Communication circuit board
Through hierarchical isolation design and filtering, the problem of weak anti-interference capability of traditional communication boards in complex electromagnetic environments is solved, and stable communication is achieved under high voltage and high current environments, improving signal quality and adaptability.
Patent Information
- Application Number
- CN202521895814.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-03
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-09-03
AI Technical Summary
Traditional communication boards have weak anti-interference capabilities under high voltage, high current and complex electromagnetic interference environments, resulting in low communication signal quality.
The system adopts a hierarchical isolation design, including a first isolation module and multiple second isolation modules, combined with a voltage conversion module and a filtering module. The modules are selected according to the characteristics of the communication interface to achieve electrical isolation and filtering, thereby enhancing anti-interference capabilities.
It effectively blocks interference between the power supply and the communication interface, improves the versatility of the communication circuit board and the quality of the communication signal, adapts to a variety of communication interfaces, eliminates the need for additional discrete power supply circuits, and improves reliability and signal integrity.
Smart Images
Figure CN224684110U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of power electronics technology, and in particular relates to a communication circuit board. Background Technology
[0002] The rapid development of energy storage converter technology has led to its widespread application in various fields such as photovoltaics and wind power. As a core component of energy storage converter devices, communication boards are responsible for enabling data exchange between the energy storage converter control system, energy management system (EMS), battery management system (BMS), and external monitoring equipment.
[0003] The communication board of the energy storage converter can adopt communication protocols such as Recommended Standard (RS), Controller Area Network (CAN) bus and Ethernet. However, in environments with high voltage, high current and complex electromagnetic interference, traditional communication board circuits have problems such as weak anti-interference ability, resulting in low communication signal quality. Utility Model Content
[0004] This application provides a communication circuit board applied to an energy storage converter, comprising: a first isolation module connected to a power supply for isolating the output voltage of the power supply to obtain an isolated first voltage; a voltage conversion module connected to the input terminal of the voltage conversion module for converting the first voltage into multiple second voltages with different values; and multiple second isolation modules, each connected to an output terminal of a voltage conversion module for isolating the second voltages to obtain isolated second voltages for powering different communication interfaces; wherein the type of the second isolation module is determined according to the communication interface to which it is connected.
[0005] In one embodiment, the communication circuit board further includes: a plurality of filtering modules connected between the isolation module and the communication interface, used to filter the second voltage, wherein the filtering modules are determined according to the communication interface to which they are connected.
[0006] In one embodiment, the communication interface includes a recommended standard communication interface, the second isolation module includes a first digital isolator, and the filtering module includes a common-mode inductor and a capacitor-inductor filter connected in sequence.
[0007] In one embodiment, the communication interface includes a controller area network bus interface, the second isolation module includes a second digital isolator, and the filtering module includes a differential filter and a transient voltage suppressor connected in sequence.
[0008] In one embodiment, the communication interface includes an Ethernet interface, the second isolation module includes a transformer, and the filtering module includes an electromagnetic interference filter.
[0009] In one embodiment, the input and output sides of the second isolation module are powered by different voltages.
[0010] In one embodiment, the circuit board further includes a temperature control module.
[0011] In one embodiment, the temperature control module includes: a temperature sensing element connected to a communication circuit board for acquiring the temperature of the communication circuit board; a temperature acquisition element connected to the temperature sensing element for acquiring the temperature of the temperature sensing element; a control element connected to the temperature acquisition element for determining a temperature adjustment strategy based on the acquired temperature; and a temperature adjustment element connected to the control element for adjusting the temperature of the circuit board based on the temperature adjustment strategy.
[0012] In one embodiment, the first isolation module includes a DC-to-DC isolation module.
[0013] In one embodiment, the communication circuit board further includes a data storage module for storing data.
