An integrated inductor, filtering device, power supply device and electronic device

Abstract

The application discloses an integrated inductor, a filtering device, a power supply device and an electronic device, and relates to the technical field of electronic magnetic elements. The integrated inductor comprises a first magnetic core, a second magnetic core, a first winding and a second winding. The first winding is wound on the first magnetic core body and the second magnetic core body, and the second winding is wound on at least the first magnetic core body. The first winding and the second winding are wound on the first magnetic core body, the winding directions of the second winding and the first winding are opposite, and a common-mode inductance structure is formed. An air gap is formed in the second magnetic core body, and the differential-mode leakage inductance is improved. Based on this, the differential-mode leakage inductance can be improved by using the differential-mode leakage inductance phenomenon of the common-mode inductance. The common-mode noise and the differential-mode noise can be suppressed or reduced, and the differential-mode inductance and the common-mode inductance are designed in a common magnetic circuit, and the integrated inductor is formed, so that the volume is reduced, the occupied space is reduced, and the miniaturization target is achieved.

Description

Technical Field

[0001] This application relates to the field of electronic magnetic components technology, and in particular to an integrated inductor, filter, power supply equipment and electronic equipment. Background Technology

[0002] Currently, in circuits requiring electromagnetic interference (EMI) suppression, differential-mode inductors and common-mode inductors are typically used to suppress differential-mode signal interference and common-mode signal interference, respectively. However, differential-mode inductors and common-mode inductors need to be arranged separately, which occupies a significant amount of space. Utility Model Content

[0003] This application provides an integrated inductor, filter, power supply equipment, and electronic device to reduce space occupation.

[0004] In a first aspect, this application provides an integrated inductor comprising: a first magnetic core, a second magnetic core, a first winding, and a second winding. The first magnetic core includes a first core body and a first hollow region, the first hollow region penetrating the first core body. The second magnetic core includes a second core body, a second hollow region, and an air gap, the second hollow region and the air gap being connected and penetrating the second core body. The second core body and the first core body are stacked along a first direction, and the second hollow region is connected to the first hollow region in the first direction. The first winding passes through the first and second hollow regions and is wound around the first and second core bodies. The second winding at least passes through the first hollow region and is wound around the first core body, with the winding directions of the second winding and the first winding being opposite.

[0005] In the integrated inductor provided in this application embodiment, by winding the first winding around the first magnetic core body and the second magnetic core body, and winding the second winding at least around the first magnetic core body, it is equivalent to having the first winding and the second winding wound on the first magnetic core body, with the winding directions of the second winding and the first winding being opposite, thereby forming a common-mode inductor structure. Furthermore, an air gap is provided on the second magnetic core body to improve differential-mode leakage inductance. Based on this, the integrated inductor in this application embodiment can utilize the differential-mode leakage inductance phenomenon of common-mode inductors to improve differential-mode leakage inductance, thereby suppressing or reducing both common-mode noise and differential-mode noise. This is equivalent to designing a common magnetic circuit for the differential-mode inductor and the common-mode inductor to form an integrated inductor, reducing volume and space occupation, and achieving the goal of miniaturization.

[0006] In addition, the first and second magnetic core bodies are stacked one on top of the other rather than nested inner and outer rings, which maximizes the protection of the winding windows of the first and second windings from the impact, improves the problem of small core opening area and high winding difficulty, and reduces processing difficulty.

[0007] In one possible implementation, the first magnetic core body is shaped as a closed ring in the first direction. The area enclosed by the inner side of the closed ring is a first hollow region, which can also be called a window. In other words, the first magnetic core body has a complete magnetic circuit structure without air gap, and its magnetic circuit is in the shape of a closed ring (such as an O-shape or a ring), which can enable the formed common-mode inductor structure to achieve high permeability, low leakage flux, low loss, and high reliability.

[0008] In one possible implementation, the first magnetic core body is a racetrack-shaped magnetic core, a toroidal magnetic core, a rectangular magnetic core, or an elliptical magnetic core. The structures and processes of these magnetic cores are relatively mature, making the implementation of the first magnetic core body relatively simple, thereby reducing design difficulty and production costs.

[0009] In one possible implementation, the first magnetic core body is an amorphous nanocrystalline ribbon magnetic core. Amorphous nanocrystalline ribbon magnetic cores have advantages such as high permeability and small size, which can further improve the differential mode leakage inductance in the common mode inductor formed based on the amorphous nanocrystalline ribbon magnetic core, and improve the problem of low differential mode leakage inductance of the amorphous nanocrystalline ribbon magnetic core itself.

[0010] In one possible implementation, the second magnetic core body comprises two C-shaped magnetic cores or two U-shaped magnetic cores with their openings facing each other. This simplifies the implementation of the second magnetic core body, reducing design complexity and production costs.

[0011] In one possible implementation, the second magnetic core further includes a third hollow region that penetrates the main body of the second magnetic core. The third hollow region and the second hollow region are located on opposite sides of the air gap in a second direction and are connected through the air gap, with the second direction intersecting the first direction. Furthermore, the third hollow region is connected to the first hollow region in the first direction, and the second winding passes through both the first and third hollow regions and is wound around the main bodies of the first and second magnetic cores. Based on this, not only is the first winding wound around the main bodies of the first and second magnetic cores, but the second winding is also wound around the main bodies of the first and second magnetic cores, which can further improve differential mode leakage inductance.

[0012] For example, the area of ​​the cross-section of the second hollow region can be the same as or approximately the area of ​​the cross-section of the third hollow region, thereby improving the stability and reliability of the second magnetic core. The cross-sections of the second and third hollow regions are respectively perpendicular to the first direction.

[0013] In one possible implementation, the second magnetic core body includes two C-shaped magnetic core groups arranged along a second direction, each C-shaped magnetic core group comprising two C-shaped magnetic cores with their openings facing each other. Based on this, the implementation of the second magnetic core body can be relatively simple, thereby reducing design difficulty and production costs.

[0014] In one possible implementation, the second magnetic core body includes two E-shaped magnetic cores with their openings facing each other. This simplifies the implementation of the second magnetic core body, reducing design complexity and production costs.

[0015] In one possible implementation, the second magnetic core body includes two U-shaped magnetic core groups arranged along a second direction, each U-shaped magnetic core group comprising two U-shaped magnetic cores with their openings facing each other. Based on this, the implementation of the second magnetic core body can be relatively simple, thereby reducing design difficulty and production costs.

[0016] In one possible implementation, the second magnetic core body is an amorphous nanocrystalline ribbon magnetic core, an iron powder magnetic core, a ferrite magnetic core, or a silicon steel magnetic core. This simplifies the implementation of the second magnetic core body, thereby reducing design complexity and production costs.

