Wafer front opening unified pod load port detection device
Patent Information
- Application Number
- CN202521935321.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-09
- Publication Date
- 2026-08-18
- Estimated Expiration
- 2035-09-09
AI Technical Summary
[0005]本申请实施例的目的在于提供一种晶圆传送盒装载端口检测装置,以解决现有技术中在对装载端口进行定位校准时存在的操作繁琐、操作时间长的技术问题
本申请将水平度测量组件、偏移度测量组件和控制器集成设置在承载座上,通过承载座与装载端口连接,以提高该晶圆传送盒装载端口检测装置的集成度,便于操作人员进行携带;
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Figure CN224653938U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of semiconductor manufacturing technology, and more specifically, relates to a wafer transfer box loading port detection device. Background Technology
[0002] In automated semiconductor manufacturing production lines, wafer transfer systems typically employ overhead cranes (OHTs) to automate the handling of FOUPs (Front Opening Unified Pods). To ensure precise automatic pick-and-place operations, the load port (LP) must be precisely aligned with the centerline of the transfer track and meet multi-dimensional positioning accuracy requirements in terms of levelness, height, and spacing. This ensures a precise connection between the overhead crane and the load port, facilitating the handling of FOUPs.
[0003] Currently, the positioning operation of LP relies on the combined use of various manual measuring tools, such as using a leveling measuring component to measure the horizontal state of LP; using a laser to simulate the center line of LP and observe its relative position with the center line of the conveyor track; using a steel ruler or tape measure to measure parameters such as the height of LP and the distance between LP Cover and the center line; and using an LP fixture to simulate the placement state of FOUP to assist the measurement and positioning of other tools.
[0004] The problems arising from adopting the above solution are: when calibrating the LP, multiple tools are required, making the operation cumbersome; during the calibration process, repeated operations are necessary, and the positioning parameters of the LP (levelness, height, centerline alignment, etc.) affect each other, requiring repeated verification of other parameters after adjusting one parameter, which prolongs the operation time; moreover, when different personnel operate, tool switching, reading errors, or inconsistent operations can easily introduce cumulative errors, ultimately affecting the positioning accuracy of the wafer transfer box's automated operation, and even causing pick-and-place failures or equipment errors, thus reducing production efficiency. Utility Model Content
[0005] The purpose of this application is to provide a wafer transfer box loading port detection device to solve the technical problems of cumbersome operation and long operation time in the prior art when positioning and calibrating the loading port.
[0006] To achieve the above objectives, the technical solution adopted in this application is: to provide a wafer transfer box loading port detection device, comprising: The carrier is provided with a connection part that is positioned and connected to the loading port, the loading port being used to pick up and place the wafer transfer box; A levelness measuring component is connected to the support base and located at the center of the support base, for detecting the levelness of the support base; An offset measuring component, connected to the carrier, is used to detect the offset of the loading port relative to the conveyor track; A controller is connected to the support base. The controller has a display screen. The levelness measuring component and the offset measuring component are both connected to the controller. The controller is used to control the opening and closing of the levelness measuring component and the offset measuring component, as well as to receive the detection data fed back by each measuring component and display the detection data on the display screen.
[0007] Optionally, the support base is provided with a first marking line and a second marking line that pass through the center of the support base and are perpendicular to each other.
[0008] Optionally, the offset measuring component is disposed on the first marking line.
[0009] Optionally, the number of offset measuring components is two, and the two offset measuring components are arranged symmetrically about the center of the support.
[0010] Optionally, the wafer transfer box loading port detection device further includes: a first distance measuring instrument connected to the carrier and connected to the controller, wherein the first distance measuring instrument is used to detect the distance between the center of the carrier and the process equipment.
[0011] Optionally, the support base is provided with a through hole penetrating the support base, and the axis of the through hole is parallel to the center line passing through the center of the support base; the first rangefinder is installed in the through hole, and the measurement signal of the first rangefinder is transmitted through the through hole.