[0014] The communication circuit board in this embodiment employs a hierarchical isolation design with a first isolation module and a second isolation module to doubly block interference between the power supply and the communication interface, thereby meeting the anti-interference requirements of the high electromagnetic environment of the energy storage converter. Furthermore, by outputting multiple second voltages through a voltage conversion module, and in conjunction with a second isolation module selected according to the characteristics of the communication interface, it can simultaneously adapt to multiple communication interfaces without the need for additional discrete power supply circuitry, thus improving the versatility of the communication circuit board. Attached Figure Description
[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 An architectural diagram of a communication circuit board provided in one embodiment of this application is shown;
[0017] Figure 2 An architectural diagram of a communication circuit board provided in one embodiment of this application is shown;
[0018] Figure 3 An architectural diagram of a communication circuit board provided in one embodiment of this application is shown;
[0019] Figure 4 An architectural diagram of a communication circuit board provided in one embodiment of this application is shown;
[0020] Figure 5 An architectural diagram of a communication circuit board provided in one embodiment of this application is shown;
[0021] Figure 6 An architectural diagram of a communication circuit board provided in one embodiment of this application is shown;
[0022] Figure 7 A schematic diagram of the power supply architecture of a communication circuit board according to an embodiment of this application is shown;
[0023] Figure 8 A schematic diagram of the isolation architecture of a communication circuit board according to an embodiment of this application is shown;
[0024] Figure 9 A schematic diagram of the connection architecture of a communication circuit board provided in one embodiment of this application is shown.
[0025] Explanation of reference numerals in the attached figures:
[0026] 100. Communication circuit board; 110. First isolation module; 120. Voltage conversion module; 130. Second isolation module; 140. Filtering module; 150. Temperature control module; 160. Data storage module;
[0027] 131. First digital isolator; 132. Second digital isolator; 133. Transformer; 141. Capacitor-inductor filter; 142. Differential filter; 143. Transient voltage suppressor; 144. Filter; 151. Temperature sensing element; 152. Temperature acquisition element; 153. Control element; 154. Temperature regulation element; C1. First capacitor; D1. Diode; L1. Common mode inductor; R1. First resistor. Detailed Implementation
[0028] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.
[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.
[0030] With the rapid development of energy storage converter technology, communication boards, as one of the core components of energy storage converter devices, are used to realize data exchange between the energy storage converter control system, energy management system (EMS), battery management system (BMS), and external monitoring equipment. They are an important part of the energy storage converter system.
[0031] The communication board of the energy storage converter can communicate using the Recommended Standard (RS), Controller Area Network (CAN) and Ethernet protocols. However, in environments with high voltage, high current and complex electromagnetic interference, the traditional communication board circuit has weak anti-interference capability and low communication quality.
[0032] In related technologies, single-stage isolation for signals or power supplies is generally used. However, such single-stage isolation may still result in common-mode interference in the circuit, reducing the reliability of communication signal transmission.
[0033] Therefore, in order to solve the problems of the prior art, this application provides a communication circuit board. The communication circuit board provided in this application embodiment will be described below.
[0034] Figure 1 A schematic diagram of a communication circuit board according to an embodiment of this application is shown. Figure 1As shown, the communication circuit board 100 is applied to an energy storage converter and includes the following modules: a first isolation module 110, which is connected to a power supply and is used to isolate the output voltage of the power supply to obtain an isolated first voltage; a voltage conversion module 120, whose input terminal is connected to the first isolation module 110 and is used to convert the first voltage into multiple second voltages with different values; and multiple second isolation modules 130, whose input terminal is connected to one output terminal of the voltage conversion module 120 and is used to isolate the second voltage to obtain an isolated second voltage for powering different communication interfaces; wherein, the type of the second isolation module 130 is determined according to the communication interface to which it is connected.
[0035] For example, the first isolation module 110 may include an input terminal and an output terminal, wherein the input terminal of the first isolation module 110 may be connected to a power supply; and the output terminal of the first isolation module 110 may be connected to the voltage conversion module 120. Furthermore, the power supply connected to the input terminal of the first isolation module 110 may be the system power supply of the energy storage converter.
[0036] The voltage output by the power supply is processed by the first isolation module 110 to obtain the first voltage. The voltage value of the first voltage can be consistent with the voltage output by the power supply, but its common-mode interference is significantly reduced.
[0037] In some alternative embodiments, the first isolation module 110 may be a direct current (DC) to DC isolation module.
[0038] It is understandable that by setting up the first isolation module 110, electrical isolation of the power supply output voltage is achieved, blocking the conduction of noise such as common-mode interference and ground loop current from the power supply side to subsequent circuits. Specifically, the first isolation module 110 can physically disconnect the direct connection between the power supply and the voltage conversion module 120, retaining only the indirect transfer of energy, thereby preventing power supply interference from directly affecting the communication circuit board 100.
[0039] For example, the input terminal of the voltage conversion module 120 is connected to the first isolation module 110, and the output terminal of the voltage conversion module 120 is connected to the second isolation module 130.
[0040] The voltage conversion module 120 can be used to convert the first voltage output by the first isolation module 110 to obtain a converted second voltage. The voltage conversion module 120 may include one or more modules, and each voltage conversion module 120 may have different or the same conversion capability for the first voltage. Furthermore, the voltage value of the second voltage output by different voltage conversion modules 120 may be different.
