Backplate processing equipment and backplate

Abstract

The utility model discloses a kind of backboard processing equipment and backboard, backboard processing equipment includes clamping mechanism, electrode jig and processing mechanism. Clamping mechanism is used to fix backboard, to make backboard immerse in working liquid;Electrode jig has processing surface, processing surface is circular arc surface, processing surface is used to discharge to backboard, to make the thinning groove with circular arc surface as bottom wall on backboard;Processing mechanism is electrically connected with electrode jig, and it is used to power supply to electrode jig, electrode jig is installed on processing mechanism, to make processing surface and clamping mechanism opposite. The backboard processing equipment of the utility model, on the one hand, can control the shape of the bottom wall of the thinning groove processed by electrode jig without reducing production efficiency. On the other hand, the wall thickness change rate corresponding to each point of the bottom wall of the thinning groove is continuous, which is beneficial to reduce the risk of strain mutation point existing in the bending deformation area, thereby improving the bending performance of the backboard.

Description

Technical Field

[0001] This utility model relates to the field of foldable screen support back panel technology, and in particular to a back panel processing equipment and a back panel. Background Technology

[0002] Foldable phone screens require a back panel for support, and this back panel needs to be able to fold and unfold with the screen. Typically, thinning grooves are cut into the surface of the back panel. These grooves reduce the thickness of the back panel and decrease its bending stiffness. The portion of the back panel with the thinning grooves forms the bending deformation area, which is used for bending deformation to allow the back panel to fold and unfold with the screen. In existing technologies, to improve processing efficiency and reduce processing difficulty, the bottom wall of the thinning groove is often machined as a flat surface or its shape is not controlled, resulting in poor bending performance of the back panel. Utility Model Content

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a backplate processing equipment and a backplate, which can improve the bending performance of the backplate.

[0004] In a first aspect, this utility model provides a backplate processing device, which includes a clamping mechanism, an electrode fixture, and a processing mechanism. The clamping mechanism is used to fix the backplate so that the backplate is immersed in the working fluid; the electrode fixture has a processing surface, which is an arc surface, and the processing surface is used to discharge onto the backplate so that a thinning groove with the arc surface as the bottom wall is formed on the backplate; the processing mechanism is electrically connected to the electrode fixture and is used to supply power to the electrode fixture, and the electrode fixture is mounted on the processing mechanism so that the processing surface is opposite to the clamping mechanism.

[0005] The backplate processing equipment provided in the first aspect of this utility model has at least the following beneficial effects: On the one hand, by applying electrical discharge to the backplate through the arc-shaped machining surface of the electrode fixture, a thinning groove is machined on the surface of the backplate. The shape of the bottom wall of the thinning groove can be controlled by the electrode fixture without reducing production efficiency. On the other hand, the thinning groove can constitute the bending deformation area of ​​the backplate. The arc-shaped bottom wall of the thinning groove machined by the electrode fixture ensures that the wall thickness change rate at each point on the bottom wall of the thinning groove is continuous, which helps to reduce the risk of strain abrupt points in the bending deformation area, thereby improving the bending performance of the backplate.

[0006] In one embodiment of this implementation, the axis of the machined surface is located on the side of the machined surface away from the clamping mechanism.

[0007] In one embodiment of this implementation, the processing mechanism supplies power to the electrode fixture in multiple rounds at intervals, with the time interval between two adjacent rounds of discharge being 100us-1000us and the duration of each round of discharge being 50us-500us.

[0008] In one embodiment of this implementation, the electrode fixture is made of graphite.

[0009] In one embodiment of this implementation, the backplate processing equipment further includes a feed driver. The processing mechanism is mounted on the feed driver, which can drive the electrode fixture to reciprocate linearly at a frequency of 0.2Hz-2Hz, so that the processing surface approaches or moves away from the backplate.

[0010] Secondly, the present invention provides a back plate, wherein a thinning groove is formed on the surface of the back plate, the thinning groove having an arc surface as the bottom wall, and the thinning groove is formed by processing the back plate using a back plate processing equipment according to any embodiment of the first aspect of the invention.

