Ultrathin shock-absorbing conductive foam
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-25
- Publication Date
- 2026-08-11
AI Technical Summary
[0003]然而，现有的导电泡棉产品往往难以同时兼顾超薄、良好的减震性能和优异的导电性能，或者在结构设计和材料选择上存在不足，无法满足一些对空间和性能要求较高的应用场景
[0013]通过导电泡棉基体层、导电功能层和减震微结构层的配合使用，导电功能层包含均匀分布的导电颗粒或金属镀层，导电颗粒为银包铜粉或石墨烯纳米片，银包铜粉结合了银的高导电性和铜的低成本优势，石墨烯纳米片则具有优异的导电性能和力学性能，能够有效提高导电功能层的导电效率，减震微结构层的表面分布有蜂窝状凹陷阵列，这种蜂窝状凹陷阵列结构能够进一步增强减震效果，从而显著提高泡棉的整体减震性能，同时，导电泡棉基体层、导电功能层与减震微结构层通过热压复合形成的一体化结构，不仅保证了各层之间的紧密结合和稳定性能，还显著提高了泡棉的整体性能，同时极大提高了空间利用率，减少了空间浪费，为电子设备等产品的集成与高效运作提供了有力支持。
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Figure CN224625205U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of ultra-thin conductive foam technology, and more specifically, it relates to an ultra-thin shock-absorbing conductive foam. Background Technology
[0002] In many fields such as electronic equipment manufacturing, aerospace, and automotive electronics, the demand for materials with shock absorption and conductivity functions is increasing. Conductive foam, as a commonly used material, must not only meet the requirements of conductivity to ensure the stability of signal transmission inside electronic equipment and prevent static electricity accumulation, but also have a certain shock absorption capacity to protect electronic components from damage caused by external impacts and vibrations.
[0003] However, existing conductive foam products often struggle to simultaneously achieve ultra-thinness, good shock absorption, and excellent conductivity, or they may have shortcomings in structural design and material selection, failing to meet the needs of some application scenarios with high space and performance requirements.
[0004] Therefore, in view of this, we have studied and improved the existing structure and its shortcomings, and provided an ultra-thin shock-absorbing and conductive foam in order to achieve a more practical purpose. Utility Model Content
[0005] To solve the above-mentioned technical problems, this utility model provides an ultra-thin shock-absorbing conductive foam, which is achieved by the following specific technical means:
[0006] An ultra-thin shock-absorbing conductive foam includes a conductive foam substrate layer, a conductive functional layer, and a shock-absorbing microstructure layer. The conductive functional layer is disposed on the upper surface of the conductive foam substrate layer, and has a thickness of 0.02-0.1 mm. The conductive functional layer contains uniformly distributed conductive particles or a metal plating layer. The shock-absorbing microstructure layer is disposed on the lower surface of the conductive foam substrate layer. The shock-absorbing microstructure layer is composed of closed-cell foam material and has a thickness of 0.1-0.5 mm. The surface of the shock-absorbing microstructure layer has a honeycomb-shaped array of depressions. The conductive foam substrate layer, the conductive functional layer, and the shock-absorbing microstructure layer are integrally formed by hot-pressing.
[0007] Furthermore, the conductive foam matrix layer is made of polyurethane foam material, and the porosity of the polyurethane foam material is between 80% and 90%.
[0008] Furthermore, the thickness of the conductive foam substrate layer is 0.3-0.6 mm.
[0009] Furthermore, the conductive particles in the conductive functional layer are silver-coated copper powder or graphene nanosheets.
[0010] Furthermore, in the honeycomb-shaped recessed array of the shock-absorbing microstructure layer, the diameter of a single hole is 0.1-1 mm and the depth of the hole is 0.05-0.3 mm.
[0011] Furthermore, it also includes an antistatic protective layer with a thickness of 0.01-0.05 mm, disposed on the upper surface of the conductive functional layer.
[0012] Compared with the prior art, the present invention has the following beneficial effects:
[0013] By combining a conductive foam substrate layer, a conductive functional layer, and a shock-absorbing microstructure layer, the conductive functional layer contains uniformly distributed conductive particles or a metal plating layer. The conductive particles are silver-coated copper powder or graphene nanosheets. Silver-coated copper powder combines the high conductivity of silver with the low cost of copper, while graphene nanosheets have excellent conductivity and mechanical properties, effectively improving the conductivity efficiency of the conductive functional layer. The surface of the shock-absorbing microstructure layer is distributed with a honeycomb-shaped array of depressions. This honeycomb-shaped array structure further enhances the shock absorption effect, thereby significantly improving the overall shock absorption performance of the foam. At the same time, the integrated structure formed by hot-pressing the conductive foam substrate layer, the conductive functional layer, and the shock-absorbing microstructure layer not only ensures the tight bonding and stable performance between the layers, but also significantly improves the overall performance of the foam. It also greatly improves space utilization and reduces space waste, providing strong support for the integration and efficient operation of electronic devices and other products. Attached Figure Description
[0014] Figure 1 This is a three-dimensional cross-sectional view of the present invention.
[0015] Figure 2 This is a three-dimensional schematic diagram of the shock-absorbing microstructure layer in this utility model.
[0016] In the diagram, the correspondence between component names and drawing numbers is as follows:
[0017] 1. Electro-foam substrate layer; 2. Conductive functional layer; 3. Shock-absorbing microstructure layer; 4. Antistatic protective layer. Detailed Implementation
[0018] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.