[0012] Optionally, the wafer transfer box loading port detection device further includes: a second rangefinder, connected to the carrier and connected to the controller, for measuring the distance between the carrier and the ground.
[0013] Optionally, the wafer transfer box loading port detection device further includes: a telescopic component connected to the controller, the second rangefinder connected to the telescopic component, and the telescopic component being used to drive the second rangefinder to move to the outside of the carrier.
[0014] Optionally, the support seat is provided with a through hole penetrating the support seat, the axis of the through hole is parallel to the center line passing through the center of the support seat, and the telescopic member is placed in the through hole and moves along the axis of the through hole.
[0015] Optionally, the connecting portion includes a first positioning portion, a second positioning portion, and a third positioning portion arranged in a triangle, wherein the first positioning portion, the second positioning portion, and the third positioning portion are all grooves.
[0016] The beneficial effects of this application are as follows: This application integrates the levelness measurement component, offset measurement component, and controller on the carrier, and connects to the loading port through the carrier to improve the integration of the wafer transfer box loading port detection device and facilitate operator carrying. The controller in this application is equipped with a display screen. The controller allows each measuring component to be started, stopped, and tested in the required sequence. For example, after adjusting the levelness of the loading port through the levelness measuring component, the offset measuring component can then be used for offset detection and adjustment. Furthermore, when the levelness measuring component detects the levelness of the carrier, the detection data can be transmitted to the controller and displayed on the screen, facilitating the operator's adjustment of the loading port's levelness based on the displayed data. This application, through data display and automatic sequential detection of levelness and offset, not only reduces the number of steps required for positioning and calibrating the loading port but also allows the operator to quickly read the aforementioned detection data, thereby reducing the time required for loading port calibration and improving the calibration efficiency. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the structure of a wafer transfer box loading port detection device provided in an embodiment of this application; Figure 2 A schematic diagram of the wafer transfer box loading port detection device provided in one embodiment of this application from another perspective; Figure 3 A control logic block diagram of the wafer transfer box loading port detection device provided in the embodiments of this application; Figure 4 A schematic diagram of the detection beam emitted by the offset measurement component provided in the embodiments of this application; Figure 5 A schematic diagram for detecting the beam on the transmission track; Figure 6 A schematic diagram of the structure of a wafer transfer box loading port detection device provided in another embodiment of this application; Figure 7 This is a schematic diagram of the wafer transfer box loading port detection device provided in another embodiment of this application from another perspective.
[0019] The following are the labeling elements in the figure: 10. Support base; 11. First marking line; 12. Second marking line; 13. Rounded corner; 14. Through hole; 15. First positioning groove; 16. Second positioning groove; 17. Third positioning groove; 20. Controller; 21. Display screen; 22. Control unit; 23. Start / stop button; 24. Storage unit; 30. Levelness measuring component; 40. Offset measuring component; 41. Detection beam; 411. First sub-beam; 412. Second sub-beam; 50. First rangefinder; 60. Second rangefinder; 70. Telescopic component; 71. Drive unit; 72. Sliding unit. Detailed Implementation
[0020] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.
[0021] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.
[0022] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0024] In automated semiconductor manufacturing production lines, overhead cranes (OHTs) transport front-opening wafer cassettes (FOUPs) to loading ports (LPs), where precise alignment is achieved by positioning structures. This allows robotic arms and other mechanisms in the process equipment to accurately pick up and place wafers from the loading port. In this specification, "process equipment" refers to the core equipment on a semiconductor production line that performs specific processes or inspection tasks, such as lithography equipment, etching equipment, thin film deposition equipment, or inspection equipment. The specific structures of the overhead cranes (OHTs), loading ports (LPs), and process equipment are not detailed here; this specification only describes the inspection device that achieves the positioning of the loading port (LP).
[0025] Please refer to the following: Figures 1 to 7 The wafer transfer box loading port detection device provided in the embodiments of this application will now be described. A wafer transfer box loading port detection device includes a carrier 10, a levelness measuring component 30, an offset measuring component 40, and a controller 20.
