A cleaning device for wafer box production

Abstract

The utility model discloses a kind of cleaning devices for silicon wafer box production, it is related to silicon wafer box processing technical field.The utility model includes cleaning shell, support frame is fixed in cleaning shell inner wall top, support frame one end is fixed with support plate;Support plate surface is fixed with several connecting pipes, the bottom of connecting pipe is fixed with several nozzles;Motor is fixed on the upper surface of support plate, bearing is fixed on the upper surface of support plate, motor output shaft is fixedly connected with bearing inner ring;Motor output shaft is fixed with movable block, the outer wall half circle range of movable block is uniformly fixed with several first transmission blocks;The end of support plate away from support frame is fixed with limit plate, limit plate inboard is slidably connected with adjusting shell.The utility model passes through the effect of adjusting shell, the output shaft of motor drives movable block to rotate, the first transmission block on its outside drives second transmission block, movable shell and adjusting shell to move by engaging, and then make the cleaning brush of cleaner reciprocatingly brush on the surface of silicon wafer box.

Description

Technical Field

[0001] This utility model belongs to the field of silicon wafer cassette processing technology, and in particular relates to a cleaning device for silicon wafer cassette production. Background Technology

[0002] As the core carrier for storing and transporting silicon wafers in the semiconductor industry, the cleanliness of the wafer's surface and internal crevices directly determines the processing quality of the wafers. Silicon wafer production is extremely sensitive to contaminants such as dust, resin debris, and mold release agent residue. If the wafer cassette carries dirt, it can cause scratches and impurities on the wafer surface, leading to defects such as decreased photolithography accuracy and short circuits, severely impacting the yield and reliability of semiconductor devices. Therefore, silicon wafer cassettes require a rigorous cleaning process after production.

[0003] Currently, most silicon wafer cassette cleaning devices on the market employ a single cleaning method: pressurizing the cleaning solution with a water pump and spraying it from nozzles, using the liquid impact force to rinse the surface of the wafer cassette. However, such devices lack sufficient impact force to remove stubborn stains adhering to the wafer cassette during production, such as residual resin from molds and metal shavings. They can only remove surface dust, and stains tend to accumulate at the corners and seams of the wafer cassette, forming residues that are difficult to clean. Furthermore, the spray range is fixed, and if the wafer cassette structure has irregular grooves, cleaning blind spots can easily appear, resulting in localized areas that do not meet cleanliness standards.

[0004] To address these issues, we provide a cleaning apparatus for silicon wafer cassette production. Utility Model Content

[0005] The purpose of this invention is to provide a cleaning device for silicon wafer cassette production. Through the action of the adjusting shell, the output shaft of the motor drives the movable block to rotate. The first transmission block on its outer side drives the second transmission block, the movable shell, and the adjusting shell to move through meshing, thereby causing the cleaning brush of the cleaner to brush the surface of the silicon wafer cassette repeatedly. At the same time, the water pump delivers the cleaning liquid in the water tank to the nozzle through the first water pipe and the connecting pipe, spraying the cleaning liquid onto the silicon wafer cassette. This can remove stubborn stains and floating dust simultaneously, avoiding stain residue caused by a single cleaning method. The cleaning is more comprehensive and thorough, solving the problem that existing devices have insufficient impact force for removing stubborn stains attached during the production process, such as resin residue and metal shavings from the mold, and can only remove surface dust.

[0006] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: The present invention is a cleaning device for silicon wafer cassette production, including a cleaning shell, a support frame fixed to the top of the inner wall of the cleaning shell, and a support plate fixed to one end of the support frame; Several connecting pipes are fixed on the surface of the support plate, and several nozzles are fixed at the bottom of the connecting pipes; A motor is fixed to the upper surface of the support plate, and a bearing is fixed to the upper surface of the support plate. The output shaft of the motor is fixedly connected to the inner ring of the bearing. The motor output shaft is fixed with a movable block, and several first transmission blocks are evenly fixed within a half-circle of the outer wall of the movable block. A limit plate is fixed to one end of the support plate away from the support frame, and an adjustment shell is slidably connected to the inner side of the limit plate; The inner wall of the adjusting shell is fixed with a movable shell, and several second transmission blocks are fixed on both sides of the inner wall of the movable shell; The first transmission block and the second transmission block are engaged and connected. Adjustment plates are fixed on both sides of the adjustment shell. The surface of the adjustment plate has a through groove. A threaded tube is fixed on one side of the adjustment plate, and a cleaner is threadedly connected inside the threaded tube.

