EMC grounding terminal and its components

Abstract

This utility model belongs to the field of EMC grounding structure, specifically disclosing an EMC grounding terminal and its components. The EMC grounding terminal includes a grounding conductor and a connecting block for interference fit on the inner wall of a conductive housing. The grounding conductor has pins for conductive connection to a circuit board, and the connecting block has a protrusion. The grounding conductor passes through the protrusion and is connected to the connecting block. The inner edge of the grounding conductor has several first deformation portions, which are interference fit with the outer peripheral surface of the protrusion. The outer edge of the grounding conductor has several second deformation portions for interference fit with the inner wall of the conductive housing. The EMC grounding assembly includes a conductive housing, a circuit board, and the aforementioned EMC grounding terminal. This solution can achieve a grounding terminal that reduces space occupation, ensures connection strength, and obtains good EMC performance.

Description

Technical Field

[0001] This utility model relates to the field of EMC grounding structures, and in particular to an EMC grounding terminal and its components. Background Technology

[0002] In the design and manufacturing of electronic products, grounding terminals are an essential and critical structural element. Especially when products use metal casings, in order to achieve good EMC performance, it is necessary to effectively reduce the impact of both electromagnetic interference and electrostatic discharge on the circuit. Therefore, grounding terminals are often used to connect the circuit board's operating ground to the metal casing.

[0003] Currently, grounding terminals often use conductors such as wires, metal springs, or metal bolts to achieve the grounding effect. Among them, metal bolts have good connection strength, but they are not suitable for use due to space limitations such as application environment, shape, and size. Metal springs will fail under long-term vibration and impact, have poor weather resistance, and can even cause personal injury in severe cases. If wires are used, they will generate a large parasitic inductance (e.g., a 10cm wire can be equivalent to a parasitic inductance of 100nH), which is the fundamental reason why the radiation of the product is higher at certain frequencies, resulting in poor EMC performance. Utility Model Content

[0004] The purpose of this invention is to provide an EMC grounding terminal and its components, which can reduce the space occupied by the grounding terminal, ensure connection strength, and achieve good EMC performance.

[0005] The technical solution provided by this utility model is as follows: an EMC grounding terminal, including a grounding conductor, the grounding conductor having pins for conductively connecting to a circuit board, and a connecting block for interference fit with the inner wall of a conductive housing, the connecting block having a protrusion, the grounding conductor passing through the protrusion and connected to the connecting block; the inner edge of the grounding conductor having a plurality of first deformation portions having interference fit with the outer peripheral surface of the protrusion, and the outer edge of the grounding conductor having a plurality of second deformation portions having interference fit with the inner wall of the conductive housing.

[0006] In the above-mentioned EMC grounding terminal, each of the first deformed portions has a clearance opening on the inner edge of the grounding conductor on both sides.

[0007] In the aforementioned EMC grounding terminal, the second deformed portion is directly opposite the first deformed portion.

[0008] In the above-mentioned EMC grounding terminal, both the first deformed portion and the second deformed portion are protruding edges and are integrally formed with the grounding conductor.

[0009] In the aforementioned EMC grounding terminal, a circumferentially circumferentially hollowed-out groove is provided on the outer peripheral surface of the protrusion, and the hollowed-out groove is located between the grounding conductor and the end face of the protrusion.

[0010] In the aforementioned EMC grounding terminal, a positioning groove is provided on the outer peripheral surface of the protrusion. The positioning groove penetrates the end face of the protrusion, and the pin is located in the corresponding positioning groove and extends to the outside of the end face of the protrusion.

[0011] In the aforementioned EMC grounding terminal, there are two pins, which are staggered and located on opposite sides of the axis of the grounding conductor, and are centrally symmetrical to each other.

[0012] In the aforementioned EMC grounding terminal, a clearance recess is provided on the raised end face, and the clearance recess is located between the two pins.

[0013] In the aforementioned EMC grounding terminal, the outer wall of the connecting block is provided with a circumferentially surrounding draft surface, which extends toward the grounding conductor to the edge of the connecting block and gradually increases in outer diameter.

