Automatic tin spotter

Abstract

The utility model discloses an automatic tin dotting machine, the automatic tin dotting machine includes: mounting seat, tin dotting mechanism, drive mechanism and mounting fixture, tin dotting mechanism and drive mechanism are installed in the top side surface of mounting seat, drive mechanism sets up one end at mounting seat, tin dotting mechanism sets up the other end at mounting seat relative drive mechanism, and mounting fixture is cooperated and installed in the drive end of drive mechanism, tin dotting mechanism includes pneumatic solder paste pump, feed tube, fixed plate and a plurality of tin dotting needle, one end of feed tube is connected in the output of pneumatic solder paste pump, and its other end extends towards drive mechanism and stretches the preset distance, and fixed plate sets up one end of feed tube towards drive mechanism, and the input of a plurality of tin dotting needle is fixedly installed in fixed plate, and the input of a plurality of tin dotting needle is connected to feed tube. The automatic tin dotting machine is automatically sent to tin dotting station and takes back through drive mechanism, replaces the operation of manual taking, aligning and placing.

Description

Technical Field

[0001] This utility model relates to the field of automatic soldering equipment technology, and in particular to an automatic soldering machine. Background Technology

[0002] Heat sinks are crucial heat dissipation components in electronic devices, and their performance directly affects the stable operation of high-power chips such as CPUs and GPUs. Modern heat sinks generally adopt a structure combining heat pipes and fins. By creating heat pipe mating holes (or soldering holes) on the fins, heat pipes are embedded and soldered into them, using solder paste as the solder to achieve a strong bond and efficient heat conduction between the two.

[0003] In this soldering process, the soldering step is crucial, requiring the precise and uniform application or filling of an appropriate amount of solder paste onto the inner wall of the heat pipe mating hole for each fin. Currently, this step is mainly achieved through two methods: Manual soldering: Operators use syringes or simple soldering tools to apply solder paste to each heat pipe hole individually by visual inspection and touch. This method has significant drawbacks: First, the production efficiency is extremely low, which cannot meet the needs of large-scale production; second, it is difficult to guarantee complete consistency in soldering, as different operators, and even the same operator at different times, will apply different amounts of solder paste, which can easily lead to defects such as cold solder joints, excessive solder balls, or bridging in subsequent soldering, seriously affecting product yield. In addition, for high-performance heat sinks with extremely small fin gaps and dense structures, manual operation makes it difficult to accurately insert the soldering tool, greatly reducing feasibility. Semi-automatic soldering equipment: Some existing automated equipment uses a single-point soldering mechanism, which is controlled by a program to move and apply solder paste to each heat pipe hole individually. While it reduces the intensity of manual labor to some extent, its work efficiency remains limited because applying solder one by one does not fundamentally shorten the work cycle. At the same time, the cumulative positioning error of multiple soldering actions and the fluctuations in the solder paste supply system still affect the consistency of the amount of solder paste in each solder hole.

[0004] Therefore, existing soldering methods, whether manual or semi-automatic, generally suffer from low production efficiency, poor soldering consistency, and insufficient adaptability to dense fin structures. This has become a technical bottleneck restricting the improvement of heat sink production quality and efficiency. Utility Model Content

[0005] Therefore, it is necessary to provide an automatic soldering machine to address the technical problems of low efficiency and poor soldering consistency of existing soldering machines.

[0006] An automatic soldering machine includes a mounting base, a soldering mechanism, a drive mechanism, and a mounting fixture. Both the soldering mechanism and the drive mechanism are mounted on the top surface of the mounting base. The drive mechanism is located at one end of the mounting base, and its drive end extends a predetermined distance along the length of the mounting base. The soldering mechanism is located at the other end of the mounting base opposite the drive mechanism, and its output end is correspondingly fitted to the end of the drive end of the drive mechanism. The mounting fixture is fitted onto the drive end of the drive mechanism.