[0011] The backplate provided by the second aspect of this utility model has at least the following beneficial effects: The thinning groove is formed on the back plate by processing the back plate processing equipment according to any embodiment of the first aspect, which can improve the bending performance of the back plate.

[0012] In one embodiment of this implementation, the thickness of the backplate is 160um-240um.

[0013] In one embodiment of this implementation, the axis of the bottom wall of the thinning groove is parallel to the surface of the back plate.

[0014] In one embodiment of this implementation, the thinning groove extends along a first direction to the edge of the back plate surface to connect opposite sides of the back plate along the first direction, which is parallel to the back plate surface.

[0015] In one embodiment of this implementation, the backplate is made of titanium alloy.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a schematic diagram of the backplate processing equipment according to one embodiment of the present invention; Figure 2 yes Figure 1 A three-dimensional structural diagram of the electrode fixture; Figure 3 yes Figure 1 A three-dimensional structural diagram of the back panel.

[0018] Figure label: Backplate processing equipment 100; backplate 10; thinning groove 11; first plate surface 12; second plate surface 13; support area 14; bending deformation area 15; electrode fixture 20; processing surface 21; clamping mechanism 30; processing mechanism 40. Detailed Implementation

[0019] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0020] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0022] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0023] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0024] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

[0025] Please see Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of the backplate 10 processing equipment 100 according to one embodiment of the present utility model; Figure 2 yes Figure 1 A three-dimensional structural schematic diagram of the electrode fixture 20; Figure 3 yes Figure 1 A three-dimensional structural schematic diagram of the backplate 10. This utility model provides a backplate 10 processing device 100, which includes a clamping mechanism 30, an electrode fixture 20, and a processing mechanism 40. The clamping mechanism 30 is used to fix the backplate 10 so that the backplate 10 is immersed in the working fluid; the electrode fixture 20 has a processing surface 21, which is an arc surface, and the processing surface 21 is used to discharge onto the backplate 10 to form a thinning groove 11 with an arc surface as the bottom wall on the backplate 10; the processing mechanism 40 is electrically connected to the electrode fixture 20 and is used to supply power to the electrode fixture 20, and the electrode fixture 20 is mounted on the processing mechanism 40 so that the processing surface 21 is opposite to the clamping mechanism 30.

[0026] Specifically, the clamping mechanism 30 and the machining mechanism 40 are arranged at intervals along the Z direction. The electrode fixture 20 is installed on the side of the machining mechanism 40 facing the clamping mechanism 30. The clamping mechanism 30 can fix the back plate 10 on the side of the clamping mechanism 30 facing the machining mechanism 40, and make the plate surface of the back plate 10 perpendicular to the Z direction. It can be understood that the clamping mechanism 30 can be immersed in the working fluid, so that the back plate 10 fixed on the clamping mechanism 30 is immersed in the working fluid, which is an electrolyte. When the clamping mechanism 30 fixes the back plate 10, the plate surface of the back plate 10 is perpendicular to the Z direction. When the electrode fixture 20 discharges through the machining surface 21 to the back plate 10 immersed in the working fluid, it can perform electro-etching on the back plate 10 to form a thinning groove 11 on the back plate 10, and make the bottom wall of the thinning groove 11 an arc surface similar in shape to the machining surface 21.

[0027] The backplate 10 processing equipment 100 of this utility model, on the one hand, discharges electricity onto the backplate 10 through the arc-shaped processing surface 21 of the electrode fixture 20 to process a thinning groove 11 on the plate surface of the backplate 10. The shape of the bottom wall of the processed thinning groove 11 can be controlled by the electrode fixture 20 without reducing production efficiency. On the other hand, the thinning groove 11 can form the bending deformation region 15 of the backplate 10. The bottom wall of the thinning groove 11 processed by the electrode fixture 20 is an arc surface, which makes the wall thickness change rate corresponding to each point of the bottom wall of the thinning groove 11 continuous. This helps to reduce the risk of strain abrupt points in the bending deformation region 15, thereby improving the bending performance of the backplate 10.

