Flip chip bonding flip alignment assembly

Abstract

The utility model discloses a kind of flip chip bonding is used to overturn alignment subassembly, it is related to chip processing technical field, including adsorption type positioning piece, overturn driving part and adjusting part, chip is adsorbed type fixed, overturn driving part drives adsorption type positioning piece and chip overturn, adjusting part is set between adsorption type positioning piece and overturn driving part, chip position is adjusted.The utility model is fixed to chip using adsorption type fixing piece, then cooperate with overturn driving part to drive adsorption type fixing piece overturn and realize the overturn driving of chip, while cooperating with adjusting part to carry out the connection between overturn driving part and adsorption type fixing piece, adjusting effect of adjusting part can be used to fine adjustment to the axial position of adsorption type fixing piece and the chip fixed thereon, so that chip can be aligned with the bonding position below after overturning, to improve the work efficiency and quality of reverse chip bonding operation.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and in particular to a flip alignment assembly for flip chip bonding. Background Technology

[0002] Currently, in the chip packaging process, the chip needs to be flipped to perform various processing techniques. However, since most chips are small and fragile, it is difficult and inefficient to move them manually. Therefore, flipping mechanisms are generally used to automatically flip the chips.

[0003] Most current chip flipping mechanisms use an adsorption-type fixing method to position the chip, and then a driving mechanism performs the chip flipping operation. However, during the chip bonding process, since the chip is fixed by adsorption, its position cannot be adjusted after flipping, making it difficult to ensure accurate alignment with the bonding position below. To address this, we propose a flip alignment component for flip chip bonding. Utility Model Content

[0004] The purpose of this invention is to provide a flip alignment assembly for flip chip bonding to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a flip alignment assembly for flip chip bonding, comprising:

[0006] Adsorption-type positioning component, which adsorbs and fixes the chip;

[0007] A flipping drive unit drives the adsorption positioning component and chip to flip.

[0008] An adjusting component is disposed between the adsorption positioning component and the flipping drive component to adjust the chip position.

[0009] Preferably, the adjusting member includes:

[0010] A flip-up base, the top of which is movably provided with a connecting plate for connecting an adsorption-type positioning component;

[0011] The translation drive is provided with a linear slide groove at the top of the flip seat for mounting the translation drive, so that the axial position of the adjustment connecting plate of the translation drive is at the top of the flip seat.

[0012] Preferably, the translation drive includes:

[0013] A movable seat that moves axially along a linear slide groove, with its top end fixed to the bottom end of a connecting plate;

[0014] A drive screw is rotatably connected to a linear slide groove, and the drive screw is threadedly inserted into the bottom of the movable seat.

[0015] A servo motor is fixedly connected to the end face of the flip base, and the rotating end of the servo motor is connected to one end of the drive screw.

[0016] Preferably, stepped grooves are provided on the top of the inner sides of the straight slide groove, and auxiliary support members are provided on the top of both sides of the movable seat for auxiliary support of the movable seat and the connecting plate on the flip seat.

[0017] Preferably, the auxiliary support includes:

[0018] Support shafts, wherein multiple support shafts are distributed in parallel and spaced apart and are fixedly connected to the side wall of the movable seat, and the end of the support shaft away from the movable seat extends into the stepped groove;

[0019] The rollers are multiple in number and are rotatably inserted into the end of the support shaft, and the outer peripheral wall of the rollers is movably fitted with the bottom of the stepped groove.

[0020] Preferably, the adsorption positioning component includes an adsorption plate, which is fixedly connected to the top of the connecting plate. The top of the connecting plate has two sets of adsorption holes symmetrically arranged, and each set of adsorption holes consists of multiple holes spaced apart.

[0021] Preferably, the flipping drive includes:

[0022] Mounting bracket, the inner side of which is rotatably connected to a flip shaft, one end of which is fixedly connected to the end of a flip seat;

[0023] At least two fixing plates are fixedly connected to the top of the inner side of the mounting frame in parallel and spaced apart. The outer wall of the flipping shaft is rotatably inserted into the top of the fixing plate. A driving component is fixedly installed between two adjacent fixing plates to drive the flipping shaft to rotate and cause the flipping seat to flip.