[0017] In one possible implementation, the first winding and the second winding have the same number of turns. This simplifies the implementation of integrated inductors, reducing design complexity and production costs. Furthermore, it improves the reliability and stability of the integrated inductor.

[0018] In one possible implementation, the conductors of at least one of the first winding and the second winding include single-core or multi-core wires, which can make the implementation of integrated inductors relatively simple, thereby reducing design difficulty and production costs.

[0019] In one possible implementation, at least one of the first winding and the second winding is a single-layer winding structure or a multi-layer winding structure, which makes the integrated inductor relatively simple to implement, thereby reducing design difficulty and production costs.

[0020] In one possible implementation, at least one of the first winding and the second winding is a three-dimensional copper wire winding or a planar printed circuit board winding. Based on this, the integrated inductor can be made relatively simple to implement, thereby reducing design difficulty and production costs.

[0021] Secondly, this application provides a filtering device that includes the integrated inductor in the first aspect or various embodiments of the first aspect, which can reduce the area occupied by the filtering device.

[0022] Thirdly, this application provides a power supply device, which includes: a power supply input terminal, a power supply output terminal, a power conversion device, and a filtering device. In the filtering device, a first end of a first winding is connected to the positive terminal of the power supply input terminal, and a second end of the first winding is connected to the positive terminal of the power conversion device's input terminal. A first end of a second winding in the filtering device is connected to the negative terminal of the power supply input terminal, and a second end of the second winding is connected to the negative terminal of the power conversion device. The positive terminal of the power conversion device's output terminal is connected to the positive terminal of the power supply output terminal, and the negative terminal of the power conversion device's output terminal is connected to the negative terminal of the power supply output terminal. Furthermore, since the filtering device is the same as in the second aspect or any embodiment of the second aspect, the footprint of the power supply device can be reduced.

[0023] Fourthly, this application provides an electronic device, which includes a power-consuming device and a power supply device, wherein the power supply output terminal of the power supply device is connected to the power-consuming device. The power supply device is the power supply device described in the third aspect or any of the embodiments of the third aspect.

[0024] Furthermore, the technical effects of the corresponding solutions in the second to fourth aspects can be referred to the technical effects that can be obtained by the corresponding solutions in the first aspect, and the repetitions will not be detailed. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of an electronic device in an embodiment of this application;

[0026] Figure 2 This is a schematic diagram of a power supply device in an embodiment of this application;

[0027] Figure 3 This is a schematic diagram illustrating the effect of inductance on differential-mode noise voltage in a power conversion device.

[0028] Figure 4 This is a circuit diagram of a filtering device;

[0029] Figure 5 This is a schematic diagram illustrating the working principle of a differential mode inductor.

[0030] Figure 6 This is a schematic diagram illustrating the working principle of a common-mode inductor.

[0031] Figure 7 This is a circuit diagram of the filtering device in the embodiments of this application;

[0032] Figure 8A This is a front view of the integrated inductor in an embodiment of this application;

[0033] Figure 8B This is a front view of the magnetic core in the integrated inductor in an embodiment of this application;

[0034] Figure 9A This is a top view of the integrated inductor in an embodiment of this application;

[0035] Figure 9B This is a top view of the magnetic core in the integrated inductor in an embodiment of this application;

[0036] Figure 9C This is a top view of the first magnetic core in the integrated inductor in an embodiment of this application;

[0037] Figure 9D This is a top view of the second magnetic core in the integrated inductor in an embodiment of this application;

[0038] Figure 10A This is a side view of the integrated inductor in an embodiment of this application;

[0039] Figure 10B This is a side view of the magnetic core in the integrated inductor in an embodiment of this application;

[0040] Figure 11 This is yet another top view of the second magnetic core in the integrated inductor in the embodiments of this application;

[0041] Figure 12 This is yet another top view of the second magnetic core in the integrated inductor in the embodiments of this application;

[0042] Figure 13 This is a schematic diagram showing the relationship between the inductance of the differential mode leakage inductance and the frequency in an embodiment of this application.

[0043] Figure label:

[0044] 1-Electronic equipment; 100-Power supply equipment; 110-Filtering device; 120-Power conversion device; 200-Electrical equipment; 300-First magnetic core; 310-First magnetic core body; 320-First hollow region; 400-Second magnetic core; 410-Second magnetic core body; 411Z1 / 411Z2-Type C magnetic core assembly;

[0045] 411Z3 / 411Z4-U type magnetic core assembly; 411a1 / 411a2 / 411b1 / 411b2-C type magnetic core; 411c1 / 411c2-E type magnetic core;

[0046] 411d1 / 411d2 / 411e1 / 411e2 - U-shaped magnetic core; 421 - Second hollow region; 422 - Third hollow region; 430 - Air gap; 510 - First winding;

[0047] 520 - Second winding; Pin1 - Power input terminal; Pout1 - Power output terminal; L0 - Integrated inductor; L1 - Common mode inductor; Y1 / Y2 / Y3 / Y4 - Common mode capacitor; X1 / X2 / X3 - Differential mode capacitor; L2 / L3 - Differential mode inductor; M1 / M2 - Magnetic core; W1 / W2 / W3 - Winding; Ia1 / Ia2 / Ib1 / Ib2 / Ic1 / Ic2 - Current signal; F1 - First direction; F2 - Second direction. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. The specific operational methods in the method embodiments can also be applied to the device embodiments or system embodiments. It should be noted that in the description of this application, "multiple" can be understood as "at least two". Furthermore, it should be understood that in the description of this application, terms such as "first" and "second" are used only for distinguishing purposes and should not be construed as indicating or implying relative importance, nor as indicating or implying order.

[0049] It should be understood that the term "and / or" used in this application describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects have an "or" relationship.

[0050] Furthermore, in the embodiments of this application, "connection" refers to electrical connection. The connection between two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components, such as the connection between A and B. Alternatively, it can be a direct connection between A and C, with C directly connected to B, and A and B connected through C.

[0051] It should be noted that the same reference numerals in the accompanying drawings of this application denote the same or similar structures, and therefore repeated descriptions of them will be omitted. Terms expressing position and direction described in this application are illustrative based on the accompanying drawings, but may be modified as needed, and all modifications are included within the scope of protection of this application. The accompanying drawings of this application are for illustrating relative positional relationships only and do not represent actual scale.

[0052] The following explains the terms that may appear in the embodiments of this application.

[0053] Power density: A measure of how much power can be processed within a given space; it can be quantified as the amount of power processed per unit volume, measured in watts per cubic meter (W / m³). 3 ) or watts per cubic inch (W / in)3 ).