[0028] Please see Figures 1 to 3 In one embodiment of this implementation, the axis of the machining surface 21 is located on the side of the machining surface 21 away from the clamping mechanism 30.

[0029] Specifically, the axis of the machined surface 21 is parallel to the X direction.

[0030] It is understood that the back plate 10 has a first plate surface 12 and a second plate surface 13 that are parallel to each other. When the clamping mechanism 30 fixes the back plate 10, the second plate surface 13 is opposite to the clamping mechanism 30, and the first plate surface 12 is opposite to the processing surface 21. The thinning groove 11 is formed on the first plate surface 12. The first plate surface 12 of the back plate 10 is used to connect with the screen, and the screen is located on the side of the first plate surface 12 away from the second plate surface 13. During the folding process of the screen, the bent part of the screen bends to form an arc surface on the side of the first plate surface 12 away from the second plate surface 13, and the axis of the arc surface formed by the screen is located on the side of the screen away from the first plate surface 12. The back plate 10 folds along the first plate surface 12 toward the screen. The thinning groove 11 forms the bending deformation area 15 of the back plate 10. The axis of the processing surface 21 is located on the side of the processing surface 21 away from the clamping mechanism 30. This allows the axis of the bottom wall of the thinning groove 11 processed by the electrode fixture 20 on the back plate 10 to be located on the side of the first plate surface 12 away from the second plate surface 13. This enables the thinning groove 11 to better accommodate the bent part of the screen, thereby reducing the risk of the bending deformation area 15 of the back plate 10 and the bent part of the screen squeezing each other when the screen is folded, causing damage to the back plate 10 or wrinkles to the screen.

[0031] Please see Figures 1 to 3 In one embodiment of this implementation, the processing mechanism 40 supplies power to the electrode fixture 20 in multiple rounds at intervals, with the time interval between two adjacent rounds of discharge being 100us-1000us and the duration of each round of discharge being 50us-500us.

[0032] Specifically, the time interval between two adjacent discharges can be 100us, 325us, 550us, 775us, or 1000us.

[0033] Understandably, during the electro-etching process of the electrode fixture 20 on the back plate 10, electro-etching waste will be generated between the electrode fixture 20 and the back plate 10. This electro-etching waste will affect the processing effect of the electrode fixture 20 on the back plate 10. The back plate 10 is immersed in the working fluid during the electro-etching process of the electrode fixture 20. When the electrode fixture 20 stops discharging the back plate 10, the working fluid can wash away the electro-etching waste between the electrode fixture 20 and the back plate 10. When the time interval between two adjacent discharges is less than 100 μs, the working fluid will not have enough time to wash away the electro-etching waste between the electrode fixture 20 and the back plate 10. This will result in a high concentration of electro-etching waste between the electrode fixture 20 and the back plate 10, which will make the surface of the bottom wall of the thinning groove 11 processed by the electrode fixture 20 on the back plate 10 rough, thereby reducing the continuity of the wall thickness change rate at each point on the bottom wall of the thinning groove 11. When the time interval between two adjacent discharges is greater than 1000 μs, the processing efficiency of the electrode fixture 20 on the back plate 10 will decrease. If the duration of each discharge is less than 50 μs, the processing efficiency of the electrode fixture 20 on the back plate 10 will be too low. If the duration of each discharge is greater than 500 μs, the surface of the bottom wall of the thinning groove 11 will become rough, causing the rate of change of wall thickness at different points on the bottom wall of the thinning groove 11 to be discontinuous. A time interval of 100 μs to 1000 μs between adjacent discharges, and a duration of 50 μs to 500 μs for each discharge, is beneficial for improving the processing efficiency of the electrode fixture 20 on the back plate 10 while ensuring the processing quality.

[0034] Please see Figures 1 to 3 In one embodiment of this implementation, the electrode fixture 20 is made of graphite.

