board body 21 can extend into the area where the window 111 is located. In this way, on the one hand, the area of the circuit board body 21 can be reduced, saving the cost of the circuit board body 21. On the other hand, the bottom of the fiber optic interface end 22a of the optical cage 22 is not interfered by the circuit board body 21, and the insertion and removal maintenance of the optical cage 22 has a larger operating space, which is conducive to improving the work efficiency of insertion and removal maintenance.
[0085] Combination Figure 2 and Figure 3 As shown, in some possible implementations, at least one of the first housing 11 and the second housing 12 has heat dissipation fins 13 on its outer wall.
[0086] In this embodiment, the heat from the optical cage 22 can be transferred to the first housing 11 and the second housing 12 through the first heat-conducting structure 3 and the second heat-conducting structure 4, respectively. The first housing 11 and the second housing 12 then exchange heat with the external air, achieving heat dissipation. To further improve the heat exchange efficiency between the first housing 11 and the second housing 12 and the external air, heat dissipation fins 13 are arranged on the outer walls of the first housing 11 and / or the second housing 12, thereby increasing the effective heat dissipation area of the first housing 11 or the second housing 12, and thus improving the heat exchange efficiency between the first housing 11 and the second housing 12 and the external air.
[0087] For example, the outer wall of the first housing 11 is provided with heat dissipation fins 13, and the heat dissipation fins 13 and the first housing 11 are integrally die-cast. For another example, the outer wall of the second housing 12 is provided with heat dissipation fins 13, and the heat dissipation fins 13 and the second housing 12 are integrally die-cast. For yet another example, the outer walls of the first housing 11 and the second housing 12 are respectively provided with heat dissipation fins 13.
[0088] Understandably, when the outer wall of the first housing 11 is provided with heat dissipation fins 13, the heat dissipation fins 13 can cover the entire outer wall of the first housing 11, or they can only cover a part of the outer wall of the first housing 11. When the outer wall of the second housing 12 is provided with heat dissipation fins 13, the heat dissipation fins 13 can cover the entire outer wall of the second housing 12, or they can only cover a part of the outer wall of the second housing 12.
[0089] Among some possible implementations, refer to Figure 2 and Figure 3 As shown, the top of the heat dissipation fin 13 is provided with a top protective plate 14. The top protective plate 14 is used to protect the heat dissipation fin 13, prevent foreign objects from entering, and prevent the heat dissipation fin 13 from being deformed by collision.
[0090] Combination Figure 3 As shown, in some possible implementations, the optical communication device also includes a power module 5, which is located inside the housing cavity and on the side of at least one optical cage 22 facing away from the window 111. A shielding cover 6 is provided between the power module 5 and the at least one optical cage 22.
[0091] With the above arrangement, the optical communication equipment can be powered by the power module 5. In order to prevent electromagnetic interference between the power module 5 and the optical cage 22, a shielding cover plate 6 is arranged between the power module 5 and the optical cage 22, which is beneficial to improving the signal transmission accuracy of the optical cage 22.
[0092] In addition to shielding the electromagnetic interference between the power module 5 and the optical cage 22, the shielding cover 6 can also shield the thermal radiation generated by the power module 5 and the optical cage 22, thereby preventing the heat from accumulating between the power module 5 and the optical cage 22 and improving the heat dissipation effect of the optical cage 22.
[0093] For example, the power module 5 is located within the area of the window 111 and is located on the side of the light cage 22 facing away from the window 111. The shielding cover 6 is arranged on the side of the power module 5 facing the window 111, separating the power module 5 from the window 111.
[0094] Combination Figure 3 As shown, in some possible implementations, the shielding cover 6 is thermally connected to the second housing 12; and the shielding cover 6 extends between the electrical interface end 22b of at least one optical cage 22 and the inner wall of the second housing 12, with the second thermally conductive structure 4 located on the shielding cover 6.