[0007] The present invention is further configured such that: the cleaner includes a threaded rod, and a connecting rod is fixed to one end of the threaded rod; The threaded rod is threadedly connected to the threaded pipe, and a cleaning brush is fixed to the end of the connecting rod away from the threaded rod.

[0008] The present invention is further configured such that the limiting plate has an "L" shaped structure; The adjusting shell has limit grooves on both sides, and the limit grooves are slidably connected to the limit plate.

[0009] The present invention is further configured such that limit rods are fixed at both ends of the adjusting shell; Several mounting plates are fixed to one side of the support plate, and through holes are opened on the surface of the mounting plates. The limiting rod is slidably connected to the through hole.

[0010] The present invention is further configured such that: a water pump is fixed on the top of the cleaning shell, and the output end of the water pump is fixedly connected to the connecting pipe through a first water pipe; The water pump input is connected to a water storage tank via a second water pipe.

[0011] The present invention is further configured such that: both sides of the inner wall of the cleaning shell are fixed with sliding grooves, and a placement plate is slidably connected inside the sliding grooves; A mesh plate is fixed to the bottom of the placement plate, and a positioning plate is fixed to the upper surface of the mesh plate.

[0012] The present invention is further configured such that: a spring is fixed to one side of the positioning plate, and a handle is fixed to one end of the spring; An adjusting rod is fixed to one end of the handle, and the adjusting rod passes through the positioning plate. A clamp is fixed to one end of the adjusting rod.

[0013] This utility model has the following beneficial effects: This invention utilizes the adjusting shell to drive the motor's output shaft to rotate the movable block. The first transmission block on its outer side engages with the second transmission block, the movable shell, and the adjusting shell, causing the cleaning brush of the cleaner to reciprocate on the surface of the silicon wafer cassette. Simultaneously, the water pump delivers the cleaning liquid from the water tank to the nozzle via the first water pipe and connecting pipe, spraying the cleaning liquid onto the silicon wafer cassette. This allows for the simultaneous removal of stubborn stains and dust, avoiding residue caused by a single cleaning method, resulting in a more comprehensive and thorough cleaning.

[0014] This invention utilizes the placement plate, which slides along the grooves on both sides of the inner wall of the cleaning shell, allowing the placement plate to be pulled directly out of the cleaning shell without needing to insert or remove the silicon wafer cassette from inside the equipment, making operation more labor-saving. By pulling the adjustment rod with the handle, the distance between the two clamping plates can be flexibly adjusted in conjunction with the elastic deformation of the spring, ensuring that the silicon wafer cassette does not shift or shake during the cleaning process, thus guaranteeing cleaning stability. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of a cleaning device for silicon wafer cassette production according to the present invention.

[0017] Figure 2 This is a side view structural diagram of the present invention.

[0018] Figure 3 This is a schematic diagram of the placement plate structure of this utility model.

[0019] Figure 4 For the present utility model Figure 3 Enlarged view of a portion of point A in the middle.

[0020] Figure 5 This is a schematic diagram of the adjusting shell structure of this utility model.

[0021] Figure 6 This is a schematic diagram of the internal structure of the movable shell of this utility model.

[0022] Figure 7 This is a side view structural diagram of the adjustable shell of this utility model.

[0023] Figure 8 This is a schematic diagram of the adjustable shell structure from an upward viewing angle according to this utility model.