[0035] It is understood that in some embodiments, when the electrode fixture 20 performs electro-etching on the backplate 10, the processing mechanism 40 can drive the electrode fixture 20 to repeatedly move closer to or away from the substrate. The electrode fixture 20 is made of graphite. On the one hand, this reduces the weight of the electrode fixture 20, thereby reducing the load on the processing mechanism 40 when it moves the electrode fixture 20, which improves the accuracy of the movement of the electrode fixture 20 by the processing mechanism 40. This is beneficial to improving the dimensional accuracy of the thinning groove 11 processed by the electrode fixture 20 on the backplate 10. On the other hand, graphite has strong thermal and electrical conductivity. By making the electrode fixture 20 from graphite, the risk of damage to the substrate due to heat generation when the electrode fixture 20 discharges a large current to the substrate can be reduced. This allows the electrode fixture 20 to process the backplate 10 with a large current, which helps to shorten the time required for the electrode fixture 20 to process the thinning groove 11 on the backplate 10. The portion of the backplate 10 other than the thinning groove 11 is the support area 14. The backplate 10 has two support areas 14, each located on one side of the bending deformation area 15. These support areas 14 support the screen. Titanium alloy has high strength, and the backplate 10 is made of titanium alloy, which improves the strength of the support areas 14. This ensures that even with a small thickness 'a', the strength of the support areas 14 meets requirements. This reduces the weight of the backplate 10 and decreases the depth of the thinning groove 11 required on the backplate 10 surface. This reduces the amount of material removed from the backplate 10 by the electrode fixture 20, thus reducing the time required for the electrode fixture 20 to machine the required thinning groove 11 on the backplate 10 and improving the production efficiency of the backplate 10.

[0036] Please see Figures 1 to 3 In one embodiment of this implementation, the backplate 10 processing equipment 100 further includes a feed driver, and the processing mechanism 40 is mounted on the feed driver. The feed driver can drive the electrode fixture 20 to reciprocate linearly at a frequency of 0.2Hz-2Hz so that the processing surface 21 approaches or moves away from the backplate 10.

[0037] Specifically, the feed driver is a linear driver with its driving direction parallel to the Z direction, and the electrode fixture 20 is mounted on the driving end of the linear driver. The frequency at which the feed driver drives the electrode fixture 20 to reciprocate linearly along the Z direction can be 0.2Hz, 0.75Hz, 1.1Hz, 1.45Hz, or 2Hz.

[0038] Understandably, the feed driver can move the electrode fixture 20 away from the back plate 10 to a first position, and the feed driver can move the electrode fixture 20 towards the back plate 10 to a second position. The first and second positions are arranged alternately along the Z direction on the same side of the back plate 10 along the Z direction. When the electrode fixture 20 is in the first position, the distance between the electrode fixture 20 and the back plate 10 is relatively large, the discharge power of the electrode fixture 20 to the back plate 10 is reduced, and the electrolyte can flush away the electro-erosion waste between the electrode fixture 20 and the back plate 10, thereby reducing the concentration of electro-erosion waste between the electrode fixture 20 and the back plate 10. When the electrode fixture 20 is in the second position, the gap between the electrode fixture 20 and the back plate 10 is small, the electrolyte has difficulty flushing away the electro-erosion waste between the electrode fixture 20 and the back plate 10, and the discharge power of the electrode fixture 20 to the back plate 10 is high, thereby increasing the concentration of electro-erosion waste between the electrode fixture 20 and the back plate 10. When the frequency of the reciprocating motion of the electrode fixture 20 driven by the feed driver is less than 0.2Hz, the electrode fixture 20 will remain in the second position for too long. This will prevent the electro-erosion waste between the electrode fixture 20 and the back plate 10 from being discharged in time, causing the concentration of the electro-erosion waste to increase and affect the machining quality of the electrode fixture 20 on the back plate 10. Consequently, the bottom wall surface of the thinning groove 11 machined by the electrode fixture 20 on the back plate 10 will be rough. When the frequency of the reciprocating motion of the electrode fixture 20 driven by the feed driver is greater than 2Hz, it will generate greater vibration, causing the relative position between the electrode fixture 20 and the back plate 10 to shift, which will reduce the machining accuracy of the electrode fixture 20 on the back plate 10. When the frequency of the reciprocating motion of the electrode fixture 20 driven by the feed driver is between 0.2Hz and 2Hz, it is beneficial to ensure the surface quality of the groove wall of the thinning groove 11 machined by the electrode fixture 20 while reducing the risk of reduced machining accuracy of the electrode fixture 20 on the back plate 10.