[0095] Through the above arrangement, the shielding cover 6 is thermally connected to the second housing 12. The heat on the shielding cover 6 can be transferred to the second housing 12 and then dissipated outward from the second housing 12. Based on this, the shielding cover 6 extends between the electrical interface end 22b and the second housing 12, so that the second heat-conducting structure 4 can be integrated on the shielding cover 6. The heat of the electrical interface end 22b is first transferred to the shielding cover 6 through the heat dissipation window 211 via the second heat-conducting structure 4, and then transferred to the second housing 12 via the shielding cover 6. The second heat-conducting structure 4 does not need to be manufactured and assembled separately. Moreover, the integrated second heat-conducting structure 4 and the shielding cover 6 have better heat conduction efficiency and heat conduction consistency, which is beneficial to improving the heat conduction efficiency between the electrical interface end 22b and the second housing 12.
[0096] Combination Figure 3 and Figure 6 As shown, in some possible implementations, the second heat-conducting structure 4 includes a protrusion on the surface of the shielding cover 6 facing the electrical interface end 22b. The protrusion has the same shape as the heat dissipation window 211 and makes thermal contact with at least one optical cage 22 facing the circuit board body 21 through the heat dissipation window 211.
[0097] With the above arrangement, the protruding structure of the shielding cover plate 6 facing the heat dissipation window 211 is used as the second heat conduction structure 4. The second heat conduction structure 4 has a simple structure and is easier to process and assemble.
[0098] For example, when a raised structure is used as the second heat-conducting structure 4, the space between the second heat-conducting structure 4 and the photocage 22 is filled with thermal grease.
[0099] In some possible implementations, the shielding cover 6 is a die-cast structure made of high thermal conductivity metal. And / or, the first housing 11 and the second housing 12 are both die-cast structures made of high thermal conductivity metal.
[0100] Die casting is a highly efficient manufacturing process that involves injecting molten metal into a precision mold cavity under high pressure and then rapidly cooling it to form the final shape. It is particularly suitable for the mass production of thin-walled metal parts with complex geometries. Using die casting to manufacture the shielding cover 6 offers a simple processing method, high forming efficiency, and enables the rapid prototyping of both the second heat-conducting structure 4 and the shielding cover 6.
[0101] Combination Figure 3 As shown, in some possible implementations, the circuit board module 2 also includes a heating element 23, which is located on the surface of the circuit board body 21 facing the second housing 12 and is thermally connected to the inner wall of the second housing 12 through a third thermally conductive structure 7.
[0102] With the above arrangement, the heating device 23 on the circuit board body 21 is arranged on the surface of the circuit board body 21 facing the second housing 12, and is connected to the inner wall of the second housing 12 through the third heat-conducting structure 7. The heat generated by the heating device 23 can be transferred to the second housing 12 through the third heat-conducting structure 7, and then dissipated outward from the second housing 12.
[0103] For example, the heat-generating device 23 includes, but is not limited to, electronic components such as driver chips, storage units, and amplifiers. These electronic components generate more heat than other electronic components. Therefore, by arranging the heat-generating device 23 on the surface of the circuit board body 21 facing the second housing 12, it can not only be directly connected to the second housing 12 through the third heat-conducting structure 7, but also be placed on opposite sides of the circuit board body 21 with the photocell 22, which also generates a large amount of heat, to achieve thermal isolation.
[0104] Combination Figure 3 As shown, in some possible implementations, the receiving cavity is divided into two relatively independent thermal isolation cavities along the closing direction by the circuit board body 21 and the shielding cover 6. The portion of the receiving cavity near the first housing 11 is further divided into two small thermal isolation cavities by the first thermally conductive structure 3, which helps to reduce the thermal impact between the photocage 22 and other electronic components on the circuit board body 21.
[0105] Combination Figure 4 and Figure 7 As shown, in some possible implementations, there are multiple optical cages 22, which are arranged in parallel at intervals, and the spacing between any two adjacent optical cages 22 may be the same or different.
[0106] In some possible implementations, the spacing between the optical cages 22 that are closer to the heating device 23 is smaller, while the spacing between the optical cages 22 that are farther from the heating device 23 is larger. Therefore, the heat density at the location of the optical cages 22 can be adjusted by flexibly arranging the spacing between them, resulting in a more even heat distribution across all the optical cages 22 and preventing heat concentration at the location of the optical cages 22.
[0107] For example, the spacing between the optical cages 22 that are closer to the heating device 23 is in the range of 19.5-20.5 mm, and the spacing between the optical cages 22 that are farther away from the heating device 23 is in the range of 24-26 mm.
