A device carrier for miniaturized semiconductor production

Abstract

The utility model relates to small -size ceramic surface pasted type photoelectric coupler production process technical field, concretely relates to a device bearing carrier for miniaturized semiconductor production, including load strip carrier and load strip pressure strip, load strip carrier and load strip pressure strip one end fixed connection, the other end is provided with the matching adsorption magnet, the protruding in the middle of load strip carrier and protruding and photoelectric coupler size match, both sides are provided with the recess of placing photoelectric coupler pin, load strip pressure strip middle hollow and with the protruding of load strip carrier match, both sides are provided with the protrusion and with the recess of load strip carrier match. The utility model can prevent the device to be placed in the material tray to be tilted, prevent the damage caused by the mutual friction and the collision of the gold layer at the bottom of the device during the device transfer process, and the two long side limit designs are the device anti -displacement and pin appearance protection.

Description

Technical Field

[0001] This utility model relates to the technical field of manufacturing process of small ceramic surface-mount optocouplers, and specifically to a device carrier for miniaturized semiconductor production. Background Technology

[0002] The production of small ceramic surface-mount optocouplers involves multiple processes, including mounting, reinforcement, baking, dust removal, and encapsulation. Throughout the entire production process, the devices must be laid flat. Especially during reinforcement, dust removal, and encapsulation, which are done manually, a carrier is needed to support the devices at each stage of the process. The original method used tweezers to hold the devices and place them one by one into a material tray. However, due to the small size of these ceramic surface-mount optocouplers, they are prone to uneven placement and tilting during movement on the production line. Pins can easily cross and overlap, hindering subsequent reinforcement and dust removal processes. Unpredictable factors during production can also cause collisions, friction, and even falls, damaging the metal surfaces and pins of the devices. According to the process-related documents, components with certain surface damage or those that have been dropped will be discarded. In addition, when multiple components are placed side by side in a tray, it is inconvenient for operators to handle them with tweezers and they are very likely to touch the appearance of adjacent components, which can lead to some uncontrollable factors. This seriously affects product quality, production efficiency and cost control. Utility Model Content

[0003] In view of this, the purpose of this utility model is to solve the problem of placement of small ceramic surface-mount optocouplers in the production process, and to provide a device placement carrier for the production process of small ceramic surface-mount optocouplers.

[0004] This utility model provides a device carrier for miniaturized semiconductor production, including a carrier strip and a carrier strip clamping strip. The carrier strip and the carrier strip clamping strip are fixedly connected at one end and have matching adsorption magnets at the other end. The carrier strip has a protrusion in the middle that matches the size of the optocoupler, and grooves on both sides for placing the pins of the optocoupler. The carrier strip clamping strip is hollow in the middle and matches the protrusion of the carrier strip, and has protrusions on both sides that match the grooves of the carrier strip.

[0005] Furthermore, the carrier strip and the carrier strip pressure strip are fixedly connected at one end using flat-head locking screws and bolts to form a bearing rotation mode.

[0006] Furthermore, a first connector is provided at one end of the carrier strip, the first connector being a front-to-back through hole; the carrier strip pressure strip has a U-shaped structure, and a second connector is provided at one end of the carrier strip pressure strip, the second connector being two front-to-back through holes, the first connector matching the second connector, the screw passing through one through hole of the second connector, the second connector through hole and the second connector through hole in sequence, and then being fixed with a locking screw.

[0007] Furthermore, a third connector is provided at one end of the carrier strip where the magnet is attached. The third connector and the carrier strip where the magnet is attached are respectively provided with through holes at the top and bottom. High-temperature resistant magnets are bonded to the air using high-temperature adhesive.

[0008] Furthermore, the distance between the first connector and the third connector matches the number of optocoupler devices placed thereon, and the height of the first connector and the third connector is higher than the height of the carrier protrusion, which serves to limit the position of the optocoupler.

[0009] Furthermore, 20 to 40 optocouplers are placed on the protrusion in the middle of the carrier strip.

[0010] Furthermore, the carrier strip and the carrier strip pressure strip are made of aluminum alloy or PEEK material.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] 1. This utility model is designed as a rectangular strip with flat bottoms on all four sides. The two ends adopt a bearing rotation mode and a magnetic adsorption mode respectively, which can be opened and closed with one button. The strip can hold multiple devices, solving the problem of manually picking them up one by one. It avoids the problem of damage to the pins and metal surfaces caused by placing multiple devices on an iron tray in the traditional way, effectively ensuring the appearance quality of the product, reducing the probability of damage, and improving the work efficiency of the operator.