[0024] Preferably, the driving element includes:

[0025] A flip motor is fixedly installed at the bottom between two adjacent fixed plates, and the rotating end of the flip motor extends out of the side wall of the fixed plate and is fixedly connected to a drive gear.

[0026] A transmission gear is fixedly sleeved on the outer wall of the flipping shaft, and the outer peripheral wall of the transmission gear meshes with the outer peripheral wall of the drive gear.

[0027] The technical effects and advantages of this utility model are as follows:

[0028] This invention utilizes an adsorption-type fixing component to secure the chip, and then a flipping drive component is used to flip the adsorption-type fixing component to achieve chip flipping. At the same time, an adjustment component is used to connect the flipping drive component and the adsorption-type fixing component. The axial position of the adsorption-type fixing component and the chip fixed on it can be finely adjusted by the adjustment function of the adjustment component, so that the chip can be aligned with the bonding position below after flipping, thereby improving the work efficiency and quality of the flipped chip bonding operation. Attached Figure Description

[0029] Figure 1 This is a three-dimensional structural diagram of the flip alignment component of this utility model.

[0030] Figure 2 This is a three-dimensional structural diagram of the flip-up seat of this utility model.

[0031] Figure 3 This is a three-dimensional structural diagram of the movable seat of this utility model.

[0032] Figure 4 This is a three-dimensional structural diagram of the mounting bracket of this utility model.

[0033] In the diagram: 100, mounting bracket; 101, adsorption plate; 102, adsorption hole; 103, flipping seat; 104, connecting plate; 105, linear slide; 106, moving seat; 107, stepped groove; 108, servo motor; 109, drive screw; 110, support shaft; 111, roller; 112, flipping shaft; 113, transmission gear; 114, fixing plate; 115, flipping motor; 116, drive gear. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] This utility model provides, for example Figures 1-4 The image shows a flip alignment assembly for flip chip bonding.

[0036] Example 1: Includes an adsorption positioning component, a flipping drive component, and an adjusting component. The adsorption positioning component adsorbs and fixes the chip; the flipping drive component drives the adsorption positioning component and the chip to flip; the adjusting component is located between the adsorption positioning component and the flipping drive component to adjust the chip position. By using negative pressure adsorption to fix the chip through the adsorption positioning component, the convenience and efficiency of chip fixing operations can be increased. Compared with traditional clamping fixing methods, it can reduce the risk of damage to the chip. The adjusting component not only serves as a connection structure between the adsorption positioning component and the flipping drive component, but also adjusts the axial position of the adsorption positioning component and the chip fixed on it through its own position adjustment function. After the adsorption positioning component is flipped by the flipping drive component, the axial position of the chip can be adjusted by the adjusting component according to the bonding position. Thus, when positioning the chip on the adsorption positioning component, the user only needs to ensure the accurate lateral position of the chip, reducing the difficulty of chip positioning operations.

[0037] The adjusting components include a tilting base 103 and a translation drive component. The top of the tilting base 103 is movably provided with a connecting plate 104 for connecting an adsorption-type positioning component. The top of the tilting base 103 is provided with a linear groove 105 for mounting the translation drive component, allowing the translation drive component to adjust the axial position of the connecting plate 104 at the top of the tilting base 103. Preferably, the translation drive component includes a movable base 106, which moves axially along the linear groove 105. The top of the movable base 106 is fixed to the bottom of the connecting plate 104. A drive screw 109 is rotatably connected within the linear groove 105, and the outside of the drive screw 109 is threadedly inserted into the bottom of the movable base 106. A servo motor 108 is fixedly connected to the tilting base 103. At the end face, the rotating end of the servo motor 108 is connected to one end of the drive screw 109. In this embodiment, the servo motor 108 is controlled by an external controller, which drives the drive screw 109 to rotate clockwise or counterclockwise. This drives the moving seat 106 to move the connecting plate 104 back and forth along the axis of the flip seat 103. This allows the position of the flip seat 103 on the connecting plate 104 to be adjusted, thereby achieving automatic fine-tuning of the axial position of the adsorption positioning component and the chip after flipping. During the adjustment, the position detection camera on the chip processing equipment can be used to align the chip with the bonding position below, eliminating the disadvantages of manual adjustment and improving the convenience and efficiency of chip alignment and positioning.

