A rotating spray semiconductor cleaning apparatus

Abstract

This utility model discloses a rotating spray semiconductor cleaning device, relating to the field of semiconductor cleaning technology. The rotating spray semiconductor cleaning device includes a housing, inside which a cleaning mechanism is installed for cleaning semiconductors. The cleaning mechanism includes a drive assembly, which includes an electric push rod fixedly mounted on the top of the housing. A support rod is fixedly mounted on the top of the electric push rod, and a support frame is fixedly mounted on the bottom of the support rod. When the support frame rotates, it drives the spray head to rotate clockwise and counterclockwise around the semiconductor at a 120-degree angle, allowing the cleaning fluid to be sprayed onto the surface of the semiconductor from multiple directions, such as the sides and bottom, avoiding dead zones caused by spraying in one direction. The electric push rod can flexibly adjust the height of the semiconductor through the support rod and the support frame, ensuring that the semiconductor is always within the optimal spray range of the spray head, further ensuring that all areas of the semiconductor surface are effectively cleaned by the cleaning fluid.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor cleaning technology, specifically a semiconductor cleaning device with rotating spray. Background Technology

[0002] As the integration density of integrated circuits increases, semiconductor devices place higher demands on semiconductor process equipment. During the semiconductor process, semiconductors need to be cleaned frequently to ensure their cleanliness. Cleaning agents are commonly used to clean them and prevent particles on the semiconductor from contaminating other components.

[0003] The existing utility model patent with publication number CN223206236U discloses a semiconductor cleaning device and equipment. The cleaning device includes: an inlet shaft assembly with an inlet channel, including an inlet shaft and a rotating shaft sleeved with the inlet shaft, the rotating shaft being configured to rotate relative to the inlet shaft; a spray assembly including at least two pipes, each including a spray pipe and an auxiliary pipe respectively connected to the inlet channel; the spray pipe is configured with several spray nozzles to spray cleaning fluid, which drives the spray pipe to rotate relative to the inlet shaft by reaction force. The absence of mechanical drive allows the rotation of the spray pipe to improve the cleaning effect of the cleaning fluid on the semiconductor device, and the cleaning device has a simple structure and low cost; the auxiliary pipe is also provided with a spray nozzle, which ensures that the entire cleaning device has sufficient reaction force to rotate, and also ensures that the spray assembly sprays cleaning fluid to cover the area, thereby achieving the cleaning effect on the semiconductor device.

[0004] The aforementioned cleaning equipment uses a rotating spray pipe for cleaning. In this method, the water flow direction is always above or diagonally above the semiconductor, which can easily create cleaning dead zones and affect the cleaning effect. Furthermore, since the spray nozzle of the cleaning equipment is always located above, it takes a long time for the cleaning solution to cover the entire semiconductor device during the rinsing process, resulting in low efficiency. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a rotating spray semiconductor cleaning device, which solves the problems of poor cleaning effect and low efficiency.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A rotating spray semiconductor cleaning device includes a housing, and a cleaning mechanism is disposed inside the housing for cleaning semiconductors. The cleaning mechanism includes:

[0007] The drive assembly includes an electric actuator fixedly mounted on the top of the housing, a support rod fixedly mounted on the top of the electric actuator, a support frame fixedly mounted on the bottom of the support rod, a stepper motor fixedly mounted on one side of the housing, a synchronous pulley fixedly mounted on the outer side of the stepper motor shaft, a synchronous belt meshing with the outer side of the synchronous pulley, a synchronous shaft inserted into the inside of the housing, and a gear fixedly mounted on the outer side of the synchronous shaft.

[0008] A delivery assembly, located inside the housing, is used to deliver rinsing liquid.

[0009] Preferably, the delivery assembly includes a liquid pump fixedly installed on one side of the housing, a hose fixedly installed at the discharge end of the liquid pump, a diverter pipe fixedly installed at the end of the hose, a movable frame fixedly installed on one side of the diverter pipe, a toothed ring fixedly installed on one side of the movable frame, a pressure bearing fixedly installed at the bottom of the movable frame, and a nozzle fixedly installed inside the movable frame.

