An encapsulated epoxy poured capacitor

Abstract

The utility model relates to capacitor technical field discloses a kind of capacitor of epoxy injection without shell, including capacitor.The utility model is packed capacitor, electrode sheet and insulating paper by epoxy potting compound all-around, eliminates internal air gap, forms continuous and dense insulating layer, greatly improves insulating performance, can better withstand high voltage, reduces electrical breakdown risk, more reliable in high-voltage circuit or in harsh environment to insulating requirement, better stability: in traditional capacitor, the connection of electrode and capacitor main body can be loose due to factors such as vibration, temperature change, affect electrical connection stability.In this capacitor, epoxy potting adhesive solidifies and bonds positive busbar electrode sheet, negative busbar electrode sheet and capacitor firmly together, enhances the stability of electrical connection, can effectively reduce the change of contact resistance, so that capacitor is more stable in long-time use or complex working conditions, and capacitance deviation is smaller.

Description

Technical Field

[0001] This utility model relates to the field of capacitor technology, and in particular to a casingless epoxy-filled capacitor. Background Technology

[0002] The primary function of a capacitor is to store and release electrical energy; therefore, its performance is limited by the insulation of the internal dielectric and the sealing of the external structure. Traditional capacitor designs typically use a metal casing and electrolyte as insulating materials. However, such designs are often affected by external environmental factors, such as humidity and temperature fluctuations, which may cause the internal dielectric to fail, thus affecting the overall performance of the capacitor.

[0003] In existing technologies, the insulation structure of traditional capacitors generally adopts a combination of outer shell and internal insulating materials. The outer shell is mostly made of plastic or metal, and the inside is supplemented with insulating paper, insulating varnish and other materials to isolate the electrodes from the capacitor core. However, this design is prone to gaps due to problems such as assembly errors of the outer shell and loose splicing of internal insulating materials. Moreover, the material joints are prone to become weak points in the insulation, which may lead to leakage or breakdown under high voltage, affecting the safety of use. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a casing-less epoxy-filled capacitor.

[0005] This utility model is achieved by the following technical solution: a shell-less epoxy-filled capacitor, including a capacitor, a positive busbar electrode plate fixedly connected to the top of the capacitor, a negative busbar electrode plate fixedly connected to the bottom of the capacitor, an insulating paper fixedly connected to the top of the positive busbar electrode plate, the outer wall of the insulating paper contacting the surface of the negative busbar electrode plate, and an epoxy potting compound on the outside of the capacitor.

[0006] As a further improvement to the above solution, the capacitor, positive busbar electrode plate, negative busbar electrode plate, and insulating paper are encapsulated with epoxy potting compound, and several capacitors are provided.

[0007] Through the above technical solution, the capacitor, electrode plates and insulating paper are fully encapsulated with epoxy potting compound, eliminating internal air gaps and forming a continuous and dense insulating layer, which greatly improves the insulation performance, can better withstand high voltage and reduce the risk of electrical breakdown.

[0008] As a further improvement to the above solution, a positive capacitor adapter hole is provided on the top of the positive busbar electrode plate, and a positive capacitor U-shaped adapter groove is provided on the top of the positive busbar electrode plate.

[0009] As a further improvement to the above solution, several positive capacitor adapter holes and several positive capacitor U-shaped adapter slots are provided.

[0010] As a further improvement to the above solution, a negative capacitor adapter hole is provided at the bottom of the negative busbar electrode plate, and a negative capacitor U-shaped adapter groove is provided at the bottom of the negative busbar electrode plate.

[0011] As a further improvement to the above solution, several negative capacitor adapter holes and several negative capacitor U-shaped adapter slots are provided.

[0012] As a further improvement to the above solution, a positive electrode contact is fixedly connected to the top of the positive electrode busbar electrode sheet, the outer wall of the positive electrode contact is fixedly connected to the inner wall of the epoxy potting compound, and the top of the positive electrode contact penetrates through the inner wall of the epoxy potting compound and extends therefrom.

[0013] As a further improvement to the above solution, a negative electrode contact is fixedly connected to the top of the negative electrode busbar electrode plate, the outer wall of the negative electrode contact is fixedly connected to the inner wall of the epoxy potting compound, and the top of the negative electrode contact penetrates through the inner wall of the epoxy potting compound and extends therethrough.