[0038] Furthermore, stepped grooves 107 are formed on the top of the inner sides of the straight slide 105, and auxiliary support members are provided on the top of both sides of the movable seat 106 for auxiliary support of the movable seat 106 and the connecting plate 104 on the flip seat 103; wherein, the auxiliary support members include support shafts 110 and rollers 111, the support shafts 110 are multiple parallel and spaced apart and fixedly connected to the side wall of the movable seat 106, the ends of the support shafts 110 away from the movable seat 106 extend into the stepped grooves 107, and the rollers 111 are multiple and are respectively connected to the support shafts 110. The end of the roller 111 is rotatably inserted, and the outer peripheral wall of the roller 111 is movably fitted with the bottom of the stepped groove 107. By setting the stepped groove 107 in the straight slide groove 105, and with the support shaft 110 and roller 111 set on the outer walls of both sides of the movable seat 106, the movable seat 106 and its connecting plate 104 on it can play an auxiliary support role on the flip seat 103. At the same time, the rolling of the roller 111 converts the traditional sliding friction resistance into rolling friction resistance, thereby reducing the friction resistance experienced by the movable seat 106 when it moves on the flip seat 103.

[0039] Example 2: Based on Example 1, the adsorption positioning component is further described, including an adsorption plate 101. The adsorption plate 101 is fixedly connected to the top of the connecting plate 104. Two sets of adsorption holes 102 are symmetrically opened on the top of the connecting plate 104. Each set of adsorption holes 102 consists of multiple holes spaced apart. By setting a flip seat 103 on the adsorption plate 101, and with the adsorption holes 102 positioned above and on both sides of the flip seat 103, they are not obstructed by the flip seat 103. This allows the pneumatic nozzle to be installed at the adsorption hole 102 position at the bottom of the adsorption plate 101, thus satisfying the adsorption fixation of the chip on the adsorption plate 101. This makes the chip installation and fixation work more convenient and efficient, while reducing the risk of damage to the chip.

[0040] Example 3: Based on Example 1 or Example 2, the flipping drive component is further described, including a mounting frame 100 and at least two fixing plates 114. A flipping shaft 112 is rotatably connected to the inner side of the mounting frame 100. One end of the flipping shaft 112 is fixedly connected to the end of the flipping seat 103. Two fixing plates 114 are fixedly connected in parallel and spaced apart to the top of the inner side of the mounting frame 100. The outer wall of the flipping shaft 112 is rotatably inserted into the top of the fixing plate 114. A drive component is fixedly installed between two adjacent fixing plates 114 to drive the flipping shaft 112 to rotate and cause the flipping seat 103 to flip. The drive component includes a flipping motor 115 and a transmission gear 113. The flipping motor 115 is fixedly installed at the bottom between two adjacent fixing plates 114. The rotating end of the flipping motor 115 extends out of the side wall of the fixing plate 114 and is fixedly connected to the drive gear. Wheel 116 and transmission gear 113 are fixedly sleeved on the outer wall of flip shaft 112, and the outer peripheral wall of transmission gear 113 meshes with the outer peripheral wall of drive gear 116. In this embodiment, there are preferably two fixing plates 114, which not only meet the support and positioning of flip shaft 112 inside the mounting bracket 100, but also meet the installation and bearing requirements of flip motor 115, so that flip motor 115 is integrated inside the mounting bracket 100, reducing the temporary use of installation space. With the meshing transmission action of drive gear 116 and transmission gear 113, flip motor 115 can drive flip shaft 112 to rotate through the cooperation between transmission gear 113 and drive gear 116, so that flip shaft 112 drives flip base 103 to rotate. Since adsorption plate 101 is installed on flip base 103, the flip driving requirement of chip can be realized.

