Multi-sided aoi inspection apparatus
By employing a multi-sided AOI inspection device with substrate positioning, visual inspection, and transfer mechanisms, the problem of multi-sided inspection of products of different specifications and sizes has been solved, achieving efficient and low-cost accurate inspection and improving inspection flexibility and accuracy.
Patent Information
- Application Number
- CN202521817216.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-26
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-08-26
AI Technical Summary
Existing technologies cannot quickly and accurately adapt to multi-faceted inspection of products of different specifications and sizes, resulting in limited inspection flexibility and accuracy. Furthermore, manual inspection is inefficient and makes it difficult to identify defective products in real time.
A multi-sided AOI inspection device is adopted, including a substrate positioning mechanism, a vision inspection mechanism, and a transfer mechanism. It utilizes a dynamically adjustable Y-axis motion module and multiple staggered cameras and laser rangefinders to achieve multi-faceted structural inspection of products of different sizes. The product position is adjusted by compensating for motion to adapt to the inspection range.
It significantly improves the size compatibility and efficiency of the tested products, reduces testing costs, simplifies the testing process, reduces cumulative errors, and enhances the flexibility and accuracy of testing.
Smart Images
Figure CN224682117U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of detection device technology, and in particular relates to a multi-sided AOI detection device. Background Technology
[0002] In the field of advanced electronics manufacturing, the miniaturization and high-density integration of integrated circuits pose continuous challenges to substrate interconnect technology. Side-line 3D printing and packaging technology, as a cutting-edge approach, has attracted widespread attention due to its potential in shaping complex structures and improving overall product productivity. The key to this technology lies in its ability to print conductive lines on substrates to form high-precision interconnect structures.
[0003] However, this high-precision printing process comes with more stringent requirements for product quality control. The printed circuit structure needs to undergo comprehensive defect inspection, including but not limited to various complex defect types such as wire detachment, short circuits, scratches, foreign object adhesion, and breakage that may occur on the front and back of the substrate and in the edge areas. Traditional production models heavily rely on manual inspection for this crucial step. The limitations of manual inspection become apparent when faced with the high-speed output of automated production lines, such as low efficiency and difficulty in quickly and reliably identifying and screening defective products generated in real time during production. Furthermore, when facing the inspection requirements of products of different sizes, existing technologies are limited by the camera's detection range. Without accurate positioning, the surface to be inspected can easily deviate from the detection range, making it impossible to accurately detect the corners and edges of the product. Therefore, existing technologies still struggle to quickly and accurately adapt to the inspection requirements of products of different sizes, resulting in limited inspection flexibility and accuracy.
[0004] Therefore, in order to overcome the limitations of current manual inspection, effectively address the quality challenges brought about by high-precision manufacturing processes, and meet the needs of rapid and accurate inspection of products of different sizes in actual production, providing a method compatible with products of different sizes has become an urgent problem to be solved. Utility Model Content
[0005] This invention provides a multi-sided AOI inspection device to solve the technical problem that existing technologies cannot be applied to accurately inspect products of different specifications and sizes.
[0006] In a first aspect, this utility model provides a multi-sided AOI inspection device, which includes a substrate positioning mechanism, a visual inspection mechanism, and a transfer mechanism. The transfer mechanism transfers the product to be tested to the area below the substrate positioning mechanism. The substrate positioning mechanism is used to position the relative position of the product to be tested. After positioning, the transfer mechanism is used to transfer the product to be tested into the detection range of the visual inspection mechanism for multi-sided structural inspection.
[0007] Furthermore, the substrate positioning mechanism includes a first Y-axis module, a first camera, and a second camera, wherein the first camera and the second camera are fixedly mounted and movably mounted on the first Y-axis module, respectively.
[0008] Furthermore, the device uses the movement of the second camera on the first Y-axis module to determine the relative position of products of different sizes.
[0009] Furthermore, the visual inspection mechanism includes multiple cameras installed in a staggered manner for inspecting the multifaceted structure of the product under test. The cameras include an upper detection camera, a lower detection camera, an upper edge detection camera, a lower edge detection camera, and a side detection camera.