[0014] The EMC grounding assembly includes a conductive housing and a circuit board, and also includes an EMC grounding terminal as described above. The outer wall of the connecting block and the second deformable part are both interference-fitted with the inner wall of the conductive housing. The circuit board is fixed on the pin and is conductively connected to the pin.

[0015] The beneficial effects of this utility model after adopting the above technical solution are as follows:

[0016] The main body of the EMC grounding terminal in this technical solution is a grounding conductor. The grounding conductor is electrically connected to the circuit board through pins. In practical applications, the circuit board is located on one side of the grounding conductor, and the connecting block is located on the opposite side of the grounding conductor. The grounding conductor is fixed on the connecting block. During product assembly, the grounding conductor and the connecting block are both housed inside the conductive housing. The second deformation portion at the outer contour (i.e., on the outer edge) of the grounding conductor is interference-fitted with the conductive housing. Under the deformation of several second deformation portions, the space between the grounding conductor and the conductive housing is filled. This multi-point contact not only forms a certain bonding force after plastic deformation, but also increases the contact area between the grounding conductor and the conductive housing in the circumferential direction, avoiding poor contact between the grounding conductor and the conductive housing, resulting in a superior connection. Meanwhile, because the grounding conductor is fixed to the connecting block, and the connecting block is also interference-fitted with the conductive shell, the grounding conductor is indirectly connected to the conductive shell through the connecting block, thereby strengthening the connection strength between the grounding conductor and the conductive shell. Furthermore, the grounding conductor extends horizontally into a ring shape on the surface of the connecting block and is connected to the connecting block by means of hot pressing, increasing the surface area of ​​the grounding conductor. This not only improves the connection strength between the grounding conductor and the connecting block, but also, in conjunction with the second deformation part, forms multiple current-conducting paths, allowing the current to reach the metal shell from the shortest current-conducting path. This reduces the potential difference generated by the current-conducting circuit, thereby improving the noise immunity of the electronic device and achieving good EMC performance. It also allows for a reduction in product size based on the shortest current-conducting path and increases the connection strength with the connecting block. Additionally, the connecting block inserts into the inner ring of the grounding conductor through a protrusion. The outer peripheral surface of the grounding conductor is interference-fitted with the first deformation part on the inner edge of the grounding conductor. Through the deformation of several first deformation parts, they are filled between the grounding conductor and the protrusion. Similarly, the multi-point contact increases the contact friction between the grounding conductor and the protrusion. After plastic deformation, a certain bonding force is formed, which fixes the grounding conductor from the inside. This prevents the second deformation part from causing the outer edge of the grounding conductor to tilt towards the circuit board side or the inner edge to arch towards the circuit board side during the interference fit installation process with the conductive shell. This prevents the grounding conductor from weakening the connection strength with the connecting block due to deformation, thereby enhancing the connection effect between the grounding conductor and the connecting block. Finally, the grounding conductor, the connecting block, and the metal shell are stably connected. This achieves a grounding terminal that can reduce the space occupied, ensure connection strength, and obtain good EMC performance. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the EMC grounding terminal of Embodiment 1 of this utility model;

[0018] Figure 2 This is the utility model Figure 1 A magnified view of a portion of A;

[0019] Figure 3 This is an exploded view of the EMC grounding terminal assembly of Embodiment 1 of this utility model;

[0020] Figure 4 This is a top view of the EMC grounding terminal of Embodiment 1 of this utility model;

[0021] Figure 5 This is a schematic diagram of the EMC grounding assembly of Embodiment 1 of this utility model;

[0022] Figure 6 This is a front view of the EMC grounding assembly of Embodiment 1 of this utility model;

[0023] Figure 7 This is an exploded view of the assembly of the EMC grounding terminal of Embodiment 1 of this utility model;

[0024] Figure 8 This is an assembly diagram of the EMC grounding terminal of Embodiment 1 of this utility model;

[0025] Figure 9 This is a waveform diagram of the electrostatic discharge current in Embodiment 1 of this utility model;

[0026] Figure 10 This is a schematic diagram of the ESD analysis principle of Embodiment 1 of this utility model.