[0026] Please see Figure 1 and Figure 6 The support base 10 has a plate-like structure and a connecting part on the support base 10 that is positioned and connected to the loading port (not shown). A levelness measuring component 30 is connected to the support base 10 and located at the center of the support base 10, with the center of the levelness measuring component 30 coinciding with the center of the support base 10. The levelness measuring component 30 is used to detect the levelness of the support base 10, i.e., the levelness of the loading port. An offset measuring component 40 is connected to the support base 10 and is used to detect the offset of the loading port relative to the conveyor track. A controller 20 is connected to the support base 10 and has a display screen 21. Both the levelness measuring component 30 and the offset measuring component 40 are connected to the controller 20. The controller 20 is used to control the opening and closing of the levelness measuring component 30 and the offset measuring component 40, and to receive the detection data fed back by each measuring component, and to display the detection data on the display screen 21.
[0027] The wafer transfer box loading port detection device provided in this application integrates the levelness measurement component 30, the offset measurement component 40, and the controller 20 together through the carrier 10, making it easy for operators to carry. In addition, by connecting the carrier 10 to the loading port, the levelness measurement component 30 and the offset measurement component 40 can be positioned for easy detection and use, thereby improving the positioning and adjustment efficiency of the loading port.
[0028] The support 10 has a first center line extending along its width and a second center line extending along its length. The first and second center lines are perpendicular to each other, and the point where the first and second center lines intersect is the center point of the support 10. On the loading port, a center line extending along the width of the loading port is called a third center line, and a center line extending along the length of the loading port is called a fourth center line. When the support 10 is positioned and connected to the loading port, the projection of the first center line onto the loading port coincides with the third center line, and the projection of the second center line onto the loading port coincides with the fourth center line, ensuring that the levelness of the support 10 is consistent with the levelness of the loading port. The operator can simultaneously detect and adjust the levelness of the loading port by detecting the levelness of the support 10.
[0029] See Figure 1 and Figure 3 As shown, the controller 20 is connected to the carrier 10, located on the side of the carrier 10 away from the loading port. The controller 20 also includes a control unit 22 and a start / stop button 23. The operator can press the start / stop button 23 to turn the control unit 22 and the display screen 21 on or off. After the display screen 21 is turned on, the operator can also select the items to be measured through the operation options displayed on the display screen 21. These operation options are set by the software program built into the control unit 22, such as selection boxes or buttons, so that the wafer transfer box loading port detection device can automatically measure, such as measuring the levelness of the loading port, measuring the distance of the loading port from the process equipment, or measuring the height of the loading port from the ground.
[0030] Specifically, after the carrier 10 is connected to the loading port, the operator selects the levelness measurement operation option, causing the controller 20 to generate a signal to control the levelness measurement component 30. The levelness measurement component 30 is then activated and begins to detect the levelness of the carrier 10. In one embodiment, the levelness measurement component 30 can be a bidirectional digital display level, which can simultaneously detect the levelness of the carrier 10 along the X and Y axes in the horizontal plane and feed the detection data back to the controller, so that the detection data is displayed on the display screen 21. This allows the operator to adjust the levelness of the loading port based on the detection data, thereby ensuring that the levelness of the loading port meets the accuracy requirements.
[0031] After the operator completes the leveling adjustment of the loading port and ensures that the leveling of the loading port meets the requirements, the offset measurement operation option can be selected on the display screen 21 to make the controller 20 generate a signal to control the offset measurement component 40 to operate. The offset measurement component 40 is activated to calibrate the verticality of the loading port, which facilitates the subsequent detection of the offset between the loading port and the surface where the overhead crane's conveyor track is located.
[0032] In one embodiment,Figure 1 As shown, the support base 10 is rectangular, and each corner of the rectangle is rounded 13. The rounded corners 13 at each corner of the support base 10 are provided to prevent the support base 10 from scratching the operator.