[0014] Through the above technical solution, several positive capacitor adapter holes and several positive capacitor U-shaped adapter slots opened on the top of the positive busbar electrode plate are used for precise docking with the top pins of different capacitors; several negative capacitor adapter holes and several negative capacitor U-shaped adapter slots opened on the bottom of the negative busbar electrode plate are adapted to the bottom pins of the capacitor.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows: This invention utilizes epoxy potting compound to comprehensively encapsulate the capacitor, electrode plates, and insulating paper, eliminating internal air gaps and forming a continuous and dense insulating layer. This significantly improves insulation performance, enabling it to better withstand high voltages and reducing the risk of electrical breakdown. It exhibits greater reliability and stability in high-voltage circuits or environments with stringent insulation requirements. In traditional capacitors, the connection between the electrodes and the capacitor body can loosen due to vibration, temperature changes, etc., affecting the stability of the electrical connection. In this capacitor, after the epoxy potting compound cures, it firmly bonds the positive and negative busbar electrodes to the capacitor, enhancing the stability of the electrical connection. This effectively reduces changes in contact resistance, resulting in more stable performance and smaller capacitance deviations under prolonged use or complex operating conditions.

[0016] This invention utilizes several positive capacitor adapter holes and several positive capacitor U-shaped adapter slots on the top of the positive busbar electrode plate for precise docking with the top pins of different capacitors; and several negative capacitor adapter holes and several negative capacitor U-shaped adapter slots on the bottom of the negative busbar electrode plate. The U-shaped adapter slot matches the bottom pins of the capacitor. Through the shape matching and quantity design of the slot structure, it meets the requirements for parallel or series connection of multiple capacitors of various types. It also ensures a stable electrical path between different capacitors and the positive and negative busbar electrodes. The positive contact fixed to the top of the positive busbar electrode is encapsulated in epoxy potting compound, extending outwards through the compound, serving as the positive output terminal of the capacitor and connecting to the positive interface of an external circuit. Similarly, the negative contact fixed to the top of the negative busbar electrode extends through the potting compound, forming a conductive path with the negative busbar electrode, serving as the negative output terminal and connecting to the negative interface of an external circuit, thus enabling power transmission. The epoxy potting compound encapsulates the capacitor, positive busbar electrode, and negative busbar electrode as a whole, creating a unified structure. The connection at the adapter slot is more stable, avoiding poor contact caused by vibration; at the same time, it fixes the position of the positive and negative contacts, ensuring accurate alignment of external connections, and taking into account both insulation and structural reinforcement functions. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the cross-sectional structure of the epoxy potting compound of this utility model; Figure 3 This is a schematic diagram of the insulating paper structure of this utility model; Figure 4 This is a schematic diagram of the negative electrode contact structure of this utility model; Figure 5 This is a schematic diagram of the positive electrode contact structure of this utility model.

[0018] Explanation of key symbols: 1. Capacitor; 2. Positive busbar electrode; 3. Negative busbar electrode; 4. Insulating paper; 5. Epoxy potting compound; 6. Positive capacitor adapter hole; 7. Positive capacitor U-shaped adapter slot; 8. Negative capacitor adapter hole; 9. Negative capacitor U-shaped adapter slot; 10. Positive contact; 11. Negative contact. Detailed Implementation

[0019] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0020] Example: Please combine Figure 1-5 An epoxy-filled capacitor without a casing according to this embodiment includes a capacitor 1, a positive busbar electrode plate 2 fixedly connected to the top of the capacitor 1, a negative busbar electrode plate 3 fixedly connected to the bottom of the capacitor 1, an insulating paper 4 fixedly connected to the top of the positive busbar electrode plate 2, the outer wall of the insulating paper 4 being in contact with the surface of the negative busbar electrode plate 3, and an epoxy potting compound 5 being disposed on the outside of the capacitor 1.

[0021] Capacitor 1, positive busbar electrode 2, negative busbar electrode 3, and insulating paper 4 are encapsulated with epoxy potting compound 5. There are several capacitors 1.

[0022] The top of the positive busbar electrode plate 2 is provided with a positive capacitor adapter hole 6 and a positive capacitor U-shaped adapter groove 7.

[0023] Several positive capacitor adapter holes 6 and several positive capacitor U-shaped adapter slots 7 are provided.

[0024] The bottom of the negative busbar electrode plate 3 is provided with a negative capacitor adapter hole 8 and a negative capacitor U-shaped adapter groove 9.

[0025] Several negative capacitor adapter holes 8 and several negative capacitor U-shaped adapter slots 9 are provided.

[0026] A positive electrode contact 10 is fixedly connected to the top of the positive electrode plate 2. The outer wall of the positive electrode contact 10 is fixedly connected to the inner wall of the epoxy potting compound 5. The top of the positive electrode contact 10 penetrates the inner wall of the epoxy potting compound 5 and extends thereafter.

[0027] The negative electrode busbar electrode plate 3 is fixedly connected to the top of the negative electrode contact 11. The outer wall of the negative electrode contact 11 is fixedly connected to the inner wall of the epoxy potting compound 5. The top of the negative electrode contact 11 penetrates the inner wall of the epoxy potting compound 5 and extends thereafter.