[0041] The voltage conversion capability of the voltage conversion module 120 is set by technicians according to the communication interface type. Protocol conversion for different communication interfaces can be achieved by corresponding protocol conversion chips. It is understood that different types of communication interfaces require different power supply voltages; therefore, different voltage conversion modules 120 can be used to achieve voltage conversion for different types of communication interfaces.
[0042] In one example, the voltage conversion module 120 may include three buck modules: a first buck module, a second buck module, and a third buck module. The first voltage may be 24 volts (V). The first buck module can adjust the first voltage to 5V, the second buck module can adjust the first voltage to 3.3V, and the third buck module can adjust the first voltage to 5V. For example, the buck module may be a buck circuit, or it may be a Cuk circuit.
[0043] It is understood that the voltage conversion module 120 in the embodiments of this application may also include a boost module. This application does not limit the voltage conversion method or its specific circuit structure.
[0044] For example, the input terminal of the second isolation module 130 is connected to the output terminal of the voltage conversion module 120, and the output terminal of the second isolation module 130 is connected to the communication interface to supply power to the communication interface. Different communication interfaces can correspond to different second isolation modules 130.
[0045] The input and output sides of the second isolation module 130 are powered by different voltages.
[0046] It is understood that the second isolation module 130 may include a primary side and a secondary side, wherein the primary side may be the input side of the second isolation module 130, and the secondary side may be the output side of the second isolation module 130. Furthermore, the input side and the output side may use different power supply voltages. This ensures both the normal operation of the second isolation module 130 to provide electrical isolation and meets the inherent requirements of the circuits on both sides through voltage differentiation, thus simultaneously guaranteeing normal circuit function and signal quality.
[0047] In this embodiment, the hierarchical isolation design of the first isolation module 110 and the second isolation module 130 effectively blocks interference between the power supply and the communication interface, thereby meeting the anti-interference requirements of the energy storage converter in a high electromagnetic environment. Furthermore, by outputting multiple second voltages through the voltage conversion module 120, and in conjunction with the second isolation module 130 selected according to the characteristics of the communication interface, multiple communication interfaces can be simultaneously adapted without the need for additional discrete power supply circuitry, thus improving the versatility of the communication circuit board 100.
[0048] In order to improve the quality of communication signals, as another implementation of this application, this application also provides another implementation of the communication circuit board 100, as detailed in the following embodiments.
[0049] Figure 2 A schematic diagram of a communication circuit board according to an embodiment of this application is shown. Figure 2 As shown, the communication circuit board 100 further includes multiple filtering modules 140. The filtering modules 140 are connected between the second isolation module 130 and the communication interface, and are used to filter the second voltage. The type of the filtering module 140 is determined according to the communication interface it is connected to.
[0050] For example, different types of communication interfaces can be implemented by using different filtering modules 140 in conjunction with different second isolation modules 130.
[0051] In some optional embodiments, the communication interface includes a recommended standard communication interface. The second isolation module 130 includes a digital isolator; the filtering module 140 includes a common-mode inductor L1 and a capacitor-inductor filter 141 connected in sequence.
[0052] Figure 3 A schematic diagram of a communication circuit board according to an embodiment of this application is shown. Figure 3 As shown, when the communication interface is the Recommended Standard (RS) interface, the second isolation module 130 can adopt the first digital isolator 131; the filtering module 140 can adopt the circuit design of common mode inductor L1 and capacitor-inductor filter 141 (i.e., RC filter 144).
[0053] The RC filter 144 may include a first resistor R1 and a first capacitor C1. The first terminal of the first resistor R1 may be connected to the common-mode inductor L1, the first terminal of the first capacitor C1 may be connected to the second terminal of the first resistor R1, the second terminal of the first capacitor C1 may be grounded, and the first terminal of the first capacitor C1 may be connected to a recommended standard communication interface.
[0054] In one example, the recommended standard interface for communication could be an RS485 interface.
[0055] In one example, the first digital isolator 131 can be an opto-isolator, a magnetic coupling isolator, or a capacitive coupling isolator, etc.
[0056] Understandably, in Figure 3In the illustrated embodiment, electrical isolation is achieved through a second digital isolator 132 to cut off the direct electrical connection between the two circuits, thereby eliminating noise in the circuit. Furthermore, common-mode interference in the circuit can be suppressed by a common-mode inductor L1, and differential-mode interference in the line can be further filtered out by an RC filter 144, smoothing the communication signal and improving signal quality.