[0010] Furthermore, the visual detection mechanism includes a first laser rangefinder, a second laser rangefinder, and a third laser rangefinder, which can respectively form upper, lower, and side laser dot arrays.
[0011] Furthermore, the first laser rangefinder and the third laser rangefinder are arranged opposite to each other and are used to detect the height values of the circuit lines on the upper and lower sides of the product under test, respectively, while the second laser rangefinder is used to detect the height values of the circuit lines on the side of the product under test.
[0012] Furthermore, the transfer mechanism includes an X-axis module, a second Y-axis module, a DD motor, and an adsorption platform. The DD motor is used to drive the adsorption platform to move on the X-axis module and the second Y-axis module. The X-axis module and the second Y-axis module are fixed on the base.
[0013] Furthermore, after the relative position of the product under test is determined, for any misaligned portion that deviates from the detection range of the visual inspection mechanism, the transfer mechanism performs compensating movements in the X, Y, and θ directions, where the θ direction is a horizontal plane rotation, so that the product under test remains horizontal with the inspection surface.
[0014] Furthermore, the camera is connected to an adjustment structure for adjusting the position of the camera.
[0015] Compared with the prior art, the present invention has the following beneficial effects:
[0016] (1) The cooperation between the substrate positioning mechanism and the vision inspection mechanism improves the size compatibility and multi-faceted structure inspection efficiency of the inspected products: First, the substrate positioning mechanism of this utility model is key to the use of a dynamically adjustable Y-axis motion module with variable diameter structure. This structure can accurately adapt to and position substrates of different shapes and sizes. Then, through precise transfer action, the system can stably and accurately transport substrates of various specifications to the inspection range of the vision inspection mechanism. This fundamentally solves the problem that the inspection surface is easily deviated from the inspection range due to the limitation of the camera inspection range of the existing equipment, resulting in the inability to accurately detect the corner position of the product. This significantly improves the size compatibility of the inspected products. Second, the vision inspection mechanism of this utility model uses multiple staggered cameras, which can simultaneously perform efficient and synchronous image acquisition and processing of the integrated circuit printing status of multiple sides of the product under test, and determine whether there are defects. This effectively simplifies the step-by-step inspection process of the traditional method, which requires multiple rotations, flips, and repositioning of the substrate. This greatly reduces the risk of cumulative error caused by repeated positioning and directly shortens the inspection time by several times.
[0017] (2) Significantly Reduced Detection System Costs: For the detection of the critical parameter of integrated circuit printing height, this invention abandons the traditional approach relying on high-cost 3D cameras and instead selects a high-precision laser ranging sensor. While meeting the same detection accuracy requirements, the laser ranging sensor has significantly lower hardware procurement costs, system integration complexity, and subsequent maintenance costs compared to a 3D vision system. This alternative solution, while ensuring the reliability of the core detection function, effectively reduces the overall manufacturing cost of the equipment and the investment threshold for end users, thereby enhancing the product's market competitiveness. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of a multi-sided AOI inspection device.
[0019] Figure 2 A schematic diagram of the substrate positioning assembly structure;
[0020] Figure 3 This is a schematic diagram of the visual inspection component structure;
[0021] Figure 4 This is a magnified view of a portion of the laser rangefinder sensor structure.