[0033] In one embodiment, such as Figure 1 As shown, the support 10 is provided with a first marking line 11 that is in line with the first center line and a second marking line 12 that is in line with the second center line. That is, the first marking line 11 and the second marking line 12 are perpendicular to each other and pass through the center of the support 10. The operator can adjust the positioning of the support 10 and the loading port by observing the positional relationship between the first marking line 11 and the second marking line 12 and the loading port.
[0034] In one embodiment, such as Figure 1 As shown, the offset measuring component 40 is positioned on the first centerline, which can be understood as the offset measuring component 40 being mounted on the first marking line 11. After the horizontal adjustment of the loading port is completed, the verticality is calibrated using the offset measuring component 40. See Figure 2 As shown, the offset measurement component 40 is used to emit a detection beam 41 onto the conveyor track. The operator can observe the relationship between the detection beam 41 and the plane on which the conveyor track is located, so as to perform vertical calibration of the loading port.
[0035] like Figure 4 As shown, the offset measurement component 40 can be a cross laser, that is, the detection beam 41 emitted by it is a cross-shaped laser, which includes a first sub-beam 411 and a second sub-beam 412, and the first sub-beam 411 and the second sub-beam 412 are perpendicular to each other. When the operator observes that the plane formed by the first sub-beam 411 and the second sub-beam 41 coincides with the plane where the conveyor track is located, it is determined that the detection beam 41 is perpendicular to the plane where the conveyor track is located.
[0036] The operator can also quickly measure the offset distance between the centerline of the loading port and the centerline of the conveyor track using the detection beam 41. During measurement, the projection of the first sub-beam 411 or the second sub-beam 412 onto the carrier 10 is aligned with the first marker line 11. For ease of explanation, in this embodiment, the projection of the detection beam 41 onto the carrier 10 is illustrated by the example of the first sub-beam 411 aligning with the first marker line 11. Please refer to... Figure 5When the detection beam 41 illuminates the plane where the conveyor track is located, the first sub-beam 411 forms a detection line within the plane. This detection line is the projection of the first center line onto the plane of the conveyor track. Based on the mapping relationship between the first and third center lines, the detection line is also the position of the third center line projected onto the plane of the conveyor track. By measuring the distance between the detection line and the center line of the conveyor track using a rangefinder, the offset of the third center line at the loading port relative to the center line of the conveyor track can be obtained. This allows operators to quickly obtain the offset of the center line of the loading port relative to the center line of the conveyor track, facilitating subsequent adjustments to the loading port.
[0037] For details, please refer to Figure 1 , Figure 2 and Figure 4 There are two offset measuring components 40, which are spaced apart on the first marking line 11. Furthermore, the two offset measuring components 40 are symmetrically arranged about the center of the carrier 10, and the distance between the two offset measuring components 40 and the center position of the carrier 10 is equal. When activated, the two offset measuring components 40 form two sets of detection lines on the conveyor track. These two sets of detection lines can more intuitively display the offset of the center line of the loading port relative to the center line of the conveyor track, facilitating subsequent adjustments to the loading port.
[0038] In one embodiment, to measure the distance between the center of the support 10 and the process equipment (not shown), please refer to... Figure 1 The wafer transfer box loading port detection device also includes a first rangefinder 50, which is used to detect the distance between the center of the carrier 10 and the process equipment.
[0039] Specifically, the measurement reference plane of the first rangefinder 50 is coplanar with the central section of the support where the first marking line 11 is located; the measurement reference plane of the first rangefinder 50 can be understood as the location where the first rangefinder emits the detection line. After completing the calibration of the horizontal and verticality, the operator selects the distance measurement operation option between the support 10 and the process equipment on the display screen 21, causing the controller 20 to generate a signal to control the operation of the first rangefinder 50. The first rangefinder 50 is activated and emits a first distance measurement signal, which is received after being reflected by the process equipment. The first rangefinder 50 calculates the distance value between the center position of the support 10 and the process equipment based on the time difference between the emitted and received signals. The first rangefinder 50 transmits this distance value to the controller 20, and the controller 20 controls the display screen 21 to display the distance value.