[0057] In some alternative embodiments, the communication interface includes a CAN interface. The second isolation module 130 includes a digital isolator; the filtering module 140 includes a differential filter 142 and a transient voltage suppressor 143 connected in sequence.
[0058] Figure 4 A schematic diagram of a communication circuit board according to an embodiment of this application is shown. Figure 4 As shown, when the communication interface is a CAN interface, the second isolation module 130 can be a second digital isolator 132; the filtering module 140 can be a differential filter 142 and a transient voltage suppressor 143 connected in sequence.
[0059] In this circuit, the first terminal of the differential filter 142 is connected to the second digital isolator 132, the second terminal of the differential filter 142 is connected to the first terminal of the transient voltage suppressor 143, and the second terminal of the transient voltage suppressor 143 is grounded. Furthermore, the first terminal of the transient voltage suppressor 143 can be connected to a CAN interface.
[0060] In one example, the transient voltage suppressor 143 can be a transient voltage suppressor (TVS) diode D1. The cathode of the TVS diode D1 is connected to the differential filter 142; the cathode of the TVS diode D1 is grounded.
[0061] In another example, the second digital isolator 132 can be an optical isolator, a magnetic coupling isolator, or a capacitive coupling isolator, etc.
[0062] Understandably, in Figure 4 In the illustrated embodiment, electrical isolation is achieved through a second digital isolator 132 to cut off the direct electrical connection between the two circuits, thereby eliminating noise in the circuit. Furthermore, differential filtering eliminates interference in the signal, ensuring the integrity of the CAN signal. Additionally, a transient voltage suppressor 143 intercepts transient high voltages, ensuring circuit safety. This combination is particularly suitable for scenarios with complex electromagnetic environments and high reliability requirements, significantly reducing the failure rate of CAN communication and extending equipment lifespan.
[0063] In some alternative embodiments, the communication interface includes an Ethernet interface, the second isolation module 130 includes a transformer 133, and the filtering module 140 includes an electromagnetic interference filter 144.
[0064] Figure 5 A schematic diagram of a communication circuit board according to an embodiment of this application is shown. Figure 5 As shown, when the communication interface is an Ethernet interface, the second isolation module 130 can be connected as a transformer 133 and the filter module 140 can be connected as an electromagnetic interference (EMI) filter 144.
[0065] The first end of transformer 133 is connected to voltage conversion module 120, the first end of EMI filter 144 is connected to the second end of transformer 133, and the second end of EMI filter 144 is connected to Ethernet interface.
[0066] exist Figure 5 In the illustrated embodiment, transformer 133 enables electrical isolation and signal coupling, ensuring stable signal transmission through the Ethernet interface. Furthermore, EMI filter 144 provides bidirectional electromagnetic interference suppression, preventing both external interference from affecting the internal circuitry and internal interference from contaminating the external bus. The combined use of transformer 133 and EMI filter 144 allows the Ethernet interface to operate compliantly in complex electromagnetic environments while protecting the internal circuitry from external faults, ultimately guaranteeing high-speed, stable, and reliable Ethernet communication performance.
[0067] To ensure the security of the communication circuit board 100, as another implementation of this application, this application also provides another implementation of the communication circuit board 100, as detailed in the following embodiments.
[0068] Figure 6 A schematic diagram of a communication circuit board according to an embodiment of this application is shown. Figure 6 As shown, the communication circuit board 100 also includes a temperature control module 150.
[0069] In some optional embodiments, the temperature control module 150 includes a temperature sensing element 151 connected to the communication circuit board 100 for acquiring the temperature of the communication circuit board 100; a temperature acquisition element 152 connected to the temperature sensing element 151 for acquiring the temperature of the temperature sensing element 151; a control element 153 connected to the temperature acquisition element 152 for determining a temperature adjustment strategy based on the acquired temperature; and a temperature adjustment element 154 connected to the control element 153 for adjusting the temperature of the circuit board based on the temperature adjustment strategy.
[0070] For example, the temperature sensing element 151 can be used to sense the temperature of the communication circuit board 100. For instance, the temperature sensing element 151 can be a negative temperature coefficient (NTC) resistor. The resistance of an NTC resistor decreases significantly as the temperature increases.
[0071] For example, temperature acquisition element 152 acquires the temperature of temperature sensing element 151 by connecting to temperature sensing element 151. In one example, the temperature acquisition unit may be a temperature sensor that characterizes the temperature of communication circuit board 100 by acquiring the temperature of the NTC resistor. In yet another example, the temperature sensor may also acquire ambient temperature data within the device where communication circuit board 100 is located.