[0054] Power inductors are inductor components that store and release energy. They are used in power conversion circuits and typically need to withstand large currents and transient power.

[0055] Filtering inductor: A passive component used to suppress noise at a specific frequency. It is often combined with a capacitor to form an inductor (L) capacitor (C) filter to reduce interference in the power supply or signal.

[0056] Current ripple: The periodic fluctuation of the inductor current of a power inductor caused by the periodic switching of switching devices in a power conversion circuit. Its essence is the continuous change of current during the energy storage and release process of the power inductor.

[0057] Switching frequency: The number of times a switching device (such as a metal-oxide-semiconductor field-effect transistor (MOSFET) or an insulated-gate bipolar transistor (IGBT)) in a power conversion circuit periodically turns on and off per unit time, usually measured in Hertz (Hz). It is one of the core parameters in power conversion circuit design, directly affecting the power supply's efficiency, size, electromagnetic interference compatibility, and cost.

[0058] Differential-mode noise: A high-frequency interference signal that exists between two conductors in a power line, signal line, or other loop, flowing in the loop with opposite phases and the same amplitude. Its core characteristic is that the noise current flows in opposite directions on the two conductors, forming a closed loop.

[0059] Common-mode noise: A high-frequency interference signal that exists simultaneously between power lines, signal lines, and reference ground (or chassis), flowing in a loop with the same phase and amplitude. Its core characteristic is that the noise current is in the same direction on both conductors and forms a loop to ground through parasitic capacitance or inductance.

[0060] Differential-mode inductor: A passive component used to suppress differential-mode noise. It is usually connected in series between the positive and negative conductors of the power line or signal line. Through its inductive reactance characteristics, it impedes the flow of high-frequency differential-mode current, thereby reducing differential-mode noise in the power line or signal line and purifying the transmission path of the power or signal.

[0061] Differential-mode capacitors, also known as X capacitors, are safety capacitors used to filter out differential-mode noise, connected between the positive and negative terminals of power or signal lines. Their core function is to bypass high-frequency differential-mode noise interference through a low-impedance path, preventing differential-mode noise from propagating along the conductor.

[0062] Common-mode inductor: A type of dual-winding magnetic core inductor used to suppress common-mode noise. Its structural feature is that two sets of coils are wound on the same magnetic core, presenting high impedance to common-mode current and extremely low impedance to differential-mode current.

[0063] Common-mode capacitor: also known as Y capacitor, is a safety capacitor used to connect the power line to ground (or metal casing) or the signal line to ground (or metal casing). It is used to bypass common-mode noise to ground and prevent it from interfering with other devices through radiation or conduction.

[0064] Differential-mode leakage inductance of a common-mode inductor: This refers to the residual inductance generated by the incomplete coupling between the windings of a common-mode inductor in practical applications. This inductance plays a role in the differential-mode current path. Specifically, when differential-mode currents (i.e., currents of equal magnitude but opposite direction) flow through the two windings of a common-mode inductor, due to imperfect magnetic coupling, some magnetic flux fails to cancel each other out, thus forming an effective inductance value. This residual inductance is the differential-mode leakage inductance.

[0065] Amorphous powders, also known as amorphous materials, are a large class of rigid solids whose constituent atoms and molecules do not exhibit periodicity or translational symmetry. The long-range order of crystalline materials is disrupted, and due to interatomic interactions, they possess short-range order within small regions of a few atoms (or molecules). Magnetic cores formed by pressing and coating powders of this type of material are called amorphous powder cores.

[0066] Nanocrystalline powder: A type of polycrystalline material with a crystal size of approximately several nanometers (usually defined as crystals or grains smaller than 100 nanometers). In contrast to amorphous materials, it retains the long-range order of its crystalline state. Magnetic cores formed by pressing and coating powders of this type of material are called nanocrystalline powder cores.

[0067] Amorphous and nanocrystalline ribbon magnetic cores: Amorphous and nanocrystalline ribbon magnetic cores are magnetic components made from special soft magnetic materials. Their definition and core characteristics are as follows: Amorphous ribbons are ribbon-like materials processed from amorphous powder through processes such as sintering, melting, annealing, and spinning. Magnetic cores formed based on amorphous ribbons are commonly referred to as amorphous ribbon magnetic cores. Nanocrystalline ribbons are ribbon-like materials processed from nanocrystalline powder through processes such as sintering, melting, annealing, and spinning. Magnetic cores formed based on nanocrystalline ribbons are commonly referred to as nanocrystalline ribbon magnetic cores. "Amorphous and nanocrystalline ribbon magnetic core" refers to a magnetic core that is either an amorphous ribbon magnetic core or a nanocrystalline ribbon magnetic core.

[0068] Iron powder magnetic core: A magnetic core produced by mixing, pressing and coating high-purity iron powder or hydroxyl iron powder.

[0069] Ferrite core: A magnetic core made of a dense, homogeneous ceramic-structured nonmetallic magnetic material, consisting of iron oxide (Fe2O3) and oxides or carbonate compounds of one or more other metals (e.g., manganese, zinc, nickel, magnesium).

[0070] Silicon steel magnetic core: A soft magnetic core made of iron-silicon alloy (Fe-Si) as the base material.

[0071] Magnetic permeability: Magnetic permeability is the degree of magnetization of a material in response to an applied magnetic field. It is divided into absolute permeability and relative permeability. Absolute permeability is equal to the ratio of magnetic induction intensity B to magnetic field strength H. The absolute permeability of vacuum is 4π × 10⁻⁶. -7 H / m. Relative permeability is the ratio of the absolute permeability of a material to the absolute permeability of vacuum. For common materials, relative permeability is generally used to refer to permeability.

[0072] Magnetic circuit: A closed loop containing magnetic flux. It generally contains a portion of material with a relative permeability > 1, such as permanent magnets, ferromagnetic materials, and electromagnets, but may also contain air gaps and other materials.

[0073] Air gap: The air gap in a magnetic circuit, often simply called an air gap.

[0074] Magnetic core saturation: For ferromagnetic materials, there is a specific value of magnetic permeability. When the external magnetic field strength H is greater than this specific value, the change in the internal magnetic induction intensity B of the material caused by further increasing the magnetic field strength can be ignored. At this time, the magnetization intensity of the material is close to a constant value. This phenomenon is called magnetic saturation.

[0075] Core opening area: refers to the cross-sectional area of ​​the window region in a magnetic element (such as a transformer or inductor) that can be used to wind a coil.

[0076] Single-core wire: A wire consisting of a single metal conductor (such as copper or aluminum) wrapped with an outer insulation layer.