[0041] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A flip alignment assembly for flip chip bonding, characterized in that, include: Adsorption-type positioning component, which adsorbs and fixes the chip; A flipping drive unit drives the adsorption positioning component and chip to flip. An adjusting component is disposed between the adsorption positioning component and the flipping drive component to adjust the chip position.

2. The flip alignment assembly for flip chip bonding according to claim 1, characterized in that, The adjusting element includes: A flip seat (103) is provided with a connecting plate (104) at the top of the flip seat (103) for connecting the suction positioning component. The translation drive is provided with a linear slide groove (105) at the top of the flip seat (103) for mounting the translation drive, so that the axial position of the translation drive adjustment connecting plate (104) at the top of the flip seat (103) is such that the translation drive is adjusted.

3. The flip alignment assembly for flip chip bonding according to claim 2, characterized in that, The translation drive includes: The movable seat (106) moves axially along the linear slide groove (105), and the top end of the movable seat (106) is fixed to the bottom end of the connecting plate (104); A drive screw (109) is rotatably connected to a linear slide groove (105), and the drive screw (109) is threadedly inserted into the bottom of a movable seat (106). A servo motor (108) is fixedly connected to the end face of the flip base (103), and the rotating end of the servo motor (108) is connected to one end of the drive screw (109) for transmission.

4. The flip alignment assembly for flip chip bonding according to claim 3, characterized in that, The straight slide (105) has stepped grooves (107) on the top inside of both sides, and the top of both sides of the movable seat (106) is provided with auxiliary support members for auxiliary support of the movable seat (106) and the connecting plate (104) on the flip seat (103).

5. The flip alignment assembly for flip chip bonding according to claim 4, characterized in that, The auxiliary support component includes: Support shafts (110) are multiple parallel and spaced apart and fixedly connected to the side wall of the movable seat (106). The end of the support shaft (110) away from the movable seat (106) extends into the stepped groove (107). Rollers (111), there are multiple rollers (111) and they are rotatably inserted into the end of the support shaft (110). The outer peripheral wall of the roller (111) is movably attached to the bottom of the stepped groove (107).

6. The flip alignment assembly for flip chip bonding according to claim 1, characterized in that, The adsorption positioning component includes an adsorption plate (101), which is fixedly connected to the top of a connecting plate (104). The top of the connecting plate (104) has two sets of adsorption holes (102) symmetrically arranged, and each set of adsorption holes (102) consists of multiple holes spaced apart.

7. The flip alignment assembly for flip chip bonding according to claim 2, characterized in that, The flipping drive includes: Mounting bracket (100), the inner side of which is rotatably connected to a flip shaft (112), one end of which is fixedly connected to the end of a flip seat (103); At least two fixing plates (114) are fixedly connected to the top of the inner side of the mounting frame (100) in parallel and spaced apart. The outer wall of the flipping shaft (112) is rotatably inserted into the top of the fixing plate (114). A driving component is fixedly installed between two adjacent fixing plates (114) to drive the flipping shaft (112) to rotate and drive the flipping seat (103) to flip.

8. The flip alignment assembly for flip chip bonding according to claim 7, characterized in that, The driving component includes: A flip motor (115) is fixedly installed at the bottom between two adjacent fixed plates (114). The rotating end of the flip motor (115) extends out of the side wall of the fixed plate (114) and is fixedly connected to a drive gear (116). The transmission gear (113) is fixedly sleeved on the outer wall of the flipping shaft (112), and the outer peripheral wall of the transmission gear (113) meshes with the outer peripheral wall of the drive gear (116).

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