[0072] For example, the control element 153 may have a built-in heat dissipation control algorithm to determine the temperature adjustment strategy based on the temperature collected by the temperature sensor, thereby maintaining the temperature of the communication circuit board 100 and the device in which the communication circuit board 100 is located.
[0073] For example, the temperature regulating element 154 is connected to the control element 153 and is used to regulate the temperature of the communication circuit board 100 and the device in which the communication circuit board 100 is located according to the temperature regulation strategy determined by the control element 153.
[0074] In one example, the temperature control element 154 can be a fan. The fan speed can be adjusted and determined by the control element 153, thereby achieving precise temperature management.
[0075] In another example, the control element 153 can also reduce power loss in the circuit and achieve a cooling effect by adjusting power output parameters, such as power output current or power output voltage.
[0076] In this embodiment of the application, by adding a temperature control module 150, which includes a temperature sensing element 151, a temperature acquisition element 152, a control element 153, and a temperature adjustment element 154, to the communication circuit board 100, the temperature of the communication circuit board 100 can be maintained, ensuring that the communication circuit board 100 can operate stably in a high-temperature environment.
[0077] In addition, in order to maintain the temperature of the communication circuit board 100, the heat dissipation performance of the PCB can be optimized by using thermal vias, copper foil extensions and layered layouts to avoid local temperature rise.
[0078] In some alternative embodiments, the communication circuit board 100 further includes a data storage module 160 for storing data.
[0079] For example, the data storage module 160 may be a non-volatile memory. Furthermore, the data storage module 160 in the communication circuit board 100 may include one or more.
[0080] In one example, the data storage module 160 may include an electrically erasable programmable read-only memory (EEPROM), or it may include flash memory. The EEPROM can be used for data storage, while the flash memory can be used to implement black box storage of fault recording information and remote upgrades.
[0081] In this embodiment, data storage is achieved by deploying a data storage module 160 in the communication circuit board 100, thereby ensuring the performance of the communication circuit board 100.
[0082] Below, in conjunction with Figure 7 , Figure 8 , Figure 9 The following example illustrates a communication circuit board.
[0083] Figure 7 A schematic diagram of the power supply architecture of a communication circuit board according to an embodiment of this application is shown; Figure 8 A schematic diagram of the isolation architecture of a communication circuit board according to an embodiment of this application is shown; Figure 9 A schematic diagram of the connection architecture of a communication circuit board provided in one embodiment of this application is shown.
[0084] like Figure 7 As shown, the communication circuit board can be powered by 24.2V DC, and the power output is isolated by a first isolation module to ensure that the power input to the communication circuit board is free from common-mode interference. The voltage output by the first isolation module can be the same as the power supply voltage, i.e., the first voltage can be 24.2V.
[0085] Furthermore, the first voltage is regulated by a voltage conversion module, so that the regulated voltage can power the various components in the communication circuit board. The voltage conversion module may include one or more modules, and each voltage conversion module may include levels. For example... Figure 7As shown, the first voltage can be adjusted from 24.2V to 5V in the first voltage conversion module, from 24.2V to 3.3V in the second voltage conversion module, and from 24.2V to 5V in the third voltage conversion module. Furthermore, the first voltage conversion module can also include a secondary voltage adjustment module to achieve secondary voltage adjustment. For example, a low dropout regulator (LDO) can be used to adjust 5V to 3V to power the main control chip in the communication circuit board.
[0086] In addition, the communication circuit board may also include a battery (e.g., a button cell battery) to synchronously power the main control chip in the communication circuit board and ensure the normal operation of the main control chip.
[0087] Each interface on the communication circuit board can be equipped with a corresponding isolation module to ensure the performance of the communication circuit board. Furthermore, digital isolators with different creepage distances can be configured for different interfaces. For example... Figure 8 As shown, the CAN interface, fan interface, and RS485 interface can be configured with digital isolators with a creepage distance of 8mm, or optocouplers with a creepage distance of 8.2mm, achieving digital isolation. The Ethernet interface can be isolated using a transformer. Furthermore, the communication circuit board can reserve 4 output dry contacts for relay isolation and 4 input dry contacts for optocoupler isolation.
[0088] like Figure 9 As shown, the communication circuit board in this embodiment may include one Ethernet interface; five RS485 communication interfaces; three CAN communication interfaces and multiple interfaces to achieve different functions.