[0027] Reference numerals: 1. Connecting block; 2. Grounding conductor; 3. Conductive housing; 4. Circuit board; 5. Thermal connector; 6. Limiting and fixing fixture;

[0028] 11. Draft surface; 12. Protrusion; 121. Clearance recess; 122. Hollowed-out groove; 123. Positioning groove;

[0029] 21. Pin; 22. Second deformation part; 23. First deformation part; 24. Clearance opening; 41. Pad. Detailed Implementation

[0030] The technical solution of this utility model will be further described in detail below with reference to specific embodiments, but this does not constitute any limitation on this utility model.

[0031] Example 1:

[0032] like Figures 1-10As shown, the EMC grounding terminal includes a grounding conductor 2, which has pins 21 for conductively connecting to the circuit board 4. It also includes a connecting block 1 for interference fit on the inner wall of the conductive housing 3. The connecting block 1 has a protrusion 12, through which the grounding conductor 2 passes and is connected to the connecting block 1. The inner edge of the grounding conductor 2 has a plurality of first deformation portions 23, which are interference fit with the outer peripheral surface of the protrusion 12. The outer edge of the grounding conductor 2 has a plurality of second deformation portions 22 for interference fit with the inner wall of the conductive housing 3.

[0033] The specific working principle is as follows: the main body of the EMC grounding terminal is the grounding conductor 2. The grounding conductor 2 is electrically connected to the circuit board 4 through the pin 21. In actual application, the circuit board 4 is located on one side of the grounding conductor 2, and the connecting block 1 is located on the opposite side of the grounding conductor 2. The grounding conductor 2 is fixed on the connecting block 1. During product assembly, the grounding conductor 2 and the connecting block 1 are both located inside the conductive shell 3. The second deformation part 22 at the outer contour (i.e., on the outer edge) of the grounding conductor 2 is press-fitted with the conductive shell 3. Under the deformation of several second deformation parts 22, the space between the grounding conductor 2 and the conductive shell 3 is filled. The multi-point contact not only forms a certain bonding force after plastic deformation, but also increases the contact area between the grounding conductor 2 and the conductive shell 3 in the circumferential direction, avoiding poor contact between the grounding conductor 2 and the conductive shell 3, and the connection form is relatively excellent. Meanwhile, since the grounding conductor 2 is fixed on the connecting block 1, and the connecting block 1 is also interference-fitted with the conductive shell 3, the grounding conductor 2 is indirectly connected to the conductive shell 3 through the connecting block 1, thereby strengthening the connection strength between the grounding conductor 2 and the conductive shell 3. Furthermore, the grounding conductor 2 extends horizontally into a ring shape on the surface of the connecting block 1 and is connected to the connecting block 1 by means of hot pressing, etc. The surface area of ​​the grounding conductor 2 is increased, which not only improves the connection strength between the grounding conductor 2 and the connecting block 1, but also, in cooperation with the second deformation part 22, forms multiple current-conducting paths, allowing the current to reach the metal shell from the shortest current-conducting path, thereby reducing the potential difference generated by the current-conducting circuit, thereby improving the noise immunity of the electronic device, achieving good EMC performance, and also reducing the product size based on the shortest current-conducting path, while increasing the connection strength with the connecting block 1. In addition, the connecting block 1 is inserted into the inner ring of the grounding conductor 2 through the protrusion 12. The outer peripheral surface of the grounding conductor 2 is press-fitted with the first deformation part 23 on the inner edge of the grounding conductor 2. Through the deformation of several first deformation parts 23, they are filled between the grounding conductor 2 and the protrusion 12. Similarly, the multi-point contact increases the contact friction between the grounding conductor 2 and the protrusion 12, and a certain bonding force is formed after plastic deformation. This fixes the grounding conductor 2 from the inside, preventing the second deformation part 22 from causing the outer edge of the grounding conductor 2 to tilt toward the circuit board 4 or the inner edge to arch toward the circuit board 4 during the installation process of the press-fitted installation with the conductive shell 3. This prevents the grounding conductor 2 from weakening the connection strength with the connecting block 1 due to deformation, thereby enhancing the connection effect between the grounding conductor 2 and the connecting block 1. Finally, the grounding conductor 2, the connecting block 1, and the metal shell are stably connected, realizing that the grounding terminal can reduce the space occupied, ensure the connection strength, and obtain good EMC effect.