[0007] The soldering mechanism includes a pneumatic solder paste pump, a feeding tube, a fixing plate, and several soldering pins. The pneumatic solder paste pump is mounted on the other end of the mounting base relative to the drive mechanism. One end of the feeding tube is connected to the output end of the pneumatic solder paste pump, and the other end extends a predetermined distance toward the drive mechanism. The fixing plate is located on the end of the feeding tube facing the drive mechanism. The input ends of several soldering pins are fixedly mounted on the fixing plate, and the input end of each soldering pin passes through the side of the fixing plate facing the feeding tube, so that the input ends of the several soldering pins are all connected to the corresponding end of the feeding tube. The output ends of the several soldering pins extend toward the drive mechanism, and the output end of each soldering pin is movably engaged with the mounting fixture.

[0008] The feeding tube includes a main pipe, a branch pipe, and several branch pipes; one end of the main pipe is connected to the output end of the pneumatic solder paste pump, and the other end is connected to the input end of the branch pipe; the branch pipe has several branch output ends, and each branch output end is connected to one end of one of several branch pipes; the ends of the branch pipes facing away from the branch pipe are connected to the input ends of several solder pins.

[0009] In one embodiment, the aforementioned mounting fixture is configured as an L-shaped plate, with the main body of the mounting fixture mounted on the top surface of the output end of the drive mechanism, and the folded side plate of the mounting fixture facing the fixing plate and positioned on the corresponding side of the main body.

[0010] In one embodiment, the output ends of the aforementioned solder pins are respectively in movable engagement with the side plate. When the drive mechanism drives the mounting fixture to move relative to the fixed plate, each solder pin slides relative to the side plate.

[0011] In one embodiment, the side plate and the fixing plate are arranged parallel to each other.

[0012] In one embodiment, the motherboard body is provided with a mating groove, which is located on the top side surface of the motherboard body.

[0013] In one embodiment, the aforementioned drive mechanism includes a lead screw slide module that extends along the length of the mounting base, with the end of the lead screw slide module extending to a fixed plate.

[0014] In one embodiment, the main body of the mounting fixture is connected to the slide surface of the lead screw slide module.

[0015] In one embodiment, the aforementioned drive mechanism further includes a limiting block, which is disposed at one end of the lead screw slide module facing the fixed plate and connected to the top side surface of the mounting base.

[0016] In one embodiment, the aforementioned fixing plate is disposed on the top side surface of the limiting block.

[0017] In one embodiment, the aforementioned soldering mechanism further includes a mounting bracket, which is disposed at the other end of the mounting base relative to the drive mechanism, and the mounting bracket extends towards the top side at a predetermined height.

[0018] In one embodiment, the pneumatic solder paste pump is mounted on a mounting bracket, and the output end of the pneumatic solder paste pump is oriented towards the bottom side.

[0019] In one embodiment, the aforementioned main pipe is made of flexible tubing.

[0020] In one embodiment, each of the above-described tubes is made of flexible tubing.

[0021] The aforementioned automatic soldering machine automatically delivers and returns the mounting fixture (clamping the heatsink) to the soldering station via a drive mechanism, replacing manual handling, alignment, and placement. The soldering action is completed during the fixture's return stroke, avoiding potential collisions or interference between the soldering pins and the hole walls during the forward stroke. This ensures smooth and continuous operation, reduces cycle time, and further improves production cycle time. Furthermore, this solution utilizes a pneumatic solder paste pump combined with a distribution pipe and multiple branch pipes for feeding, ensuring that the solder paste is pumped from a single source, evenly distributed to each branch pipe and soldering pin via the distribution pipe, and fed from the source... The head ensures the consistency of the initial state of solder paste pressure and flow rate allocated to each point. At the same time, the pneumatic pump method can provide stable and controllable output pressure, ensuring a stable amount of solder paste dispensing each time. In addition, the complex multi-point synchronous soldering function is integrated into a compact system, reducing the difficulty of operation and dependence on personnel skills. The drive mechanism and soldering mechanism are both mounted on the same mounting base, forming a complete modular unit, which ensures the relative positional accuracy between the components, improves the rigidity and stability of the equipment, and facilitates installation, debugging and transportation. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of an automatic soldering machine in one embodiment; Figure 2 This is a schematic diagram of the structure of an automatic soldering machine in one embodiment. Detailed Implementation