[0089] For example, the three CAN interfaces can be connected to the BMS, PC, and inverter controller in the energy storage converter, respectively; the five RS485 communication interfaces can be connected to the heat exchanger / temperature and humidity controller, centrifugal fan, Human-Machine Interface (HMI), and gateway, respectively. Furthermore, the gateway connects to the EMS via an Ethernet (ETH) interface. In addition, the communication board can also connect to Flash memory via a Serial Peripheral Interface (SPI). Multiple interfaces are also provided for connection to crystal oscillators, Real-Time Clock (RTC) crystal oscillators, RTC batteries, power monitoring, board temperature acquisition, board power acquisition, and four digital inputs (DI) and four digital outputs (DO).
[0090] Furthermore, when it comes to communication architecture, a redundant communication system that supports a primary network (such as Ethernet) and a backup network (such as RS-485) can be adopted. When the primary network fails, it automatically switches to the backup network, thereby ensuring the communication function of the communication circuit board.
[0091] When designing cut lines in a PCB layout, draw the cut lines on the ground plane layer to completely separate analog ground and digital ground. Cut lines should avoid high-frequency signal traces. Furthermore, setting an appropriate isolation band width (e.g., an isolation bandwidth ≥ 10mil) can enhance the isolation effect.
[0092] It is understood that, in this embodiment, multi-level isolation and filtering, along with intelligent thermal management, address the shortcomings of existing communication boards, such as low integration, insufficient reliability, high power consumption, and heat dissipation issues. This system enables the collaborative operation of multiple communication protocols, including RS-485, CAN, and Ethernet, improving communication reliability; through PCB ground plane cutting design and multi-level isolation technology, electromagnetic interference is effectively suppressed, ensuring signal integrity; combined with temperature sensors and heat dissipation control algorithms, dynamic heat dissipation adjustment is achieved, ensuring stable system operation in high-temperature environments; and a comprehensive fault protection mechanism is integrated to guarantee the safe and reliable operation of the system.
[0093] The above description is merely a specific implementation of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.
Claims
1. A communication circuit board, characterized in that, Applications in energy storage converters include: The first isolation module is connected to the power supply and is used to isolate the output voltage of the power supply to obtain a first voltage after isolation. A voltage conversion module, wherein the input terminal of the voltage conversion module is connected to the first isolation module, and is used to convert the first voltage into multiple second voltages with different voltage values; Multiple second isolation modules are provided, with the input terminal of each second isolation module connected to one output terminal of the voltage conversion module, for isolating the second voltage to obtain an isolated second voltage for powering different communication interfaces; wherein, the type of the second isolation module is determined according to the communication interface to which it is connected.
2. The communication circuit board according to claim 1, characterized in that, The communication circuit board further includes: multiple filtering modules, which are connected between the second isolation module and the communication interface for filtering the second voltage, wherein the filtering module is determined according to the communication interface to which it is connected.
3. The communication circuit board according to claim 2, characterized in that, The communication interface includes a recommended standard communication interface. The second isolation module includes a first digital isolator; the filtering module includes a common-mode inductor and a capacitor-inductor filter connected in sequence.
4. The communication circuit board according to claim 2, characterized in that, The communication interface includes a controller area network bus interface. The second isolation module includes a second digital isolator; the filtering module includes a differential filter and a transient voltage suppressor connected in sequence.
5. The communication circuit board according to claim 2, characterized in that, The communication interface includes an Ethernet interface. The second isolation module includes a transformer; the filtering module includes an electromagnetic interference filter.
6. The communication circuit board according to any one of claims 3-5, characterized in that, The input and output sides of the second isolation module are powered by different voltages.
7. The communication circuit board according to claim 1, characterized in that, The circuit board also includes a temperature control module.
8. The communication circuit board according to claim 7, characterized in that, The temperature control module includes: A temperature sensing element, connected to the communication circuit board, is used to obtain the temperature of the communication circuit board; A temperature acquisition element, connected to the temperature sensing element, is used to acquire the temperature of the temperature sensing element; A control element, connected to the temperature acquisition element, is used to determine a temperature adjustment strategy based on the acquired temperature. A temperature regulating element, connected to the control element, is used to adjust the temperature of the circuit board based on the temperature regulating strategy.
9. The communication circuit board according to claim 1, characterized in that, The first isolation module includes a DC-to-DC isolation module.
10. The communication circuit board according to claim 1, characterized in that, The communication circuit board also includes: Data storage module, used to store data.