[0022] Figure 5 This is a schematic diagram of the transfer component structure;
[0023] Figure 6 This is a schematic diagram of the substrate inspection surface;
[0024] Explanation of reference numerals in the attached drawings: Substrate positioning mechanism-1, First Y-axis module-11, First camera-12, Second camera-13, Visual inspection mechanism-2, Upper detection camera-21, Lower detection camera-22, Upper edge detection camera-23, Lower edge detection camera-24, Side detection camera-25, First laser rangefinder-26, Second laser rangefinder-27, Third laser rangefinder-28, Transfer mechanism-3, X-axis module-31, Second Y-axis module-32, DD motor-33, Adsorption platform-34, Upper side-4, Lower side-5, Upper side edge-6, Lower side edge-7, Side side-8. Detailed Implementation
[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below in conjunction with the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0026] As described in the background section of this utility model, side-line 3D printing and packaging technology, as a cutting-edge method, has attracted widespread attention due to its potential in forming complex structures and improving overall product productivity. The printed line structure needs to undergo comprehensive defect inspection, but manual inspection suffers from problems such as low efficiency and difficulty in quickly and reliably identifying and screening defective products generated in real time during production. Furthermore, when facing the inspection needs of products of different sizes, existing technologies are limited by the camera's detection range; without accurate positioning, the surface to be inspected easily deviates from the detection range, resulting in inaccurate detection of the product's edges and corners. Therefore, existing technologies still struggle to quickly and accurately adapt to the inspection requirements of products of different sizes, limiting inspection flexibility and accuracy. This utility model aims to provide a multi-sided AOI inspection device to solve the above-mentioned technical problems.
[0027] like Figure 1 As shown, the multi-faceted AOI inspection device of this utility model includes a substrate positioning mechanism 1, a vision inspection mechanism 2, and a transfer mechanism 3. The substrate positioning mechanism 1 is used for positioning products of different sizes, the vision inspection mechanism 2 is used for inspecting the multi-faceted structure of the product under test, and the transfer mechanism 3 is used for transferring the product under test. The transfer mechanism 3 transfers the product under test to below the substrate positioning mechanism 1. The substrate positioning mechanism 1 is used to position the relative position of the product under test. After positioning, the transfer mechanism 3 transfers the product under test into the detection range of the vision inspection mechanism 2 for multi-faceted structure inspection.
[0028] like Figure 2 As shown, the substrate positioning mechanism 1 includes a first Y-axis module 11, a first camera 12, and a second camera 13. The first camera 12 is fixedly mounted on the first Y-axis module 11, and the second camera 13 is movably mounted on the first Y-axis module 11 for detecting diameter changes and is compatible with substrates of different sizes. This device completes the relative position positioning of products to be tested of different sizes by moving the second camera 13 on the first Y-axis module 11.
[0029] like Figure 3 and Figure 4 As shown, the visual inspection mechanism 2 includes multiple cameras installed in a staggered manner for inspecting the multifaceted structure of the product under test. The cameras include an upper detection camera 21, a lower detection camera 22, an upper edge detection camera 23, a lower edge detection camera 24, and a side detection camera 25. Figure 6 As shown, the cameras are respectively used to detect various complex defects such as wire detachment, short circuits, scratches, foreign object adhesion, and breakage on the upper side 4, lower side 5, upper edge 6, lower edge 7, and side surface 8 of the product. The cameras can also be connected to an adjustment structure to adjust their position. Furthermore, the visual inspection mechanism 2 includes a first laser rangefinder 26, a second laser rangefinder 27, and a third laser rangefinder 28, forming upper, lower, and side laser dot arrays, respectively. The first laser rangefinder 26 and the third laser rangefinder 28 are arranged opposite each other and are used to detect the height values of the circuit lines on the upper and lower sides of the product under test, respectively. The second laser rangefinder 27 is used to detect the height values of the circuit lines on the side surface of the product under test.
[0030] like Figure 5 As shown, the transfer mechanism 3 includes an X-axis module 31, a second Y-axis module 32, a DD motor 33, and an adsorption platform 34. The product to be tested is placed above the adsorption platform 34. The DD motor 33 drives the adsorption platform 34 to move on the X-axis module 31 and the second Y-axis module 32. The X-axis module 31 and the second Y-axis module 32 are fixed on a base. Furthermore, the DD motor 33 can also be used as a rotation mechanism for multi-faceted substrate inspection. After the product to be tested completes its relative positioning, for any misaligned portion deviating from the detection range of the visual inspection mechanism 2, compensation movements in the X, Y, and θ directions can be performed by the transfer mechanism 3 under the drive of the DD motor 33. The θ direction involves horizontal rotation, ensuring the product to be tested remains horizontal with the inspection surface.