[0040] In one embodiment, to measure the distance between the support 10 and the ground, please refer to... Figure 1 and Figure 2The wafer transfer box loading port detection device also includes a second distance measuring instrument 60. Specifically, the second distance measuring instrument 60 is connected to the carrier 10 to measure the distance between the carrier 10 and the ground. After completing the horizontal and vertical calibration, or after completing the distance measurement between the loading port and the process equipment, the operator selects the distance measurement operation option for measuring the distance between the carrier 10 and the ground on the display screen 21, which causes the controller 20 to generate a signal to start the second distance measuring instrument 60. The second distance measuring instrument 60 is activated and transmits a second distance measurement signal transmitted vertically, which is received after being reflected by the ground. The second distance measuring instrument 60 calculates the distance value between the carrier 10 and the ground based on the time difference between the transmitted signal and the received signal, and this distance value can be displayed on the display screen 21.
[0041] In one embodiment of this application, both the first rangefinder 50 and the second rangefinder 60 are laser rangefinders, and both the first ranging signal and the second ranging signal are laser signals.
[0042] In another embodiment of this application, both the first rangefinder 50 and the second rangefinder 60 are infrared rangefinders, and both the first ranging signal and the second ranging signal are infrared light signals.
[0043] In another embodiment of this application, the first rangefinder 50 and the second rangefinder 60 are both ultrasonic rangefinders, and the first ranging signal and the second ranging signal are both ultrasonic signals.
[0044] In one embodiment, please refer to Figure 6 and Figure 7 The carrier 10 has a through hole 14, the axis of which is parallel to the center line passing through the center of the carrier 10, such as when the axis of the through hole 14 is parallel to the second center line, and the through hole 10 penetrates the carrier 10. A first rangefinder 50 and a second rangefinder 60 are installed in the through hole 14, and the measurement signal of the first rangefinder 50 is transmitted through the through hole 14. In this embodiment, guiding the transmission of the measurement signal through the through hole 14 makes the measurement value of the first rangefinder 50 more accurate. Furthermore, it avoids damage to the first rangefinder 50 and the second rangefinder 60 when moving the wafer transfer box to load the port detection device.
[0045] To enable the second rangefinder 60 to move to the outside of the through-hole 14 to measure the distance between the loading port and the ground, the wafer transfer box loading port detection device also includes a telescopic member 70 for driving the second rangefinder 60 to move to the outside of the support 10. Specifically, the telescopic member 70 is installed inside the through-hole 14 and includes a driving part 71 and a sliding part 72 connected to the driving part 71. The second rangefinder 60 is connected to the sliding part 72, which can reciprocate under the drive of the driving part 71, thereby realizing the movement of the second rangefinder 60.
[0046] In this embodiment, the controller 20 generates a signal to control the telescopic member 70. The telescopic member 70 is activated, causing the drive unit 71 to extend the sliding part 72, thereby moving the second rangefinder 60 to the outside of the support base 10. Subsequently, the controller 20 controls the second rangefinder 60 to measure the distance between the loading port and the ground, and displays this distance value on the display screen 21. After completing the distance measurement between the loading port and the ground, the controller 20 controls the telescopic member 70 to retract, causing the drive unit 71 to retract the sliding part 72, and moving the second rangefinder 60 to the inside of the support base 10.
[0047] In one embodiment of this application, the telescopic member 70 is an electric telescopic rod or a cylinder.
[0048] In this application, please refer to Figure 3 The controller 20 is also equipped with a storage unit 24, which is used to store detection data such as the levelness data of the loading port, the distance between the loading port and the process equipment, and the height of the loading port from the ground.
[0049] In one embodiment, the connecting portion on the support 10 includes a threaded hole (not shown) provided on the support 10. The threaded hole penetrates the support 10 along the thickness direction of the support 10. The support 10 is detachably connected to the loading port by bolts (not shown).