[0077] Multi-core wire: Composed of multiple thin conductors twisted together, it is divided into two categories: ordinary multi-core wire and stranded multi-core wire. Ordinary multi-core wire is usually based on multiple thin conductors simply twisted together and sharing a common insulation layer. Stranded multi-core wire is usually based on each thin conductor being individually insulated before being twisted together, and is suitable for optimizing high-frequency performance.

[0078] Single-layer winding: The guide wire is wound in only one layer on the magnetic core or frame, with no overlap between adjacent turns.

[0079] Multi-layer winding: The guide wire is wound in multiple layers on the magnetic core or frame, with each layer isolated by insulating material.

[0080] Close winding: A winding method in which adjacent turns of the guide wire are tightly fitted together without gaps during winding.

[0081] Intermittent winding: A winding method in which the guide wire is wound with a uniform gap between adjacent turns.

[0082] Layered flat winding: A winding method in which the guide wires are stacked layer by layer in a layered structure, with the conductors arranged in parallel within each layer.

[0083] Random winding: The guide wire is wound without a fixed pattern, and the turns overlap and intersect (also known as "scattered winding").

[0084] Honeycomb winding: a special winding method in which wires are wound at a certain angle to form a honeycomb structure.

[0085] Three-dimensional copper wire winding: an inductor structure formed by winding copper wire (single core or multiple strands) in three-dimensional space, commonly found in traditional wire-wound inductors or transformers.

[0086] Planar PCB winding: The inductor structure is formed by etching the copper layer of a printed circuit board (PCB) into a spiral coil, which is a two-dimensional planar design.

[0087] To facilitate understanding of the integrated inductor provided in this application embodiment, its application scenarios are first introduced below. The integrated inductor provided in this application embodiment can be applied to electronic devices that require EMI suppression. Electronic devices include, but are not limited to, terminal devices and communication devices. Among them, terminal devices include, but are not limited to, devices such as computers. Communication devices include, but are not limited to, wireless network devices (e.g., wireless base stations), fixed network devices, server devices, and smart broadband devices. It is understood that the specific implementation of the electronic device can be determined according to the actual application scenario, and is not limited here.

[0088] Figure 1 This is a schematic diagram of an electronic device in an embodiment of this application, with reference to... Figure 1 Electronic device 1 includes a power supply device 100 and a power consumption device 200. The power supply device 100 includes a power input terminal Pin1 and a power output terminal Pout1. The power input terminal Pin1 is used to receive voltage V1, and the power output terminal Pout1 is used to connect to the power consumption device 200. The power supply device 100 is used to boost or buck the voltage V1 to a voltage V2 suitable for the power consumption device 200, and then output it to the power consumption device 200 to supply power. Exemplarily, the power consumption device 200 is the load in electronic device 1. Voltages V1 and V2 can be direct current (DC) voltage or alternating current (AC) voltage. Exemplarily, the power supply device 100 can be a switching power supply. In other embodiments of this application, the power supply device 100 can also be other power sources, and this application does not limit it.

[0089] Understandably, Figure 1 The hardware structure of the illustrated electronic device does not constitute a limitation on the electronic device in the embodiments of this application. That is, the electronic device in the embodiments of this application may include more or fewer components than illustrated, may combine two or more components, or may have different component configurations. Furthermore, Figure 1 The various components shown can be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing and / or application-specific integrated circuits.

[0090] Figure 2 This is a schematic diagram of a power supply device in an embodiment of this application, with reference to... Figure 2 The power supply device 100 includes a power conversion device 120 and a filter device 110. The filter device 110 is connected to the positive and negative terminals of the power supply input pin 1, the positive terminal of the power supply input pin 1, the positive terminal of the power conversion device 120 input pin 2, and the negative terminal of the power conversion device 120 input pin 2. The positive terminal of the power conversion device 120 output pin Pout 2 is connected to the positive terminal of the power supply output pin Pout 1, and the negative terminal of the power conversion device 120 output pin Pout 2 is connected to the negative terminal of the power supply output pin Pout 1. The filter device 110 is used to filter the voltage at the power supply input pin 1 to reduce or suppress EMI. The power conversion device 120 is used to boost or buck the voltage V1 at the power supply input pin 1 to a voltage V2 suitable for the power supply device 200, and then output it through the power supply output pin Pout 1.

[0091] Understandably, Figure 2 In the diagram, "+" represents the positive electrode and "-" represents the negative electrode.

[0092] In some embodiments, the power conversion device 120 typically includes switching devices, inductors, capacitors, and other components. Voltage conversion is achieved by controlling the switching devices to turn on and off, thereby charging and discharging the inductors and capacitors. In practical applications, an important parameter of the power supply device 100 is its power density. Since power density is a measure of how much power can be processed within a given space, it can be quantified as the amount of power processed per unit volume. These values ​​can be calculated based on the rated power of the power supply device 100 and the enclosure volume of the power supply device 100 (e.g., the enclosure volume can be the product of the length, width, and height of the structure formed by all components included, i.e., length × width × height). Based on this, it can be seen that an effective way to improve power density is to reduce the size of the power supply device 100 while keeping the input power constant. In the power supply device 100, the volume of passive components such as inductors, capacitors, and transformers accounts for the majority of the total volume of the power supply device 100, thus becoming a key bottleneck for improving power density. Currently, the size of passive components can be reduced by increasing the switching frequency of the switching devices in the power conversion device 120. In the power conversion device 120, passive components such as inductors and capacitors store and release energy during each switching cycle. The higher the switching frequency, the less energy is stored per switching cycle. For example, the design formula for the inductor in the buck converter is as follows:

[0093]

[0094] Where L represents the power inductance value of the inductor in the power conversion device 120, D represents the duty cycle of the switching device in the power conversion device 120, and ΔI L f represents the inductor current ripple of the inductor in the power conversion device 120. sw V represents the switching frequency of the switching devices in the power conversion device 120. L This represents the voltage across the inductor in the power conversion device 120. Based on this formula, it can be seen that the power inductance value L is related to the switching frequency f. sw Inversely proportional to the switching frequency f sw As the value of the power inductance increases, the required power inductance value L decreases, and the volume of the inductor in the corresponding power conversion device 120 also decreases, thereby saving space and reducing the size of the power supply equipment 100.

