Alumina ceramic substrate special-shaped hole laser processing device

Abstract

The utility model relates to ceramic precision machining technical field, concretely is a kind of alumina ceramic substrate special-shaped hole laser processing device, it includes: chassis, mobile device one and mobile device two have in chassis upper end, the side fixed connection of mobile device two has lifting device, lifting device other side fixed connection has T type platform, T type platform detachably connected have engraver and laser generator;Alumina ceramic substrate is fixedly connected on long rod before processing, it is moved by control system control device, it is moved according to the shape position of processing hole when processing, first, alumina ceramic substrate is preliminarily cut by laser head, nitrogen is added by air inlet when cutting, nitrogen pressure is increased by booster pump and enters air pipe, prevent the dust when processing from entering laser head and influence accuracy, then, finish machining is carried out by engraver, dust dispersion is reduced by water flow when processing, solve the problem of single device processing with defect.

Description

Technical Field

[0001] This utility model relates to the field of precision ceramic processing technology, specifically to a laser processing device for irregular holes in alumina ceramic substrates. Background Technology

[0002] Alumina ceramic substrates are a type of ceramic material with aluminum oxide as the main component. This material has high insulation and high strength, and is widely used in the electronics industry.

[0003] In the prior art, laser cutting equipment or machining equipment are used to cut and process alumina ceramic substrates when processing irregular holes.

[0004] However, the radius of the rounded corners of irregular holes is limited when using a single laser cutting device, and the tool breakage rate is high when cutting irregular holes with a single machining device. Therefore, it is necessary to combine a laser cutting device and a machining device for processing. To address these issues, this utility model proposes a laser processing device for irregular holes on alumina ceramic substrates. Utility Model Content

[0005] The purpose of this invention is to provide a laser processing device for irregular holes in alumina ceramic substrates, so as to solve the problem of defects in processing with a single device mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A laser processing device for irregular holes in alumina ceramic substrates, comprising: a base frame, two support rods 1 fixedly connected to the left and right sides of the upper end of the base frame, a moving device 1 slidably connected above the support rods 1, a support rod 2 fixedly connected to the side of the two moving devices 1 that are close to each other, a moving device 2 slidably connected above the support rods 2, a lifting device fixedly connected to one side of the moving device 2, a T-shaped platform fixedly connected to the other side of the lifting device, a carving machine and a laser generator detachably connected to the T-shaped platform, a boss fixedly connected to one side of the T-shaped platform, a water pipe fixedly connected to the center of the boss; a booster pump fixedly connected to one side of the laser generator, an air pipe fixedly connected below the booster pump, a laser head fixedly connected below the laser generator, the laser head including a focusing lens, and one end of the air pipe fixedly connected below the focusing lens inside the laser head.

[0007] Preferably, the moving device includes a trapezoidal plate, a motor is fixedly connected to one side of the trapezoidal plate, a plurality of fixing rods are fixedly connected to the other side of the trapezoidal plate, a small square plate is fixedly connected to the end of the fixing rod away from the trapezoidal plate, a plurality of rotating wheels are slidably connected to the upper fixing rod, and the output end of the motor is fixedly connected to one end of the upper middle fixing rod.

[0008] Preferably, the second mobile device includes two large square plates. A motor and a lifting device are fixedly connected to the sides of the two large square plates that are far apart from each other. Several fixed rods are fixedly connected between the two large square plates. Several rotating wheels are slidably connected to the upper fixed rod. The output end of the motor is fixedly connected to one end of the upper middle fixed rod.

[0009] Preferably, two guide rails are provided above the first support rod and the second support rod. The first support rod passes through the fixed rod inside the first moving device and is slidably connected to the rotating wheel. The second support rod passes through the fixed rod inside the second moving device and is slidably connected to the rotating wheel.