[0013] 2. The horizontal support bar designed in this utility model consists of two parts. The bottom bearing part is wider than the top limiting support part when the device pins are placed, which can hold flat devices and effectively avoid the devices falling over and being scrapped during the production process, thus saving production costs.

[0014] 3. The carrier strip and pressure strip of this utility model are made of high temperature resistant aluminum alloy. Considering that the carrier strip and pressure strip are easily deformed after being baked at high temperature multiple times, the carrier strip and pressure strip are made of high temperature resistant aluminum alloy.

[0015] 4. The carrier strip designed in this utility model is versatile and can be used for small ceramic patch-type devices. Through reasonable design of size and quantity, this carrier can meet the process requirements of various models of small ceramic patch-type optocouplers, and has high flexibility and adaptability. Attached Figure Description

[0016] Figure 1 This is an overall schematic diagram of a device support carrier for miniaturized semiconductor production according to the present invention;

[0017] Figure 2 This is a schematic diagram of the carrier strip and pressure strip structure in this utility model;

[0018] Figure 3 These are top and bottom views of the carrier strip and pressure strip structure in this utility model;

[0019] Figure 4 This is a front view of the carrier strip and pressure strip structure in this utility model;

[0020] Figure 5 This is a schematic diagram of the carrier structure in this utility model;

[0021] Figure 6 This is a top view of the carrier structure in this utility model;

[0022] The labels in the attached drawings include: 1-carrier strip; 2-carrier strip carrier; 3-optocoupler; 4-screw; 11-second connector; 12-strip-shaped first protrusion; 21-first connector; 22-groove; 23-strip-shaped second protrusion; 24-third connector. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] This utility model provides a device carrier for miniaturized semiconductor production, such as... Figure 1 It includes a carrier strip 2 and a carrier strip pressing strip 1. The carrier strip and the carrier strip pressing strip are fixedly connected at one end and have matching adsorption magnets at the other end. The carrier strip has a protrusion in the middle that matches the size of the optocoupler 3, and grooves on both sides for placing the pins of the optocoupler. The carrier strip pressing strip has a hollow center that matches the protrusion of the carrier strip and protrusions on both sides that match the grooves of the carrier strip.

[0025] As an optional implementation, in this embodiment, the carrier strip and the carrier strip pressure strip are fixedly connected at one end by a flat-head locking screw and a screw 4, forming a bearing rotation mode. Specifically, a first connector is provided at one end of the carrier strip, and the first connector is a through hole running forward and backward; the carrier strip pressure strip has a U-shaped structure, and a second connector is provided at one end of the carrier strip pressure strip, and the second connector is two through holes running forward and backward. The first connector matches the second connector, and the screw passes through one through hole, the second connector through hole, and the second connector through hole in sequence, and is then fixed by the locking screw.

[0026] This embodiment proposes a device carrier for miniaturized semiconductor production. The carrier is rectangular with flat bottoms on all four sides. The two ends utilize a bearing rotation mode and a magnetic adsorption mode, respectively, allowing for one-button opening and closing. It features an internal horizontal support strip with a concave-convex structure. The central support section serves as a device placement support, with its edges polished to reduce sharpness and effectively prevent hard contact between the device's bottom gold layer and the carrier's inner corners. This structure effectively prevents devices from tipping over in the material tray and avoids damage caused by friction and collision between the device's bottom gold layer and the components during transport. The two long sides provide limiting designs to prevent device displacement and protect the pin appearance. Furthermore, the carrier strip has a hollow center, facilitating dust removal in subsequent processes and improving operator efficiency. It also facilitates device handling at various stages of production. The carrier is made of high-temperature resistant aluminum alloy and PEEK material, suitable for high-temperature baking processes. This structure can improve the production efficiency and product appearance qualification rate of small ceramic optocouplers and is applicable to the production processes of various small ceramic surface-mount optocoupler models.

[0027] like Figure 2 This invention provides a specific structure for a carrier strip pressure strip. The structure is U-shaped, with a gap in the middle that matches the size of the optocoupler, allowing the optocoupler to be placed precisely within the gap. Protrusions are provided on both sides of the U-shaped structure near the gap, used to press and fix the pins of the optocoupler. A second connector 11 is provided at one end of the carrier strip pressure strip, with a through hole running forward and backward. A strip-shaped first protrusion 12 is provided below the carrier strip pressure strip, positioned on the side of the U-shaped structure near the gap and matching a groove on the carrier strip. A hole is provided at the other end of the carrier strip pressure strip for placing an adsorption magnet. As an optional embodiment, this invention uses a high-temperature resistant magnet, which is bonded to the hole using high-temperature adhesive.