[0095] While reducing the inductance in the power conversion device 120 significantly reduces its size, it presents a considerable challenge for the filter device 110. (Combined) Figure 3 And the following formula, Figure 3 This is a schematic diagram illustrating the effect of the inductor on the differential-mode noise voltage in a power conversion device. V ds L represents the voltage across the switching devices in the power conversion device 120.b C represents the inductor in the power conversion device 120. x Represents differential-mode capacitor, V dm Represents the differential-mode noise voltage, R LN Representing the load. A reduction in the size of the inductor in the power conversion device 120 leads to an increase in differential-mode noise. The relationship between differential-mode noise and the inductor in the power conversion device 120 is as follows:

[0096]

[0097] Among them, V dm Represents the differential-mode noise voltage, V ds C represents the voltage across the switching devices in the power conversion device 120. x Represents differential-mode capacitance, f sw Let L represent the switching frequency of the switching devices in the power conversion device 120, and let L represent the power inductance value of the inductor in the power conversion device 120. Based on this formula, it can be seen that while decreasing the power inductance value L can reduce the size of the power conversion device 120, it also reduces V... dm This will increase, leading to an increase in differential-mode noise. To mitigate this effect, the differential-mode capacitance C needs to be increased. x This results in an increase in the area of ​​the filter device 110. Consequently, the reduction in the size of the power conversion device 120 due to the increased switching frequency is attributed to the increased area of ​​the filter device 110.

[0098] Figure 4 This is a circuit diagram of a filtering device, refer to... Figure 4 The filter device 110 includes: a common-mode inductor L1, common-mode capacitors Y1, Y2, Y3, and Y4, differential-mode capacitors X1, X2, and X3, and differential-mode inductors L2 and L3. The connection relationships of the common-mode inductors L1, Y1, Y2, Y3, and Y4, the differential-mode capacitors X1, X2, and X3, and the differential-mode inductors L2 and L3 can be referenced. Figure 4 The specifics are not elaborated here. Common-mode inductors L1 and common-mode capacitors Y1, Y2, Y3, and Y4 are used to suppress or reduce common-mode noise in the conducted emission (CE) band, while differential-mode capacitors X1, X2, and X3 and differential-mode inductors L2 and L3 are used to suppress or reduce differential-mode noise in the CE band. Typically, one way to address increased differential-mode noise is to increase the capacitance values ​​of differential-mode capacitors X1, X2, and X3, and the inductance values ​​of differential-mode inductors L2 and L3. Another way is to increase the number of differential-mode capacitors X1, X2, and X3, and the number of differential-mode inductors L2 and L3. However, both of these methods increase the area of ​​the filter device 110.

[0099] Figure 5 This is a schematic diagram illustrating the working principle of a differential mode inductor, refer to... Figure 5 The differential-mode inductor includes a magnetic core M1 and a winding W1, with the winding W1 wound unidirectionally on the magnetic core M1. The differential-mode noise in the circuit consists of current signals Ia1 and Ia2 generated in opposite directions between the two input power lines. When current signal Ia1 flows through winding W1, the direction of the generated magnetic field is Fa1; when current signal Ia2 flows through winding W1, the direction of the generated magnetic field is Fa2. This causes a reverse induced electromotive force when current signals Ia1 and Ia2 flow through winding W1, thereby suppressing or reducing the time-varying trend of differential-mode noise and achieving the effect of separating signal and noise in the circuit.

[0100] Figure 6 This is a schematic diagram illustrating the working principle of a common-mode inductor, where... Figure 6 (a) in the diagram shows the working principle of common-mode noise flowing through a common-mode inductor. Figure 6 (b) shows the working principle diagram when differential-mode noise flows through a common-mode inductor. (Refer to...) Figure 6 In (a) and (b) of the diagram, the common-mode inductor includes a magnetic core M2 and two windings W2 and W3 with opposite winding directions. The common-mode noise in the circuit consists of current signals Ib1 and Ib2 on two signal lines, both in the same direction and connected to ground. When current signals Ib1 and Ib2 flow through windings W2 and W3 respectively, the magnetic flux generated by these two windings can superimpose due to their opposite winding directions, resulting in a considerable inductance and thus filtering out common-mode interference signals. When the differential-mode noise current signals Ic1 and Ic2 flow through windings W2 and W3 respectively, the generated magnetic flux cancels each other out, preventing the generation of a reverse induced electromotive force and thus having no effect on the differential-mode current.

[0101] In some embodiments, due to the presence of leakage flux in the magnetic core and the difficulty in achieving perfect symmetry in the two windings of a common-mode inductor, the common-mode inductor still exhibits a certain inductive effect for differential-mode current. This phenomenon is referred to as differential-mode leakage inductance of the common-mode inductor. Based on this, embodiments of this application provide an integrated inductor that utilizes the differential-mode leakage inductance phenomenon of the common-mode inductor to increase the differential-mode leakage inductance. This can suppress or reduce both common-mode and differential-mode noise, effectively combining the differential-mode and common-mode inductors into a common magnetic circuit design to form an integrated inductor, thereby reducing size and achieving miniaturization.

[0102] Figure 7 This is a circuit diagram of the filtering device in the embodiments of this application, with reference to... Figure 7The filtering device 110 includes: an integrated inductor L0, common-mode capacitors Y1, Y2, Y3, and Y4, and differential-mode capacitors X1 and X3. The integrated inductor L0 and common-mode capacitors Y1, Y2, Y3, and Y4 are used to suppress or reduce common-mode noise in the CE band, while the differential-mode capacitors X1 and X3 are used to suppress or reduce differential-mode noise in the CE band. The integrated inductor L0 is also used to suppress or reduce differential-mode noise in the CE band. Specifically, the first end a1 of the first winding 510 of the integrated inductor L0 is connected to the positive terminal of the power supply input terminal Pin1, the second end a2 of the first winding 510 is connected to the positive terminal of the power conversion device 120 input terminal Pin2, the first end a3 of the second winding 520 of the integrated inductor L0 is connected to the negative terminal of the power supply input terminal Pin1, and the second end a4 of the second winding 520 is connected to the negative terminal of the power conversion device 120. Furthermore, through... Figure 7 and Figure 4 In contrast, the integrated inductor L0 in the embodiments of this application can replace... Figure 4 The common-mode inductor L1, differential-mode capacitor X2, and differential-mode inductors L2 and L3 reduce the footprint of the filter device 110. Furthermore, the connection relationships of common-mode capacitors Y1, Y2, Y3, and Y4, and differential-mode capacitors X1 and X3 can be referenced... Figure 7 The specifics will not be elaborated here.

[0103] Figure 8A This is a front view of the integrated inductor in an embodiment of this application. Figure 8B This is a front view of the magnetic core in the integrated inductor in an embodiment of this application. Figure 9A This is a top view of the integrated inductor in an embodiment of this application. Figure 9B This is a top view of the magnetic core in the integrated inductor in an embodiment of this application. Figure 9C This is a top view of the first magnetic core in the integrated inductor in an embodiment of this application. Figure 9D This is a top view of the second magnetic core in the integrated inductor in an embodiment of this application. Figure 10A This is a side view of the integrated inductor in an embodiment of this application. Figure 10B This is a side view of the magnetic core in the integrated inductor in an embodiment of this application.