[0050] In another embodiment, the connecting portion on the support 10 includes a first magnetic member (not shown) disposed on the support 10, and a second magnetic member is disposed on the loading port. The position of the second magnetic member corresponds to the position of the first magnetic member. The support 10 is fixed to the loading port by the magnetic attraction between the first magnetic member and the second magnetic member.
[0051] In another embodiment, the connecting portion may include a first positioning portion, a second positioning portion, and a third positioning portion arranged in a triangle, all of which are grooves. Specifically, the first positioning portion, the second positioning portion, and the third positioning portion are all disposed on the side of the support 10 facing the loading port. The first positioning portion is disposed on the first marking line 11, and the center line of the first positioning portion coincides with the first marking line 11. The second positioning portion and the third positioning portion are located on both sides of the second marking line 12. The second positioning portion and the third positioning portion may be symmetrically arranged about the second marking line 12.
[0052] like Figure 1 , Figure 4 and Figure 6As shown, the first positioning part, the second positioning part, and the third positioning part are all grooves, that is, the first positioning part, the second positioning part, and the third positioning part are respectively the first positioning groove 15, the second positioning groove 16, and the third positioning groove 17. Correspondingly, the loading port is provided with a first positioning block, a second positioning block, and a third positioning block, the positions of the first positioning block, the second positioning block, and the third positioning block correspond one-to-one with the positions of the first positioning groove 15, the second positioning groove 16, and the third positioning groove 17.
[0053] The connecting parts in the above embodiments can be implemented in combination or individually, and no limitation is made here.
[0054] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A wafer transfer box loading port detection device, characterized in that, include: The carrier is provided with a connection part that is positioned and connected to the loading port, the loading port being used to pick up and place the wafer transfer box; A levelness measuring component is connected to the support base and located at the center of the support base, for detecting the levelness of the support base; An offset measuring component, connected to the carrier, is used to detect the offset of the loading port relative to the conveyor track; A controller is connected to the support base. The controller has a display screen. The levelness measuring component and the offset measuring component are both connected to the controller. The controller is used to control the opening and closing of the levelness measuring component and the offset measuring component, as well as to receive the detection data fed back by each measuring component and display the detection data on the display screen.
2. The wafer transfer box loading port detection device as described in claim 1, characterized in that, The support base is provided with a first marking line and a second marking line that pass through the center of the support base and are perpendicular to each other.
3. The wafer transfer box loading port detection device as described in claim 2, characterized in that, The offset measuring component is positioned on the first marking line.
4. The wafer transfer box loading port detection device as described in claim 3, characterized in that, The number of offset measuring components is two, and the two offset measuring components are symmetrically arranged about the center of the support.
5. The wafer transfer box loading port detection device as described in claim 1, characterized in that, Also includes: A first distance measuring instrument is connected to the support base and to the controller. The first distance measuring instrument is used to detect the distance between the center of the support base and the process equipment.
6. The wafer transfer box loading port detection device as described in claim 5, characterized in that, The support base is provided with a through hole penetrating the support base, and the axis of the through hole is parallel to the center line passing through the center of the support base; The first rangefinder is installed in the through hole, and the measurement signal of the first rangefinder is transmitted through the through hole.
7. The wafer transfer box loading port detection device as described in claim 1, characterized in that, Also includes: The second distance measuring instrument is connected to the support base and the controller, and is used to measure the distance between the support base and the ground.
8. The wafer transfer box loading port detection device as described in claim 7, characterized in that, Also includes: A telescopic component is connected to the controller, and the second rangefinder is connected to the telescopic component. The telescopic component is used to drive the second rangefinder to move to the outside of the support base.
9. The wafer transfer box loading port detection device as described in claim 8, characterized in that, The support base is provided with a through hole, the axis of the through hole is parallel to the center line passing through the center of the support base, and the telescopic member is placed in the through hole and moves along the axis of the through hole.
10. The wafer transfer box loading port detection device as described in claim 1, characterized in that, The connecting portion includes a first positioning portion, a second positioning portion, and a third positioning portion arranged in a triangle, and the first positioning portion, the second positioning portion, and the third positioning portion are all grooves.