[0034] In this embodiment, the grounding conductor 2 has a ring-shaped structure. The ring-shaped structure can be a circular ring, a square, or a hollow polygon. This embodiment does not impose too many restrictions on this.

[0035] In practical use, the conductive shell 3 can be made of metal, metal composite material, graphite composite material, etc.; in addition, the structure of the conductive shell 3 can be a round tube, a square box, or a hollow irregular shape. This embodiment does not impose too many restrictions on the structure and material of the conductive shell 3.

[0036] Combination Figure 7 and Figure 8 As shown, in this embodiment, the installation process of the grounding conductor 2 and the connecting block 1 is as follows: the grounding conductor 2 is passed through the protrusion 12 and fitted onto the connecting block 1, and the connecting block 1 is placed inside the limiting and fixing fixture 6; the heat connector 5 is heated to a preset temperature range, and the heated heat connector 5 is used to press the grounding conductor 2, so that the grounding conductor 2 squeezes the connecting block 1 within a preset time until the grounding conductor 2 and the connecting block 1 no longer separate, thus completing the heat-pressing connection.

[0037] In some embodiments, the grounding conductor 2 and the connecting block 1 can be connected by means of heat pressing, hot melting, adhesive bonding or snap-fitting, etc. This embodiment does not impose too many restrictions on this.

[0038] like Figure 3 As shown, preferably, each of the first deformed portions 23 has a clearance opening 24 on the inner edge of the grounding conductor 2 on both sides.

[0039] The setting of the clearance opening 24 increases the shortest distance between the edge of the first deformable part 23 facing the ground conductor 2 and the inner edge of the ground conductor 2, which increases the torque of the first deformable part 23 under stress, thereby increasing the deformability of the first deformable part 23 and reducing the deformation difficulty of the second deformable part 22.

[0040] like Figure 4 As shown, in another preferred embodiment, the second deformable portion 22 and the first deformable portion 23 are directly opposite each other.

[0041] After the second deformation part 22 and the first deformation part 23 are deformed, by spatially arranging the second deformation part 22 and the first deformation part 23 to face each other, multiple pairs of balanced interaction forces are formed on both sides of the inner and outer rings of the grounding conductor 2, so that the grounding conductor 2 is in a state of force balance, reducing the risk of deformation of the grounding conductor 2 during assembly, and avoiding the generation of internal stress in the grounding conductor 2, thereby extending the service life of the grounding conductor 2.

[0042] like Figure 2As shown, in the specific configuration, both the first deformable part 23 and the second deformable part 22 are protruding edges and are integrally formed with the grounding conductor 2.

[0043] Before deformation, both the first deformation part 23 and the second deformation part 22 are in a horizontally extended state together with the grounding conductor 2. This state facilitates integral molding, reducing processing costs and difficulties, and avoids changes in internal resistance caused by welding and other connection methods, thus achieving good conductivity. The first deformation part 23 extends radially towards the center of the grounding conductor 2 and also extends circumferentially. The second deformation part 22 extends radially towards the outside of the grounding conductor 2 and also extends circumferentially. Both the first deformation part 23 and the second deformation part 22 expand the contactable and variable area through extension, thereby enhancing the connection strength.

[0044] like Figure 3 As shown, in a further improvement, a circumferentially encircling groove 122 is provided on the outer peripheral surface of the protrusion 12, and the groove 122 is located between the grounding conductor 2 and the end face of the protrusion 12.