[0024] The attached diagram lists the components represented by each number as follows: 1-Cleaning shell, 2-Support frame, 3-Support plate, 4-Connecting pipe, 5-Nozzle, 6-Motor, 7-Bearing, 8-Moving block, 9-First transmission block, 10-Limiting plate, 11-Adjusting shell, 12-Moving shell, 13-Second transmission block, 14-Adjusting plate, 15-Through groove, 16-Threaded pipe, 17-Cleaner, 18-Threaded rod, 19-Connecting rod, 20-Cleaning brush, 21-Limiting groove, 22-Limiting rod, 23-Mounting plate, 24-Through hole, 25-Water pump, 26-Water tank, 27-Slide groove, 28-Placement plate, 29-Mesh plate, 30-Positioning plate, 31-Spring, 32-Handle, 33-Adjusting rod, 34-Clamping plate. Detailed Implementation

[0025] It should be noted that, where there is no conflict, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0026] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0027] In this utility model, unless otherwise stated, the orientations used, such as "up" and "down", usually refer to the direction shown in the accompanying drawings, or to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" usually refer to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0028] For a specific implementation example, please refer to Implementation Example 1. Figures 1-8 This utility model is a cleaning device for silicon wafer cassette production, including a cleaning shell 1, a support frame 2 fixed to the top of the inner wall of the cleaning shell 1, and a support plate 3 fixed to one end of the support frame 2; a plurality of connecting pipes 4 fixed to the surface of the support plate 3, and a plurality of nozzles 5 fixed to the bottom of the connecting pipes 4; a motor 6 fixed to the upper surface of the support plate 3, and a bearing 7 fixed to the upper surface of the support plate 3, with the output shaft of the motor 6 fixedly connected to the inner ring of the bearing 7; a movable block 8 fixed to the output shaft of the motor 6, and a plurality of nozzles 5 evenly fixed within a semicircle of the outer wall of the movable block 8. A transmission block 9; a limit plate 10 is fixed at one end of the support plate 3 away from the support frame 2, and an adjustment shell 11 is slidably connected to the inner side of the limit plate 10; a movable shell 12 is fixed to the inner wall of the adjustment shell 11, and several second transmission blocks 13 are fixed to both sides of the inner wall of the movable shell 12; the first transmission block 9 is meshed with the second transmission block 13; an adjustment plate 14 is fixed to both sides of the adjustment shell 11, and a through groove 15 is opened on the surface of the adjustment plate 14. A threaded tube 16 is fixed to one side of the adjustment plate 14, and a cleaner 17 is threadedly connected inside the threaded tube 16.

[0029] Specifically, the cleaner 17 includes a threaded rod 18, one end of which is fixed with a connecting rod 19; the threaded rod 18 is threadedly connected to the threaded tube 16, and a cleaning brush 20 is fixed to the end of the connecting rod 19 away from the threaded rod 18; the limiting plate 10 has an "L" shaped structure; the adjusting shell 11 has limiting grooves 21 on both sides, and the limiting grooves 21 are slidably connected to the limiting plate 10.

[0030] Furthermore, limit rods 22 are fixed at both ends of the adjusting shell 11; several mounting plates 23 are fixed on one side of the support plate 3, and through holes 24 are opened on the surface of the mounting plates 23; the limit rods 22 are slidably connected to the through holes 24; a water pump 25 is fixed on the top of the cleaning shell 1, and the output end of the water pump 25 is fixedly connected to the connecting pipe 4 through the first water pipe; the input end of the water pump 25 is connected to the water storage tank 26 through the second water pipe.