[0023] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0024] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0026] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0028] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0029] Please see Figures 1 to 2This utility model discloses an automatic soldering machine 1, which includes a mounting base 10, a soldering mechanism 20, a drive mechanism 30, and a mounting fixture 40. The soldering mechanism 20 and the drive mechanism 30 are both mounted on the top surface of the mounting base 10. The drive mechanism 30 is located at one end of the mounting base 10, and its drive end extends a predetermined distance along the length of the mounting base 10. The soldering mechanism 20 is located at the other end of the mounting base 10 opposite to the drive mechanism 30, and its output end is correspondingly engaged with the drive mechanism 30. The end of the moving end; based on this, the mounting fixture 40 is installed on the driving end of the driving mechanism 30, so that the driving mechanism 30 can drive the mounting fixture 40 to reciprocate along a preset direction. When the mounting fixture 40 moves to the output end of the soldering mechanism 20, the heat sink to be soldered placed on the mounting fixture 40 corresponds to the output end of the soldering mechanism 20. Then, under the drive of the driving mechanism 30, during the process of the mounting fixture 40 driving the heat sink to move back, the output end of the soldering mechanism 20 performs soldering action on the heat pipe mating hole wall of each fin of the heat sink. Specifically, the soldering mechanism 20 includes a pneumatic solder paste pump 21, a feeding tube 22, a fixing plate 23, and a plurality of soldering pins 24; the pneumatic solder paste pump 21 is mounted on the other end of the mounting base 10 relative to the drive mechanism 30; one end of the feeding tube 22 is connected to the output end of the pneumatic solder paste pump 21, and the other end extends a predetermined distance toward the drive mechanism 30; the fixing plate 23 is disposed on the end of the feeding tube 22 facing the drive mechanism 30; the input ends of the plurality of soldering pins 24 are fixedly mounted on the fixing plate 23, and the input end of each soldering pin 24 penetrates through the fixing plate 23. 3. The input ends of several solder needles 24 are connected to the corresponding ends of the feeding pipe 22, so that the pneumatic solder paste pump 21 can pump solder paste through the feeding pipe 22 to the several solder needles 24 respectively. The output ends of the several solder needles 24 extend toward the drive mechanism 30, and the output end of each solder needle 24 is movably engaged with the mounting fixture 40. When the mounting fixture 40 moves toward the fixed plate 23, the output ends of the several solder needles 24 can be inserted into the several heat pipe soldering holes of the heat sink, thereby completing the soldering action. More specifically, the feeding pipe 22 includes a main pipe 221, a branch pipe 222, and several branch pipes 223; one end of the main pipe 221 is connected to the output end of the pneumatic solder paste pump 21, and the other end is connected to the input end of the branch pipe 222; the branch pipe 222 has several branch output ends, and each branch output end is connected to one end of one of several branch pipes 223; the ends of the several branch pipes 223 facing away from the branch pipe 222 are connected to the input ends of several soldering pins 24, so that the pneumatic solder paste pump 21 can pump solder paste to several soldering pins 24 through one output port, thereby simultaneously completing the soldering work on multiple heat pipe soldering holes of the heat sink.Based on the above configuration, the automatic soldering machine 1 of this solution automatically delivers the mounting fixture 40 (clamping the heat sink) to the soldering station and brings it back via the drive mechanism 30, replacing the manual handling of picking up, aligning, and placing. The soldering action is completed during the fixture's return stroke, which avoids potential collisions or interference between the soldering pins 24 and the hole walls during the forward stroke, ensuring the smoothness and continuity of the action, reducing cycle time, and further improving production cycle time. Furthermore, this solution utilizes a pneumatic solder paste pump 21 combined with a distribution pipe 222 and multiple branch pipes 223 to ensure that the solder paste is pumped from the same source and evenly distributed to each branch via the distribution pipe 222. The tube 223 and the soldering needle 24 ensure the consistency of the initial state of the solder paste pressure and flow rate allocated to each point from the source. At the same time, the pneumatic pumping method can provide a stable and controllable output pressure, ensuring a stable amount of solder paste applied each time. In addition, the complex multi-point synchronous soldering function is integrated into a compact system, reducing the difficulty of operation and the dependence on personnel skills. The drive mechanism 30 and the soldering mechanism 20 are both mounted on the same mounting base 10, forming a complete modular unit, which ensures the relative positional accuracy between the components, improves the rigidity and stability of the equipment, and facilitates installation, debugging and transportation.