[0045] In the specific configuration, in order to ensure that the current on the circuit board 4 is guided to the conductive shell 3 only by the grounding conductor 2, the connecting block 1 is made of insulating material. Plastic is the preferred material for connecting block 1 due to its greater economic efficiency. However, the grounding conductor 2 is made of a non-plastic material that can conduct electricity. The materials of the connecting block 1 and the grounding conductor 2 are different, which causes the amount of thermal expansion and contraction of the two to be different. In order to ensure that the protrusion 12 on the connecting block 1 can continuously abut against the first deformed part 23, a hollowed-out groove 122 is opened on the outer peripheral surface of the protrusion 12, and a large amount of stress is concentrated at the hollowed-out groove 122. Whenever the protrusion 12 is subjected to a large amount of deformation due to thermal expansion and contraction, it will appear in the hollowed-out groove 122 and its surroundings, thereby reducing the amount of deformation at other positions on the protrusion 12.

[0046] In some embodiments, in addition to plastic, the connecting block 1 can also be made of insulating materials such as rubber or wood. In this embodiment, the material of the connecting block 1 is not limited.

[0047] like Figure 3 As shown, another improvement is that a positioning groove 123 is provided on the outer peripheral surface of the protrusion 12. The positioning groove 123 penetrates the end face of the protrusion 12, and the pin 21 is located in the corresponding positioning groove 123 and extends to the outside of the end face of the protrusion 12.

[0048] The positioning groove 123 serves both to position the pin 21 and to protect it, preventing deformation or damage. In addition, the positioning groove 123 also positions the grounding conductor 2 through the pin 21, preventing the grounding conductor 2 from rotating circumferentially.

[0049] In the specific configuration, pin 21 is perpendicular to the grounding conductor 2, which makes the grounding conductor 2 have a better space utilization rate when it is connected to the circuit board 4. It also makes it easier to process pin 21 on the grounding conductor 2 in an integral molding process, effectively reducing processing costs and processing difficulty.

[0050] like Figure 4 As shown, as a further improvement of this embodiment, there are two pins 21. The two pins 21 are offset from each other and are located on opposite sides of the axis of the grounding conductor 2, and are centrally symmetrical to each other.

[0051] The spatial arrangement of the two pins 21 on the grounding conductor 2 allows the grounding conductor 2 to connect to the front and back ends of the circuit board 4 with the shortest distance, and also serves as a physical positioning effect for clamping the circuit board 4. This ensures that the circuit board 4 can be firmly fixed on the two pins 21 after it is electrically connected to them.

[0052] In the specific configuration, the end face of the circuit board 4 and the protrusion 12 are perpendicular to each other, that is, the circuit board 4 stands upright on one side of the end face of the protrusion 12, and the two pins 21 extend to the end faces of the front and back of the circuit board 4 respectively. The end faces of the front and back of the circuit board 4 are provided with pads 41 corresponding to the two pins 21 one by one. The pins 21 are fixed on the corresponding pads 41 and are electrically connected to the circuit board 4.

[0053] In some embodiments, the two connection points of the circuit board 4 are located on the same side end face, and correspondingly, the two pins 21 are also located on the same side of the circuit board 4. This embodiment does not impose too many restrictions on the arrangement of the pins 21.

[0054] like Figure 1 As shown, preferably, a clearance recess 121 is provided on the end face of the protrusion 12, and the clearance recess 121 is located between the two pins 21.

[0055] The recessed platform 121 provides a cavity structure on the end face of the protrusion 12 that can accommodate the components on the circuit board 4. The components on the circuit board 4 are placed inside the recessed platform 121, which avoids interference between the components on the circuit board 4 and the end face of the protrusion 12, thus reducing the distance between the circuit board 4 and the end face of the protrusion 12. This also reduces the required length of the pin 21 to connect to the circuit board 4, preventing a large potential difference due to the excessive length of the pin 21, which could lead to a decrease in noise immunity.