[0010] Preferably, the electric actuators are symmetrically installed on both sides of the top of the housing, with the center of the support frame as the reference, and the support frame is connected to the electric actuators via support rods.

[0011] Preferably, the top of the housing is provided with an opening structure that fits with the support frame, the shaft of the stepper motor is connected to the top of the synchronous shaft through a synchronous pulley and a synchronous belt, and the gear and the gear ring mesh with each other.

[0012] Preferably, the hose penetrates the inner wall of the front side of the outer shell, the hose is fixedly connected to one end of the diverter pipe, the diverter pipe communicates with the inner cavities of the three annular structures of the movable frame, and the toothed ring is fixedly installed on the outer side of the three annular structures of the movable frame.

[0013] Preferably, the movable frame is fixedly connected to the bottom surface of the outer shell through a pressure bearing, and the nozzle is installed in a ring on the inner wall of the three ring structures of the movable frame and points to the center of the movable frame. The size of the ring structure of the movable frame is larger than that of the support frame.

[0014] Beneficial effects

[0015] This invention provides a semiconductor cleaning device with rotating spray. Compared with the prior art, it has the following advantages:

[0016] (1) The rotating spray semiconductor cleaning equipment shortens the coverage time through structural design and component coordination: After the liquid pump is started, the cleaning liquid is efficiently delivered to the distribution pipe through the hose. The distribution pipe is connected to the inner cavity of the three annular structures of the movable frame, which can distribute the cleaning liquid to multiple annular areas at the same time. The annular structure of the movable frame, in conjunction with the nozzles on the inner wall, can realize multi-annular and multi-nozzle simultaneous spraying, which greatly expands the coverage range of a single spray. At the same time, the stepper motor drives the movable frame to rotate through the transmission component, so that the spray range of the nozzle continuously and dynamically covers the semiconductor surface. It does not need to rely on the natural flow of the cleaning liquid or long-term fixed spraying to cover the entire semiconductor, which significantly shortens the time required for the cleaning liquid to fully cover the semiconductor, thereby improving the overall cleaning efficiency and solving the problem of low efficiency.

[0017] (2) In this rotating spray semiconductor cleaning equipment, after the stepper motor is started, the synchronous shaft is driven to rotate through the transmission of the synchronous wheel and the synchronous belt. The gear on the synchronous shaft meshes with the gear ring on the outside of the movable frame, driving the movable frame to rotate stably with the pressure bearing as the fulcrum. At the same time, the nozzles are installed in a ring on the inner wall of the movable frame and all point to the center. When the movable frame rotates, it will drive the nozzles to rotate clockwise and counterclockwise around the semiconductor at a 120-degree angle, so that the cleaning liquid can be sprayed onto the surface of the semiconductor from multiple directions such as the side circumference and the bottom, avoiding dead corners caused by spraying in a single direction. In addition, the electric push rod can drive the support frame through the support rod to flexibly adjust the height of the semiconductor, so that the semiconductor is always within the optimal range of the nozzle spray, further ensuring that all areas of the semiconductor surface can be effectively rinsed by the cleaning liquid, thereby solving the problem of poor cleaning effect. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the support frame installation structure of this utility model;

[0020] Figure 3 This is a schematic diagram of the nozzle mounting structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the gear and gear ring connection structure of this utility model;

[0022] In the diagram: 1. Outer casing; 2. Cleaning mechanism; 21. Drive assembly; 211. Electric actuator; 212. Support rod; 213. Support frame; 214. Stepper motor; 215. Synchronous pulley; 216. Synchronous belt; 217. Synchronous shaft; 218. Gear; 22. Conveying assembly; 221. Liquid pump; 222. Hoses; 223. Diverter pipe; 224. Movable frame; 225. Gear ring; 226. Pressure bearing; 227. Nozzle. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-4 This utility model provides a technical solution: a rotating spray semiconductor cleaning device includes a housing 1, and a cleaning mechanism 2 is provided inside the housing 1 for cleaning semiconductors. The cleaning mechanism 2 includes:

[0025] The drive assembly 21 includes an electric actuator 211 fixedly mounted on the top of the housing 1. A support rod 212 is fixedly mounted on the top of the electric actuator 211, and a support frame 213 is fixedly mounted on the bottom of the support rod 212. A stepper motor 214 is fixedly mounted on one side of the housing 1. A synchronous pulley 215 is fixedly mounted on the outer side of the shaft of the stepper motor 214. A synchronous belt 216 is meshed on the outer side of the synchronous pulley 215. A synchronous shaft 217 is inserted inside the housing 1. A gear 218 is fixedly mounted on the outer side of the synchronous shaft 217. The electric actuator 211 is symmetrically mounted on both sides of the top of the housing 1 with the center of the support frame 213 as the reference. The support frame 213 is connected to the electric actuator 211 through the support rod 212. The top of the housing 1 is provided with an opening structure that fits with the support frame 213. The shaft of the stepper motor 214 is connected to the top of the synchronous shaft 217 through the synchronous pulley 215 and the synchronous belt 216. The gear 218 meshes with the gear ring 225.

[0026] Specifically, the electric actuator 211 is connected to the support frame 213 via the support rod 212, allowing adjustment of the height of the support frame 213, which in turn supports the semiconductor device. The stepper motor 214's shaft is connected to the synchronous shaft 217 via the synchronous pulley 215 and the synchronous belt 216. The synchronous shaft 217 is rotatably connected to the housing 1. After the stepper motor 214 starts, it drives the synchronous shaft 217 to reciprocate left and right, causing the gear 218 to drive the movable frame 224 to rotate via the gear ring 225.

[0027] A delivery assembly 22, disposed inside the housing 1, is used to deliver rinsing liquid. The delivery assembly 22 includes a liquid pump 221 fixedly mounted on one side of the housing 1. A hose 222 is fixedly mounted at the discharge end of the liquid pump 221. A diverter pipe 223 is fixedly mounted at the end of the hose 222. A movable frame 224 is fixedly mounted on one side of the diverter pipe 223. A toothed ring 225 is fixedly mounted on one side of the movable frame 224. A pressure bearing 226 is fixedly mounted at the bottom of the movable frame 224. A nozzle 227 is fixedly mounted inside the movable frame 224. The tube 222 penetrates the inner wall of the front side of the outer shell 1. The flexible tube 222 is fixedly connected to one end of the diversion tube 223. The diversion tube 223 is connected to the inner cavity of the three annular structures of the movable frame 224. The toothed ring 225 is fixedly installed on the outside of the three annular structures of the movable frame 224. The movable frame 224 is fixedly connected to the bottom surface of the outer shell 1 through the pressure bearing 226. The nozzle 227 is installed in a ring on the inner wall of the three annular structures of the movable frame 224 and points to the center of the movable frame 224. The size of the annular structure of the movable frame 224 is larger than that of the support frame 213.

[0028] Specifically, the liquid pump 221 is connected to the diversion pipe 223 via a hose 222, enabling it to deliver cleaning solution into the diversion pipe 223. The hose 222 adapts to the positional changes of the diversion pipe 223 as the movable frame 224 rotates, ensuring that the diversion pipe 223 remains connected to the discharge port of the liquid pump 221. The bottom of the movable frame 224 is mounted on the bottom surface of the inner cavity of the outer casing 1 via a pressure bearing 226, forming a rotatable connection with the outer casing 1. The three annular structures of the movable frame 224 contain annular cavities, and these annular cavities are interconnected with the nozzle 227 and the diversion pipe 223.

