Cleaning apparatus for semiconductor components

Abstract

This utility model relates to the field of semiconductor fabrication technology and discloses a cleaning device for semiconductor components, including a cleaning tank, a liquid containing tank, and a liquid outlet pipe. The cleaning tank is equipped with a first connecting pipe, a second connecting pipe, a third connecting pipe, and a fourth connecting pipe. The liquid containing tank includes a deionized water tank, an acid tank, a degreasing agent tank, and a wastewater tank. The first connecting pipe is connected to the deionized water tank, the second connecting pipe is connected to the acid tank, the third connecting pipe is connected to the degreasing agent tank, and the fourth connecting pipe is connected to the wastewater tank. The liquid outlet pipe has its outlet located above the cleaning tank and is sequentially connected to a vent pipe, a deionized water pipe, an acid pipe, a degreasing agent pipe, and a wastewater pipe. This utility model provides a cleaning device for semiconductor components that eliminates the need for multiple handling of semiconductor components by simply placing them in the cleaning tank, thus saving labor costs.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor fabrication technology, and in particular to a cleaning device for semiconductor components. Background Technology

[0002] In semiconductor manufacturing, cleaning semiconductor components is a core process that runs through the entire process of wafer fabrication, photolithography, etching, and deposition. To ensure that semiconductor components are thoroughly cleaned, each cleaning process requires separate cleaning with acid, degreaser, and deionized water. Since acid, degreaser, and deionized water are placed in different equipment or containers, semiconductor components need to be transferred between different equipment or containers, which makes the cleaning process complex and wastes labor costs.

[0003] Therefore, there is an urgent need for a cleaning device for semiconductor components to solve the above-mentioned technical problems. Utility Model Content

[0004] The purpose of this invention is to provide a cleaning device for semiconductor components, which can solve the problem of...

[0005] In the process of cleaning semiconductor components, acids, degreasers, and deionized water are placed in different equipment or containers. The semiconductor components need to be transferred between different equipment or containers, which makes the cleaning process complicated and wastes labor costs.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A cleaning device for semiconductor components, comprising:

[0008] The cleaning tank is equipped with a first connecting pipe, a second connecting pipe, a third connecting pipe and a fourth connecting pipe;

[0009] A liquid container tank, comprising a deionized water tank, an acid tank, a degreasing agent tank, and a degreasing agent tank, wherein a first connecting pipe is connected to the deionized water tank, a second connecting pipe is connected to the acid tank, a third connecting pipe is connected to the degreasing agent tank, and a fourth connecting pipe is connected to the wastewater tank.

[0010] The outlet pipe is located above the cleaning tank and is connected in sequence to the vent pipe, deionized water pipe, acid pipe, degreasing agent pipe and wastewater pipe.

[0011] The ventilation pipe is connected to the liquid outlet pipe at the furthest point from the liquid outlet. The deionized water pipe is connected to the deionized water tank through a first suction source. The acid pipe is connected to the acid tank through a second suction source. The degreasing agent pipe is connected to the degreasing agent tank through a third suction source. The wastewater pipe is connected to the wastewater tank through a fourth suction source.

[0012] As an optional solution, the deionized water pipe, acid pipe, degreasing agent pipe, and wastewater pipe are each equipped with a switch.

[0013] As an alternative, the cleaning tank is positioned above the liquid containing tank.

[0014] As an alternative, the bottom of the cleaning tank is provided with a support member, which is serrated and used to support the semiconductor components.

[0015] As an optional feature, the bottom of the cleaning tank is provided with a grip.

[0016] As an optional solution, it includes a first control element, a second control element, a third control element, and a fourth control element, wherein the first control element, the second control element, the third control element, and the fourth control element are electrically connected to the first suction source, the second suction source, the third suction source, and the fourth suction source, respectively.

[0017] As an alternative, a housing is included, with the cleaning tank and liquid containment tank disposed inside the housing.

[0018] As an optional solution, the housing is provided with a receiving cavity, which is located below the cleaning tank, and the first suction source, the second suction source, the third suction source and the fourth suction source are all located in the receiving cavity.

[0019] As an alternative, one side wall of the housing extends upward to form an extension, and the first control member, the second control member, the third control member and the fourth control member are all disposed on the extension.

[0020] As an optional solution, the extension is provided with an operation window, the deionized water pipe, acid pipe, degreasing agent pipe, and wastewater pipe are located outside the housing, and the switch is located at the operation window.

[0021] This utility model has at least the following beneficial effects:

[0022] This utility model provides a cleaning device for semiconductor components. When cleaning semiconductor components, simply place the semiconductor components in the cleaning tank, and the semiconductor components can be cleaned with acid, degreaser, and deionized water respectively. There is no need to repeatedly handle the semiconductor components, saving labor costs. Moreover, the acid, degreaser, and deionized water can all be recycled to avoid waste. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments of this utility model will be briefly introduced below.