[0104] Reference Figure 8A , Figure 8B , Figures 9A to 9D , Figure 10A as well as Figure 10BThe integrated inductor in this embodiment may include: a first magnetic core 300, a second magnetic core 400, a first winding 510, and a second winding 520. The first magnetic core 300 includes a first magnetic core body 310 and a first hollow region 320, with the first hollow region 320 penetrating the first magnetic core body 310. The second magnetic core 400 includes a second magnetic core body 410, a second hollow region 421, and an air gap 430, with the second hollow region 421 and the air gap 430 connected and penetrating the second magnetic core body 410. The second magnetic core body 410 and the first magnetic core body 310 are stacked along a first direction F1, and the second hollow region 421 is connected to the first hollow region 320 in the first direction F1. The first winding 510 passes through the first hollow region 320 and the second hollow region 421 and is wound around the first magnetic core body 310 and the second magnetic core body 410. The second winding 520 at least passes through the first hollow region 320 and is wound around the first magnetic core body 310. Furthermore, the second winding 520 and the first winding 510 are wound in opposite directions.

[0105] In the integrated inductor provided in this embodiment, by winding the first winding 510 around the first magnetic core body 310 and the second magnetic core body 410, and winding the second winding 520 around at least the first magnetic core body 310, it is equivalent to having the first winding 510 and the second winding 520 wound on the first magnetic core body 310, with the winding directions of the second winding 520 and the first winding 510 opposite, thereby forming a common-mode inductor structure. Furthermore, an air gap 430 is provided on the second magnetic core body 410 to improve the differential-mode leakage inductance. Based on this, the integrated inductor in this embodiment can utilize the differential-mode leakage inductance phenomenon of the common-mode inductor to improve the differential-mode leakage inductance, thereby suppressing or reducing both common-mode noise and differential-mode noise. This is equivalent to designing a common magnetic circuit for the differential-mode inductor and the common-mode inductor to form an integrated inductor, reducing volume and space occupation, and achieving the goal of miniaturization.

[0106] In addition, the first magnetic core body 310 and the second magnetic core body 410 are stacked on top of each other rather than nested inner and outer rings, which maximizes the protection of the winding windows of the first winding 510 and the second winding 520 from being affected, improves the problem of small magnetic core opening area and high winding process difficulty, and reduces processing difficulty.

[0107] For example, refer to Figure 9A The first winding 510 and the second winding 520 are wound around the side posts of the first magnetic core body 310 and the second magnetic core body 410.

[0108] For example, refer to Figure 9C The first hollow region 320 refers to the region surrounded by the first magnetic core body 310.

[0109] For example, refer to Figure 9CThe first magnetic core body 310 has a closed ring shape in the first direction F1, and the area enclosed by the inner side of the closed ring is the first hollow region 320, which can also be called a window. In other words, the first magnetic core body 310 has a complete magnetic circuit structure without air gap 430, and its magnetic circuit is in the shape of a closed ring (such as an O-shape or ring), which can enable the formed common mode inductor structure to achieve high permeability, low leakage flux, low loss, and high reliability.

[0110] In one embodiment of this application, reference is made to... Figure 9C The first magnetic core body 310 is a racetrack-shaped magnetic core. The structure and manufacturing process of racetrack-shaped magnetic cores are relatively mature, making the implementation of the first magnetic core body 310 relatively simple, thereby reducing design difficulty and production costs. In other embodiments of this application, the first magnetic core body 310 can also be a ring-shaped magnetic core, a rectangular magnetic core, or an elliptical magnetic core. The structures and manufacturing processes of these magnetic cores are relatively mature, making the implementation of the first magnetic core body 310 relatively simple, thereby reducing design difficulty and production costs. It is understood that the shape of the first magnetic core body 310 in the first direction F1 can also be a non-closed ring. For example, the first magnetic core body 310 can be configured as two C-shaped magnetic cores with their openings facing each other or two U-shaped magnetic cores with their openings facing each other. The above are merely illustrative examples of the specific structure of the first magnetic core body 310 provided in the embodiments of this application. In specific implementations, the specific structure of the first magnetic core body 310 is not limited to the structure provided in the embodiments of this disclosure, and can also be other structures known to those skilled in the art based on the inventive concept of this application, which are not limited here.

[0111] Referring to Table 1, common-mode inductor structures using ferrite cores include: ordinary ferrite inductors, inductors with open-gap magnetic bridge structures, and inductors with bonded magnetic ring structures. Common-mode inductor structures using amorphous / nanocrystalline ribbon cores include: ordinary amorphous / nanocrystalline ribbon common-mode inductors, inductors with overlapping magnetic bridge structures, and inductors with nested large and small ring structures. These common-mode inductor structures have different common-mode inductance, differential-mode leakage inductance, and performance characteristics. Among them, amorphous / nanocrystalline ribbon cores have advantages such as high permeability and small size. In one embodiment of this application, the first core body 310 is an amorphous / nanocrystalline ribbon core. In other words, in this embodiment, the differential-mode leakage inductance can be further improved in common-mode inductors based on amorphous / nanocrystalline ribbon cores, thus addressing the issue of low differential-mode leakage inductance inherent in amorphous / nanocrystalline ribbon cores. It is understood that, depending on the needs of actual application scenarios, the first core body 310 can also be set as a ferrite core or a silicon steel core.

[0112]

[0113]

[0114] Table 1

[0115] It is understood that the values ​​in Table 1 are merely illustrative examples, and these values ​​may differ in different application scenarios. The specific values ​​can be determined based on the actual application scenario and do not constitute a limitation on this application.

[0116] For example, refer to Figure 9A , Figure 9B and Figure 9D The second hollow region 421 refers to the region surrounded by the second magnetic core body 410.

[0117] For example, refer to Figure 9A , Figure 9B and Figure 9D Air gap 430 refers to a section of air gap in the magnetic circuit of the second magnetic core body 410. Furthermore, referring to... Figure 13 , Figure 13 This is a schematic diagram illustrating the relationship between the inductance of the differential-mode leakage inductor and frequency in an embodiment of this application. Specifically, S1 exemplarily illustrates the relationship between the inductance of the differential-mode leakage inductor and frequency when the integrated inductor only has a first magnetic core. S2 exemplarily illustrates the relationship between the inductance of the differential-mode leakage inductor and frequency in this application. Figure 9A The curve showing the relationship between the inductance of the differential mode leakage inductance and frequency is illustrated when the air gap width H1 of the integrated inductor is set to 0.1 mm. S3 exemplarily illustrates the present application. Figure 9A The diagram shows the relationship between the differential-mode leakage inductance and frequency when the air gap width H1 of the integrated inductor is set to 0.3 mm. Comparing curves S1 to S3, it is clear that setting the air gap 430 increases the differential-mode leakage inductance of the integrated inductor. Furthermore, the differential-mode leakage inductance can be adjusted by regulating the width H1 of the air gap 430. Therefore, the width H1 of the air gap 430 can be set according to the required differential-mode leakage inductance in the actual application scenario, preventing core saturation while ensuring the differential-mode leakage inductance characteristics.