[0056] Combination Figure 5 and Figure 6 As shown, another improvement is that the outer wall of the connecting block 1 is provided with a circumferentially surrounding draft surface 11, which extends toward the grounded conductor 2 to the edge of the connecting block 1 and gradually increases in outer diameter.

[0057] The draft surface 11 is located on the side of the connecting block 1 adjacent to the grounded conductor 2, so that the position of the connecting block 1 and the conductive shell 3 in interference fit is adjacent to the second deformable part 22. The draft surface 11 and the second deformable part 22 jointly bear the extrusion force applied by the conductive shell 3 at that location. That is, the draft surface 11 shares part of the extrusion force on the second deformable part 22, so that the force on the second deformable part 22 is within a suitable range, and the second deformable part 22 is prevented from breaking due to excessive deformation.

[0058] In some embodiments, the fine outer diameter end of the draft surface 11 is flush with the end face of the connecting block 1 away from the grounded conductor 2, or is located in the middle of the connecting block 1, or is located on the outer peripheral surface of the connecting block 1 away from the grounded conductor 2. This embodiment does not impose too many restrictions on this.

[0059] In this embodiment, the draft surface 11 is arranged circumferentially around the outer peripheral surface of the connecting block 1. The thicker outer diameter end of the draft surface 11 is flush with the end face of the adjacent grounding conductor 2 of the connecting block 1, and the thinner outer diameter end of the draft surface 11 is located on one side of the outer peripheral surface of the connecting block 1 adjacent to the grounding conductor 2. Compared with other embodiments, this embodiment can ensure the connection strength and reduce the frictional resistance during assembly, thus having better assembly performance.

[0060] like Figures 1-10 As shown, the EMC grounding assembly includes a conductive housing 3 and a circuit board 4, and also includes an EMC grounding terminal as described above. The outer wall of the connecting block 1 and the second deformation part 22 are both interference-fitted with the inner wall of the conductive housing 3. The circuit board 4 is fixed on the pin 21 and is conductively connected to the pin 21.

[0061] In this embodiment, the grounding conductor 2 and the conductive shell 3 have a good overlap effect, which can both avoid the failure of the product's electrostatic discharge immunity test and prevent excessive radiated emissions. Electrostatic discharge (ESD) is a transient, high-energy, and wide-spectrum electromagnetic interference that can interfere with the device under test (EUT). The main pathways of interference are direct energy interference and spatial coupling interference. Direct energy interference is caused by a transient large current that damages internal circuits (such as IC chip damage) or causes circuit errors (such as latch-up). Spatial coupling interference... Figure 9 As shown, the leading edge time of ESD is very short, about 0.7-1ns, and its spectral range can reach hundreds of MHz. Therefore, even slightly longer cables, microstrip lines or striplines in circuit board 4 can form effective coupling.

[0062] When there is a poor overlap between the conductive outer casing 3 and the circuit board 4, resulting in a noticeable gap, this gap is equivalent to impedance, as referenced. Figure 10 As shown, under the action of the electrostatic discharge current on the conductive housing 3 (as indicated by the dotted line in the figure), a relatively high voltage drop ΔU will be generated; in addition, there are distributed capacitances between the conductive housing 3 and the ground plane (i.e., pad 41) of the internal circuit, and between the conductive housing 3 and the signal lines. Among them, the distributed capacitance between the conductive housing 3 and the ground plane (i.e., pad 41) in the circuit board 4 is the largest, such as... Figure 10 As shown in Cp, this distributed capacitance has the greatest impact under high-frequency electrostatic discharge interference.

[0063] With the voltage drop ΔU present, a portion of the electrostatic discharge current will inevitably flow through the distributed capacitance Cp to the ground plane (i.e., pad 41), and finally to the ground, as shown below. Figure 10 As shown by the dashed line A.

[0064] In practical applications, the ground plane (i.e., pad 41) in circuit board 4 is not an ideal ground plane. It is not complete (the impedance of a complete ground plane is 3mΩ) and has a certain impedance. This is because there must be vias on the ground plane (i.e., pad 41), and the gaps in the vias will cause impedance discontinuity.