[0030] Furthermore, the mounting fixture 40 is configured as an L-shaped plate, with the main body 41 of the mounting fixture 40 mounted on the top surface of the output end of the drive mechanism 30. The folded side plate 42 of the mounting fixture 40 is positioned on the corresponding side of the main body 41 facing the fixing plate 23. Specifically, the output ends of several solder pins 24 are respectively in movable engagement with the side plate 42. When the drive mechanism 30 drives the mounting fixture 40 to move relative to the fixing plate 23, each solder pin 24 slides relative to the side plate 42. Thus, when the heat sink is engaged with the main body 41, the several solder pins 24 can move relative to the several heat pipe solder joints of the heat sink on the other side of the side plate 42.

[0031] Specifically, in one embodiment, the side plate 42 and the fixing plate 23 are arranged parallel to each other to improve the relative sliding stability between each solder pin 24 and the side plate 42, and reduce the friction and interference between the side surface of the solder pin 24 and the side plate 42.

[0032] Specifically, in one embodiment, the motherboard body 41 is provided with a mating groove a, which is located on the top side surface of the motherboard body 41 for the mating installation of the heat sink, so as to realize the supporting and positioning function of the mounting fixture 40 for the heat sink.

[0033] Furthermore, the drive mechanism 30 includes a lead screw slide module 31, which extends along the length of the mounting base 10, with its end extending to the fixing plate 23. Based on this, the main body 41 of the mounting fixture 40 is connected to the slide surface of the lead screw slide module 31, enabling the lead screw slide module 31 to drive the mounting fixture 40 to reciprocate along the lead screw extension direction.

[0034] Furthermore, the drive mechanism 30 also includes a limiting block 32, which is disposed at the end of the lead screw slide module 31 facing the fixed plate 23 and connected to the top side surface of the mounting base 10. Based on this, the fixed plate 23 is disposed on the top side surface of the limiting block 32 to support the fixed plate 23, so that the fixed plate 23 can be correspondingly engaged with the side plate body 42 of the mounting fixture 40.

[0035] Furthermore, the soldering mechanism 20 also includes a mounting bracket 25, which is disposed at the other end of the mounting base 10 relative to the drive mechanism 30, and extends towards the top at a predetermined height. Based on this, the pneumatic solder paste pump 21 is mounted on the mounting bracket 25, and the output end of the pneumatic solder paste pump 21 is disposed towards the bottom.

[0036] Furthermore, in one embodiment, the main pipe 221 is made of flexible tubing to achieve a flexible connection between the pneumatic solder paste pump 21 and the branch pipe 222.

[0037] Furthermore, in one embodiment, each branch pipe 223 is made of flexible tubing to achieve a flexible connection between the branch pipe 222 and several solder pins 24.