[0118] In one embodiment of this application, reference is made to... Figure 9A , Figure 9B and Figure 9DThe second magnetic core 400 also includes a third hollow region 422, which penetrates the second magnetic core body 410. The third hollow region 422 and the second hollow region 421 are located on both sides of the air gap 430 in the second direction F2 and are connected through the air gap 430. Furthermore, the third hollow region 422 is connected to the first hollow region 320 in the first direction F1. The second winding 520 passes through the first hollow region 320 and the third hollow region 422 and is wound around the first magnetic core body 310 and the second magnetic core body 410. Based on this, not only is the first winding 510 wound around the first magnetic core body 310 and the second magnetic core body 410, but the second winding 520 is also wound around the first magnetic core body 310 and the second magnetic core body 410, which can further improve the differential mode leakage inductance.

[0119] For example, the area of ​​the cross-section of the second hollow region 421 can be the same as or approximately the area of ​​the cross-section of the third hollow region 422, thereby improving the stability and reliability of the second magnetic core 400. The cross-sections of the second hollow region 421 and the third hollow region 422 are respectively perpendicular to the first direction F1.

[0120] As an example, refer to Figure 9D The second magnetic core body 410 may include two C-shaped magnetic core groups 411Z1 and 411Z2, which are arranged along the second direction F2. Specifically, C-shaped magnetic core group 411Z1 includes two C-shaped magnetic cores 411a1 and 411a2 with their openings facing each other, and C-shaped magnetic core group 411Z2 includes two C-shaped magnetic cores 411b1 and 411b2 with their openings facing each other. Since the structure and manufacturing process of C-shaped magnetic cores 411a1, 411a2, 411b1, and 411b2 are relatively mature, the second magnetic core body 410 can be implemented relatively simply, thereby reducing design difficulty and production costs. For example, the area enclosed by the two C-shaped magnetic cores 411a1 and 411a2 is the second hollow region 421, and the area enclosed by the two C-shaped magnetic cores 411b1 and 411b2 is the third hollow region 422.

[0121] For example, refer to Figure 9DThe first ends of C-type magnetic cores 411a1 and 411a2 are attached to each other, while the second ends of C-type magnetic cores 411a1 and 411a2 are spaced apart and not attached, forming part of the air gap 430. The first ends of C-type magnetic cores 411b1 and 411b2 are attached to each other, while the second ends of C-type magnetic cores 411b1 and 411b2 are spaced apart and not attached, forming another part of the air gap 430. The second ends of C-type magnetic cores 411a1 and 411b1 are attached to each other, while the second ends of C-type magnetic cores 411a2 and 411b2 are attached to each other, forming the air gap 430.

[0122] For example, the C-type magnetic cores 411a1, 411a2, 411b1 and 411b2 have the same structure and size, which can reduce the difficulty of manufacturing.

[0123] For example, the second direction F2 intersects the first direction F1. For instance, the second direction F2 is perpendicular to the first direction F1.

[0124] As yet another example, see reference Figure 11 , Figure 11 This is another top view of the second magnetic core in the integrated inductor of this application embodiment. The second magnetic core body 410 includes two E-type magnetic cores 411c1 and 411c2 with their openings facing each other. Since the structure and manufacturing process of the E-type magnetic cores 411c1 and 411c2 are relatively mature, the second magnetic core body 410 can be implemented relatively simply, thereby reducing design difficulty and production costs. Exemplarily, the side posts of the two E-type magnetic cores 411c1 and 411c2 are attached to each other, while the center posts of the two E-type magnetic cores 411c1 and 411c2 are facing each other and spaced apart, not attached to each other, forming the aforementioned air gap 430. Furthermore, the area enclosed by the two E-type magnetic cores 411c1 and 411c2 is a second hollow area 421, and the other area enclosed is a third hollow area 422.

[0125] As yet another example, see reference Figure 12 , Figure 12This is another top view of the second magnetic core in the integrated inductor according to an embodiment of this application. The second magnetic core body 410 includes two U-shaped magnetic core groups 411Z3 and 411Z4, which are arranged along the second direction F2. Furthermore, the U-shaped magnetic core group 411Z3 includes two U-shaped magnetic cores 411d1 and 411d2 with their openings facing each other, and the U-shaped magnetic core group 411Z4 includes two U-shaped magnetic cores 411e1 and 411e2 with their openings facing each other. Since the structure and manufacturing process of the U-shaped magnetic cores 411d1, 411d2, 411e1, and 411e2 are relatively mature, the implementation of the second magnetic core body 410 can be relatively simple, thereby reducing design difficulty and production costs. For example, the area enclosed by the two U-shaped magnetic cores 411d1 and 411d2 is the second hollow region 421, and the area enclosed by the two U-shaped magnetic cores 411e1 and 411e2 is the third hollow region 422.

[0126] For example, refer to Figure 12 The first ends of U-shaped magnetic cores 411d1 and 411d2 are attached to each other, while the second ends of U-shaped magnetic cores 411d1 and 411d2 are spaced apart and not attached, forming part of the air gap 430. The first ends of U-shaped magnetic cores 411e1 and 411e2 are attached to each other, while the second ends of U-shaped magnetic cores 411e1 and 411e2 are spaced apart and not attached, forming another part of the air gap 430. The second ends of U-shaped magnetic cores 411d1 and 411e1 are attached to each other, and the second ends of U-shaped magnetic cores 411d2 and 411e2 are attached to each other, forming the air gap 430.

[0127] The above are merely examples illustrating the specific structure of the second magnetic core body 410 provided in the embodiments of this application. In specific implementations, the specific structure of the second magnetic core body 410 is not limited to the structure provided in the embodiments of this disclosure, and may also be other structures known to those skilled in the art based on the inventive concept of this application, which are not limited here.

[0128] In one embodiment of this application, the second magnetic core body 410 is an amorphous nanocrystalline ribbon magnetic core, an iron powder magnetic core, a ferrite magnetic core, or a silicon steel magnetic core. Since the structures and processes of these magnetic cores are relatively mature, the implementation of the second magnetic core body 410 is relatively simple, thereby reducing design difficulty and production costs.