[0024] Figure 1 A first-angle structural schematic diagram of a cleaning device for semiconductor components provided in an embodiment of this utility model;

[0025] Figure 2 A second-angle structural schematic diagram of a cleaning device for semiconductor components provided in an embodiment of this utility model;

[0026] Figure 3 A schematic diagram of a cleaning device (removal cleaning tank) for semiconductor components provided in an embodiment of this utility model;

[0027] Figure 4 This is a third-angle structural diagram of a cleaning device for semiconductor components provided in an embodiment of the present invention.

[0028] Figure label:

[0029] 1. Cleaning tank; 11. First connecting pipe; 12. Second connecting pipe; 13. Third connecting pipe; 14. Fourth connecting pipe; 2. Liquid container tank; 21. Deionized water tank; 22. Acid tank; 23. Degreasing agent tank; 24. Wastewater tank; 3. Discharge pipe; 4. Vent pipe; 5. Deionized water pipe; 6. Acid pipe; 7. Degreasing agent pipe; 8. Wastewater pipe; 9. Shell; 91. Receiving cavity; 92. Extension; 921. Operation window. Detailed Implementation

[0030] In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0031] In the existing technology, in order to clean semiconductor components, each cleaning process requires separate cleaning with acid, degreaser, and deionized water. Since the acid, degreaser, and deionized water are placed in different equipment or containers, the semiconductor components need to be transferred between different equipment or containers, which makes the cleaning process complicated and wastes labor costs.

[0032] Therefore, such as Figures 1 to 4 As shown, an embodiment of this utility model provides a cleaning device for semiconductor components to solve the above-mentioned technical problems.

[0033] A cleaning device for semiconductor components includes a cleaning tank 1, a liquid containing tank 2, and an outlet pipe 3. The cleaning tank 1 is equipped with a first connecting pipe 11, a second connecting pipe 12, a third connecting pipe 13, and a fourth connecting pipe 14. The liquid containing tank 2 includes a deionized water tank 21, an acid tank 22, a degreasing agent tank 23, and a wastewater tank 24. The first connecting pipe 11 is connected to the deionized water tank 21, the second connecting pipe 12 is connected to the acid tank 22, the third connecting pipe 13 is connected to the degreasing agent tank 23, and the fourth connecting pipe 14 is connected to the wastewater tank 24. The outlet of the outlet pipe 3 is located above the cleaning tank 1 and is sequentially connected to a vent pipe 4, a deionized water pipe 5, an acid pipe 6, a degreasing agent pipe 7, and a wastewater pipe 8. The vent pipe 4 is connected to the outlet of the outlet pipe 3 at its furthest point from the outlet. The deionized water pipe 5 is connected to the deionized water tank 21 via a first suction source, and the acid pipe 6 is connected to the acid tank 22 via a second suction source. The degreasing agent pipe 7 is connected to the degreasing agent tank 23 via the third suction source, and the wastewater pipe 8 is connected to the wastewater tank 24 via the fourth suction source. This allows for cleaning of semiconductor components simply by placing them in the cleaning tank 1, enabling separate cleaning with deionized water, acid, and degreasing agent. This eliminates the need for multiple handling of the semiconductor components, saving labor costs. Furthermore, the deionized water circulates between the deionized water tank 21 and the cleaning tank 1 under the action of the first suction source, the acid circulates between the acid tank 22 and the cleaning tank 1 under the action of the second suction source, the degreasing agent circulates between the degreasing agent tank 23 and the cleaning tank 1 under the action of the third suction source, and the wastewater circulates between the wastewater tank 24 and the cleaning tank 1 under the action of the fourth suction source. This allows for the multiple uses of deionized water, acid, and degreasing agent, avoiding waste. In this application, the liquid outlet pipe 3 is sequentially connected to the vent pipe 4, deionized water pipe 5, acid pipe 6, degreasing agent pipe 7, and wastewater pipe 8. The vent pipe 4 is connected to the furthest point from the liquid outlet pipe 3, and the other end of the vent pipe 4 is connected to a gas source. This avoids interference between the wastewater, degreasing agent, acid, and deionized water pipes, thus ensuring the cleaning effect. After cleaning, the liquid on the semiconductor components can be removed using gas. The gas source mentioned here can be an air pump. Of course, in this application, only one of the first connecting pipe 11, the second connecting pipe 12, the third connecting pipe 13, and the fourth connecting pipe 14 can be kept conductive during cleaning. The other connecting pipes must be prevented from being conductive (for example, the free ends of the connecting pipes can be sealed with rubber stoppers).

[0034] In some embodiments, in order to facilitate selective control of the flow of deionized water, acid, degreasing agent, and wastewater into the cleaning tank 1, the deionized water pipe 5, acid pipe 6, degreasing agent pipe 7, and wastewater pipe 8 are each equipped with a switch.

[0035] In some embodiments, to save the internal space occupied by the cleaning tank 1 and the liquid container 2 in the cleaning equipment for semiconductor components of this application, the cleaning tank 1 is disposed above the liquid container 2.