[0108] Combination Figure 3 and Figure 7 As shown, in some possible implementations, there are multiple optical cages 22, which are arranged in parallel at intervals and at an angle to the edge of the circuit board body 21. In this way, the space occupied by the optical cages 22 in the area of the window 111 and in the circuit board body 21 can be reduced, which is beneficial to reducing the overall size of the optical communication equipment.
[0109] Combination Figure 7 As shown, in some possible implementations, the housing module 1 is cuboid, the circuit board body 21 and the shielding cover 6 are L-shaped, and the shapes of the circuit board body 21 and the shielding cover 6 are complementary.
[0110] The above description is only for the purpose of enabling those skilled in the art to understand the technical solution of this application, and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. An optical communication device, characterized in that, The optical communication device includes: a housing module (1) and a circuit board module (2); The housing module (1) includes a first housing (11) and a second housing (12). The first housing (11) and the second housing (12) are connected and cover each other to form a receiving cavity. A window (111) is provided on the first housing (111), and a window cover (112) is provided on the window (111). The circuit board module (2) is located inside the receiving cavity; The circuit board module (2) includes a circuit board body (21) and at least one optical cage (22). The circuit board body (21) is located inside the second housing (12), and the at least one optical cage (22) is located on the circuit board body (21). The optical fiber interface end (22a) of the at least one optical cage (22) is located inside the area where the window (111) is located.
2. The optical communication device according to claim 1, characterized in that, The electrical interface terminal (22b) of the at least one optical cage (22) is located outside the area where the window (111) is located; the electrical interface terminal (22b) is thermally connected to the inner wall of the first housing (11) through the first thermally conductive structure (3) and thermally connected to the inner wall of the second housing (12) through the second thermally conductive structure (4).
3. The optical communication device according to claim 2, characterized in that, The at least one optical cage (22) is located on the surface of the circuit board body (21) facing the first housing (11), and the first heat-conducting structure (3) is located on the surface of the at least one optical cage (22) facing the first housing (11); The circuit board body (21) covered by the at least one optical cage (22) has a heat dissipation window (211), and the second heat-conducting structure (4) passes through the heat dissipation window (211) and makes heat-conducting contact with the surface of the at least one optical cage (22) facing the circuit board body (21).
4. The optical communication device according to claim 1, characterized in that, The circuit board body (21) is located outside the area where the window (111) is located, and the at least one optical cage (22) is located on the edge of the circuit board body (21) facing the window (111), and the optical fiber interface end (22a) of each optical cage (22) extends to the inside of the area where the window (111) is located.
5. The optical communication device according to claim 3, characterized in that, The optical communication device further includes a power module (5), which is located inside the accommodating cavity and on the side of the at least one optical cage (22) facing away from the window (111). A shielding cover (6) is provided between the power module (5) and the at least one optical cage (22).
6. The optical communication device according to claim 5, characterized in that, The shielding cover (6) is thermally connected to the second housing (12); The shielding cover (6) extends between the electrical interface end (22b) of the at least one optical cage (22) and the inner wall of the second housing (12), and the second heat-conducting structure (4) is located on the shielding cover (6).
7. The optical communication device according to claim 6, characterized in that, The second heat-conducting structure (4) includes a protrusion on the surface of the shielding cover (6) facing the electrical interface end (22b), the protrusion having the same shape as the heat dissipation window (211) and making thermal contact with the surface of the at least one optical cage (22) facing the circuit board body (21) through the heat dissipation window (211).
8. The optical communication device according to claim 5, characterized in that, The shielding cover (6) is a high thermal conductivity metal die-casting structure; And / or, The first shell (11) and the second shell (12) are respectively high thermal conductivity metal die-cast structures.
9. The optical communication device according to claim 2, characterized in that, The circuit board module (2) also includes a heating device (23), which is located on the surface of the circuit board body (21) facing the second housing (12) and is thermally connected to the inner wall of the second housing (12) through a third thermally conductive structure (7).
10. The optical communication device according to any one of claims 1 to 9, characterized in that, The number of optical cages (22) is multiple, and the multiple optical cages (22) are arranged in parallel and spaced apart. The spacing between any two adjacent optical cages (22) may be the same or different.