[0129] In one embodiment of this application, the first winding 510 and the second winding 520 have the same number of turns, which simplifies the implementation of the integrated inductor, thereby reducing design complexity and production costs. Furthermore, it also improves the reliability and stability of the integrated inductor.

[0130] In one embodiment of this application, the conductors of at least one of the first winding 510 and the second winding 520 include single-core wires or multi-core wires, which simplifies the implementation of integrated inductors, thereby reducing design complexity and production costs. Exemplarily, the conductors of the first winding 510 and the second winding 520 are both single-core wires, or both are multi-core wires. Exemplarily, single-core wires include, but are not limited to, circular cross-section wires, square cross-section wires, and flat cross-section wires. Multi-core wires include, but are not limited to, ordinary multi-core wires and stranded multi-core wires.

[0131] In one embodiment of this application, at least one of the first winding 510 and the second winding 520 is a single-layer winding structure or a multi-layer winding structure, which simplifies the implementation of the integrated inductor, thereby reducing design difficulty and production costs. Exemplarily, both the first winding 510 and the second winding 520 are single-layer winding structures. Alternatively, both the first winding 510 and the second winding 520 are multi-layer winding structures. Exemplarily, single-layer winding structures include, but are not limited to, windings formed using close winding, spaced winding, or other winding methods. Multi-layer winding structures include, but are not limited to, windings formed using layered flat winding, random winding, honeycomb winding, or other winding methods.

[0132] In one embodiment of this application, at least one of the first winding 510 and the second winding 520 is a three-dimensional copper wire winding or a planar printed circuit board (PCB) winding. Based on this, the implementation of the integrated inductor can be relatively simple, thereby reducing design complexity and production costs. Exemplarily, both the first winding 510 and the second winding 520 are three-dimensional copper wire windings. Alternatively, both the first winding 510 and the second winding 520 are planar printed circuit board windings.

[0133] It is understood that, in order to clearly demonstrate the structure of the integrated inductor in the embodiments of this application, Figures 8A to 10B The illustration is based on an example where the second magnetic core 400 has a second hollow region 421 and a third hollow region 422. In other embodiments of this application, the second magnetic core 400 may not have a third hollow region 422, in which case the second winding 520 passes through the first hollow region 320 and is wound around the first magnetic core body 310. As an example, the second magnetic core body 410 may include two C-shaped magnetic cores 411a1 and 411a2 with their openings facing each other. Alternatively, the second magnetic core body 410 may include two U-shaped magnetic cores 411d1 and 411d2 with their openings facing each other.

[0134] The above description is only a specific implementation of this application, but the protection scope of this application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the protection scope of this application.

Claims

1. An integrated inductor, characterized in that, include: The first magnetic core includes a first magnetic core body and a first hollow region, wherein the first hollow region penetrates the first magnetic core body; The second magnetic core includes a second magnetic core body, a second hollow region and an air gap. The second hollow region and the air gap are connected and penetrate the second magnetic core body. The second magnetic core body and the first magnetic core body are stacked along a first direction. The second hollow region and the first hollow region are connected in the first direction. The first winding passes through the first hollow region and the second hollow region and is wound around the first magnetic core body and the second magnetic core body; The second winding passes through at least the first hollow region and is wound around the first magnetic core body, with the second winding and the first winding having opposite winding directions.

2. The integrated inductor according to claim 1, characterized in that, The first magnetic core body has a closed ring shape in the first direction.

3. The integrated inductor according to claim 2, characterized in that, The first magnetic core body is a racetrack-shaped magnetic core, a ring-shaped magnetic core, a rectangular magnetic core, or an elliptical magnetic core.

4. The integrated inductor according to any one of claims 1-3, characterized in that, The first magnetic core body is an amorphous nanocrystalline ribbon magnetic core.

5. The integrated inductor according to any one of claims 1-4, characterized in that, The second magnetic core body includes: two C-shaped magnetic cores with their openings facing each other or two U-shaped magnetic cores with their openings facing each other.

6. The integrated inductor according to any one of claims 1-4, characterized in that, The second magnetic core also includes a third hollow region, which penetrates the main body of the second magnetic core. The third hollow region and the second hollow region are located on both sides of the air gap in the second direction and are connected through the air gap. The second direction intersects the first direction. The third hollow region is connected to the first hollow region in the first direction, and the second winding passes through the first hollow region and the third hollow region and is wound around the first magnetic core body and the second magnetic core body.

7. The integrated inductor according to claim 6, characterized in that, The second magnetic core body includes: two C-shaped magnetic core groups, the two C-shaped magnetic core groups being arranged along the second direction, each C-shaped magnetic core group including two C-shaped magnetic cores with their openings facing each other; or, The second magnetic core body includes: two E-type magnetic cores with their openings facing each other; or, The second magnetic core body includes: two U-shaped magnetic core groups, the two U-shaped magnetic core groups are arranged along the second direction, and each U-shaped magnetic core group includes two U-shaped magnetic cores with their openings facing each other.

8. The integrated inductor according to any one of claims 1-7, characterized in that, The second magnetic core body is an amorphous nanocrystalline ribbon magnetic core, an iron powder magnetic core, a ferrite magnetic core, or a silicon steel magnetic core.

9. The integrated inductor according to any one of claims 1-8, characterized in that, The first winding and the second winding have the same number of turns; or, The conductors of at least one of the first winding and the second winding comprise single-core or multi-core wires; or, At least one of the first winding and the second winding is a single-layer winding structure or a multi-layer winding structure; or; At least one of the first winding and the second winding is a three-dimensional copper wire winding or a planar printed circuit board winding.

10. A filtering device, characterized in that, Including the integrated inductor as described in any one of claims 1-9.

11. A power supply device, characterized in that, include: A power input terminal, a power output terminal, a power conversion device, and a filtering device as described in claim 10; The first end of the first winding in the filter device is connected to the positive terminal of the power supply input terminal, the second end of the first winding is connected to the positive terminal of the power conversion device input terminal, the first end of the second winding in the filter device is connected to the negative terminal of the power supply input terminal, the second end of the second winding is connected to the negative terminal of the power conversion device, the positive terminal of the output terminal of the power conversion device is connected to the positive terminal of the power supply output terminal, and the negative terminal of the output terminal of the power conversion device is connected to the negative terminal of the power supply output terminal.

12. An electronic device, characterized in that, It includes electrical equipment and the power supply equipment as described in claim 11, wherein the power supply output terminal of the power supply equipment is connected to the electrical equipment.

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