[0028] like Figures 3-4This embodiment also provides specific implementation dimensions for a carrier strip pressure bar suitable for small ceramic surface-mount encapsulated coupling devices with an external size of 5.1mm × 5.1mm or less. To accommodate this device, the gap width of the carrier strip pressure bar in this embodiment is 5.7mm, the gap length is 103mm, and the number of devices placed varies depending on the specific width of the device, with a minimum of 20 and a maximum of 30 devices placed. The thickness of the U-shaped structure is 1.7mm, the thickness of the protrusion is 1.8mm, the length of the first connector is 6mm, and the diameter of the through hole on the first connector is 3.1mm.

[0029] like Figure 5 This invention provides a specific structure for a carrier strip, which matches the carrier strip pressure strip. One end of the carrier strip is provided with a first connector 21, which has a through hole in the front-to-back direction. The first connector matches a second connector, that is, the through hole sizes of the first connector and the second connector match, and the width of the first connector matches the width of the gap in the middle of the second connector. Grooves 22 are provided on both sides of the carrier strip, and a strip-shaped second protrusion 23 is provided in the middle. The width of the protrusion matches that of the optocoupler, and the grooves 22 are used to place the pins of the optocoupler. The other end of the carrier strip is provided with a third connector 24, which has a hole in the top-to-bottom direction for placing an adsorption magnet. This hole matches the hole in the carrier strip pressure strip for placing the adsorption magnet.

[0030] like Figure 6 In this embodiment, the width of the first connector and the third connector is the same as the width of the strip-shaped second protrusion 23 on the carrier, and the first connector and the third connector are slightly higher than the strip-shaped second protrusion 23. This can limit the position of the optocoupler placed on the strip-shaped second protrusion 23. The protrusions, grooves, gaps in the middle of the carrier and protrusions on both sides of the carrier in this invention jointly limit the position of the optocoupler, reducing the process error caused by displacement of the optocoupler during the process.

[0031] In this utility model, the unmarked dimensional tolerances of the carrier are processed according to GB / T-1804 2000 M grade, and the unmarked positional tolerances meet the requirements of GB / T-1184 1996 K grade.

[0032] In the description of this utility model, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "side", "top", "inner", "outer", "front", "center", "both ends", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0033] In this utility model, unless otherwise explicitly specified and limited, the terms "installation", "setting", "connection", "fixing", "rotation", etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A device carrier for miniaturized semiconductor manufacturing, characterized in that, It includes a carrier strip and a carrier strip pressing strip. The carrier strip and the carrier strip pressing strip are fixedly connected at one end and have a matching adsorption magnet at the other end. The carrier strip has a protrusion in the middle that matches the size of the optocoupler, and grooves on both sides for placing the pins of the optocoupler. The carrier strip pressing strip is hollow in the middle and matches the protrusion of the carrier strip, and has protrusions on both sides that match the grooves of the carrier strip.

2. The device carrier for miniaturized semiconductor manufacturing according to claim 1, characterized in that, The carrier strip and the carrier strip pressure strip are fixedly connected at one end by a flat-head locking screw and a threaded rod, forming a bearing rotation mode.

3. The device carrier for miniaturized semiconductor manufacturing according to claim 2, characterized in that, A first connector is provided at one end of the carrier strip, and the first connector is a through hole in the front and back direction; the carrier strip pressure strip has a U-shaped structure, and a second connector is provided at one end of the carrier strip pressure strip, and the second connector is two through holes in the front and back direction. The first connector matches the second connector, and the screw passes through one through hole of the second connector, the second connector through hole and the second connector through hole in sequence, and then is fixed by the locking screw.

4. A device carrier for miniaturized semiconductor manufacturing according to claim 3, characterized in that, The carrier strip has a third connector at one end where the magnet is attached. The third connector and the carrier strip have holes at the other end where the magnet is attached, and the high-temperature magnet is bonded to the holes using high-temperature adhesive.

5. A device carrier for miniaturized semiconductor manufacturing according to claim 4, characterized in that, The distance between the first connector and the third connector matches the number of optocoupler devices placed thereon, and the height of the first connector and the third connector is higher than the height of the carrier protrusion, which serves to limit the position of the optocoupler.

6. A device carrier for miniaturized semiconductor manufacturing according to claim 1 or 5, characterized in that, 20 to 30 optocouplers are placed on the protrusion in the middle of the carrier strip.

7. A device carrier for miniaturized semiconductor manufacturing according to claim 1, characterized in that, The carrier strip and the carrier strip pressure strip are made of aluminum alloy or PEEK material.

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