[0031] Working principle: The product to be tested is placed above the adsorption platform 34 and moves with the second Y-axis module 32 and X-axis module 31 under the drive of the DD motor 33. The product first moves to the first camera 12 to capture the first positioning point. The second camera 13 then moves with the first Y-axis module 11 to the second positioning point of the product according to different product sizes, completing the relative position positioning of the product. For misaligned parts that deviate from the AOI detection range, the second Y-axis module 32 and X-axis module 31 perform compensation movements in the X, Y, and θ directions under the drive of the DD motor 33. After the motion compensation is completed, the product moves with the adsorption platform 34 to the front, side, and back laser dot matrix composed of the first laser rangefinder 26, the second laser rangefinder 27, and the third laser rangefinder 28 to complete the detection of the circuit height of the front, side, and back of the printed integrated circuit. Finally, it enters the vision inspection mechanism 2, which consists of five cameras installed in a staggered sequence, to detect the circuits on the top 4, bottom 5, top edge 6, bottom edge 7, and side 8 of the printed integrated circuit. The detection sequence is as follows: side detection camera 25 detects the side lines of the product, top detection camera 21 detects the top lines of the product, bottom detection camera 22 detects the back lines of the product, top edge line detection camera 23 detects the top edge lines of the product, and bottom edge line detection camera 24 detects the bottom edge lines of the product.
[0032] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0033] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0034] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the present invention.
Claims
1. A multi-sided AOI inspection device, characterized in that, It includes a substrate positioning mechanism (1), a visual inspection mechanism (2) and a transfer mechanism (3). The transfer mechanism (3) transfers the product to be tested to the area below the substrate positioning mechanism (1). The substrate positioning mechanism (1) is used to position the relative position of the product to be tested. After positioning, the transfer mechanism (3) is used to transfer the product to be tested to the detection range of the visual inspection mechanism (2) for multi-faceted structure inspection.
2. The multi-sided AOI detection device according to claim 1, characterized in that, The substrate positioning mechanism (1) includes a first Y-axis module (11), a first camera (12) and a second camera (13), wherein the first camera (12) and the second camera (13) are fixedly mounted and movably mounted on the first Y-axis module (11), respectively.
3. The multi-sided AOI detection device according to claim 2, characterized in that, The device uses the movement of the second camera (13) on the first Y-axis module (11) to determine the relative position of products of different sizes.
4. The multi-sided AOI detection device according to claim 1, characterized in that, The visual inspection mechanism (2) includes multiple cameras installed in a staggered manner for inspecting the multifaceted structure of the product under test.
5. The multi-sided AOI detection device according to claim 4, characterized in that, The cameras include an upper detection camera (21), a lower detection camera (22), an upper edge detection camera (23), a lower edge detection camera (24), and a side detection camera (25).
6. The multi-sided AOI detection device according to claim 1, characterized in that, The visual inspection mechanism (2) also includes a first laser rangefinder (26), a second laser rangefinder (27) and a third laser rangefinder (28), which respectively form upper, lower and side laser dot arrays.
7. The multi-sided AOI detection device according to claim 6, characterized in that, The first laser rangefinder (26) and the third laser rangefinder (28) are arranged opposite to each other and are used to detect the height values of the circuit lines on the upper and lower sides of the product under test, respectively. The second laser rangefinder (27) is used to detect the height values of the circuit lines on the side of the product under test.
8. The multi-sided AOI detection device according to claim 1, characterized in that, The transfer mechanism (3) includes an X-axis module (31), a second Y-axis module (32), a DD motor (33), and an adsorption platform (34). The DD motor (33) is used to drive the adsorption platform (34) to move on the X-axis module (31) and the second Y-axis module (32). The X-axis module (31) and the second Y-axis module (32) are fixed on the base.
9. The multi-sided AOI detection device according to claim 1, characterized in that, After the relative position of the product under test is located, for the misaligned part that deviates from the detection range of the visual inspection mechanism (2), the transfer mechanism (3) performs compensation movement in the X, Y, and θ directions.
10. The multi-sided AOI detection device according to claim 4, characterized in that, The camera is connected to an adjustment mechanism for adjusting the position of the camera.