[0031] The operation process of this embodiment is as follows: Align the threaded rod 18 of the cleaner 17 with the threaded tube 16 fixed on one side of the adjusting plate 14, rotate the threaded rod 18 so that the threaded rod 18 moves downward along the inner wall of the threaded tube 16; at the same time, observe the distance between the cleaning brush 20 at the end of the connecting rod 19 and the surface of the silicon wafer box, until the bristles of the cleaning brush 20 just lightly touch the surface of the silicon wafer box to be cleaned, turn on the power of the motor 6, and the output shaft of the motor 6 drives the movable block 8 to rotate at a constant speed around the bearing 7; the first transmission block 9 within half a circle of the outer wall of the movable block 8 rotates with the movable block 8, and when the first transmission block 9 engages with the second transmission blocks 13 on both sides of the inner wall of the movable shell 12, it drives the movable shell 12 and the adjusting shell 11 to move synchronously, and then drives the cleaning brush 20 to reciprocate on the surface of the silicon wafer box through the adjusting plate 14 and the cleaner 17; turn on the power switch of the water pump 25, and the water pump 25 drives the water pump 25 to reciprocate through the input end. The second water pipe draws cleaning fluid from the water tank 26 and delivers it through the first water pipe at the output end to several connecting pipes 4 on the surface of the support plate 3. The cleaning fluid is then distributed along the connecting pipes 4 to several nozzles 5 at the bottom, and finally sprayed from the nozzles 5 in a mist or columnar shape onto the surface of the silicon wafer cassette. This works in conjunction with the brushing action of the cleaning brush 20 to achieve dual cleaning through brushing and spraying. In this device, the output shaft of the motor 6 drives the movable block 8 to rotate. The first transmission block 9 on its outer side drives the second transmission block 13, the movable shell 12, and the adjusting shell 11 to move through meshing, thereby causing the cleaning brush 20 of the cleaner 17 to brush back and forth on the surface of the silicon wafer cassette. At the same time, the water pump 25 delivers the cleaning fluid in the water tank 26 through the first water pipe and connecting pipes 4 to the nozzles 5, spraying the cleaning fluid onto the silicon wafer cassette. This can remove stubborn stains and dust simultaneously, avoiding stain residue caused by a single cleaning method, and making the cleaning more comprehensive and thorough.

[0032] For a specific embodiment two, please refer to Figures 3-4 Based on the first specific embodiment, both sides of the inner wall of the cleaning shell 1 are fixed with sliding grooves 27, and a placement plate 28 is slidably connected inside the sliding grooves 27; a mesh plate 29 is fixed at the bottom of the placement plate 28, and a positioning plate 30 is fixed on the upper surface of the mesh plate 29.

[0033] Specifically, a spring 31 is fixed to one side of the positioning plate 30, and a handle 32 is fixed to one end of the spring 31; an adjusting rod 33 is fixed to one end of the handle 32, and the adjusting rod 33 passes through the positioning plate 30; a clamping plate 34 is fixed to one end of the adjusting rod 33.

[0034] The operation process of this embodiment is as follows: Hold the two sides of the placement plate 28 and pull it out smoothly along the sliding grooves 27 fixed on both sides of the inner wall of the cleaning shell 1 until the placement plate 28 is completely extended out of the cleaning shell 1. Pinch the handle 32 on one side of the positioning plate 30 and pull it away from the positioning plate 30. At this time, the handle 32 drives the adjusting rod 33 to move synchronously, and the spring 31 between the positioning plate 30 and the handle 32 is compressed. According to the width of the silicon wafer box to be cleaned, adjust the distance between the two clamping plates 34 to be slightly larger than the width of the silicon wafer box. Place the silicon wafer box to be cleaned smoothly on the mesh plate 29 at the bottom of the placement plate 28. Release the handle 32, and the spring 31 returns to its deformation. Push the clamping plates 34 towards the silicon wafer box through the adjusting rod 33 until the two clamping plates 34 are tightly attached to the two side walls of the silicon wafer box to achieve a stable fixation of the silicon wafer box. Hold the two sides of the placement plate 28 with both hands and slowly push it into the cleaning groove 27. Inside the shell 1, the silicon wafer cassette is positioned until the front end of the placement plate 28 is in contact with the inner wall of the cleaning shell 1. In this device, the placement plate 28 acts as a sliding groove on both sides of the inner wall of the cleaning shell 1, which slides with the placement plate 28. The placement plate 28 can be pulled directly out of the cleaning shell along the groove 27 without having to go deep into the equipment to place or remove the silicon wafer cassette, making the operation more labor-saving. By pulling the adjustment rod 33 with the handle 32, the distance between the two clamping plates 34 can be flexibly adjusted in conjunction with the elastic deformation of the spring 31, ensuring that the silicon wafer cassette does not shift or shake during the cleaning process, thus ensuring cleaning stability. The mesh plate 29 at the bottom of the placement plate 28 has a hollow feature, so the waste liquid generated during cleaning can be directly discharged downward through the mesh plate 29 without accumulating on the placement plate 28, preventing the silicon wafer cassette from being in contact with the waste liquid for a long time and causing secondary pollution. At the same time, it ensures that the cleaning liquid can continuously act on the surface of the silicon wafer cassette, improving the cleaning cleanliness.