[0065] When interference current flows through the working ground plane (i.e., pad 41), a voltage drop ΔU will occur due to the impedance. This ΔU is the culprit for circuit chaos. In addition, the voltage drop ΔU is also one of the reasons for excessive radiated emissions.

[0066] If the impedance is discontinuous, the interference signal will be difficult to discharge quickly. This will couple to the internal circuit through the distributed capacitance, resulting in damage or internal circuit chaos. Therefore, an effective way to prevent electrostatic interference from being directly coupled into the circuit board 4 is to connect the electrostatic interference signal directly to the ground through a conductor, and to keep the impedance of the electrostatic discharge point continuous.

[0067] In this embodiment, a good connection is formed between the grounded conductor 2 and the conductive shell 3, allowing static electricity to be quickly discharged onto the conductive shell 3 and conducted to the ground through the conductive shell 3. In addition, the conductive shell 3 has a better shielding effect. The electromagnetic field generated during the static discharge process will give the conductive shell 3 a shielding effect from the outside, thereby ensuring the stability of the internal circuit. That is, it effectively reduces the impact of both electromagnetic interference and static discharge on the circuit and obtains good EMC performance.

[0068] The above embodiments are preferred embodiments of the present utility model, but the embodiments of the present utility model are not limited to the above embodiments. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present utility model shall be considered equivalent substitutions and shall be included within the protection scope of the present utility model.

Claims

1. An EMC grounding terminal, comprising a grounding conductor, wherein the grounding conductor is provided with pins for conductive connection to a circuit board, characterized in that, It also includes a connecting block for interference fit on the inner wall of the conductive housing, the connecting block having a protrusion, the grounding conductor passing through the protrusion and connected to the connecting block; the inner edge of the grounding conductor has a plurality of first deformation portions, the first deformation portions being interference fit with the outer peripheral surface of the protrusion, and the outer edge of the grounding conductor having a plurality of second deformation portions for interference fit with the inner wall of the conductive housing.

2. The EMC grounding terminal according to claim 1, characterized in that, Each of the first deformed portions has a clearance opening on the inner edge of the grounding conductor on both sides.

3. The EMC grounding terminal according to claim 1, characterized in that, The second deformed part is directly opposite the first deformed part.

4. The EMC grounding terminal according to claim 1, characterized in that, Both the first deformed portion and the second deformed portion are protruding edges and are integrally formed with the grounding conductor.

5. The EMC grounding terminal according to any one of claims 1-4, characterized in that, A circumferentially encircling groove is provided on the outer peripheral surface of the protrusion, and the groove is located between the grounding conductor and the end face of the protrusion.

6. The EMC grounding terminal according to any one of claims 1-4, characterized in that, A positioning groove is provided on the outer peripheral surface of the protrusion. The positioning groove penetrates the end face of the protrusion. The pin is located in the corresponding positioning groove and extends to the outside of the end face of the protrusion.

7. The EMC grounding terminal according to any one of claims 1-4, characterized in that, The pin has two pins, which are staggered and located on opposite sides of the axis of the grounding conductor, and are centrally symmetrical to each other.

8. The EMC grounding terminal according to claim 7, characterized in that, A clearance recess is provided on the end face of the protrusion, and the clearance recess is located between the two pins.

9. The EMC grounding terminal according to any one of claims 1-4, characterized in that, The outer wall of the connecting block is provided with a circumferentially surrounding draft surface, which extends toward the grounding conductor to the edge of the connecting block and gradually increases in outer diameter.

10. An EMC grounding assembly, comprising a conductive housing and a circuit board, characterized in that, It also includes the EMC grounding terminal as described in any one of claims 1-9, wherein the outer wall of the connecting block and the second deformed portion are both interference-fitted with the inner wall of the conductive housing, and the circuit board is fixed on the pin and electrically connected to the pin.

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