[0039] Please see Figure 3 Secondly, the present invention provides a back plate 10, on the surface of which a thinning groove 11 is provided. The thinning groove 11 has an arc surface as its bottom wall and is formed by processing the back plate 10 by the back plate 10 processing equipment 100 of any embodiment of the first aspect of the invention.

[0040] Specifically, the back plate 10 has a first plate surface 12 and a second plate surface 13 that are spaced apart and parallel to each other along the Z direction. A thinning groove 11 is formed on the first plate surface 12. The axis of the bottom wall of the thinning groove 11 is parallel to the X direction. The bottom wall of the thinning groove 11 extends circumferentially to the first plate surface 12 along the axis of the bottom wall of the thinning groove 11. That is, the side wall of the thinning groove 11 is an arc surface that is smoothly connected to the bottom wall of the thinning groove 11. The axis of the side wall of the thinning groove 11 coincides with the axis of the bottom wall of the thinning groove 11, and the radius of the side wall of the thinning groove 11 is the same as the radius of the bottom wall of the thinning groove 11.

[0041] It is understood that the sidewall of the thinning groove 11 is an arc surface that smoothly connects to the bottom wall of the thinning groove 11. The axis of the sidewall of the thinning groove 11 coincides with the axis of the bottom wall of the thinning groove 11, and the radius of the sidewall of the thinning groove 11 is the same as the radius of the bottom wall of the thinning groove 11. This helps to further reduce the risk of strain abrupt change points in the bending deformation region 15, thereby further improving the bending performance of the back plate 10. The thinning groove 11 is formed by processing the back plate 10 using the back plate 10 processing equipment 100 of any embodiment of the first aspect of the embodiment, which can improve the bending performance of the back plate 10.

[0042] Please see Figures 1 to 3 In one embodiment of this implementation, the thickness of the back plate 10 is 160um-240um.

[0043] Specifically, the thickness 'a' of the back plate 10 can be 160 μm, 180 μm, 200 μm, 220 μm, or 240 μm. It is understood that before the electrode fixture 20 processes the thinning groove 11 on the back plate 10, the thickness of all parts of the back plate 10 is the same. After the electrode fixture 20 processes the thinning groove 11 on the back plate 10, the thickness of the portion of the back plate 10 with the thinning groove 11 decreases, while the thickness of the portion outside the thinning groove 11 remains unchanged; that is, the thickness of the support region 14 remains unchanged. When the thickness 'a' of the backplate 10 is less than 160µm, the thickness of the support area 14 is too small, making the support area 14 prone to deformation. This results in poor support of the backplate 10 for the screen. When the thickness 'a' of the backplate 10 is greater than 240µm, the depth of the thinning groove 11 needs to be set larger to ensure that the thickness of the bending deformation area 15 is sufficiently small. This leads to the electrode fixture 20 needing to perform electro-etching on the backplate 10 for a longer period, thus increasing the time required to process the thinning groove 11 on the backplate 10. Setting the thickness of the backplate 10 to 160µm-240µm helps to reduce the processing time of the backplate 10 while ensuring its support effect on the screen.

[0044] Please see Figure 1 and Figure 3 In one embodiment of this implementation, the axis of the bottom wall of the thinning groove 11 is parallel to the surface of the back plate 10.