[0028] The implementation principle of a casingless epoxy-filled capacitor in this application embodiment is as follows: Several positive capacitor adapter holes 6 and several positive capacitor U-shaped adapter slots 7 are provided on the top of the positive busbar electrode plate 2 for precise docking with the top pins of different capacitors 1; several negative capacitor adapter holes 8 and several negative capacitor U-shaped adapter slots 7 are provided on the bottom of the negative busbar electrode plate 3. The U-shaped adapter slot 9 is designed to fit the bottom pins of capacitor 1. Through the shape matching and quantity design of the slot structure, it meets the requirements for parallel or series connection of multiple capacitors 1, and ensures a stable electrical path between different capacitors 1 and the positive and negative busbar electrodes. Simultaneously, the positive contact 10 fixed to the top of the positive busbar electrode 2 is encapsulated in epoxy potting compound 5, extending outwards through the compound, serving as the positive output terminal of the capacitor and connecting to the positive interface of the external circuit. Similarly, the negative contact 11 fixed to the top of the negative busbar electrode 3 extends through the potting compound, forming a conductive path with the negative busbar electrode 3, serving as the negative output terminal and connecting to the negative interface of the external circuit, thus enabling power transmission. The epoxy potting compound 5 encapsulates capacitor 1, positive busbar electrode 2, and negative busbar electrode 3 as a whole, thus ensuring the connection of the positive capacitor adapter hole 6, positive capacitor U-shaped adapter slot 7, negative capacitor adapter hole 8, and negative capacitor U-shaped adapter slot 9. The connection at the adapter slot 9 is more secure, preventing poor contact due to vibration. Simultaneously, it fixes the positions of the positive contact 10 and negative contact 11, ensuring precise external connection alignment. This design balances insulation and structural reinforcement. Furthermore, the epoxy potting compound 5 comprehensively encapsulates the capacitor 1, electrode plates, and insulating paper 4, eliminating internal air gaps and forming a continuous and dense insulating layer. This significantly improves insulation performance, allowing it to better withstand high voltages and reduce the risk of electrical breakdown. It exhibits greater reliability and stability in high-voltage circuits or environments with stringent insulation requirements. In traditional capacitors, the connection between the electrodes and the capacitor body may loosen due to vibration, temperature changes, etc., affecting the stability of the electrical connection. In this capacitor, after the epoxy potting compound cures, it firmly bonds the positive busbar electrode plate 2, the negative busbar electrode plate 3, and the capacitor 1 together, enhancing the stability of the electrical connection. This effectively reduces changes in contact resistance, resulting in more stable performance and smaller capacitance deviations under long-term use or complex operating conditions.

[0029] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A casingless epoxy-filled capacitor, characterized in that, The capacitor (1) is fixedly connected to a positive busbar electrode plate (2) at the top and a negative busbar electrode plate (3) at the bottom. An insulating paper (4) is fixedly connected to the top of the positive busbar electrode plate (2). The outer wall of the insulating paper (4) is in contact with the surface of the negative busbar electrode plate (3). An epoxy potting compound (5) is provided on the outside of the capacitor (1).

2. The casingless epoxy-filled capacitor as described in claim 1, characterized in that: The capacitor (1), positive busbar electrode (2), negative busbar electrode (3), and insulating paper (4) are encapsulated with epoxy potting compound (5), and there are several capacitors (1).

3. A casingless epoxy-filled capacitor as described in claim 1, characterized in that: The positive busbar electrode plate (2) has a positive capacitor adapter hole (6) on its top and a positive capacitor U-shaped adapter groove (7) on its top.

4. A casingless epoxy-filled capacitor as described in claim 3, characterized in that: The positive capacitor adapter hole (6) has several openings, and the positive capacitor U-shaped adapter slot (7) has several openings.

5. A casingless epoxy-filled capacitor as described in claim 1, characterized in that: The bottom of the negative electrode busbar electrode plate (3) is provided with a negative electrode capacitor adapter hole (8) and the bottom of the negative electrode busbar electrode plate (3) is provided with a negative electrode capacitor U-shaped adapter groove (9).

6. A casingless epoxy-filled capacitor as described in claim 5, characterized in that: The negative capacitor adapter hole (8) has several openings, and the negative capacitor U-shaped adapter groove (9) has several openings.

7. A casingless epoxy-filled capacitor as described in claim 1, characterized in that: The positive electrode plate (2) is fixedly connected to a positive electrode contact (10) at the top. The outer wall of the positive electrode contact (10) is fixedly connected to the inner wall of the epoxy potting compound (5). The top of the positive electrode contact (10) penetrates the inner wall of the epoxy potting compound (5) and extends therethrough.

8. A casingless epoxy-filled capacitor as described in claim 1, characterized in that: The negative electrode plate (3) is fixedly connected to a negative electrode contact (11) at the top. The outer wall of the negative electrode contact (11) is fixedly connected to the inner wall of the epoxy potting compound (5). The top of the negative electrode contact (11) penetrates the inner wall of the epoxy potting compound (5) and extends therethrough.

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