[0010] Preferably, the lifting device includes a square shell, a motor is fixedly connected to the upper end of the square shell, a spiral roller is rotatably connected to the center inside the square shell, the output end of the motor is fixedly connected to one end of the spiral roller, and two connecting parts are rotatably connected to the outside of the spiral roller.

[0011] Preferably, a drill bit is rotatably connected to the bottom of the engraving machine, a nozzle is fixedly connected to one end of the water pipe near the drill bit, and the other end of the water pipe can be connected to a water pump.

[0012] Preferably, an air inlet is fixedly connected to one side of the booster pump.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This invention addresses the issue of defects inherent in single-device processing by fixing an alumina ceramic substrate to a long rod before processing. A control system controls motors 1, 2, and 3 to rotate, driving moving devices 1, 2, and a lifting device. During processing, the substrate moves forward, backward, left, right, up, and down according to the shape and position of the holes. For irregularly shaped holes, a laser head first performs preliminary cutting of the alumina ceramic substrate. Nitrogen gas is introduced through the air inlet during cutting, and the pressure is increased by a booster pump before entering the gas pipe. High-pressure nitrogen is then ejected from the other end of the gas pipe to prevent dust from entering the laser head and affecting processing accuracy. The substrate is then finished using a carving machine. Water flow is used during processing to reduce dust dispersion and lower the drill bit temperature. This combination of laser cutting for roughing and carving for finishing solves the problem of defects inherent in single-device processing. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the mobile device of this utility model;

[0017] Figure 3 This is a cross-sectional schematic diagram of the mobile device of this utility model;

[0018] Figure 4This is a schematic diagram of the lifting device of this utility model;

[0019] Figure 5 This is a schematic diagram of the laser composite processing device of this utility model.

[0020] In the diagram: 1. Base frame; 2. Support rod one; 3. Moving device one; 4. Support rod two; 5. Moving device two; 6. Lifting device; 7. Trapezoidal plate; 8. Small square plate; 9. Motor one; 10. Fixing rod; 11. Rotary wheel; 12. Large square plate; 13. Motor three; 14. Motor two; 15. Spiral roller; 16. Connector; 17. Engraving machine; 18. Water pipe; 19. Boss; 20. Drill bit; 21. Booster pump; 22. Air pipe; 23. Laser head; 24. Focusing lens; 25. Laser generator; 26. T-shaped stage; 27. Square shell. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this utility model clear and complete, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of this utility model, and are merely used to explain the embodiments of this utility model. They are not intended to limit the embodiments of this utility model. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0022] Example 1, please refer to Figures 1 to 4This utility model provides a technical solution: a laser processing device for irregular holes in alumina ceramic substrates, comprising: a base frame 1, with several long rods fixedly connected to the top of the base frame 1. Before processing, the alumina ceramic substrate is fixed on the long rods to prevent slippage during processing. Two support rods 2 are fixedly connected to the left and right sides of the upper end of the base frame 1. A moving device 3 is slidably connected above the support rods 2. The moving device 3 includes a trapezoidal plate 7. A motor 9 is fixedly connected to one side of the trapezoidal plate 7, and several fixing rods 10 are fixedly connected to the other side of the trapezoidal plate 7. A small square plate 8 is fixedly connected to the end of the fixing rod 10 away from the trapezoidal plate 7. Several rotating wheels 11 are slidably connected to the upper fixing rod 10. The output end of the motor 9 is fixedly connected to one end of the upper middle fixing rod 10. Support rods 4 are fixedly connected to the sides of the two moving devices 3 that are close to each other. A moving device 5 is slidably connected above the support rods 4. The second moving device 5 includes two large square plates 12. A motor 2 14 and a lifting device 6 are fixedly connected to the two large square plates 12 on their opposite sides. Several fixed rods 10 are fixedly connected between the two large square plates 12. Several rotating wheels 11 are slidably connected to the upper fixed rods 10. The output end of the motor 2 14 is fixedly connected to one end of the upper middle fixed rod 10. The lifting device 6 is fixedly connected to one side of the moving device 2 5. Two guide rails are provided above the support rod 1 2 and the support rod 2 4. The support rod 1 2 passes through the fixed rods 10 inside the moving device 1 3 and is slidably connected to the rotating wheels 11. The support rod 2 4 passes through the fixed rods 10 inside the moving device 2 5 and is slidably connected to the rotating wheels 11. The two motors 1 9 drive the two moving devices 1 3 to slide above the support rods 1 2, and the motor 2 14 drives the moving device 2 5 to move above the support rods 2 4, so that the processing device can move back and forth and left and right.