[0038] In summary, the automatic soldering machine disclosed in this utility model automatically delivers and returns the mounting fixture (clamping the heat sink) to the soldering station via a drive mechanism, replacing manual handling, alignment, and placement. The soldering action is completed during the fixture's return stroke, avoiding potential collisions or interference between the soldering needle and the hole wall during the forward stroke, ensuring smooth and continuous operation, reducing cycle time, and further improving production speed. Furthermore, this solution utilizes a pneumatic solder paste pump combined with a distribution pipe and multiple branch pipes for feeding, ensuring that the solder paste is pumped from a single source and evenly distributed to each branch pipe via the distribution pipe. The soldering needles ensure the consistency of initial solder paste pressure and flow rate at each point from the source. At the same time, the pneumatic pump provides stable and controllable output pressure, ensuring a consistent amount of solder paste applied each time. In addition, the complex multi-point synchronous soldering function is integrated into a compact system, reducing the difficulty of operation and dependence on personnel skills. The drive mechanism and soldering mechanism are both mounted on the same mounting base, forming a complete modular unit, which ensures the relative positional accuracy between components, improves the rigidity and stability of the equipment, and facilitates installation, debugging, and transportation.

[0039] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0040] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An automatic soldering machine, characterized in that, include: The mounting base, soldering mechanism, drive mechanism, and mounting fixture are provided. The soldering mechanism and drive mechanism are both mounted on the top side surface of the mounting base. The drive mechanism is located at one end of the mounting base, and its drive end extends a predetermined distance along the length of the mounting base. The soldering mechanism is located at the other end of the mounting base opposite the drive mechanism, and its output end is correspondingly fitted to the end of the drive end of the drive mechanism. The mounting fixture is fitted onto the drive end of the drive mechanism. The soldering mechanism includes a pneumatic solder paste pump, a feeding tube, a fixing plate, and several soldering pins. The pneumatic solder paste pump is mounted on the other end of the mounting base relative to the drive mechanism. One end of the feeding tube is connected to the output end of the pneumatic solder paste pump, and the other end extends a predetermined distance toward the drive mechanism. The fixing plate is located on the end of the feeding tube facing the drive mechanism. The input ends of several soldering pins are fixedly mounted on the fixing plate, and the input end of each soldering pin passes through the side of the fixing plate facing the feeding tube, so that the input ends of the several soldering pins are all connected to the corresponding end of the feeding tube. The output ends of the several soldering pins extend toward the drive mechanism, and the output end of each soldering pin is movably engaged with the mounting fixture. The feeding tube includes a main pipe, a branch pipe, and several branch pipes; one end of the main pipe is connected to the output end of the pneumatic solder paste pump, and the other end is connected to the input end of the branch pipe; the branch pipe has several branch output ends, and each branch output end is connected to one end of one of several branch pipes; the ends of the branch pipes facing away from the branch pipe are connected to the input ends of several solder pins.

2. The automatic soldering machine according to claim 1, characterized in that, The mounting fixture is set as an L-shaped plate. The main body of the mounting fixture is mounted on the top surface of the output end of the drive mechanism, and the folded side plate of the mounting fixture is set on the corresponding side of the main body facing the fixing plate.

3. The automatic soldering machine according to claim 2, characterized in that, The output ends of several solder pins are respectively engaged with the side plate. When the drive mechanism drives the mounting fixture to move relative to the fixed plate, each solder pin slides relative to the side plate.

4. The automatic soldering machine according to claim 3, characterized in that, The side panels and the fixing plate are set parallel to each other.

5. The automatic soldering machine according to claim 4, characterized in that, The motherboard body is provided with a mating groove, which is located on the top side surface of the motherboard body.

6. The automatic soldering machine according to claim 5, characterized in that, The drive mechanism includes a lead screw slide module, which extends along the length of the mounting base and extends to the fixed plate at its end.

7. The automatic soldering machine according to claim 6, characterized in that, The main body of the mounting fixture is connected to the slide surface of the lead screw slide module.

8. The automatic soldering machine according to claim 7, characterized in that, The drive mechanism also includes a limiting block, which is located at the end of the lead screw slide module facing the fixed plate and connected to the top side surface of the mounting base.

9. The automatic soldering machine according to claim 8, characterized in that, The fixing plate is set on the top side surface of the limiting block.

10. The automatic soldering machine according to claim 9, characterized in that, The soldering mechanism also includes a mounting bracket, which is located at the other end of the mounting base relative to the drive mechanism, and extends towards the top side at a predetermined height.

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