[0035] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0036] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A cleaning apparatus for silicon wafer cassette production, comprising a cleaning housing (1), characterized in that: The cleaning shell (1) has a support frame (2) fixed to the top of its inner wall, and a support plate (3) is fixed to one end of the support frame (2). The support plate (3) has several connecting pipes (4) fixed on its surface, and several nozzles (5) are fixed at the bottom of the connecting pipes (4). A motor (6) is fixed on the upper surface of the support plate (3), and a bearing (7) is fixed on the upper surface of the support plate (3). The output shaft of the motor (6) is fixedly connected to the inner ring of the bearing (7). The output shaft of the motor (6) is fixed with a movable block (8), and a number of first transmission blocks (9) are evenly fixed within a half-circle of the outer wall of the movable block (8). A limiting plate (10) is fixed at one end of the support plate (3) away from the support frame (2), and an adjusting shell (11) is slidably connected to the inner side of the limiting plate (10). The inner wall of the adjusting shell (11) is fixed with a movable shell (12), and several second transmission blocks (13) are fixed on both sides of the inner wall of the movable shell (12). The first transmission block (9) and the second transmission block (13) are engaged and connected; Adjustment plates (14) are fixed on both sides of the adjustment shell (11). A through groove (15) is opened on the surface of the adjustment plate (14). A threaded tube (16) is fixed on one side of the adjustment plate (14). A cleaner (17) is threaded inside the threaded tube (16).

2. The cleaning apparatus for silicon wafer cassette production according to claim 1, characterized in that, The cleaner (17) includes a threaded rod (18), one end of which is fixed with a connecting rod (19). The threaded rod (18) is threadedly connected to the threaded tube (16), and a cleaning brush (20) is fixed at the end of the connecting rod (19) away from the threaded rod (18).

3. The cleaning apparatus for silicon wafer cassette production according to claim 1, characterized in that, The limiting plate (10) has an "L" shaped structure; The adjusting shell (11) has limit grooves (21) on both sides, and the limit grooves (21) are slidably connected to the limit plate (10).

4. A cleaning apparatus for silicon wafer cassette production according to claim 1, characterized in that, Limit rods (22) are fixed at both ends of the adjusting shell (11); A plurality of mounting plates (23) are fixed on one side of the support plate (3), and through holes (24) are opened on the surface of the mounting plate (23). The limiting rod (22) is slidably connected to the through hole (24).

5. A cleaning apparatus for silicon wafer cassette production according to claim 1, characterized in that, A water pump (25) is fixed on the top of the cleaning shell (1), and the output end of the water pump (25) is fixedly connected to the connecting pipe (4) through the first water pipe. The water pump (25) is connected to a water storage tank (26) via a second water pipe at its input end.

6. A cleaning apparatus for silicon wafer cassette production according to claim 1, characterized in that, The cleaning shell (1) has a sliding groove (27) fixed on both sides of its inner wall, and a placement plate (28) is slidably connected inside the sliding groove (27). The bottom of the placement plate (28) is fixed with a mesh plate (29), and the upper surface of the mesh plate (29) is fixed with a positioning plate (30).

7. A cleaning apparatus for silicon wafer cassette production according to claim 6, characterized in that, A spring (31) is fixed to one side of the positioning plate (30), and a handle (32) is fixed to one end of the spring (31). An adjusting rod (33) is fixed to one end of the handle (32), and the adjusting rod (33) passes through the positioning plate (30). One end of the adjusting rod (33) is fixed with a clamp (34).

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