[0023] A T-shaped platform 26 is fixedly connected to the other side of the lifting device 6. The lifting device 6 includes a square shell 27. A motor 13 is fixedly connected to the upper end of the square shell 27. A spiral roller 15 is rotatably connected to the center inside the square shell 27. The output end of the motor 13 is fixedly connected to one end of the spiral roller 15. Two connecting pieces 16 are rotatably connected to the outside of the spiral roller 15. The spiral roller 15 is rotated by the forward or reverse rotation of the motor 13, which in turn moves the connecting pieces 16 up and down.

[0024] Specifically, before processing, the alumina ceramic substrate is fixedly connected to the long rod. The control system controls motor 19, motor 214 and motor 313 to rotate and drive moving device 13, moving device 25 and lifting device 6 to move. During processing, the device moves forward, backward, left, right and up and down according to the shape and position of the processing hole.

[0025] Example 2: Based on Example 1, as follows Figure 4 , Figure 5The T-shaped stage 26 shown is detachably connected to an engraving machine 17 and a laser generator 25. A boss 19 is fixedly connected to one side of the T-shaped stage 26, and a water pipe 18 is fixedly connected to the center of the boss 19. A booster pump 21 is fixedly connected to one side of the laser generator 25, and an air inlet is fixedly connected to one side of the booster pump 21. An air pipe 22 is fixedly connected below the booster pump 21. A laser head 23 is fixedly connected below the laser generator 25. The laser head 23 includes a focusing lens 24. The laser emitted by the laser generator 25 is focused onto the laser head 23 by the focusing lens 24. The outlet is located below the focusing lens 24 inside the laser head 23, with one end of the air pipe 22 fixedly connected. Nitrogen gas is added through the air inlet and the pressure of the nitrogen gas is increased by the booster pump 21 before entering the air pipe 22. High-pressure nitrogen gas is sprayed out from the other end of the air pipe 22 to prevent dust from entering the laser head 23 during processing and affecting the processing accuracy. A drill bit 20 is rotatably connected to the bottom of the engraving machine 17. A nozzle is fixedly connected to one end of the water pipe 18 near the drill bit 20. The other end of the water pipe 18 can be connected to a water pump. During processing, the water flow reduces dust dispersion and lowers the temperature of the drill bit 20.

[0026] Specifically, when processing irregular holes, the alumina ceramic substrate is first initially cut by the laser head 23. Nitrogen gas is added through the air inlet during the cutting process. After the nitrogen pressure is increased by the booster pump 21, it enters the air pipe 22. High-pressure nitrogen gas is sprayed out from the other end of the air pipe 22 to prevent dust from entering the laser head 23 during processing and affecting the processing accuracy. Then, the engraving machine 17 is used for fine processing. During processing, water flow is used to reduce dust dispersion and lower the temperature of the drill bit 20.