[0036] In some embodiments, in order to facilitate the placement of semiconductor components in the cleaning tank 1, a support member 15 is provided at the bottom of the cleaning tank 1. During cleaning, the semiconductor components are placed on the support member 15, which can be serrated to facilitate the flow of liquid in the cleaning tank 1.

[0037] In some embodiments, in order to facilitate the removal or placement of the cleaning tank 1 into the cleaning equipment for semiconductor components of this application, a gripping member 16 is provided at the bottom of the cleaning tank 1.

[0038] In some embodiments, to facilitate selective control of the operation of the first suction source, the second suction source, the third suction source, and the fourth suction source, this application further includes a first control element, a second control element, a third control element, and a fourth control element. The first control element, the second control element, the third control element, and the fourth control element are electrically connected to the first suction source, the second suction source, the third suction source, and the fourth suction source, respectively. The first suction source, the second suction source, the third suction source, and the fourth suction source can be an electromagnetic pump.

[0039] In some embodiments, in order to make the overall appearance of the cleaning equipment for semiconductor components of this application aesthetically pleasing, it also includes a housing 9, a cleaning tank 1 and a liquid containing tank 2 disposed inside the housing 9, a receiving cavity 91 provided on the housing 9, the receiving cavity 91 being disposed below the cleaning tank 1, and a first suction source, a second suction source, a third suction source and a fourth suction source all disposed in the receiving cavity 91.

[0040] In some embodiments, in order to facilitate the operation of the first control element, the second control element, the third control element, the fourth control element, and the switch, one side wall of the housing 9 extends upward to form an extension 92. The first control element, the second control element, the third control element, and the fourth control element are all disposed on the extension 92. The extension 92 is provided with an operation window 921. The deionized water pipe 5, the acid pipe 6, the degreasing agent pipe 7, and the wastewater pipe 8 are disposed outside the housing 9. The switch is disposed at the operation window 921.

[0041] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A cleaning device for semiconductor components, characterized in that, include The cleaning tank (1) is equipped with a first connecting pipe (11), a second connecting pipe (12), a third connecting pipe (13) and a fourth connecting pipe (14). The liquid container (2) includes a deionized water tank (21), an acid tank (22), a degreasing agent tank (23), and a wastewater tank (24). The first connecting pipe (11) is connected to the deionized water tank (21), the second connecting pipe (12) is connected to the acid tank (22), the third connecting pipe (13) is connected to the degreasing agent tank (23), and the fourth connecting pipe (14) is connected to the wastewater tank (24). The outlet pipe (3) is located above the cleaning tank (1). The outlet pipe (3) is connected in sequence to the air pipe (4), the deionized water pipe (5), the acid pipe (6), the degreasing agent pipe (7), and the wastewater pipe (8). Among them, the vent pipe (4) is connected to the liquid outlet pipe (3) at the farthest point from the liquid outlet. The deionized water pipe (5) is connected to the deionized water tank (21) through the first suction source. The acid pipe (6) is connected to the acid tank (22) through the second suction source. The degreasing agent pipe (7) is connected to the degreasing agent tank (23) through the third suction source. The wastewater pipe (8) is connected to the wastewater tank (24) through the fourth suction source.

2. The cleaning equipment for semiconductor components according to claim 1, characterized in that, The deionized water pipe (5), acid pipe (6), degreasing agent pipe (7), and wastewater pipe (8) are each equipped with a switch.

3. The cleaning equipment for semiconductor components according to claim 1, characterized in that, The cleaning tank (1) is positioned above the liquid container tank (2).

4. The cleaning equipment for semiconductor components according to claim 1, characterized in that, The bottom of the cleaning tank (1) is provided with a support member (15), which is serrated and is used to support the semiconductor components.

5. A cleaning device for semiconductor components according to claim 1, characterized in that, The bottom of the cleaning tank (1) is provided with a grip (16).

6. A cleaning device for semiconductor components according to claim 1, characterized in that, It includes a first control element, a second control element, a third control element, and a fourth control element, which are electrically connected to a first suction source, a second suction source, a third suction source, and a fourth suction source, respectively.

7. A cleaning device for semiconductor components according to claim 6, characterized in that, Includes a housing (9), and the cleaning tank (1) and the liquid containing tank (2) are disposed inside the housing (9).

8. A cleaning device for semiconductor components according to claim 7, characterized in that, The housing (9) is provided with a receiving cavity (91), which is located below the cleaning tank (1). The first suction source, the second suction source, the third suction source and the fourth suction source are all located in the receiving cavity (91).

9. A cleaning device for semiconductor components according to claim 7, characterized in that, One side wall of the housing (9) extends upward to form an extension (92), and the first control member, the second control member, the third control member and the fourth control member are all disposed on the extension (92).

10. A cleaning device for semiconductor components according to claim 9, characterized in that, An operation window (921) is provided on the extension (92). The deionized water pipe (5), acid pipe (6), degreasing agent pipe (7), and wastewater pipe (8) are located outside the housing (9). The deionized water pipe (5), acid pipe (6), degreasing agent pipe (7), and wastewater pipe (8) are each provided with a switch. The switch is located at the operation window (921).

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