[0045] Specifically, the axis of the bottom wall of the thinning groove 11 is parallel to the X direction. It can be understood that when the back plate 10 is folded, each point within the bending deformation region 15 of the back plate 10 experiences circumferential strain along an axis parallel to the X direction. The fact that the axis of the bottom wall of the thinning groove 11 is parallel to the X direction ensures that the wall thickness corresponding to each point arranged along the X direction within the thinning groove 11 is the same. This ensures that when the back plate 10 is folded, the strain at each point arranged along the X direction within the bending deformation region 15 of the back plate 10 is the same, which helps to further reduce the risk of strain abrupt changes within the bending deformation region 15 of the back plate 10, thereby further improving the bending performance of the back plate 10.

[0046] Please see Figure 1 and Figure 3 In one embodiment of this implementation, the thinning groove 11 extends along a first direction to the edge of the back plate 10 to connect the opposite sides of the back plate 10 along the first direction, which is parallel to the back plate 10.

[0047] Specifically, the first direction is parallel to the X direction. This arrangement allows the bending deformation area 15 to extend along the X direction to the edges of opposite sides of the back plate 10, thereby increasing the size of the bending deformation area 15 in the X direction and further improving the bending performance of the back plate 10.

[0048] Please see Figure 1 and Figure 3 In one embodiment of this implementation, the backplate 10 is made of titanium alloy.

[0049] It is understandable that titanium alloy has high strength. The back plate 10 is made of titanium alloy, which can improve the strength of the support area 14 of the back plate 10. This ensures that the strength of the support area 14 of the back plate 10 can meet the requirements even when the thickness a of the back plate 10 is small. On the one hand, this helps to reduce the weight of the back plate 10. On the other hand, it can reduce the depth of the arc thinning groove 11 that needs to be opened on the plate surface of the back plate 10. This helps to reduce the time required for the electrode fixture 20 to perform electro-etching on the back plate 10, thereby improving the production efficiency of the back plate 10.

[0050] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A backplate processing equipment, characterized in that, include: A clamping mechanism is used to fix the back plate so that the back plate is immersed in the working fluid; An electrode fixture has a machined surface, which is an arc surface. The machined surface is used to discharge onto the back plate to form a thinning groove with an arc surface as the bottom wall on the back plate. A machining mechanism is electrically connected to the electrode fixture and is used to supply power to the electrode fixture, which is mounted on the machining mechanism so that the machining surface is opposite to the clamping mechanism.

2. The backplate processing equipment according to claim 1, characterized in that, The axis of the machined surface is located on the side of the machined surface away from the clamping mechanism.

3. The backplate processing equipment according to claim 1, characterized in that, The processing mechanism provides multiple rounds of intermittent power supply to the electrode fixture, with the time interval between two adjacent rounds of discharge being 100us-1000us and the duration of each round of discharge being 50us-500us.

4. The backplate processing equipment according to claim 1, characterized in that, The electrode fixture is made of graphite.

5. The backplate processing equipment according to claim 1, characterized in that, The backplate processing equipment also includes a feed driver, and the processing mechanism is mounted on the feed driver. The feed driver can drive the electrode fixture to perform reciprocating linear motion at a frequency of 0.2Hz-2Hz, so that the processing surface moves closer to or further away from the backplate.

6. A backplate, characterized in that, A thinning groove is formed on the surface of the back plate, the thinning groove having a circular arc surface as its bottom wall, and the thinning groove is formed by processing the back plate using the back plate processing equipment according to any one of claims 1 to 5.

7. The backplate according to claim 6, characterized in that, The thickness of the backplate is 160um-240um.

8. The backplate according to claim 6, characterized in that, The axis of the bottom wall of the thinning groove is parallel to the surface of the back plate.

9. The backplate according to claim 6, characterized in that, The thinning groove extends along a first direction to the edge of the back plate surface to connect the opposite sides of the back plate along the first direction, which is parallel to the back plate surface.

10. The backplate according to claim 6, characterized in that, The backplate is made of titanium alloy.

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