[0027] Before processing, the alumina ceramic substrate is fixedly connected to a long rod. The control system controls motor 9, motor 14, and motor 13 to rotate, driving moving device 3, moving device 5, and lifting device 6 to move. During processing, the device moves forward, backward, left, right, up, and down according to the shape and position of the hole. When processing irregular holes, the alumina ceramic substrate is first initially cut by the laser head 23. Nitrogen gas is added through the air inlet during cutting. The nitrogen pressure is increased by the booster pump 21 and then enters the air pipe 22. High-pressure nitrogen gas is sprayed out from the other end of the air pipe 22 to prevent dust from entering the laser head 23 during processing and affecting the processing accuracy. After that, the engraving machine 17 performs fine processing. During processing, water flow is used to reduce dust dispersion and lower the temperature of the drill bit 20.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An apparatus for laser processing of a shaped hole in an aluminum oxide ceramic substrate, comprising: The base frame (1) is characterized in that: two support rods (2) are fixedly connected to the left and right sides of the upper end of the base frame (1), a moving device (3) is slidably connected above the support rods (2), a support rod (4) is fixedly connected to the side of the two moving devices (3) that are close to each other, a moving device (5) is slidably connected above the support rods (4), a lifting device (6) is fixedly connected to one side of the moving device (5), a T-shaped platform (26) is fixedly connected to the other side of the lifting device (6), a carving machine (17) and a laser generator (25) are detachably connected to the T-shaped platform (26), a boss (19) is fixedly connected to one side of the T-shaped platform (26), and a water pipe (18) is fixedly connected to the center of the boss (19); A booster pump (21) is fixedly connected to one side of the laser generator (25), and an air pipe (22) is fixedly connected below the booster pump (21). A laser head (23) is fixedly connected below the laser generator (25), and a focusing lens (24) is included inside the laser head (23). One end of the air pipe (22) is fixedly connected below the focusing lens (24) inside the laser head (23).

2. The apparatus for laser processing of a shaped hole in an aluminum oxide ceramic substrate according to claim 1, wherein: The mobile device (3) includes a trapezoidal plate (7), a motor (9) is fixedly connected to one side of the trapezoidal plate (7), and several fixing rods (10) are fixedly connected to the other side of the trapezoidal plate (7). A small square plate (8) is fixedly connected to one end of the fixing rod (10) away from the trapezoidal plate (7). Several rotating wheels (11) are slidably connected to the upper fixing rod (10). The output end of the motor (9) is fixedly connected to one end of the upper middle fixing rod (10).

3. The laser processing apparatus for irregular holes in alumina ceramic substrates according to claim 1, characterized in that: The second mobile device (5) includes two large square plates (12). The two large square plates (12) are respectively fixedly connected to a motor (14) and a lifting device (6) on the side away from each other. Several fixed rods (10) are fixedly connected between the two large square plates (12). Several rotating wheels (11) are slidably connected to the upper fixed rod (10). The output end of the motor (14) is fixedly connected to one end of the upper middle fixed rod (10).

4. The laser processing apparatus for irregular holes in alumina ceramic substrates according to claim 1, characterized in that: Two guide rails are provided above the first support rod (2) and the second support rod (4). The first support rod (2) passes through the fixed rod (10) inside the first moving device (3) and is slidably connected to the rotating wheel (11). The second support rod (4) passes through the fixed rod (10) inside the second moving device (5) and is slidably connected to the rotating wheel (11).

5. The laser processing apparatus for irregular holes in alumina ceramic substrates according to claim 1, characterized in that: The lifting device (6) includes a square shell (27), a motor (13) is fixedly connected to the upper end of the square shell (27), a spiral roller (15) is rotatably connected to the center inside the square shell (27), the output end of the motor (13) is fixedly connected to one end of the spiral roller (15), and two connecting pieces (16) are rotatably connected to the outside of the spiral roller (15).

6. The laser processing apparatus for irregular holes in alumina ceramic substrates according to claim 1, characterized in that: The bottom of the engraving machine (17) is rotatably connected to a drill bit (20), and a nozzle is fixedly connected to one end of the water pipe (18) near the drill bit (20). The other end of the water pipe (18) can be connected to a water pump.

7. The laser processing apparatus for irregular holes in alumina ceramic substrates according to claim 1, characterized in that: An air inlet is fixedly connected to one side of the booster pump (21).

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