[0029] Specifically, the electric actuator 211 is model HB-DJ805G, the stepper motor 214 is model 57HS11, and the liquid pump 221 is model FSB-20-160. In addition, all contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0030] During operation, the semiconductor to be cleaned is placed on the support frame 213. Then, the electric push rod 211 is activated. The electric push rod 211 drives the support frame 213 downward along the opening structure at the top of the housing 1 via the support rod 212 until the semiconductor moves to a suitable cleaning position inside the annular structure of the movable frame 224. Next, the stepper motor 214 is activated. The shaft of the stepper motor 214 drives the synchronous pulley 215 to rotate. The synchronous pulley 215 drives the synchronous shaft 217 to rotate via the meshing synchronous belt 216. The synchronous shaft 217 then drives the gear 218 fixed on the outside to rotate. The gear 218 meshes with the toothed ring 225 on the outside of the movable frame 224, driving the movable frame 224 through the pressure bearing 226 at the bottom. To ensure stable rotation of the fulcrum on the bottom surface of the outer casing 1, the liquid pump 221 is activated. The liquid pump 221 delivers the cleaning liquid to the hose 222 connected to the drain end. The hose 222 guides the cleaning liquid to the end of the diversion pipe 223. The diversion pipe 223 is connected to the three annular inner cavities of the movable frame 224, distributing the cleaning liquid evenly into the annular inner cavities of the movable frame 224. Finally, the cleaning liquid is sprayed towards the center through the nozzles 227 installed annularly on the inner wall of the movable frame 224, performing all-round rotating spray cleaning on the semiconductor inside the movable frame 224 during rotation. During the cleaning process, the height of the support frame 213 can be finely adjusted by the electric push rod 211 to ensure that all parts of the semiconductor can fully contact the cleaning liquid.

[0031] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor cleaning device with rotating spray, comprising a housing (1), characterized in that: The housing (1) is provided with a cleaning mechanism (2) for cleaning semiconductors. The cleaning mechanism (2) includes: The drive assembly (21) includes an electric push rod (211) fixedly mounted on the top of the housing (1), a support rod (212) fixedly mounted on the top of the electric push rod (211), a support frame (213) fixedly mounted on the bottom of the support rod (212), a stepper motor (214) fixedly mounted on one side of the housing (1), a synchronous pulley (215) fixedly mounted on the outer side of the shaft of the stepper motor (214), a synchronous belt (216) meshing with the outer side of the synchronous pulley (215), a synchronous shaft (217) inserted into the inside of the housing (1), and a gear (218) fixedly mounted on the outer side of the synchronous shaft (217). The delivery assembly (22) is located inside the housing (1) for delivering flushing liquid.

2. The semiconductor cleaning equipment with rotating spray according to claim 1, characterized in that: The delivery assembly (22) includes a liquid pump (221) fixedly installed on one side of the housing (1). A hose (222) is fixedly installed at the discharge end of the liquid pump (221). A diverter pipe (223) is fixedly installed at the end of the hose (222). A movable frame (224) is fixedly installed on one side of the diverter pipe (223). A toothed ring (225) is fixedly installed on one side of the movable frame (224). A pressure bearing (226) is fixedly installed at the bottom of the movable frame (224). A nozzle (227) is fixedly installed inside the movable frame (224).

3. The semiconductor cleaning equipment with rotating spray according to claim 1, characterized in that: The electric actuator (211) is symmetrically installed on both sides of the top of the housing (1) with the center of the support frame (213) as the reference. The support frame (213) is connected to the electric actuator (211) through the support rod (212).

4. The semiconductor cleaning device with rotating spray according to claim 1, characterized in that: The top of the outer casing (1) is provided with an opening structure that fits with the support frame (213). The rotating shaft of the stepper motor (214) is connected to the top of the synchronous shaft (217) through the synchronous pulley (215) and the synchronous belt (216). The gear (218) meshes with the gear ring (225).

5. A semiconductor cleaning device with rotating spray according to claim 2, characterized in that: The hose (222) penetrates the inner wall of the front side of the outer shell (1). The hose (222) is fixedly connected to one end of the diversion pipe (223). The diversion pipe (223) is connected to the inner cavity of the three annular structures of the movable frame (224). The toothed ring (225) is fixedly installed on the outside of the three annular structures of the movable frame (224).

6. A semiconductor cleaning device with rotating spray according to claim 2, characterized in that: The movable frame (224) is fixedly connected to the bottom surface of the outer shell (1) through a pressure bearing (226). The nozzle (227) is installed in a ring on the inner wall of the three ring structures of the movable frame (224) and points to the center of the movable frame (224). The ring structure of the movable frame (224) is larger than the support frame (213).

Images