[0019] Example:
[0020] As attached Figure 1 To be continued Figure 2 As shown:
[0021] This utility model provides an ultra-thin shock-absorbing conductive foam, comprising a conductive foam substrate layer 1, a conductive functional layer 2, and a shock-absorbing microstructure layer 3. The conductive functional layer 2 is applied to the upper surface of the conductive foam substrate layer 1, and has a thickness of 0.02-0.1 mm. The conductive functional layer 2 contains uniformly distributed conductive particles or a metal plating layer. The shock-absorbing microstructure layer 3 is disposed on the lower surface of the conductive foam substrate layer 1. The shock-absorbing microstructure layer 3 is composed of closed-cell foam material, has a thickness of 0.1-0.5 mm, and has a honeycomb-shaped array of depressions distributed on its surface. The conductive foam substrate layer 1, the conductive functional layer 2, and the shock-absorbing microstructure layer 3 are integrated into a single structure through hot-pressing.
[0022] The conductive foam matrix layer 1 is made of polyurethane foam material with a porosity between 80% and 90%. During the preparation process, the foaming process parameters, such as the amount of foaming agent, temperature and time, are precisely controlled to obtain the ideal pore structure.
[0023] The conductive foam substrate layer 1 has a thickness of 0.3-0.6mm, and the dimensional accuracy is ensured through a cutting process to meet the ultra-thin requirements.
[0024] Among them, the conductive particles of the conductive functional layer 2 are silver-coated copper powder or graphene nanosheets. Silver-coated copper powder combines the high conductivity of silver with the low cost of copper, while graphene nanosheets have excellent conductivity and mechanical properties.
[0025] Among them, in the honeycomb-shaped recessed array of the shock-absorbing microstructure layer 3, the diameter of a single hole is 0.1-1mm and the depth of the hole is 0.05-0.3mm. This structure can effectively buffer external impact forces and improve shock absorption performance.
[0026] It also includes an antistatic protective layer 4 on the upper surface of the conductive functional layer 2, with a thickness of 0.01-0.05mm. The antistatic protective layer 4 is made of antistatic material, which can not only prevent static electricity accumulation from damaging electronic equipment, but also protect the conductive functional layer 2 to a certain extent and extend the service life of the foam.
[0027] The working principle of this embodiment:
[0028] The conductive foam matrix layer 1, conductive functional layer 2, and shock-absorbing microstructure layer 3 work together. The conductive functional layer 2 contains uniformly distributed conductive particles or metal plating. The conductive particles are silver-coated copper powder or graphene nanosheets. Silver-coated copper powder combines the high conductivity of silver with the low cost of copper, while graphene nanosheets have excellent conductivity and mechanical properties, which can effectively improve the conductivity efficiency of the conductive functional layer 2. The surface of the shock-absorbing microstructure layer 3 is distributed with a honeycomb-shaped array of depressions. This honeycomb-shaped array of depressions can further enhance the shock absorption effect. When subjected to external force, the depression structure can undergo elastic deformation, absorbing and dispersing energy, thereby significantly improving the overall shock absorption performance of the foam. At the same time, the integrated structure formed by the conductive foam matrix layer 1, conductive functional layer 2, and shock-absorbing microstructure layer 3 through hot pressing not only ensures the tight bonding and stable performance between the layers, but also significantly improves the overall performance of the foam. It also greatly improves space utilization and reduces space waste, providing strong support for the integration and efficient operation of electronic devices and other products.
[0029] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.
Claims
1. An ultra-thin shock absorbing conductive foam, characterized in that: The structure includes a conductive foam substrate layer (1), a conductive functional layer (2), and a shock-absorbing microstructure layer (3). The conductive functional layer (2) is applied to the upper surface of the conductive foam substrate layer (1). The conductive functional layer (2) has a thickness of 0.02-0.1 mm and contains uniformly distributed conductive particles or a metal plating layer. The shock-absorbing microstructure layer (3) is disposed on the lower surface of the conductive foam substrate layer (1). The shock-absorbing microstructure layer (3) is made of closed-cell foam material with a thickness of 0.1-0.5 mm. The surface of the shock-absorbing microstructure layer (3) is distributed with a honeycomb-shaped array of depressions. The conductive foam substrate layer (1), the conductive functional layer (2), and the shock-absorbing microstructure layer (3) are integrated into a single structure by hot-pressing.
2. The ultra-thin shock-absorbing and conductive foam as described in claim 1, characterized in that: The conductive foam substrate layer (1) is made of polyurethane foam material, and the porosity of the polyurethane foam material is between 80% and 90%.
3. The ultra-thin shock-absorbing and conductive foam as described in claim 1, characterized in that: The thickness of the conductive foam substrate layer (1) is 0.3-0.6 mm.
4. The ultra-thin shock-absorbing and conductive foam as described in claim 1, characterized in that: The conductive particles of the conductive functional layer (2) are silver-coated copper powder or graphene nanosheets.
5. The ultra-thin shock-absorbing and conductive foam as described in claim 1, characterized in that: In the honeycomb-shaped recessed array of the shock-absorbing microstructure layer (3), the diameter of a single hole is 0.1-1 mm and the depth of a hole is 0.05-0.3 mm.
6. The ultra-thin shock-absorbing and conductive foam as described in claim 1, characterized in that: It also includes an antistatic protective layer (4) disposed on the upper surface of the conductive functional layer (2), with a thickness of 0.01-0.05 mm.